CN203746900U - A white LED - Google Patents
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- CN203746900U CN203746900U CN201420056783.0U CN201420056783U CN203746900U CN 203746900 U CN203746900 U CN 203746900U CN 201420056783 U CN201420056783 U CN 201420056783U CN 203746900 U CN203746900 U CN 203746900U
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Abstract
Description
技术领域technical field
本实用新型属于LED发光技术领域,尤其涉及一种白光LED。The utility model belongs to the technical field of LED lighting, in particular to a white LED.
背景技术Background technique
LED是一种能够将电能转化为可见光的半导体装置,它采用电场发光,利用化合物材料制成P-N结的光电器件,改变了白炽灯钨丝发光与节能灯三基色粉发光的原理,发光二极管具有寿命长、光效高、无辐射与低能耗的优点,普遍应用于当今社会的照明及灯光装饰技术领域,LED的光谱几乎全部集中于可见光频段,LED的亮度与LED的发光角度有必然的联系,LED的发光角度越小亮度越小。LED is a semiconductor device that can convert electrical energy into visible light. It uses electric field luminescence and uses compound materials to make a P-N junction optoelectronic device. The advantages of long life, high luminous efficiency, no radiation and low energy consumption are widely used in the field of lighting and lighting decoration technology in today's society. The spectrum of LEDs is almost all concentrated in the visible light frequency band, and the brightness of LEDs is necessarily related to the luminous angle of LEDs. , the smaller the light emitting angle of the LED, the smaller the brightness.
现有的白光LED主要采用以下结构,在蓝色晶片上涂覆可以发出黄光的荧光粉,蓝色晶片发出的部分蓝光被荧光粉吸收发出黄光,另一部分蓝光与荧光粉发出的黄光混合,从而可以得到白光,目前,在发光晶片上涂覆荧光粉通常采取将胶水(环氧树脂、硅胶、硅树脂等)与荧光粉混合后,通过手动或自动点胶机将荧光粉与胶水的混合体覆盖在发光晶片上,然而,由于涂胶量难于控制,且荧光粉易于沉淀、涂布不均匀,导致荧光粉在发光晶片分布的一致性不好,光强损失大,此外,发光晶片在发光的同时产生热量,涂覆在发光晶片表面的荧光粉由于温度升高而产生颜色偏移,因此,不能很好地与发光晶片发出的光混合成白光,导致白光LED出光效果差。The existing white light LED mainly adopts the following structure, the phosphor powder that can emit yellow light is coated on the blue chip, part of the blue light emitted by the blue chip is absorbed by the phosphor powder and emits yellow light, and the other part of the blue light is combined with the yellow light emitted by the phosphor powder Mixing, so that white light can be obtained. At present, the coating of fluorescent powder on the light-emitting wafer usually takes the glue (epoxy resin, silica gel, silicone resin, etc.) However, due to the difficulty in controlling the amount of glue applied, and the easy precipitation and uneven coating of the phosphor powder, the distribution of the phosphor powder on the light emitting chip is not uniform and the light intensity is lost. In addition, the luminescent The chip generates heat while emitting light, and the phosphor powder coated on the surface of the light-emitting chip produces color shift due to temperature rise. Therefore, it cannot be well mixed with the light emitted by the light-emitting chip to form white light, resulting in poor light output of white LEDs.
实用新型内容Utility model content
本实用新型的目的在于提供一种白光LED,旨在解决现有的白光LED光强损失大、出光效果差的问题。The purpose of the utility model is to provide a white light LED, aiming at solving the problems of large light intensity loss and poor light emitting effect of the existing white light LED.
为解决上述技术问题,本实用新型提供一种白光LED的技术方案是,包括透明基板和固设于所述透明基板上的多个具有六面发光的蓝色晶片,所述透明基板上设有一电路层,所述电路层具有第一正极和第一负极,所述蓝色晶片具有第二正极和第二负极,所述第二正极与所述第一正极电性连接,所述第二负极与所述第一负极电性连接,所述透明基板上还设有正极端子和负极端子,所述正极端子与所述第一正极电性连接,所述负极端子与所述第一负极电性连接,还包括管壁上嵌设有黄色荧光粉的玻璃管,所述玻璃管具有一空腔,所述蓝色晶片、所述透明基板均安装于所述空腔内,所述玻璃管的端部熔接于所述透明基板的端部。In order to solve the above-mentioned technical problems, the utility model provides a white light LED technical solution, which includes a transparent substrate and a plurality of blue chips with six sides of light that are fixed on the transparent substrate, and the transparent substrate is provided with a A circuit layer, the circuit layer has a first positive pole and a first negative pole, the blue chip has a second positive pole and a second negative pole, the second positive pole is electrically connected to the first positive pole, and the second negative pole It is electrically connected to the first negative electrode, and the transparent substrate is also provided with a positive terminal and a negative terminal, the positive terminal is electrically connected to the first positive electrode, and the negative terminal is electrically connected to the first negative electrode. The connection also includes a glass tube with yellow fluorescent powder embedded on the tube wall, the glass tube has a cavity, the blue chip and the transparent substrate are installed in the cavity, and the end of the glass tube part is welded to the end part of the transparent substrate.
具体地,相邻两所述蓝色晶片串联连接,位于首尾两端的所述第二正极、所述第二负极分别与所述第一正极、所述第一负极电性连接。Specifically, two adjacent blue chips are connected in series, and the second positive electrode and the second negative electrode located at both ends are electrically connected to the first positive electrode and the first negative electrode respectively.
又或者,各所述蓝色晶片的第二正极共接在一起形成与所述第一正极电性连接的正极端,所述第二负极共接在一起形成与所述第一负极电性连接的负极端。Alternatively, the second positive poles of each of the blue chips are connected together to form a positive terminal electrically connected to the first positive pole, and the second negative poles are connected together to form a positive terminal electrically connected to the first negative pole. negative extreme.
进一步地,还包括多个用于提升显示指数的红色晶片,各所述红色晶片固设于所述透明基板上并与所述蓝色晶片形成串联连接或并联连接,各所述红色晶片分别与所述电路层电性连接。Further, it also includes a plurality of red chips for improving the display index, each of the red chips is fixed on the transparent substrate and connected in series or in parallel with the blue chip, and each of the red chips is respectively connected to the blue chip. The circuit layers are electrically connected.
优选地,所述透明基板为蓝宝石基板或玻璃基板。Preferably, the transparent substrate is a sapphire substrate or a glass substrate.
优选地,所述电路层为镍层或银层。Preferably, the circuit layer is a nickel layer or a silver layer.
优选地,所述正极端子与所述负极端子分别焊接于所述透明基板的两端。Preferably, the positive terminal and the negative terminal are respectively welded to two ends of the transparent substrate.
本实用新型提供一种白光LED的有益效果在于:通过烧结工艺将黄色荧光粉嵌入玻璃中烧制成玻璃管,黄色荧光粉分布更加均匀,提高荧光粉在玻璃管中分布的一致性,降低光强损失,蓝色晶片发光时,与黄色荧光粉混合出光,形成白光,此外,将荧光粉嵌设于玻璃管中,蓝色晶片在发光过程中产生的热量不会影响荧光粉的工作性能,消除现有技术中,涂覆在发光晶片上的荧光粉受热时产生颜色偏移,影响白光LED出光效果,因此,本实用新型提供的白光LED出光更加均匀,同时,在白光LED中将六面发光的蓝色晶片固设于透明基板上,有效地利用蓝色晶片的六个发光面,达到全周光角度的出光效果,大大地提升了LED光源的光通量及出光效率,出光率可达200lm/W,解决光线照射物体上出现亮度不均的问题,The utility model provides a white light LED with beneficial effects that: the yellow fluorescent powder is embedded in the glass and fired into a glass tube through a sintering process, the distribution of the yellow fluorescent powder is more uniform, the uniformity of the distribution of the fluorescent powder in the glass tube is improved, and the light emission is reduced. Strong loss, when the blue chip emits light, it mixes with the yellow phosphor to form white light. In addition, the phosphor is embedded in the glass tube, and the heat generated by the blue chip during the light emitting process will not affect the working performance of the phosphor. In the prior art, the phosphor powder coated on the light-emitting chip produces color shift when heated, which affects the light output effect of the white light LED. Therefore, the white light LED provided by the utility model is more uniform in light output. The luminous blue chip is fixed on the transparent substrate, and effectively utilizes the six light-emitting surfaces of the blue chip to achieve the light output effect of the full-circumference light angle, which greatly improves the luminous flux and light output efficiency of the LED light source, and the light output rate can reach 200lm /W, to solve the problem of uneven brightness on objects illuminated by light,
附图说明Description of drawings
图1为本实用新型实施例一提供的白光LED的立体示意图;Fig. 1 is a three-dimensional schematic diagram of a white light LED provided in Embodiment 1 of the present utility model;
图2为图1的左视图;Fig. 2 is the left view of Fig. 1;
图3为本实用新型实施例一提供的白光LED内部结构示意图;Fig. 3 is a schematic diagram of the internal structure of the white light LED provided by Embodiment 1 of the present utility model;
图4为本实用新型实施例二提供的白光LED内部结构示意图。FIG. 4 is a schematic diagram of the internal structure of the white light LED provided by Embodiment 2 of the present invention.
具体实施方式Detailed ways
为了使本实用新型的目的、技术方案及优点更加清楚明白,以下结合附图及实施例,对本实用新型进行进一步详细说明。应当理解,此处所描述的具体实施例仅仅用以解释本实用新型,并不用于限定本实用新型。In order to make the purpose, technical solution and advantages of the utility model clearer, the utility model will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model, and are not intended to limit the utility model.
以下结合具体实施例对本实用新型进行详细的描述。The utility model is described in detail below in conjunction with specific embodiments.
实施例一Embodiment one
如图1与图2所示,本实用新型实施例提供一种白光LED1,包括透明基板11和具有六面发光的蓝色晶片12,蓝色晶片12固设于透明基板11上,透明基板11上设有一电路层13,电路层13具有第一正极和第一负极,蓝色晶片12具有第二正极和第二负极,第二正极与第一正极电性连接,第二负极与第一正极电性连接,即各蓝色晶片12分别与电路层13形成电性连接,透明基板11上还设有正极端子14和负极端子15,正极端子14与第一正极电性连接,负极端子15与第一负极电性连接,即正极端子14和负极端子15分别与电路层13形成电性连接,白光LED1还包括玻璃管16,玻璃管16利用玻璃烧结工艺将黄色荧光粉嵌入玻璃内烧制而成,荧光粉与玻璃管16烧制成一体,荧光粉在玻璃管16的管壁内分布均匀,提高荧光粉在玻璃管16中分布的一致性,玻璃管16呈中空管状,玻璃管16具有一空腔161,蓝色晶片12、透明基板11均安装于空腔161内,由于蓝色晶片13呈六面发光,蓝色晶片13发出的蓝光与玻璃管16上的黄色荧光粉发出的黄光在空腔161内混合,形成白光,混合更加均匀,同时,将荧光粉设置在玻璃管16上,不再涂覆在蓝色晶片13上,蓝色晶片13发光产生的热量,不会影响荧光粉的工作性能,解决了现有技术中荧光粉由于温度过高而产生颜色偏移,导致白光LED出光效果差,同时,透明基板11有效地利用蓝色晶片13的六个出光面,改善传统LED光源指向性强,出光角度小的问题,提升LED光源的光通量以及出光效率,出光效率可达到200lm/W,避免LED光源照射在物体表面出现亮度不均的现象,更加符合用户需求,此外,玻璃管16的端部与透明基板11的端部形成熔融连接,由于玻璃管16的两端开口,透明基板11、蓝色晶片12安装于玻璃管16内,需要封闭玻璃管16的开口,将玻璃管16的两端烧结,与玻璃基板11的端部熔融连接在一起,无需使用封装胶,保持玻璃管16的内部密封,确保蓝色晶片12与黄色荧光粉混合后形成的白光,不会从玻璃管16的端部外泄,进一步提高出光率。As shown in Fig. 1 and Fig. 2, the embodiment of the present utility model provides a white light LED 1, which includes a transparent substrate 11 and a blue chip 12 with six-sided light emitting. The blue chip 12 is fixed on the transparent substrate 11, and the transparent substrate 11 A circuit layer 13 is arranged on it, the circuit layer 13 has a first positive pole and a first negative pole, the blue chip 12 has a second positive pole and a second negative pole, the second positive pole is electrically connected to the first positive pole, and the second negative pole is connected to the first positive pole Electrically connected, that is, each blue chip 12 is electrically connected to the circuit layer 13, and the transparent substrate 11 is also provided with a positive terminal 14 and a negative terminal 15, the positive terminal 14 is electrically connected to the first positive electrode, and the negative terminal 15 is connected to the first positive electrode. The first negative electrode is electrically connected, that is, the positive terminal 14 and the negative terminal 15 are respectively electrically connected to the circuit layer 13. The white LED 1 also includes a glass tube 16. The glass tube 16 uses a glass sintering process to embed yellow phosphor powder into the glass and fire it. The fluorescent powder is fired into one body with the glass tube 16, and the fluorescent powder is evenly distributed in the tube wall of the glass tube 16, which improves the consistency of the distribution of the fluorescent powder in the glass tube 16. The glass tube 16 is in the shape of a hollow tube, and the glass tube 16 has A cavity 161, the blue chip 12 and the transparent substrate 11 are installed in the cavity 161, because the blue chip 13 emits light from six sides, the blue light emitted by the blue chip 13 and the yellow light emitted by the yellow fluorescent powder on the glass tube 16 Mix in the cavity 161 to form white light, and the mixing is more uniform. At the same time, the fluorescent powder is arranged on the glass tube 16 and is no longer coated on the blue chip 13. The heat generated by the blue chip 13 will not affect the fluorescence. The working performance of the powder solves the problem of the color shift of the phosphor powder in the prior art due to the high temperature, which leads to the poor light output effect of the white LED. The problem of strong directivity of LED light source and small light output angle can improve the luminous flux and light output efficiency of LED light source, and the light output efficiency can reach 200lm/W, which can avoid the phenomenon of uneven brightness of LED light source on the surface of objects, which is more in line with user needs. In addition, The end of the glass tube 16 forms a melting connection with the end of the transparent substrate 11. Since the two ends of the glass tube 16 are open, the transparent substrate 11 and the blue chip 12 are installed in the glass tube 16. It is necessary to close the opening of the glass tube 16. The two ends of the glass tube 16 are sintered and connected together with the end of the glass substrate 11 by fusion. There is no need to use encapsulation glue to keep the inside of the glass tube 16 sealed, so as to ensure that the white light formed after the blue chip 12 is mixed with the yellow phosphor will not Leaking from the end of the glass tube 16 further improves the light extraction rate.
如图1与图3所示,相邻两蓝色晶片12串联连接,即一蓝色晶片12的第二正极通过第一导线17与另一蓝色晶片12的相对应的第二负极串联连接,将所有的蓝色晶片12依次连接在一起,形成串联电路,设于串联电路首端的蓝色晶片12引出第二正极以及设于串联电路尾端的蓝色晶片12引出第二负极分别与电路层13的第一正极、第一负极电性连接,当正极端子、负极端子与外部电源接通,各蓝色晶片12同时发光,白光LED出光柔和,且玻璃管16的两端无暗影。As shown in Figure 1 and Figure 3, two adjacent blue chips 12 are connected in series, that is, the second positive electrode of one blue chip 12 is connected in series with the corresponding second negative electrode of the other blue chip 12 through the first wire 17 , all the blue chips 12 are connected together sequentially to form a series circuit, the blue chip 12 arranged at the head end of the series circuit leads to the second positive electrode and the blue chip 12 arranged at the end of the series circuit leads to the second negative electrode respectively connected with the circuit layer The first positive pole and the first negative pole of 13 are electrically connected. When the positive pole terminal and the negative pole terminal are connected to the external power supply, each blue chip 12 emits light at the same time.
如图1所示,在白光LED中还包括多个红色晶片18,红色晶片18可用于提升白光LED的显示指数,红色晶片18固设于透明基板11上,并与蓝色晶片12形成串联连接或并联连接,各红色晶片18分别与电路层13电性连接,增设的红色晶片18、蓝色晶片12和黄色荧光粉发出的光经过混合后出光更加柔和,改善白光LED在照射物体上会出现强光刺眼的问题。As shown in FIG. 1, a plurality of red chips 18 are also included in the white LED. The red chips 18 can be used to improve the display index of the white LED. The red chips 18 are fixed on the transparent substrate 11 and connected in series with the blue chip 12. Or connected in parallel, each red chip 18 is electrically connected to the circuit layer 13 respectively, the light emitted by the added red chip 18, blue chip 12 and yellow phosphor is mixed and the light is softer, which improves the appearance of the white LED on the irradiated object. glare problem.
如图1与图2所示,在透明基板11上利用电镀蒸镀工艺在透明基板11的表面形成电路层13,具体地,电路层13可以为银层或镍层,电路层13作为导电体,电路层13与外部电源连通,给蓝色晶片12供电使其正常发光,当然,电路层13也可选用其他导电金属制成,透明基板11封装于空腔161内,保护电路层13免受外部环境的影响,且保证蓝色晶片12发出的光线与玻璃管16上的黄色荧光粉发出的光线充分混合,免受外界干扰,实现出光均匀的效果,蓝色晶片12通过粘合剂粘接在电路层13上,粘接应牢固且不发生偏移,在实施粘接过程中,应确保粘合剂不会涂抹至透明基板11的其他部位,以免影响LED的正常工作,当然,也可以采用覆晶工艺,确保,白光LED使用过程中,蓝色晶片12不会发生脱落等问题。As shown in Figures 1 and 2, a circuit layer 13 is formed on the surface of the transparent substrate 11 by electroplating and evaporation process on the transparent substrate 11. Specifically, the circuit layer 13 can be a silver layer or a nickel layer, and the circuit layer 13 is used as a conductor , the circuit layer 13 communicates with an external power supply, and supplies power to the blue chip 12 to make it emit light normally. Of course, the circuit layer 13 can also be made of other conductive metals, and the transparent substrate 11 is encapsulated in the cavity 161 to protect the circuit layer 13 from The impact of the external environment, and ensure that the light emitted by the blue chip 12 is fully mixed with the light emitted by the yellow phosphor on the glass tube 16, free from external interference, and achieve the effect of uniform light emission. The blue chip 12 is bonded by an adhesive On the circuit layer 13, the bonding should be firm and not shifted. During the bonding process, it should be ensured that the adhesive will not be applied to other parts of the transparent substrate 11, so as not to affect the normal operation of the LED. Of course, it can also The flip-chip process is adopted to ensure that the blue chip 12 will not fall off during the use of the white LED.
如图1所示,采用焊锡工艺将正极端子14与负极端子15焊接于透明基板11的两端上,并与电路层13导通,正极端子14、负极端子15通过电路层13与蓝色晶片12的第二正极、第二负极电性连接,正极端子14和负极端子15与外部电源连通,电路层13将电流传送给蓝色晶片12,使其正常发光,保证白光LED正常出光。As shown in Figure 1, the positive terminal 14 and the negative terminal 15 are soldered to both ends of the transparent substrate 11 by soldering process, and are connected to the circuit layer 13, and the positive terminal 14 and the negative terminal 15 are connected to the blue chip through the circuit layer 13. The second positive pole and the second negative pole of 12 are electrically connected, the positive pole terminal 14 and the negative pole terminal 15 are connected with the external power supply, and the circuit layer 13 transmits the current to the blue chip 12 to make it emit light normally and ensure the normal light emission of the white LED.
如图1所示,透明基板11为玻璃基板或蓝宝石基板,透明基板11作为蓝色晶片12、红色晶片18的承载体,透明基板11选用具有高透光率的材质做成,蓝色晶片12发出的光与荧光粉发出的黄光混合后,形成白光,高透光率便于光线的出射,选用的材质应有利于蓝色晶片12的出光、安装蓝色晶片12和在透明基板11的表面刻蚀线路结构,选用玻璃或蓝宝石作为透明基板11,出光效果更好,且可有效利用蓝色晶片12的六个出光面,达到全周光角度的出光效果,大大地提升LED光源的光通量以及出光效率,出光率可达200lm/W。As shown in Figure 1, the transparent substrate 11 is a glass substrate or a sapphire substrate, and the transparent substrate 11 is used as a carrier for the blue chip 12 and the red chip 18. The transparent substrate 11 is made of a material with high light transmittance, and the blue chip 12 After the emitted light is mixed with the yellow light emitted by the fluorescent powder, white light is formed, and the high light transmittance is convenient for the emission of light. Etching the circuit structure, choosing glass or sapphire as the transparent substrate 11, the light output effect is better, and the six light output surfaces of the blue chip 12 can be effectively used to achieve the light output effect of the full-circumference light angle, which greatly improves the luminous flux of the LED light source and Light extraction efficiency, the light output rate can reach 200lm/W.
实施例二Embodiment two
如图4所示,实施例二与实施例一的具体结构基本相同,而两者的区别在于,各蓝色晶片12的第二正极共接在一起形成正极端,正极端与第一正极电性连接,各蓝色晶片12的第二负极共接在一起形成负极端,负极端与第一负极电性连接,即各蓝色晶片12通过第二导线19并联在一起形成并联电路,当正极端子14、负极端子15与外部电源接通,各蓝色晶片12同时发光,即使偶一个蓝色晶片12出现故障,也不会影响白光LED的正常发光,提高白光LED的工作可靠性。As shown in Figure 4, the specific structure of embodiment two is basically the same as that of embodiment one, and the difference between the two is that the second positive electrodes of each blue chip 12 are connected together to form a positive end, and the positive end is connected to the first positive electrode. The second negative pole of each blue chip 12 is connected together to form a negative terminal, and the negative terminal is electrically connected to the first negative pole, that is, each blue chip 12 is connected in parallel through a second wire 19 to form a parallel circuit. Terminal 14, negative terminal 15 are connected with external power supply, and each blue chip 12 emits light at the same time, even if even one blue chip 12 breaks down, it will not affect the normal luminescence of white light LED, and improve the working reliability of white light LED.
以上所述仅为本实用新型的较佳实施例而已,并不用以限制本实用新型,凡在本实用新型的精神和原则之内所作的任何修改、等同替换和改进等,均应包含在本实用新型的保护范围之内。The above descriptions are only preferred embodiments of the present utility model, and are not intended to limit the present utility model. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present utility model shall be included in this utility model. within the scope of protection of utility models.
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| CN104241501A (en) * | 2014-09-22 | 2014-12-24 | 四川柏狮光电技术有限公司 | All-direction plant growth lamp LED filament and manufacturing method thereof |
| CN106090650A (en) * | 2016-07-29 | 2016-11-09 | 广州依恩施节能科技有限公司 | A kind of LED fluorescent lamp and manufacture method thereof |
| CN110246952A (en) * | 2019-05-08 | 2019-09-17 | 格瑞电子(厦门)有限公司 | A kind of LED wafer color-changing device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104241501A (en) * | 2014-09-22 | 2014-12-24 | 四川柏狮光电技术有限公司 | All-direction plant growth lamp LED filament and manufacturing method thereof |
| CN106090650A (en) * | 2016-07-29 | 2016-11-09 | 广州依恩施节能科技有限公司 | A kind of LED fluorescent lamp and manufacture method thereof |
| CN110246952A (en) * | 2019-05-08 | 2019-09-17 | 格瑞电子(厦门)有限公司 | A kind of LED wafer color-changing device |
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