CN203754808U - Horizontally-arranged nozzle pipe structure for etching device - Google Patents
Horizontally-arranged nozzle pipe structure for etching device Download PDFInfo
- Publication number
- CN203754808U CN203754808U CN201320894206.4U CN201320894206U CN203754808U CN 203754808 U CN203754808 U CN 203754808U CN 201320894206 U CN201320894206 U CN 201320894206U CN 203754808 U CN203754808 U CN 203754808U
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- CN
- China
- Prior art keywords
- etching
- nozzle
- liquid
- shower nozzle
- nozzle bar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 238000005530 etching Methods 0.000 title claims abstract description 81
- 239000007788 liquid Substances 0.000 claims abstract description 40
- 230000000977 initiatory effect Effects 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 230000003247 decreasing effect Effects 0.000 claims description 3
- 239000007921 spray Substances 0.000 abstract description 21
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 238000001914 filtration Methods 0.000 abstract description 3
- 239000000243 solution Substances 0.000 description 11
- 230000000694 effects Effects 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 230000009471 action Effects 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 230000003628 erosive effect Effects 0.000 description 5
- 239000003153 chemical reaction reagent Substances 0.000 description 4
- 230000005484 gravity Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005086 pumping Methods 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000000889 atomisation Methods 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000002848 electrochemical method Methods 0.000 description 1
- 238000003487 electrochemical reaction Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The utility model relates to a horizontally-arranged nozzle pipe structure for an etching device. The reasonable distribution of pressure and flow of a liquid which is sprayed on a workpiece from different horizontal planes and different distances is realized through different spacing structures among liquid delivery pipes and among spray heads. The horizontally-arranged nozzle pipe structure comprises a distribution pipe, a plurality of liquid delivery pipes with spray heads and a plurality of spray heads, wherein the liquid inlet end of the distribution pipe is connected with an etching solution inlet pipe of an etching machine; the distribution pipe is communicated and provided with the plurality of horizontal and parallel liquid delivery pipes with spray heads; and each liquid delivery pipe is provided with the plurality of spray heads at intervals. The horizontally-arranged nozzle pipe structure not only can be used for solving the problem of etching nonuniformity caused by low etching speed at the upper part of a vertically-placed circuit board and high etching speed at the lower part of the vertically-placed circuit board, but also can be used for saving spray pipes, reducing the requirement for a liquid delivery pump and simplifying a liquid filtration and return structure and is beneficial to equipment space utilization.
Description
Technical field
The utility model belongs to etching machines field, and especially a kind of level for etching system is laid blast tube structure.
Background technology
Etching is selectively not protected material corrosion on workpiece to be removed with chemistry or electrochemical method, thereby on metal or other matrix, makes the technology of accurate figure, and it is exactly etching that subtractive process is manufactured one of most significant steps of circuit board technology.
Before etching; first on copper coated foil plate surface, carry out figure transfer; by the Copper Foil protectiveness material of conductive pattern part; be that resist covers, but not conductive pattern portions, outside the copper that will remove is exposed to; etching reagent and contacting with this part copper during etching; there is chemistry or electrochemical reaction, copper dissolution, in caustic solution, has been reached to the object of removing.
Circuit card etching machines passes plate with level at present, and vertical spray etching mode and equipment are main.Utilize pump that etching solution is sent into upper and lower spray header, atomisation particulate, sprays being eclipsed of workpiece with certain pressure and in facet, carries out etching.Workpiece is transmitted by travelling belt or roller-way, and etching is carried out continuously.Etching solution recycles.Spray-type etching machines is mainly by filtering and liquid storage part, and liquid sprays cyclic part, and workpiece transfer partly forms.On such equipment, etching reagent and workpiece all move, and the direction of etching reagent motion is consistent with the direction that need to cut material.Etching solution sprays from nozzle with certain pressure after being squeezed in spray pipeline by pump.Nozzle is divided into two groups of spray group and lower sprays, along plummet direction, installs and is arranged into array, and upper spray group is sprayed from the top down, and lower spray group is sprayed from the bottom up.
This kind equipment, upper and lower plates is convenient, and level of automation is high, is applicable to producing in enormous quantities, but has circuit card upper and lower surface etching speed and the inconsistent problem of quality.Due to the effect of gravity, the etching solution that is sprayed onto lower surface is easy to depart from etching face drippage, and solution exchange velocity is fast, constantly has new soln to contact with etching face, has reduced the chance of lateral erosion, and lateral erosion is less, thereby etching speed is fast, and etching quality is good.And the etching solution of upper surface needs horizontal flow to edge, could discharge, exchange is upgraded slow, the etching reagent residence time is long, in vertical etching to both sides etching, plate middle part particularly, liquid flows out especially difficulty, cause etching speed slow, and lateral erosion is serious.Such structure causes the etching of plate lower surface fast and good, top surface edge still can, and middle slow and poor.The vertical spray water of this class board device of flating pass, for fine wire circuit board making, there will be the excessive erosion of lower surface circuit, even open circuit, and the phenomenon that the copper that upper surface should remove is removed not yet is completely not suitable for high-precision circuit board and produces.
Publication number is the Chinese patent of 202272951U, a kind of vertical biography plate is disclosed, the engraving method of horizontal-jet and equipment, in this patent, circuit card vertically transmits, etching liquid along continuous straight runs sprays, and has avoided level to pass the defects such as pool effect, plate two facet etches that plate causes are inconsistent, has obvious advantage.Straight line open nozzles is arranged in etching chamber both sides according to certain rules, does not have transfer roller to stop, each nozzle, with certain pressure horizontal-jet etching solution, as the covering of the fan launching, intersects and is sprayed onto on plate face, and two sides spraying pressure is consistent.Circuit card, all the time in erectility, is beneficial to the mobile exchange of etching liquid, does not have slow, the ropy pond of the etching speed causing due to the liquid hold-up of upper surface middle part phenomenon.Circuit card vertically transmits, and does not have the difference of spraying up and down, and the pressure difference that does not have gravity to cause there will not be one side excessive erosion, another side undercut phenomenon.Therefore, circuit card two facet etch situations are identical, and etching speed is consistent.
Yet, although this patent has solved the identical problem of circuit card two facet etch situation,, adopt such structure still to have the difference of circuit card upper and lower etch effect.
According to this patent, when with pump when each blast tube pumping liquid of nozzle is housed, liquid flows from bottom to top, the nozzle opening of often flowing through, sprays by nozzle with regard to some liquid, the total liquid measure pumping out is shunted successively.Like this, during nethermost nozzle shunting, liquid measure is maximum, therefore the liquid pressure that nethermost nozzle gushes out and flow are just maximum, and during the shunting of nozzle above, the flow that liquid measure will be got than the nozzle below it is little, pressure and the flow of the liquid therefore gushing out also diminish.The like, the position of nozzle is more top, and the pressure of the liquid ejecting and flow are just less.When pumping pressure is not enough, nozzle has below been got most of flow, causes the spraying pressure of uppermost nozzle and injection flow not enough, therefore, by the jeting effect of upper nozzle, be not as good as the jeting effect of lower nozzle, be to cause a slow lower fast important factor on etching speed.
On the other hand, circuit card is put perpendicular to horizontal plane and injection direction, is positioned at the nozzle along continuous straight runs atomizing of liquids of different level, makes the etching speed phenomenon fast not as bottom etching speed in circuit card top more serious.Be positioned at the nozzle of higher level face, spray circuit plate top, be positioned at lower level face nozzle, the bottom of spray circuit plate, the liquid that is ejected into circuit card top is flowed downward by the effect of gravity, through the surface of circuit card bottom, like this, circuit card bottom had both been subject to the etching action of the liquid that corresponding nozzle ejection comes, and was also subject to the etching action of the liquid that flows from circuit card top, and therefore etched speed is faster than circuit card top.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art part, provides that a kind of to solve the circuit card top etching speed of vertically putting slow, and the level for etching system of the etching problem of non-uniform that bottom etching speed causes is soon laid blast tube structure.
The utility model is by the following technical solutions:
A kind of level for etching system is laid blast tube structure, by the different pitch structure between tubing and between shower nozzle, realization in different level and distance to the properly distributed of pressure and the flow of workpiece atomizing of liquids, comprise distribution piping, nozzle bar and shower nozzle, distribution piping liquid feeding end connects the etching solution water inlet pipe of etching machine, on distribution piping, be communicated with the nozzle bar that many horizontal parallel are installed, on each tubing, be arranged at intervals with a plurality of shower nozzles.
And the junction of described distribution piping and each nozzle bar is all provided with valve.
And, longitudinal pitch between described every two adjacent nozzle bars increases progressively from top to bottom successively, and the ratio increasing progressively is: spacing between arbitrary nozzle bar and the nozzle bar of its underpart: spacing=1.05～1.5:1 between this nozzle bar and the nozzle bar on its top.
And, two every adjacent shower nozzle transverse pitchs on described each nozzle bar successively decrease successively from initiating terminal to clearing end, the ratio of successively decreasing is: arbitrary shower nozzle and this shower nozzle are near spacing and this shower nozzle between the adjacent shower nozzle of clearing end one side and its near gap ratio=1:1.05～1.5 between the adjacent shower nozzle of initiating terminal one side, and described each nozzle bar is all usingd near distribution piping one side as initiating terminal.
Advantage of the present utility model and positively effect are:
It is slow that the utility model has not only solved the circuit card top etching speed of vertically putting, the etching problem of non-uniform that bottom etching speed causes soon, can also save jet pipe, reduction is to carrying the requirement of liquor pump, and be beneficial to the utilization of the device space, liquid filtering and return-flow structure have been simplified, it is in particular in: utilized from circuit card top by run by gravity through circuit card lower liquid the etching action to circuit card bottom, the flow and the pressure that circuit card bottom are sprayed to etching liquid have been reduced, thereby can reduce circuit card lower nozzle pipe and be arranged on the nozzle quantity on blast tube, and therefore relatively improve corresponding to circuit card top injection flow and pressure, thereby improved on the whole etching speed, reduced the flow of transferpump and pressure requirement.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Embodiment
Below in conjunction with accompanying drawing and by specific embodiment, the utility model is described in further detail, and following examples are descriptive, are not determinate, can not limit protection domain of the present utility model with this.
A kind of level for etching machine is laid blast tube structure, by selecting the spacing between tubing and between shower nozzle, be adjusted in different level and the upper pressure to workpiece atomizing of liquids of distance and flow, comprise distribution piping 3, nozzle bar and shower nozzle 4, distribution piping liquid feeding end connects the etching solution water inlet pipe of etching machine, on distribution piping, be communicated with the nozzle bar that many horizontal parallel are installed, on each tubing, be arranged at intervals with a plurality of shower nozzles, the junction of distribution piping and each nozzle bar is all provided with valve 2, this level laying blast tube structure is arranged on the facet that is eclipsed to workpiece 1 in the etching area in etching machine and carries out etching, longitudinal pitch between every two adjacent nozzle bars increases progressively from top to bottom successively, the ratio increasing progressively is: spacing between arbitrary nozzle bar and the nozzle bar of its underpart: spacing=1.05～1.5:1 between this nozzle bar and the nozzle bar on its top, two every adjacent shower nozzle transverse pitchs on each nozzle bar successively decrease successively from initiating terminal to clearing end, and the ratio of successively decreasing is:
Arbitrary shower nozzle and this shower nozzle are near spacing and this shower nozzle shower nozzle between the adjacent shower nozzle of clearing end one side and its near gap ratio=1:1.05～1.5 between the adjacent shower nozzle of initiating terminal one side, and each nozzle bar is all usingd near distribution piping one side as initiating terminal.
Principle of work of the present utility model is:
When the etching machine of laying mechanism by above-mentioned shower nozzle carries out etching to workpiece, regulate in advance the folding degree of different level blast tube valve, make corresponding to the nozzle ejection on circuit card top is many to the amount of liquid on circuit card top, pressure is large, and the amount of liquid that is ejected into circuit card bottom is few, pressure is little, thereby the etching speed that adds large circuit board top, improves etch effect.Simultaneously, although the amount of liquid coming corresponding to the nozzle ejection of circuit card bottom is few, pressure is little, but because the bottom of circuit card is not only subject to the etching action of the etching liquid that the nozzle ejection corresponding with it go out, but also flowed downward through the etching action in its when surface by circuit card top etching liquid, so the bottom of circuit card still can keep the etching speed synchronous with circuit card top.
Claims (4)
1. the level for etching system is laid blast tube structure, it is characterized in that: comprise distribution piping, nozzle bar and shower nozzle, distribution piping liquid feeding end connects the etching solution water inlet pipe of etching machine, on distribution piping, be communicated with the nozzle bar that many horizontal parallel are installed, on each tubing, be arranged at intervals with a plurality of shower nozzles.
2. the level for etching system according to claim 1 is laid blast tube structure, it is characterized in that: the junction of described distribution piping and each nozzle bar is all provided with valve.
3. the level for etching system according to claim 2 is laid blast tube structure, it is characterized in that: the longitudinal pitch between described every two adjacent nozzle bars increases progressively from top to bottom successively, and the ratio increasing progressively is: spacing between arbitrary nozzle bar and the nozzle bar of its underpart: spacing=1.05～1.5:1 between this nozzle bar and the nozzle bar on its top.
4. the level for etching system according to claim 3 is laid blast tube structure, it is characterized in that: two the every adjacent shower nozzle transverse pitchs on described each nozzle bar successively decrease successively from initiating terminal to clearing end, the ratio of successively decreasing is: arbitrary shower nozzle and this shower nozzle are near spacing and this shower nozzle between the adjacent shower nozzle of clearing end one side and its near gap ratio=1:1.05～1.5 between the adjacent shower nozzle of initiating terminal one side, and described each nozzle bar is all usingd near distribution piping one side as initiating terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320894206.4U CN203754808U (en) | 2013-12-30 | 2013-12-30 | Horizontally-arranged nozzle pipe structure for etching device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320894206.4U CN203754808U (en) | 2013-12-30 | 2013-12-30 | Horizontally-arranged nozzle pipe structure for etching device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203754808U true CN203754808U (en) | 2014-08-06 |
Family
ID=51250107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320894206.4U Expired - Lifetime CN203754808U (en) | 2013-12-30 | 2013-12-30 | Horizontally-arranged nozzle pipe structure for etching device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203754808U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110592653A (en) * | 2019-09-03 | 2019-12-20 | 昆山东威科技股份有限公司 | Horizontal spraying structure and electrolytic etching device applied by same |
| CN110592650A (en) * | 2019-09-03 | 2019-12-20 | 昆山东威科技股份有限公司 | An electrolytic etching device |
| CN110777241A (en) * | 2019-11-22 | 2020-02-11 | 马鞍山钢铁股份有限公司 | A kind of railway wheel cooling device, cooling method and preparation method |
| CN116916561A (en) * | 2023-06-25 | 2023-10-20 | 湖北金禄科技有限公司 | Copper melting method and circuit board for high aspect ratio circuit board |
-
2013
- 2013-12-30 CN CN201320894206.4U patent/CN203754808U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110592653A (en) * | 2019-09-03 | 2019-12-20 | 昆山东威科技股份有限公司 | Horizontal spraying structure and electrolytic etching device applied by same |
| CN110592650A (en) * | 2019-09-03 | 2019-12-20 | 昆山东威科技股份有限公司 | An electrolytic etching device |
| CN110592653B (en) * | 2019-09-03 | 2024-02-02 | 昆山东威科技股份有限公司 | Transverse spraying structure and electrolytic etching device applied by same |
| CN110777241A (en) * | 2019-11-22 | 2020-02-11 | 马鞍山钢铁股份有限公司 | A kind of railway wheel cooling device, cooling method and preparation method |
| CN110777241B (en) * | 2019-11-22 | 2025-07-25 | 马鞍山钢铁股份有限公司 | Railway wheel cooling device, cooling method and preparation method |
| CN116916561A (en) * | 2023-06-25 | 2023-10-20 | 湖北金禄科技有限公司 | Copper melting method and circuit board for high aspect ratio circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: 300384 off the coast of Tianjin Huayuan Thai Development Road No. 6 six ring K1-5-102 Patentee after: DECOTER (TIANJIN) SCIENCE AND TECHNOLOGY DEVELOPMENT CO.,LTD. Address before: Off the coast of Tianjin city Xiqing District 300384 ring road six Huayuan Thai Development No. 6 K1-5-102 Patentee before: TIANJIN DECOTER Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140806 |