CN203733836U - LED filament and illuminating device - Google Patents
LED filament and illuminating device Download PDFInfo
- Publication number
- CN203733836U CN203733836U CN201420019691.5U CN201420019691U CN203733836U CN 203733836 U CN203733836 U CN 203733836U CN 201420019691 U CN201420019691 U CN 201420019691U CN 203733836 U CN203733836 U CN 203733836U
- Authority
- CN
- China
- Prior art keywords
- bonding area
- crystal bonding
- led filament
- fluorescent glue
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003292 glue Substances 0.000 claims abstract description 36
- 239000013078 crystal Substances 0.000 claims description 45
- 238000005452 bending Methods 0.000 claims description 11
- 150000002739 metals Chemical group 0.000 claims description 7
- 239000004033 plastic Substances 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract 3
- 239000003086 colorant Substances 0.000 abstract 1
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 230000005284 excitation Effects 0.000 description 3
- 238000009740 moulding (composite fabrication) Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000002146 bilateral effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004568 cement Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model is applicable to the field of illuminating technology, and provides an LED filament and an illuminating device. The LED filament comprises a metal framework and fluorescent glue, wherein at least one surface of the metal framework is provided with a die bonding zone, a plurality of LED chips are arranged in the die bonding zone, and the fluorescent glue wraps a part of the metal framework on which the die bonding zone is located. Thus, the light emitted by the LED chips arranged in the die bonding zone triggers the peripheral fluorescent glue to produce light with required colors, thereby solving the problem of blue light leaking of the LED filament; therefore, the LED filament can be widely applied to various illuminating devices, and the illuminating effect is excellent.
Description
Technical field
The utility model belongs to lighting technical field, relates in particular to a kind of LED filament and lighting device.
Background technology
At present, LED filament light sources product is mainly by transparent ceramic or glass substrate forming wiring board, thereby reaches the luminous object of wide-angle.But transparent ceramic and glass substrate are expensive, make complexity, and thermal conductivity is low, generally use power <1W, and encapsulation finished product cannot fundamentally solve Lou blue problem.
Utility model content
The object of the utility model embodiment is to provide a kind of LED filament, is intended to solve existing LED filament and has the blue problem of leaking.
The utility model embodiment realizes like this, a LED filament, comprises metallic framework and fluorescent glue, and crystal bonding area is established at least one surface of described metallic framework, a plurality of LED chips are located at described crystal bonding area, and described fluorescent glue wraps the part metals skeleton at place, crystal bonding area.
Another object of the utility model embodiment is to provide a kind of lighting device, and described lighting device adopts above-mentioned LED filament.
The utility model embodiment is located at metallic framework by crystal bonding area, then by fluorescent glue, wrapped the part metals skeleton at place, crystal bonding area, be located at like this optical excitation periphery fluorescent glue that the LED chip of described crystal bonding area sends and produce the light of required color, thereby solve LED filament, leak blue problem.Thereby this LED filament can be widely used in various lighting devices, illuminating effect is splendid.
Accompanying drawing explanation
Fig. 1 is the structural representation of the LED filament that provides of the utility model embodiment;
Fig. 2 is the side-looking structure chart of Fig. 1;
Fig. 3 is the structural representation of the metallic framework that provides of the utility model embodiment;
Fig. 4 is the side-looking structure chart of Fig. 3;
Fig. 5 is the structural representation (being only connected extension and bending part by plastic parts) of the metallic framework that provides of the utility model embodiment;
Fig. 6 is Fig. 5 B-B schematic cross-section;
Fig. 7 is in the cross sectional representation of crystal bonding area shown in Fig. 1 (having offered through hole).
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
The utility model embodiment is located at metallic framework by crystal bonding area, then by fluorescent glue, wrapped the part metals skeleton at place, crystal bonding area, be located at like this optical excitation periphery fluorescent glue that the LED chip of described crystal bonding area sends and produce the light of required color, thereby solve LED filament, leak blue problem.
Below in conjunction with specific embodiment, realization of the present utility model is described in detail.
As shown in Fig. 1～4, the LED filament that the utility model embodiment provides comprises metallic framework 1 and fluorescent glue 2, crystal bonding area 11 is established on described metallic framework 1 at least one surface, and a plurality of LED chips 3 are located at described crystal bonding area 11, and described fluorescent glue 2 wraps the part metals skeleton at 11 places, crystal bonding area.Be located at like this optical excitation periphery fluorescent glue that the LED chip 3 of described crystal bonding area 11 sends and produce the light of required color, thereby solve LED filament, leak blue problem.Passage using described metallic framework 1 as chip support, heat radiation, electrical interconnection herein, thermal conductivity and intensity are all higher, have promoted the reliability of this LED filament, can make in other words more high-power LED filament.
Metallic framework 1 described in the utility model embodiment first processes by machining, chemical etching or other forming method.Then, in 11 designs of described crystal bonding area, make the interconnected circuit of LED chip 3 and external electrical.Then, by fluorescent glue 2 described in the technological formings such as injection moulding or mold pressing, make it entirely to wrap up the part metals skeleton at LED chip 3 and place, 11(Ji crystal bonding area, crystal bonding area), thus realize linear luminous body, similar incandescent lamp illumination effect.In addition, also can described crystal bonding area 11 establish a plurality ofly in order to fill the through hole 17 of fluorescent glue, each through hole 17 be between adjacent LED chip 3, as shown in Figure 7.The part light that described like this LED chip 3 sends in fluorescent glue 2 inner total reflections by being substrate by through hole 17 from metallic framework 1() back side outgoing, thereby improve the photochromic consistency in this LED filament positive and negative, increased the bond strength of fluorescent glue 2 with metallic framework 1 simultaneously.
Conventionally, described LED filament can be both bilateral single electrode, can be also monolateral bipolar electrode, flexible design.As shown in Figure 3,4, the LED filament that the present embodiment provides is taked bilateral single electrode pattern, and wherein said metallic framework 1 two ends are weld zone 12, and 11You one end, described crystal bonding area and weld zone 12 disconnect, so the positive and negative electrode of this LED filament is disconnected, and destroy less to whole metallic framework 1.Certainly, 11 two ends, described crystal bonding area all disconnect and also can with corresponding weld zone 12.
Wherein, a bending part 13 is established in that one end that 11Yu weld zone, described crystal bonding area 12 disconnects, and establishes an extension 14 with the weld zone 12 that described crystal bonding area 11 disconnects, and described extension 14 is parallel to bending part 13, as shown in Figure 3,4.At this, by described fluorescent glue 2 location extensions 14 and bending part 13, make it to be separated by a distance, and be parallel to each other.This structural design, after described fluorescent glue 2 moulding, has strengthened the bonding strength of the gap of 11Yu weld zone, described crystal bonding area 12, further promotes the reliability of this LED filament.Also can by the 16 pairs of described extensions 14 of plastic parts after solidifying, bending part 13 location, be connected separately herein, make described extension 14 be parallel to bending part 13, thereby the positive and negative electrode disconnecting be engaged togather, as shown in Figure 5,6.Described extension 14 and bending part 13 are embedded in this plastic parts 16, can be to be partly or entirely wrapped in plastic cement, so guarantee that positive and negative electrode position is relatively stable, at gap easy fracture not, have improved the bulk strength of described metallic framework 1 simultaneously.Wherein, described plastic parts 16 can be made by transparent or other colouring plastic (as thermoplastic or thermosetting material).
For strengthening button glue power, guarantee described fluorescent glue 2 and metallic framework 1 bond strength, in described weld zone 12, near the end of crystal bonding area 11, establish to fill the through hole 15 of fluorescent glue.The through hole 15 of this increase has reduced the area of the excessive glue of described fluorescent glue, also can shorten described fluorescent glue in the distance of the metallic framework 1 excessive glue in surface.As preferably, described through hole 15 is only filled by fluorescent glue near the part of crystal bonding area 11, so both can reach aforementioned effect, can save described fluorescent glue again.The surface of described crystal bonding area 11 is coated with nickel film, silverskin or golden film, with this, strengthens this LED filament light extraction efficiency.
For optimizing this LED filamentray structure, described metallic framework 1 overall length b is not less than 8mm, and the width a of described weld zone is greater than 0.2mm, and thickness e is greater than 0.1mm, is less than 0.5mm; The length c of described crystal bonding area 11 is greater than 50% of metallic framework 1 overall length b, and the width d of described crystal bonding area 11 is greater than 0.3mm.Described fluorescent glue 2 is for being mixed with the thermosets of fluorescent material, and its length f is greater than the length c of described crystal bonding area 11, and width g is not less than the width d of described crystal bonding area 11, and thickness h is greater than 0.3mm, so that the part metals skeleton at 11 places, crystal bonding area is wrapped.It is square, circular or oval that the cross section of described fluorescent glue 2 can be.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all any modifications of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection range of the present utility model.
Claims (12)
1. a LED filament, is characterized in that, comprises metallic framework and fluorescent glue, and described metallic framework middle part is crystal bonding area, and a plurality of LED chips are located at described crystal bonding area, and described fluorescent glue wraps the part metals skeleton at place, crystal bonding area.
2. LED filament as claimed in claim 1, is characterized in that, described metallic framework two ends are weld zone, and described crystal bonding area has at least one end and weld zone to disconnect.
3. LED filament as claimed in claim 1 or 2, is characterized in that, a bending part is established in that one end that described crystal bonding area and weld zone disconnect, and establishes an extension with the weld zone that described crystal bonding area disconnects, and described extension is parallel to bending part.
4. LED filament as claimed in claim 3, is characterized in that, by the plastic parts after solidifying, described extension, bending part location is connected, and makes described extension be parallel to bending part.
5. LED filament as claimed in claim 1 or 2, is characterized in that, described crystal bonding area is established a plurality of in order to fill the through hole of fluorescent glue, and each through hole is between adjacent LED chip.
6. LED filament as claimed in claim 3, is characterized in that, the through hole of fluorescent glue is established to fill in described weld zone near the end of crystal bonding area.
7. LED filament as claimed in claim 6, is characterized in that, described through hole is only filled by fluorescent glue near the part of crystal bonding area.
8. the LED filament as described in claim 6 or 7, is characterized in that, the surface of described crystal bonding area is coated with nickel film, silverskin or golden film.
9. LED filament as claimed in claim 3, is characterized in that, described metallic framework overall length b is not less than 8mm, and the width a of described weld zone is greater than 0.2mm, and thickness e is greater than 0.1mm, is less than 0.5mm; The length c of described crystal bonding area is greater than 50% of metallic framework overall length b, and the width d of described crystal bonding area is greater than 0.3mm.
10. LED filament as claimed in claim 9, is characterized in that, described fluorescent glue is the thermosets that is mixed with fluorescent material, and its length f is greater than the length c of described crystal bonding area, and width g is not less than the width d of described crystal bonding area, and thickness h is greater than 0.3mm.
11. LED filaments as claimed in claim 10, is characterized in that, the cross section of described fluorescent glue is square, circular or oval.
12. 1 kinds of lighting devices, is characterized in that, described lighting device adopts the LED filament as described in any one in claim 1～11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420019691.5U CN203733836U (en) | 2014-01-06 | 2014-01-13 | LED filament and illuminating device |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420006625.4 | 2014-01-06 | ||
| CN201420006625 | 2014-01-06 | ||
| CN201410005835 | 2014-01-06 | ||
| CN201410005835.6 | 2014-01-06 | ||
| CN201420019691.5U CN203733836U (en) | 2014-01-06 | 2014-01-13 | LED filament and illuminating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203733836U true CN203733836U (en) | 2014-07-23 |
Family
ID=50862603
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420019691.5U Expired - Fee Related CN203733836U (en) | 2014-01-06 | 2014-01-13 | LED filament and illuminating device |
| CN201410014680.2A Expired - Fee Related CN103855148B (en) | 2014-01-06 | 2014-01-13 | LED filament and illuminator |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410014680.2A Expired - Fee Related CN103855148B (en) | 2014-01-06 | 2014-01-13 | LED filament and illuminator |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN203733836U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103855148A (en) * | 2014-01-06 | 2014-06-11 | 深圳市瑞丰光电子股份有限公司 | Led filament and lighting device |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020176259A1 (en) * | 1999-11-18 | 2002-11-28 | Ducharme Alfred D. | Systems and methods for converting illumination |
| TW540168B (en) * | 2002-03-11 | 2003-07-01 | Harvatek Corp | LED package with metal substrates protrusion outside the glue |
| RU2369943C2 (en) * | 2007-03-19 | 2009-10-10 | Валентин Николаевич Щербаков | Light-emitting diode matrix |
| KR20100052031A (en) * | 2008-11-10 | 2010-05-19 | 서울반도체 주식회사 | Led module |
| CN102709454A (en) * | 2012-05-30 | 2012-10-03 | 上舜照明（中国）有限公司 | Surface-roughened double-layer adhesive structure LED light source and manufacturing method thereof |
| CN203367277U (en) * | 2013-07-01 | 2013-12-25 | 临安市新三联照明电器有限公司 | A cylindrical LED filament |
| CN203733836U (en) * | 2014-01-06 | 2014-07-23 | 深圳市瑞丰光电子股份有限公司 | LED filament and illuminating device |
-
2014
- 2014-01-13 CN CN201420019691.5U patent/CN203733836U/en not_active Expired - Fee Related
- 2014-01-13 CN CN201410014680.2A patent/CN103855148B/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103855148A (en) * | 2014-01-06 | 2014-06-11 | 深圳市瑞丰光电子股份有限公司 | Led filament and lighting device |
| CN103855148B (en) * | 2014-01-06 | 2017-03-08 | 深圳市瑞丰光电子股份有限公司 | LED filament and illuminator |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103855148A (en) | 2014-06-11 |
| CN103855148B (en) | 2017-03-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140723 Termination date: 20180113 |