CN203786580U - 模块化温控器 - Google Patents
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Abstract
一种模块化温控器，包括盒体、安装在盒体内部的主线路板，以及安装在盒体下方的电源盒，盒体上成型有穿透盒身以使盒体外部与盒体内部相通的插孔；温控器还包括可以通过插孔至少部分插入到盒体内部或从盒体内部拔出的传感器模块，传感器模块在插入到盒体内部后与主线路板电连接，从而实现对所需控制因素进行调节。本实用新型通过将传感器设置为类似U盘的可插拔形式，使得用户可以根据自身需求自由选择购买传感器模块，在需要改变温控器功能时只需更换模块即可实现，而不必如现有技术中必须购买多个温控器。采用模块化的传感器使得本实用新型的温控器功能多样化，且降低了用户的购买成本。
Description
技术领域
本实用新型涉及温控设备技术领域，具体涉及一种模块化温控器。
背景技术
目前，市场上常用的温控器是通过内部设置的温度传感器而实现对温度、湿度进行控制的电开关设备，普遍用于中央空调、家庭取暖、地暖及各种燃油、燃气锅炉(壁挂炉)等设备。温控器可以自由调节室内温度，其能够按照用户的要求设定各种时间段并能够在各种预设好的模式下自动运行调节室温，使室内达到舒适的温度，从而达到方便、节能、舒适温暖的理想生活环境。
另外，市场上还有一种用于新风系统中的温控器，其不仅需要对室内的温湿度进行控制，而且还需要对室内的空气品质进行检测从而控制新风系统以实现对室内空气品质的调节，例如对室内二氧化碳浓度进行检测等。该种温控器内部需要设置用于对空气品质进行检测的空气品质传感器。
上述两种温控器类似的产品中，温湿度传感器以及空气品质传感器均设置在温控器盒体的内部，与盒体内的温控器主线路板固定连接。该种温控器结构由于生产方便而广泛流行，然而在实际使用中却给用户带来许多不便。不同的用户的需求不一，有些用户只需要对室内温湿度进行控制调节，有些用户需要在新风系统中对温湿度以及空气品质均进行调节，然而还有一些用户如果想满足上述两种需求，则只能同时购买两种温控器，这无疑增加了用户的购买成本，造成用户对现有温控器结构的不满。
实用新型内容
因此，本实用新型要解决的技术问题在于现有技术中温控器功能单一，无法满足用户需求的技术问题，从而提供一种可以满足不同用户需求的功能多样且成本低的模块化温控器。
为实现上述实用新型目的，本实用新型采用了如下技术方案：
一种模块化温控器,包括盒体、安装在所述盒体内部的主线路板，以及安装在所述盒体下方的电源盒，所述盒体上成型有穿透盒身以使盒体外部与盒体内部相通的插孔；所述温控器还包括可以通过所述插孔至少部分插入到所述盒体内部或从所述盒体内部拔出的传感器模块，所述传感器模块在插入到所述盒体内部后与所述主线路板电连接，从而实现对所需控制因素进行调节。
所述传感器模块包括能够部分插入到所述盒体内部的线路板、设置在所述线路板插入端上，用于电连接所述主线路板的芯片，以及包围在所述线路板外部的模块壳套，所述模块壳套上成型有若干个散热孔。
所述模块壳套与所述盒体之间成型有用于所述传感器模块部分插入所述插孔后固定所述传感器模块的卡接结构。
所述卡接结构包括成型在所述模块壳套上的卡钩以及成型在所述盒体上适于与所述卡钩卡接配合的卡槽。
所述模块壳套包括所述传感器模块部分插入到所述插孔后扣合在所述插孔上的壳套底座以及盖在所述壳套底座上的壳套盖板，所述壳套底座和所述壳套盖板上均成型有若干个所述散热孔。
所述盒体包括可拆卸的面板和底座，所述底座其中一侧壁上成型有所述插孔。
所述线路板的插入端在插入所述盒体内部后位于所述主线路板的下方，所述线路板的插入端之间设置有连接所述芯片和所述主线路板的连接器。
所述传感器模块为温湿度传感器模块。
所述传感器模块为温湿度和空气品质传感器模块。
本实用新型的上述技术方案相比现有技术具有以下优点：
1.本实用新型模块化温控器，包括可以通过盒体上成型的穿透盒身的插孔至少部分插入到盒体内部或从盒体内部拔出的传感器模块，传感器模块在插入盒体内部后与盒体内部的主线路板电连接，从而实现对所需控制因素进行调节，例如传感器模块可以是温湿度传感器模块，插入后即可对室内温湿度进行调节，传感器模块还可以是温湿度和空气品质传感器模块，插入后即可对室内温湿度以及空气品质(如室内空气中二氧化碳的浓度)进行调节；本实用新型通过将传感器设置为类似U盘的可插拔形式，使得用户可以根据自身需求自由选择购买传感器模块，在需要改变温控器功能时只需更换模块即可实现，而不必如现有技术中必须购买多个温控器，采用模块化的传感器使得本实用新型的温控器功能多样化，且降低了用户的购买成本。
2.本实用新型模块化温控器，所述模块壳套与所述盒体之间成型有用于所述传感器模块部分插入所述插孔后固定所述传感器模块的卡接结构，通过卡接结构的设置使得传感器模块插入到盒体内部后不晃动，保证温控器的工作可靠性；另外，卡接结构的设置使得传感器模块在拔出时也较方便，有利于提高传感器模块的更换效率。
3.本实用新型模块化温控器，所述传感器模块包括能够部分插入到所述盒体内部的线路板、设置在所述线路板插入端上，用于电连接所述主线路板的芯片，以及包围在所述线路板外部的模块壳套，所述模块壳套上成型有若干个散热孔，通过散热孔的设置，实现了盒体内部和盒体外部空气的流通，从而保证传感器模块在工作时不会由于温度过高而降低检测的精确度。
附图说明
为了使本实用新型的内容更容易被清楚的理解，下面根据本实用新型的具体实施例并结合附图，对本实用新型作进一步详细的说明，其中
图1是本实用新型实施例一的模块化温控器的结构示意图，其中传感器模块处于插入状态；
图2是本实用新型实施例一的模块化温控器的分解结构示意图；
图3是本实用新型实施例一的模块化温控器的传感器模块的结构示意图；
图4是本实用新型实施例一的模块化温控器的盒体的底座的结构示意图；
图5是本实用新型实施例一的模块化温控器的传感器处于拔出状态的结构示意图；
图6是本实用新型模块实施例二的模块化温控器的结构示意图，其中传感器模块处于插入状态。
附图标记说明：1-主线路板，2-电源盒，3-面板，4-底座，41-插孔，43-卡槽，5-传感器模块，51-线路板，52-芯片，53-壳套底座，531-卡钩，54-壳套盖板，55-散热孔，6-连接器。
具体实施方式
实施例一
如图1和2所示，一种模块化温控器，包括盒体、安装在所述盒体内部的主线路板1，以及安装在所述盒体下方的电源盒2，所述盒体上成型有穿透盒身以使盒体外部与盒体内部相通的插孔41；所述温控器还包括可以通过所述插孔41至少部分插入到所述盒体内部或从所述盒体内部拔出的传感器模块5，所述传感器模块5在插入到所述盒体内部后与所述主线路板1电连接，从而实现对所需控制因素进行调节。
需要说明的是，所述电连接是指，所述传感器模块5在插入所述盒体内部后既可以与所述主线路板1上对应的控制芯片直接连接，也可以与对应的控制芯片间接连接，但是不管是直接连接还是间接连接都以实现传感器模块5与主线路板1电导通为目的。另外，还需要说明的是，所述所需控制因素是指用户对室内有需求进行调节的因素，例如可以是温度、湿度、温湿度、温湿度和空气品质，空气品质可以是二氧化碳浓度等。
在本实施例中，所述传感器模块5为用于对室内温湿度进行调节的温湿度传感器模块。如图1所示，用户将温湿度传感器模块通过所述盒体上成型的穿透盒身的插孔41部分插入到所述盒体的内部，使温湿度传感器模块与盒体内部的主线路板电连接，从而能够实现对温湿度的调节；当用户需要改变温控器功能时，如图5所示，将温湿度传感器模块从插孔41中拔出，然后根据需要更换适合的传感器模块。需要说明的是，在本实施例中，温湿度传感器模块采用部分插入的结构形式，但是本实用新型并不限于此，在其他实施例中，温湿度传感器模块还可以成型为全部插入到盒体内部的结构形式。
本实施例的温湿度传感器模块通过采用了类似于U盘的可插入拔出的结构形式，使得用户可以根据自身需求自由选择购买传感器模块，在需要改变温控器功能时只需更换传感器模块即可实现，而不必购买多个温控器才能满足需求，采用模块化的传感器使得本实施例的温控器功能多样化，且降低了用户的购买成本。
进一步地，在本实施例中，如图3所示，所述传感器模块5包括能够部分插入到所述盒体内部的线路板51、设置在所述线路板51插入端上，用于电连接所述主线路板1的芯片52，以及包围在所述线路板51外部的模块壳套，所述模块壳套上成型有若干个散热孔55，通过散热孔55的设置实现了盒体内部与盒体外部的空气流通，保证了温湿度传感器模块在工作中不会由于温度过高而降低检测的准确度。
在本实施例中，为了保证温湿度传感器模块从所述插孔41中插入后不会出现晃动，如图3和图4所示，所述模块壳套与所述盒体之间成型有用于所述传感器模块5部分插入所述插孔41后固定所述传感器模块5的卡接结构。通过卡接结构的设置使得温湿度传感器模块插入到盒体内部后不晃动，保证温控器的工作可靠性；另外，卡接结构的设置使得温湿度传感器模块在拔出时也较方便，便于用户更换其它传感器模块。
具体地，如图4所示，所述卡接结构包括成型在所述模块壳套上的卡钩531以及成型在所述盒体上适于与所述卡钩531卡接配合的卡槽43。
在本实施例中，为了温湿度传感器模块装配方便，如图3所示，所述模块壳套包括所述传感器模块5部分插入到所述插孔41后扣合在所述插孔41上的壳套底座53以及盖在所述壳套底座53上的壳套盖板54，所述壳套底座53和所述壳套盖板54上均成型有若干个所述散热孔55。
另外，在本实施例中，如图1所示，所述盒体包括可拆卸的面板3和底座4，所述底座4其中一侧壁上成型有所述插孔41。
在本实施例中，温湿度传感器模块与主线路板1采用间接连接的方式，具体为，如图2所示，所述线路板51的插入端在插入所述盒体内部后位于所述主线路板1的下方，所述线路板51的插入端之间设置有连接所述芯片52和所述主线路板1的连接器6。
实施例二
作为实施例一中温湿度传感器的一种可替换形式，如图6所示，本实施例中采用的传感器模块5为温湿度和空气品质传感器模块，采用温湿度和空气品质传感器模块的温控器可以应用于新风系统中，用于对室内温湿度以及包括二氧化碳浓度在内的空气品质的调节。
显然，上述实施例仅仅是为清楚地说明所作的举例，而并非对实施方式的限定。对于所属领域的普通技术人员来说，在上述说明的基础上还可以做出其它不同形式的变化或变动。这里无需也无法对所有的实施方式予以穷举。而由此所引申出的显而易见的变化或变动仍处于本实用新型创造的保护范围之中。
Claims (9)
1.一种模块化温控器,包括盒体、安装在所述盒体内部的主线路板(1)，以及安装在所述盒体下方的电源盒(2)，其特征在于：所述盒体上成型有穿透盒身以使盒体外部与盒体内部相通的插孔(41)；所述温控器还包括可以通过所述插孔(41)至少部分插入到所述盒体内部或从所述盒体内部拔出的传感器模块(5)，所述传感器模块(5)在插入到所述盒体内部后与所述主线路板(1)电连接，从而实现对所需控制因素进行调节。
2.根据权利要求1所述的模块化温控器，其特征在于：所述传感器模块(5)包括能够部分插入到所述盒体内部的线路板(51)、设置在所述线路板(51)插入端上，用于电连接所述主线路板(1)的芯片(52)，以及包围在所述线路板(51)外部的模块壳套，所述模块壳套上成型有若干个散热孔(55)。
3.根据权利要求2所述的模块化温控器，其特征在于：所述模块壳套与所述盒体之间成型有用于所述传感器模块(5)部分插入所述插孔(41)后固定所述传感器模块(5)的卡接结构。
4.根据权利要求3所述的模块化温控器，其特征在于：所述卡接结构包括成型在所述模块壳套上的卡钩(531)以及成型在所述盒体上适于与所述卡钩(531)卡接配合的卡槽(43)。
5.根据权利要求4所述的模块化温控器，其特征在于：所述模块壳套包括所述传感器模块(5)部分插入到所述插孔(41)后扣合在所述插孔(41)上的壳套底座(53)以及盖在所述壳套底座(53)上的壳套盖板(54)，所述壳套底座(53)和所述壳套盖板(54)上均成型有若干个所述散热孔(55)。
6.根据权利要求1-5中任一项所述的模块化温控器，其特征在于：所述盒体包括可拆卸的面板(3)和底座(4)，所述底座(4)其中一侧壁上成型有所述插孔(41)。
7.根据权利要求6所述的模块化温控器，其特征在于：所述线路板(51)的插入端在插入所述盒体内部后位于所述主线路板(1)的下方，所述线路板(51)的插入端之间设置有连接所述芯片(52)和所述主线路板(1)的连接器(6)。
8.根据权利要求7所述的模块化温控器，其特征在于：所述传感器模块(5)为温湿度传感器模块。
9.根据权利要求7所述的模块化温控器，其特征在于：所述传感器模块(5)为温湿度和空气品质传感器模块。
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Cited By (49)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| CN107390738A (zh) * | 2016-05-17 | 2017-11-24 | 北京海林节能科技股份有限公司 | 温控器固定装置 |
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2014
- 2014-04-29 CN CN201420216754.6U patent/CN203786580U/zh not_active Expired - Fee Related
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Effective date of registration: 20160706 Address after: Wenzhou City, Zhejiang Province in 325026 Port Industrial Zone No. 300 Hua Lu Ling Patentee after: ZHEJIANG MENRED COMFORT SYSTEM Co.,Ltd. Address before: 325600, No. twenty, No. 222, Yueqing Economic Development Zone, Zhejiang, Wenzhou Patentee before: MENRED GROUP Co.,Ltd. |
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