CN203773561U - Fingerprint recognition device and electronic device including same - Google Patents

Abstract

The utility model provides a fingerprint identification device and contain its electron device. The fingerprint identification device comprises a fingerprint input module and a fingerprint identification module; wherein the fingerprint identification module comprises: the dielectric layer comprises grid-shaped grooves, and conductive materials are filled in the grid-shaped grooves; and the driving channels and the sensing channels are respectively contained in the latticed grooves and are arranged on different planes of the dielectric layer, the driving channels extend along a first dimension direction, the sensing channels extend along a second dimension direction intersecting with the first dimension direction, and the driving channels and the sensing channels are separated through the dielectric layer and are crossed to form a plurality of identification units.

Description

Fingerprint recognition device and electronic device including same

technical field

The utility model relates to fingerprint identification technology, in particular to a fingerprint identification device and an electronic device containing the same.

Background technique

In recent years, with the development of storage technology, electronic devices such as mobile phones and computers store a large amount of personal information and other important data, and its security has become more important. At present, passwords, graphics and other forms are often used to realize the password protection of its electronic equipment, that is, users set personal password protection by inputting numbers, letters and combinations thereof in advance, or by inputting specific graphics into electronic equipment; When using the electronic device, these passwords or graphics are input again, and the electronic device verifies the legitimacy of the user's identity by comparing with the preset password or graphics, thereby protecting the user's privacy.

However, for encryption methods such as passwords and graphics, users need to remember the set passwords. In addition, there is a danger of password leakage in public places; and in order to improve security, it is often necessary to increase the complexity of passwords and graphics, which is undoubtedly This further increases the difficulty of user memory, causing conflicts between security and ease of use.

The uneven lines on the surface of the finger are composed of ridge lines. Fingerprint recognition uses the uniqueness and stability of fingerprints to realize identity recognition, and fingerprints do not require user memory and are easy to carry. The current fingerprint recognition methods mainly include image feature recognition, laser feature recognition and sliding capacitive sensing. Image feature recognition and laser feature recognition use visible light and laser to extract fingerprint ridge line information respectively, and use algorithms for feature analysis to identify different individuals; both methods require more complex spatial structures such as CCD probes and laser generators. Not suitable for light and thin applications. Traditional sliding capacitive sensors are common in notebook computers, and fingerprint information is scanned through the sensing surface of the finger sliding sensor. Fingerprint recognition speed and space simplification are better than the former two, but it is also not suitable for the future consumer electronics field that has a huge market and requires high integration, flexibility, and light transmission.

However, the structure of the capacitive fingerprint sensor in the prior art is a silicon substrate structure, and its driving electrodes and sensing electrodes are ITO structures, that is, conductive materials are directly coated on the substrate to form conductive patterns, so that the amount of conductive materials used is large. , and is easy to wear; in addition, the conductive material used in the prior art is indium tin oxide, and indium in indium tin oxide is a rare metal and is expensive.

Utility model content

In view of this, the utility model provides a fingerprint identification device with simple structure and high fingerprint identification accuracy.

Additional aspects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

One aspect of the utility model provides a fingerprint identification device, including a fingerprint input module and a fingerprint identification module, characterized in that, the fingerprint identification module includes: a dielectric layer, the dielectric layer includes grid-shaped grooves, and the mesh The grid-shaped grooves are filled with conductive material; and, a plurality of driving channels and a plurality of sensing channels, the plurality of driving channels and the plurality of sensing channels are respectively accommodated in the grid-shaped grooves, and arranged on different planes of the dielectric layer, the drive channel is extended along the first dimension, the sensing channel is extended along the second dimension intersecting the first dimension, and the drive channel and The sensing channels are separated by the dielectric layer and intersect to form a plurality of identification units; wherein, the width of each of the driving channels and each of the sensing channels is not greater than 100 μm. .

In one embodiment, the distance between adjacent driving channels and between adjacent sensing channels is no greater than 100 μm.

In another embodiment, the dielectric layer is a single substrate; the driving channel and the sensing channel are separately disposed on different surfaces of the substrate.

In yet another embodiment, the dielectric layer is a stacked structure, including a first matrix layer, a base, and a second matrix layer stacked in sequence; the driving channel and the sensing channel are separately arranged on the first matrix layer A surface on a side away from the base and a surface on a side of the second matrix layer away from the base.

In yet another embodiment, the dielectric layer is a stacked structure, including a matrix layer and a substrate stacked in sequence; the driving channel and the sensing channel are separately arranged on the surface of the matrix layer away from the substrate and The surface of the base near the side of the matrix layer.

In yet another embodiment, the dielectric layer is a stacked structure, including a first matrix layer, a second matrix layer and a substrate stacked in sequence; the driving channel and the sensing channel are separately arranged on the first matrix layer The surface on the side away from the second matrix layer and the surface on the side of the second matrix layer away from the base.

In yet another embodiment, the dielectric layer is a stacked structure, including a first substrate, an adhesive layer, and a second substrate stacked in sequence; the driving channel and the sensing channel are separately arranged on the first substrate away from the other The surface on the side of the second base and the surface on the side of the second base away from the first base.

In yet another embodiment, the dielectric layer is a stacked structure, including a first matrix layer, a first substrate, an adhesive layer, a second substrate, and a second matrix layer stacked in sequence; the driving channel and the sensing The channel is separately arranged on the surface of the first matrix layer away from the first base and the surface of the second matrix layer away from the second base.

In yet another embodiment, the fingerprint identification module further includes a plurality of lead wires, and each of the driving channels and each of the sensing channels is electrically connected to one of the lead wires.

In yet another embodiment, the plurality of lead wires are grid-like groove structures, or raised grid-like conductive lines or conductive line segments.

In yet another embodiment, the grid shape of the grid-like groove is a regular grid or a random grid.

Another aspect of the utility model provides an electronic device, including any one of the above-mentioned fingerprint identification devices.

The fingerprint identification device provided by the embodiment of the utility model adopts a groove-shaped metal grid structure, and the conductive material is filled in the groove, which saves the conductive material and improves the anti-scratch and anti-scratch ability of the fingerprint identification device; and the filled The conductive material is mainly metal silver, etc., which is cheap and reduces the manufacturing cost. In addition, the fingerprint identification device has a grid-shaped groove on the dielectric layer of the fingerprint identification module, and the driving channel and the sensing channel are respectively accommodated in the grid-shaped grooves on different surfaces of the dielectric layer. The driving channel and the sensing channel The maximum width of each is not greater than 100 μm, and the distance between adjacent driving channels or adjacent sensing channels is not greater than 100 μm, which ensures that when the finger is placed on the fingerprint input module, there can be as many recognition units as possible at the same time. Sensing the ridge line of the fingerprint improves the accuracy and precision of fingerprint identification; in addition, the fingerprint information does not need to be memorized by the user and is easy to carry, which solves the contradiction between the safety and ease of use of electronic equipment.

Description of drawings

The above and other features and advantages of the present invention will become more apparent by describing in detail example embodiments thereof with reference to the accompanying drawings.

Fig. 1 is a schematic cross-sectional view of a fingerprint identification device provided by an embodiment of the present invention;

Fig. 2A and Fig. 2B are respectively the plane schematic diagram and the cross-sectional schematic diagram of the fingerprint recognition module in the utility model embodiment;

3A and 3B are schematic plan views of the driving channel and the sensing channel in the embodiment of the present invention, respectively;

Fig. 4 is another schematic plan view of the fingerprint identification module in the embodiment of the present invention;

5 is a top view of the fingerprint identification device shown in FIG. 1;

6 is a schematic cross-sectional view of the fingerprint identification module in Embodiment 1 of the present invention;

7A and 7B are schematic cross-sectional views of fingerprint identification modules in different embodiments in Embodiment 2 of the present invention;

Fig. 8 is a schematic cross-sectional view of the fingerprint identification module in Embodiment 3 of the present invention;

9A and 9B are schematic cross-sectional views of fingerprint identification modules in different embodiments in Embodiment 4 of the present invention;

Fig. 10 is a schematic cross-sectional view of the fingerprint identification module in Embodiment 5 of the present invention;

Fig. 11 is a schematic cross-sectional view of the fingerprint identification module in Embodiment 6 of the present invention;

12A to 12D are schematic diagrams of the grid shape of the grid-shaped grooves of the fingerprint identification module in the embodiment of the present invention.

Detailed ways

Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully incorporate the concepts of example embodiments. communicated to those skilled in the art. In the drawings, the thickness of regions and layers are exaggerated for clarity. The same reference numerals denote the same or similar structures in the drawings, and thus their repeated descriptions will be omitted.

The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided in order to give a thorough understanding of embodiments of the invention. However, those skilled in the art should appreciate that the technical solutions of the present invention can also be practiced without one or more of the specific details, or with other methods, components, materials, etc. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring the invention.

It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illustration only. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

FIG. 1 is a schematic cross-sectional view of a fingerprint recognition device provided by an embodiment of the present invention. As shown in FIG. 1 , the fingerprint identification device 10 in the embodiment of the present invention includes a fingerprint input module 11 and a fingerprint identification module 13 , and the fingerprint input module 11 and the fingerprint identification module 13 are bonded by an adhesive layer 12 .

The fingerprint input module 11 is a panel for fingerprint input. The material of the fingerprint input module 11 can be non-conductive materials such as transparent or non-transparent plastic or glass. Specifically, in this embodiment, the fingerprint input module 11 is PMMA with a thickness of 1.0-1.5 mm. The shape of the fingerprint input module 11 can be set as required, and can be other shapes such as square, rectangle, circle, etc. The shape of the input panel 11 shown in FIG. 5 is a square.

The adhesive layer 12 is transparent optical glue, such as OCA optical glue or transparent UV glue. Specifically, in this embodiment, OCA optical glue is used with a thickness of 25 μm to reduce the thickness of the overall device.

Please refer to FIG. 2A , FIG. 2B to FIG. 4 together. FIG. 2A and FIG. 2B are respectively a schematic plan view and a schematic cross-sectional view of the fingerprint identification module in the embodiment of the present invention. 3A and 3B are schematic plan views of the driving channel and the sensing channel in the embodiment of the present invention, respectively. Fig. 4 is another schematic plan view of the fingerprint recognition module in the embodiment of the present invention. As shown in FIG. 2B , the fingerprint identification module 13 includes a dielectric layer 100 , a driving channel 14 and a sensing channel 15 . The dielectric layer 100 includes grid-like grooves 131 . The driving channel 14 and the sensing channel 15 are accommodated in the grid-like groove 131 and the grid-like groove 131 is filled with conductive material, such as metals such as silver, copper, gold, aluminum or combinations thereof.

In order to cooperate with the external IC circuit, the drive channel 14 and the sensing channel 15 are designed as different conductive patterns, such as strips as shown in Figure 2A or rhombuses as shown in Figure 4, or other graphics, and the utility model does not rely on This is the limit.

When the finger is in contact with the fingerprint recognition device, the actual distance between the ridge and the valley is different, which means that the generated capacitance value is different, and its value is at the picofarad (pF) level, so the current signal it transmits is also different. These weak current signal differences are amplified by the IC processing chip to determine the ridges and valleys of the fingerprint. As shown in FIG. 2A, the drive channel 14 is extended along the first dimension, and the sensing channel 15 is extended along the second direction intersecting the first dimension. The first dimension is the X-axis direction, and the second dimension is Y-axis direction. In FIG. 4 , the first dimensional direction is the Y axis, the second dimensional direction is the X axis, and the first dimensional direction is perpendicular to the second dimensional direction. The driving channel 14 and the sensing channel 15 are separated by a dielectric layer 100 and vertically intersect to form a plurality of identification units 180 (the circles in the figure are only circles showing the positions of the identification units and have no other meaning). Each identification unit 180 detects the current signals in the identification unit, and transmits these current signals to the IC processing chip, and detects the positions of the ridges and valleys according to the difference of the current signals, so as to outline the lines and veins of human fingers, and then By comparing with the pre-stored fingerprint, the identification of the user's identity can be realized.

Since the width of the ridges and valleys of human fingerprints is roughly between 150-300 μm, in the present utility model, the maximum width of the driving channel and the sensing channel is not more than 100 μm, that is, the width L1 of the driving channel in Figure 3A And the width L2 of the sensing channel in Figure 3B is not greater than 100 μm, which can ensure that the number of ridges or valleys that can be sensed in a single identification unit is not more than 1, so that the same detection coordinate can only correspond to one ridge or one The position of the valley; and the distance S1 between adjacent driving channels and the distance S2 between adjacent sensing channels are not greater than 100 μm. Please refer to FIG. 2A and FIG. 2B again. When the hand 18 is placed on the fingerprint input module 13, the distance between adjacent driving channels and adjacent sensing channels is less than 100 μm, that is, the distance between adjacent identification units 180 It is less than 100 μm, which ensures that 2-5 identification units can sense different capacitance signals at the same time to determine the position of the ridge or valley. Compared with the original single unit reflecting the position of the ridge or valley, it can accurately sense fingerprints The input signal improves the accuracy and sensitivity of the fingerprint identification device.

For the conductive pattern shown in Figure 4, preferably, the maximum width of the driving channel 14 and the sensing channel 15 is not greater than 100 μm, and the maximum width of the driving channel 14 and the sensing channel 15 is the length L3 of the diagonal line of the rhombus, which is relatively The maximum distance between adjacent driving channels or between adjacent sensing channels is the distance S3 between the connecting parts of the diamond pattern not greater than 100 μm.

FIG. 5 is a top view of the fingerprint identification device shown in FIG. 1 . As shown in Figure 5, the fingerprint identification device 10 also includes a lead set 16, the lead set 16 is connected to an external IC processing chip (not shown), the fingerprint identification device 10 receives the fingerprint input signal, and passes the fingerprint input signal through the lead set 16. Send to the external IC processing chip.

The driving channel 14 or the sensing channel 15 is connected to the lead group 16 through respective leads, each driving channel 14 or each sensing channel 15 is electrically connected to a corresponding driving lead or sensing lead, and adjacent driving channels 14 or adjacent The sensing channels 15 are insulated. As shown in FIG. 2A or FIG. 4 , insulation between adjacent driving channels 14 or adjacent sensing channels 15 is shown in blanks. In other embodiments, the same grid as that of the driving channel 14 or the sensing channel 15 can also be filled, that is, the grid lines of the grid are disconnected from the grid lines of the driving channel 14 or the sensing channel 15, or the grid lines The gridlines of the grid are the gridlines that are disconnected from each other.

The fingerprint identification device 10 provided by the utility model can be set in the structure or casing of electronic equipment or other equipment, such as in the buttons of a mobile phone or a tablet computer, for locking or unlocking the electronic equipment. At this time, if the fingerprint recognition device 10 is located in an invisible area of the device, its dielectric layer 100 may be a non-transparent insulating material. In addition, the fingerprint identification device 10 can also be configured in the visible area of electronic equipment, that is, used in conjunction with the display part of the electronic equipment, for identity authentication during the operation of the electronic equipment system, such as bank account security verification, and its dielectric layer 100 is a transparent insulating material.

In some embodiments, the fingerprint identification module has different structures, which will be described in detail below.

Embodiment one

FIG. 6 is a schematic cross-sectional view of the fingerprint identification module in Embodiment 1 of the present invention. As shown in FIG. 6 , the fingerprint identification module 13 includes a dielectric layer 100 , a driving channel 14 and a sensing channel 15 . In this embodiment, the dielectric layer 100 is a single substrate. The substrate 100 includes a first surface and a second surface opposite to the first surface, and the first surface and the second surface are respectively provided with grid-like grooves 131 . The driving channel 14 and the sensing channel 15 are accommodated in the grid-shaped groove 131 . In order to ensure the accuracy of fingerprint recognition, in this embodiment, preferably, the maximum width of the driving channel 14 and the sensing channel 15 is 50 μm; the maximum distance between adjacent driving channels 14 or between adjacent sensing channels 15 is 10 μm.

As shown in FIG. 6, the grid-shaped grooves 131 are filled with conductive material, and the driving channel 14 and the sensing channel 15 are respectively formed on the first surface and the second surface of the dielectric layer 100 through the design of the conductive pattern, so as to cooperate with the external IC circuits. As shown in FIG. 3A , the driving channel 14 is designed as a horizontal strip; as shown in FIG. 3B , the sensing channel 15 is designed as a vertical strip, which is separated from the driving channel 14 by the dielectric layer 100 and is vertical.

The above-mentioned fingerprint recognition module 13 also includes lead electrodes 17 . As shown in FIG. 6 , grid-shaped grooves 132 are opened in the edge-invisible region of the dielectric layer 110 , and the lead electrodes 17 are accommodated in the grid-shaped grooves 132 . The lead electrodes 17 are respectively electrically connected to the driving channel 14 and the sensing channel 15 of the fingerprint recognition module 13 , and connected to the lead wire group 16 . At the same time, the lead electrodes 17 can be screen printed or inkjet printed to form raised grid-shaped conductive lines or conductive line segments on the surface of the dielectric layer 110 . The minimum width of the raised grid-shaped conductive lines or conductive line segments may be 10 μm to 200 μm, and the height may be 5 μm to 10 μm.

The grid-shaped grooves 131 and 132 have a width of 0.2 μm˜5 μm and a depth of 2 μm˜6 μm, and the ratio of the depth to the width is greater than 1. The grid shape of the grid-like groove 131 is a regular or irregular grid, as shown in Figure 12A to Figure 12D, the grid shape of the grid-like groove 131 can be regular hexagon, square, rhombus, rectangle, Any of a parallelogram, a curved quadrilateral, or a random mesh. Correspondingly, the grid shape of the driving channel 14 and the sensing channel 15 may be a regular hexagon, square, rhombus, rectangle, parallelogram, curved quadrilateral or a random grid shape.

Furthermore, in order to reduce the overall thickness of the device, in this embodiment, the thickness of the dielectric layer is less than 200 μm.

Embodiment two

FIG. 7A and FIG. 7B are cross-sectional schematic diagrams of fingerprint identification modules in different embodiments in Embodiment 2 of the present invention. In this embodiment, the fingerprint identification module 23 includes a dielectric layer 200 , a driving channel 24 and a sensing channel 25 . The dielectric layer 200 is a stacked structure. The dielectric layer 200 includes a first matrix layer 211, a base 210 and a second matrix layer 221 stacked in sequence. The surface on one side of the substrate 210 is provided with grid-shaped grooves 231, and the driving channel 24 and the sensing channel 25 are accommodated in the grid-shaped grooves 231. Through the design of the conductive pattern, on the side of the first matrix layer 211 away from the substrate 210 The driving channel 24 and the sensing channel 25 are respectively formed on the surface and the surface of the second matrix layer 221 away from the substrate 210. The patterns of the driving channel 24 and the sensing channel 25 can be strips, as shown in FIG. 2A , or diamonds. , as shown in FIG. 4 , can also be other patterns; in order to ensure the accuracy of fingerprint recognition, the maximum width of the driving channel 24 and the sensing channel 25 is not greater than 100 μm, between adjacent driving channels 24 or between adjacent sensing channels 25 The maximum distance between them is not more than 100 μm. In this embodiment, preferably, the maximum width of the driving channel 24 and the sensing channel 25 is 60 μm, and the maximum distance between adjacent driving channels 24 or adjacent sensing channels 25 is 20 μm. .

The fingerprint identification module 23 also includes lead electrodes 27 . As shown in FIG. 7A , grid-shaped grooves 232 are formed in the edge-invisible regions of the first substrate layer 211 and the second substrate layer 221 , and the lead electrodes 27 are accommodated in the grid-shaped grooves 232 . The lead electrodes 27 are respectively electrically connected to the driving channel 24 and the sensing channel 25 , and connected to the lead group 16 as shown in FIG. 5 . As shown in FIG. 7B , the lead electrodes 27 can also be screen printed or inkjet printed to form raised grid-shaped conductive lines or conductive line segments on the surface of the first matrix layer 211 or the second matrix layer 221 . The minimum width of the raised grid-shaped conductive lines or conductive line segments may be 10 μm to 200 μm, and the height may be 5 μm to 10 μm.

Other structures of the fingerprint identification device described in this embodiment are similar to those described in Embodiment 1, and will not be repeated here.

Embodiment Three

Fig. 8 is a schematic cross-sectional view of the fingerprint identification module in the third embodiment of the present invention. In this embodiment, the fingerprint identification module 33 includes a dielectric layer 300 and an identification layer. The dielectric layer 300 is a stacked structure, including a substrate 310 and a matrix layer 311 stacked in sequence. The identification layer includes a driving channel 34 and a sensing channel 35. The surface of the matrix layer 311 away from the substrate 310 and the surface of the substrate 310 close to the matrix layer 311 are respectively provided with grid-shaped grooves 331, and the identification layer is accommodated in the grid. In the groove 331, the driving channel 34 and the sensing channel 35 are respectively formed on the surface of the matrix layer 311 away from the substrate 310 and on the surface of the substrate 310 close to the substrate 311 through conductive pattern design. The patterns of the driving channels 34 and the sensing channels 35 can be strips as shown in FIG. 2A , diamonds as shown in FIG. 4 , or other patterns. To ensure the accuracy of fingerprint recognition, the maximum width of the driving channel 34 and the sensing channel 35 is not greater than 100 μm, and the maximum distance between adjacent driving channels 34 or between adjacent sensing channels 35 is not greater than 100 μm. In this embodiment, preferably, the maximum width of the driving channel 34 and the sensing channel 35 is 70 μm, and the maximum distance between adjacent driving channels 34 or between adjacent driving channels 35 is 30 μm.

The above-mentioned fingerprint recognition module 33 also includes lead electrodes 37 . As shown in FIG. 8 , grid-shaped grooves 332 are formed in the edge-invisible region of the matrix layer 311 and the substrate 310 , and the lead electrodes 37 are accommodated in the grid-shaped grooves 332 . The lead electrodes 37 are respectively electrically connected to the driving channel 34 and the sensing channel 35 , and connected to the lead group 16 as shown in FIG. 5 . In addition, the lead electrodes 37 can also be screen printed or inkjet printed to form raised grid-shaped conductive lines or conductive line segments on the surface of the matrix layer 311 or the substrate 310 (not shown in the figure). The minimum width of the raised grid-shaped conductive lines or conductive line segments may be 10 μm to 200 μm, and the height may be 5 μm to 10 μm.

Other structures of the fingerprint identification device described in this embodiment are similar to those described in Embodiment 1, and will not be repeated here.

Embodiment Four

FIG. 9A and FIG. 9B are cross-sectional schematic diagrams of fingerprint recognition modules in different embodiments in Embodiment 4 of the present utility model. In this embodiment, the fingerprint identification module 43 includes a dielectric layer 400 and an identification layer. The dielectric layer 400 is a stacked structure, including a substrate 410, a second matrix layer 421 and a first matrix layer 411 stacked in sequence, the identification layer includes a driving channel 44 and a sensing channel 45, and the first matrix layer 411 is away from the side of the substrate 410 The surface and the surface of the second matrix layer 421 away from the base 410 are respectively provided with grid-shaped grooves 431 , and the identification layer is accommodated in the grid-shaped grooves 431 . Through the conductive pattern design, the driving channel 44 and the sensing channel 45 are respectively formed on the surface of the first matrix layer 411 away from the substrate 410 and the surface of the second matrix layer 421 away from the substrate 410, and the driving channel 44 and the sensing channel 45 are respectively formed. The pattern of the channels 45 may be strips as shown in FIG. 2A , diamonds as shown in FIG. 4 , or other patterns. In order to ensure the accuracy of fingerprint recognition, the maximum width of the driving channel 44 and the sensing channel 45 is not greater than 100 μm, and the maximum distance between adjacent driving channels 44 or between adjacent sensing channels 45 is not greater than 100 μm. In this embodiment , preferably, the maximum width of the driving channel 44 and the sensing channel 45 is 80 μm, and the maximum distance between adjacent driving channels 44 or between adjacent driving channels 45 is 40 μm.

The above-mentioned fingerprint recognition module 43 also includes lead electrodes 47 . As shown in FIG. 9A , the first matrix layer 411 and the second matrix layer 421 are provided with grid-shaped grooves 432 in the invisible region away from the edge of the substrate 410 , and the lead electrodes 47 are accommodated in the grid-shaped grooves 432 . The lead electrodes 47 are respectively electrically connected to the driving channel 44 and the sensing channel 45 , and connected to the lead group 16 as shown in FIG. 5 . In addition, as shown in FIG. 9B , the lead electrodes 47 can be screen printed or inkjet printed to form raised grid-like conductive lines or conductive wires on the surfaces of the first matrix layer 411 and the second matrix layer 421 away from the substrate 410, respectively. Line segment 47. The minimum width of the raised grid-shaped conductive lines or conductive line segments may be 10 μm to 200 μm, and the height may be 5 μm to 10 μm.

Embodiment five

FIG. 10 is a schematic cross-sectional view of the fingerprint identification module in Embodiment 5 of the present invention. In this embodiment, the fingerprint identification module 53 includes a dielectric layer 500 and an identification layer. The dielectric layer 500 is a stacked structure, including a first substrate 510 , an adhesive layer (with oblique lines in the figure) and a second substrate 520 stacked in sequence. The recognition layer includes drive channels 54 and sense channels 55 . Grid-shaped grooves 531 are respectively defined on the surface of the first base 510 away from the adhesive layer and the surface of the second base 520 away from the adhesive layer, and the identification layer is accommodated in the grid-shaped grooves 531 . Through the conductive pattern design, the driving channel 54 and the sensing channel 55 are respectively formed on the surface of the first substrate 510 away from the adhesive layer and the surface of the second substrate away from the adhesive layer. The patterns of the driving channels 54 and the sensing channels 55 can be strips as shown in FIG. 2A , diamonds as shown in FIG. 4 , or other patterns. In order to ensure the accuracy of fingerprint recognition, the maximum width of the driving channel 54 and the sensing channel 55 is not greater than 100 μm, and the maximum distance between adjacent driving channels 54 or between adjacent sensing channels 55 is not greater than 100 μm. In this embodiment , preferably, the maximum width of the driving channel 54 and the sensing channel 55 is 40 μm, and the maximum distance between adjacent driving channels 54 or between adjacent driving channels 55 is 10 μm.

The above-mentioned fingerprint recognition module 53 also includes lead electrodes 57 . As shown in FIG. 10 , the first substrate 510 and the second substrate 520 are away from the edge of the adhesive layer—invisible regions are respectively provided with grid-shaped grooves 532, and the lead electrodes 57 are accommodated in the grid-shaped grooves 532, as shown in FIG. 10 shown. The lead electrodes 57 are respectively electrically connected to the driving channel 54 and the sensing channel 55 , and connected to the lead group 16 as shown in FIG. 5 . In addition, the lead electrodes 57 can also be screen printed or inkjet printed to form raised grid-shaped conductive lines or conductive line segments on the surfaces of the first substrate 510 and the second substrate 520 away from the adhesive layer (not shown in the figure). ). The minimum width of the raised grid-shaped conductive lines or conductive line segments may be 10 μm to 200 μm, and the height may be 5 μm to 10 μm.

Other structures of the fingerprint identification device described in this embodiment are similar to those described in Embodiment 1, and will not be repeated here.

Embodiment six

Fig. 11 is a schematic cross-sectional view of the fingerprint identification module in Embodiment 6 of the present invention. In this embodiment, the fingerprint identification module 63 includes a dielectric layer 600 and an identification layer. The dielectric layer 600 is a stacked structure, including a first substrate layer 611 , a first substrate 610 , an adhesive layer (the hatched part in the figure), a second substrate 620 and a second substrate layer 621 stacked in sequence. The recognition layer includes a driving channel 64 and a sensing channel 65, and the surface of the first matrix layer 611 away from the first substrate 610 and the surface of the second matrix layer 621 away from the second substrate 620 are respectively provided with grid-shaped grooves. 631, the identification layer is accommodated in the grid-shaped groove 631, designed with a conductive pattern, on the surface of the first matrix layer 611 away from the first substrate 610 and the surface of the second matrix layer 621 away from the second substrate 620 The driving channel 64 and the sensing channel 65 are respectively formed on the top; the patterns of the driving channel 64 and the sensing channel 65 can be strips as shown in FIG. 2A , diamonds as shown in FIG. 4 , or other patterns. To ensure the accuracy of fingerprint recognition, the maximum width of the driving channel 64 and the sensing channel 65 is not greater than 100 μm, and the maximum distance between adjacent driving channels 64 or between adjacent sensing channels 65 is not greater than 100 μm. In this embodiment, preferably, the maximum width of the driving channel 64 and the sensing channel 65 is 45 μm, and the maximum distance between adjacent driving channels 64 or between adjacent driving channels 65 is 15 μm.

The above-mentioned fingerprint recognition module 63 also includes lead electrodes 67 . As shown in FIG. 11 , the lead electrodes 67 can be screen printed or inkjet printed to form a raised network on the surfaces of the first matrix layer 611 and the second matrix layer 621 away from the first substrate 610 and away from the second substrate 620. Grid-shaped conductive wires or conductive wire segments 67 . The minimum width of the raised grid-shaped conductive lines or conductive line segments may be 10 μm to 200 μm, and the height may be 5 μm to 10 μm. In addition, grid-shaped grooves can also be respectively set in the invisible regions of the edge of the first substrate layer 611 away from the first substrate 610 and the edge of the second substrate layer 621 away from the second substrate 620, and the lead electrodes 67 are accommodated in the grid. in the groove (not shown in the figure). The lead electrodes 67 are respectively electrically connected to the driving channel 64 and the sensing channel 65 , and connected to the lead set 16 as shown in FIG. 5 .

Other structures of the fingerprint identification device described in this embodiment are similar to those described in Embodiment 1, and will not be repeated here.

The fingerprint identification device provided by the embodiment of the utility model adopts a groove-shaped metal grid structure, and the conductive material is filled in the groove, which saves the conductive material and improves the anti-scratch and anti-scratch ability of the fingerprint identification device; and the filled The conductive material is mainly metal silver, etc., which is cheap and reduces the manufacturing cost. In addition, the fingerprint identification device has a grid-shaped groove on the dielectric layer of the fingerprint identification module, and the driving channel and the sensing channel are respectively accommodated in the grid-shaped grooves on different surfaces of the dielectric layer. The driving channel and the sensing channel The maximum width of each is not greater than 100 μm, and the distance between adjacent driving channels or adjacent sensing channels is not greater than 100 μm, which ensures that when the finger is placed on the fingerprint input module, there can be as many recognition units as possible at the same time. Sensing the ridge line of the fingerprint improves the accuracy and precision of fingerprint identification; in addition, the fingerprint information does not need to be memorized by the user and is easy to carry, which solves the contradiction between the safety and ease of use of electronic equipment.

Exemplary embodiments of the present utility model have been specifically shown and described above. It should be understood that the invention is not limited to the disclosed embodiments, but on the contrary, the invention is intended to cover various modifications and equivalents included within the scope of the appended claims.

Claims (12)

1. A fingerprint identification device, comprising a fingerprint input module and a fingerprint identification module, characterized in that, the fingerprint identification module comprises: a dielectric layer comprising a grid of grooves filled with a conductive material; and, A plurality of driving channels and a plurality of sensing channels, the plurality of driving channels and the plurality of sensing channels are respectively accommodated in the grid-shaped grooves and arranged on different planes of the dielectric layer, so The driving channel is extended along the first dimensional direction, the sensing channel is extended along the second dimensional direction intersecting with the first dimensional direction, the driving channel is separated from the sensing channel by the dielectric layer and Cross to form multiple identification units; Wherein, the width of each of the driving channels and each of the sensing channels is not greater than 100 μm. 2 . The fingerprint recognition device according to claim 1 , wherein the distances between adjacent driving channels and between adjacent sensing channels are no greater than 100 μm. 3 . The fingerprint identification device according to claim 1 , wherein the dielectric layer is a single substrate; the driving channel and the sensing channel are separately arranged on different surfaces of the substrate. 4 . 4. The fingerprint recognition device according to claim 1, characterized in that, the dielectric layer is a stacked structure, including a first matrix layer, a substrate, and a second matrix layer stacked in sequence; the drive channel and the sensor The measurement channels are separately arranged on the surface of the first matrix layer away from the base and the surface of the second matrix layer away from the base. 5. The fingerprint identification device according to claim 1, wherein the dielectric layer is a stacked structure, including a substrate layer and a substrate stacked in sequence; the driving channel and the sensing channel are separately arranged on the substrate The surface of the layer on the side away from the substrate and the surface of the substrate on the side of the substrate close to the substrate layer. 6. The fingerprint identification device according to claim 1, wherein the dielectric layer is a stacked structure, including a first matrix layer, a second matrix layer and a substrate stacked in sequence; the driving channel and the sensor The measurement channels are separately arranged on the surface of the first matrix layer away from the second matrix layer and the surface of the second matrix layer away from the base. 7. The fingerprint identification device according to claim 1, wherein the dielectric layer is a stacked structure, including a first substrate, an adhesive layer and a second substrate stacked in sequence; the driving channel and the sensing The channels are separately arranged on the surface of the first base away from the second base and the surface of the second base away from the first base. 8. The fingerprint identification device according to claim 1, wherein the dielectric layer is a stacked structure, comprising a first substrate layer, a first substrate, an adhesive layer, a second substrate and a second substrate layer stacked in sequence The driving channel and the sensing channel are respectively arranged on the surface of the first matrix layer away from the first substrate and the surface of the second matrix layer away from the second substrate. 9 . The fingerprint identification device according to claim 1 , wherein the fingerprint identification module further comprises a plurality of lead wires, and each of the driving channels and each of the sensing channels are respectively electrically connected to one of the lead wires. 10 . The fingerprint identification device according to claim 9 , wherein the plurality of lead wires are grid-like groove structures, or raised grid-like conductive lines or conductive line segments. 11 . 11. The fingerprint recognition device according to claim 1, characterized in that, the grid shape of the grid-like groove is a regular grid or a random grid. 12. An electronic device, comprising the fingerprint recognition device according to any one of claims 1-11.