CN203722986U - Mobile terminal - Google Patents
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- CN203722986U CN203722986U CN201420003850.2U CN201420003850U CN203722986U CN 203722986 U CN203722986 U CN 203722986U CN 201420003850 U CN201420003850 U CN 201420003850U CN 203722986 U CN203722986 U CN 203722986U
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
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Abstract
本实用新型提供了一种移动终端,包括前壳、后壳、设置于所述前壳和后壳之间的音频部件和印制电路板,还包括导热部件,所述音频部件与印制电路板之间设置有容纳空间,所述导热部件设置在所述容纳空间中,所述导热部件的第一面与所述音频部件的磁性结构表面接触,第二面与所述印制电路板接地的铜面接触。本实用新型的有益效果在于,通过在所述音频部件与印制电路板之间设置了与两者均接触连接的导热部件,使得所述音频部件产生的热量能够通过所述导热部件均匀的传导至所述印制电路板上,增加了所述音频部件的散热效果,从而有效的散发了所述音频部件在使用过程中产生的热量,增强了所述音频部件可靠性的同时,也增加了其使用寿命。
The utility model provides a mobile terminal, comprising a front shell, a rear shell, an audio component and a printed circuit board arranged between the front shell and the rear shell, and a heat conducting component, the audio component and the printed circuit An accommodating space is provided between the boards, the heat-conducting component is arranged in the accommodating space, the first surface of the heat-conducting component is in contact with the surface of the magnetic structure of the audio component, and the second surface is grounded with the printed circuit board copper contact. The beneficial effect of the utility model is that the heat generated by the audio component can be evenly conducted through the heat conduction component by setting a heat conduction component between the audio component and the printed circuit board and connected to both of them. On the printed circuit board, the heat dissipation effect of the audio components is increased, thereby effectively dissipating the heat generated by the audio components during use, and while enhancing the reliability of the audio components, it also increases its service life.
Description
技术领域technical field
本实用新型涉及一种移动终端,尤其涉及一种增强音频部件可靠性的移动终端。The utility model relates to a mobile terminal, in particular to a mobile terminal which enhances the reliability of audio components.
背景技术Background technique
现有的移动终端,都会配有至少一个音频部件,最常见的包括一个扬声器(Speaker)和一个收音器(Receiver)。其中Speaker用于MP3外放、免提通话、来电铃音等;Receiver用于手持通话。为了满足不同用户需求以及不同应用场景,终端软件会将声音响度设置成高低不同的等级,当用户需要大铃音响度,比如外放MP3或者在吵杂的环境下通话,音频部件的输出功率自然也会增加。当音频部件长时间工作在大音量状态下,音频部件本体会逐渐发热,内部磁性结构温度上升,这样不仅会降低音频部件的灵敏度,还会影响到磁通密度,从而引起失真,甚至导致音频部件损坏。Existing mobile terminals are equipped with at least one audio component, most commonly including a speaker (Speaker) and a receiver (Receiver). Among them, the Speaker is used for MP3 playback, hands-free calls, ringtones for incoming calls, etc.; the Receiver is used for handheld calls. In order to meet the needs of different users and different application scenarios, the terminal software will set the loudness of the sound to different levels. When the user needs a louder loudness, such as playing MP3 or talking in a noisy environment, the output power of the audio components will naturally will also increase. When the audio component works at a high volume for a long time, the body of the audio component will gradually heat up, and the temperature of the internal magnetic structure will rise. This will not only reduce the sensitivity of the audio component, but also affect the magnetic flux density, which will cause distortion and even cause the audio component to damage.
针对此问题,目前常见的解决方案是:1、使用钕铁硼材料,可以做到耐高温150度左右;2、降低铃声响度。传统解决方案虽然能在一定程度上解决音频部件的发热问题,但是使用钕铁硼材料成本很高,而降低铃声响度会影响用户体验,此问题有待解决。To solve this problem, the current common solutions are: 1. Use NdFeB materials, which can withstand high temperatures of about 150 degrees; 2. Reduce the loudness of the bell. Although traditional solutions can solve the heating problem of audio components to a certain extent, the cost of using NdFeB materials is very high, and reducing the loudness of the ringtone will affect the user experience, and this problem needs to be solved.
实用新型内容Utility model content
基于现有技术中存在的上述缺陷,本实用新型的目的在于提供一种移动终端,解决移动终端的音频部件由于发热问题得不到有效改善,而容易损坏的问题。Based on the above-mentioned defects in the prior art, the purpose of this utility model is to provide a mobile terminal, which solves the problem that the audio components of the mobile terminal are easily damaged because the heating problem cannot be effectively improved.
本实用新型提供了一种移动终端,包括前壳、后壳、设置于所述前壳和后壳之间的音频部件和印制电路板,还包括导热部件,所述音频部件与印制电路板之间设置有容纳空间,所述导热部件设置在所述容纳空间中,所述导热部件的第一面与所述音频部件的磁性结构表面接触,第二面与所述印制电路板接地的铜面接触。The utility model provides a mobile terminal, comprising a front shell, a rear shell, an audio component and a printed circuit board arranged between the front shell and the rear shell, and a heat conducting component, the audio component and the printed circuit An accommodating space is provided between the boards, the heat-conducting component is arranged in the accommodating space, the first surface of the heat-conducting component is in contact with the surface of the magnetic structure of the audio component, and the second surface is grounded with the printed circuit board copper contact.
作为优选,所述导热部件为片体结构。Preferably, the heat conduction component is a sheet structure.
作为优选,所述导热部件的厚度为0.1mm。Preferably, the thickness of the heat conducting component is 0.1mm.
作为优选,所述导热部件的第一面完全覆盖住所述音频部件的磁性结构表面。Preferably, the first surface of the heat conducting component completely covers the surface of the magnetic structure of the audio component.
作为优选,所述导热部件的第一面与所述音频部件的磁性结构表面黏贴连接。Preferably, the first surface of the heat conducting component is adhesively connected to the surface of the magnetic structure of the audio component.
作为优选,所述后壳设置有用于容纳所述音频部件的音腔,组装后,在所述后壳的挤压下,所述音频部件、导热部件、印制电路板依次压接在一起。Preferably, the rear shell is provided with a sound cavity for accommodating the audio components, and after assembly, the audio components, heat-conducting components, and printed circuit board are crimped together sequentially under the extrusion of the rear shell.
作为优选,所述音腔中还黏附有泡棉,所述音频部件的振膜面黏附于所述泡棉上。Preferably, foam is also adhered to the sound cavity, and the diaphragm surface of the audio component is adhered to the foam.
作为优选,所述印制电路板接地的铜面通过金属支架与所述前壳相接触。Preferably, the grounded copper surface of the printed circuit board is in contact with the front shell through a metal bracket.
作为优选,所述导热部件的材料为石墨或者导热硅胶。Preferably, the material of the heat-conducting component is graphite or heat-conducting silica gel.
作为优选,所述音频部件包括至少一个扬声器和一个话筒。Advantageously, said audio components include at least one speaker and one microphone.
本实用新型的有益效果在于,通过在所述音频部件与印制电路板之间设置了与两者均接触连接的导热部件,使得所述音频部件产生的热量能够通过所述导热部件均匀的传导至所述印制电路板上,增加了所述音频部件的散热效果,从而有效的散发了所述音频部件在使用过程中产生的热量,增强了所述音频部件可靠性的同时,也增加了其使用寿命。The beneficial effect of the utility model is that the heat generated by the audio component can be evenly conducted through the heat conduction component by setting a heat conduction component between the audio component and the printed circuit board and connected to both of them. On the printed circuit board, the heat dissipation effect of the audio components is increased, thereby effectively dissipating the heat generated by the audio components during use, and while enhancing the reliability of the audio components, it also increases its service life.
附图说明Description of drawings
图1为本实用新型的结构示意图;Fig. 1 is the structural representation of the utility model;
图2为本实用新型的音频部件的结构示意图。Fig. 2 is a structural schematic diagram of the audio component of the present invention.
具体实施方式Detailed ways
为使本实用新型的目的、技术方案和优点更加清楚,下面将结合附图及具体实施例对本实用新型进行详细描述。In order to make the purpose, technical solution and advantages of the utility model clearer, the utility model will be described in detail below in conjunction with the accompanying drawings and specific embodiments.
图1为本实用新型的结构示意图。如图1所示,本实用新型提供一种移动终端,包括前壳1、后壳2、设置于前壳1和后壳2之间的音频部件3、印制电路板4(PCB-Printed Circuit Board)及导热部件5。在本实施例中,后壳2的底部设置有用于容纳音频部件3的音腔21,音腔21中黏附有限制音频部件3位移的泡棉6,音频部件3的振膜面黏附于泡棉6上。音频部件3与印制电路板4之间设置有用于容纳导热部件5的容纳空间。在本实施例中,导热部件5为呈片状的导热硅胶,为了保证其良好的储热能力,导热硅胶的厚度约为0.1mm。结合图1、图2所示,导热部件5设置在音频部件3与印制电路板4所形成的容纳空间中,导热部件5的第一面与音频部件3的磁性结构表面31黏贴连接,第二面与PCB4接地的铜面41接触。在本实施例中,为了达到更好的导热效果,导热部件5的第一面完全覆盖住音频部件3的磁性结构表面31。如此,音频部件3在工作中所产生的热量,能够有效的通过导热部件5传导给PCB4,将原有的辐射散热的方式优化为导热的散热方式,增加了热传递效率,使音频部件的可靠性能大大提升,减少了音频部件损坏的可能性。组装后,在后壳2的挤压下,音频部件3、导热部件5、PCB4依次压接在一起,保持可靠接触。Fig. 1 is the structural representation of the utility model. As shown in Figure 1, the utility model provides a mobile terminal, including a front case 1, a rear case 2, an audio component 3 arranged between the front case 1 and the rear case 2, a printed circuit board 4 (PCB-Printed Circuit Board) and heat conduction components 5. In this embodiment, the bottom of the rear shell 2 is provided with a sound cavity 21 for accommodating the audio component 3, and the foam 6 that limits the displacement of the audio component 3 is adhered to the sound cavity 21, and the diaphragm surface of the audio component 3 is adhered to the foam 6 on. An accommodating space for accommodating the heat-conducting component 5 is provided between the audio component 3 and the printed circuit board 4 . In this embodiment, the heat-conducting component 5 is sheet-shaped heat-conducting silica gel. In order to ensure its good heat storage capacity, the thickness of the heat-conducting silica gel is about 0.1 mm. As shown in FIG. 1 and FIG. 2, the heat conduction component 5 is disposed in the accommodation space formed by the audio component 3 and the printed circuit board 4, and the first surface of the heat conduction component 5 is adhesively connected to the magnetic structure surface 31 of the audio component 3, The second surface is in contact with the grounded copper surface 41 of the PCB 4 . In this embodiment, in order to achieve better heat conduction effect, the first surface of the heat conduction component 5 completely covers the magnetic structure surface 31 of the audio component 3 . In this way, the heat generated by the audio component 3 during work can be effectively conducted to the PCB 4 through the heat conduction component 5, and the original radiation heat dissipation method is optimized to the heat conduction heat dissipation method, which increases the heat transfer efficiency and makes the audio components reliable. Performance is greatly improved and the possibility of audio component damage is reduced. After assembly, under the extrusion of the rear case 2, the audio component 3, the heat conduction component 5, and the PCB 4 are crimped together sequentially to maintain reliable contact.
为了进一步改善散热效果,PCB4接地的铜面41可通过金属支架8与前壳1相接触,如此,音频部件3的热量通过导热部件5传导给PCB4的铜箔,通过这些导热率较高的铜箔,将热量散播到PCB4的表面,再通过金属支架8,将音频部件3产生的热量散发到整机,大大的增加了散热面积,提高了散热率。In order to further improve the heat dissipation effect, the grounded copper surface 41 of the PCB4 can be in contact with the front shell 1 through the metal bracket 8, so that the heat of the audio component 3 is conducted to the copper foil of the PCB4 through the heat conducting component 5, and through these copper foils with higher thermal conductivity The foil spreads the heat to the surface of the PCB4, and then dissipates the heat generated by the audio component 3 to the whole machine through the metal bracket 8, which greatly increases the heat dissipation area and improves the heat dissipation rate.
在本实施例中,音频部件3为单独的一个Speaker和Receiver二合一器件。音频部件3也可为分别放置于上下两个音腔中的Speaker和Receiver,亦可为三个Speaker以满足音乐发烧友的立体声体验。导热部件5的材料也可选用石墨。导热部件5本身具有弹性好、散热能力强、承受冲击载荷能力大的性能,不仅能够导热,还能控制音频部件3移位,在移动终端收到外力冲击的时候保护音频部件3。In this embodiment, the audio component 3 is a single speaker and receiver two-in-one device. The audio component 3 can also be a Speaker and a Receiver respectively placed in the upper and lower sound chambers, or it can be three Speakers to satisfy the stereo experience for music enthusiasts. Graphite can also be selected as the material of the heat conducting member 5 . The heat conduction component 5 itself has good elasticity, strong heat dissipation capability, and high impact load bearing performance. It can not only conduct heat, but also control the displacement of the audio component 3, and protect the audio component 3 when the mobile terminal is impacted by an external force.
在现有技术中,音频部件的保护是通过牺牲音频指标或者是制造成本来实现的,而本实施例通过在音频部件3与PCB4之间增设了导热部件5,使得音频部件3产生的热量能够通过导热部件5均匀的传导至PCB4上,将原有的辐射散热的方式转化为导热的散热方式,PCB4上的铜箔作为热的良导体,配合地孔使得热量均匀的散布到整板PCB4上,增大了散热面积,增强了音频部件3的散热效果。而后,再通过金属支架8,有效的将热量进一步从PCB4散布到整机,由此,音频部件3产生的热量得以快速散发,以恢复正常温度。本实用新型的改进不仅增强了音频部件的可靠性,同时也增加了音频部件乃至整机的使用寿命。In the prior art, the protection of audio components is achieved by sacrificing audio indicators or manufacturing costs, but in this embodiment, a heat-conducting component 5 is added between the audio components 3 and the PCB4, so that the heat generated by the audio components 3 can be reduced. Through the heat conduction component 5, it is evenly conducted to the PCB4, and the original radiation heat dissipation method is converted into a heat conduction heat dissipation method. The copper foil on the PCB4 is a good conductor of heat, and the heat is evenly distributed to the entire PCB4 with the ground hole. , the heat dissipation area is increased, and the heat dissipation effect of the audio component 3 is enhanced. Then, through the metal bracket 8, the heat is further spread from the PCB4 to the whole machine effectively, thus, the heat generated by the audio component 3 can be quickly dissipated to restore the normal temperature. The improvement of the utility model not only enhances the reliability of the audio components, but also increases the service life of the audio components and even the whole machine.
以上实施例仅用以说明本实用新型的技术方案而非限制,本领域的普通技术人员应当理解,可以对本实用新型的技术方案进行修改或者等同替换,而不脱离本实用新型技术方案的精神范围,其均应涵盖在本实用新型的权利要求范围当中。The above embodiments are only used to illustrate the technical solution of the utility model without limitation. Those of ordinary skill in the art should understand that the technical solution of the utility model can be modified or equivalently replaced without departing from the spirit scope of the technical solution of the utility model , which should all be included in the scope of claims of the present utility model.
Claims (10)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420003850.2U CN203722986U (en) | 2014-01-03 | 2014-01-03 | Mobile terminal |
| PCT/CN2014/076468 WO2015139357A1 (en) | 2014-01-03 | 2014-04-29 | Mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420003850.2U CN203722986U (en) | 2014-01-03 | 2014-01-03 | Mobile terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203722986U true CN203722986U (en) | 2014-07-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420003850.2U Expired - Fee Related CN203722986U (en) | 2014-01-03 | 2014-01-03 | Mobile terminal |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN203722986U (en) |
| WO (1) | WO2015139357A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106453702A (en) * | 2016-09-28 | 2017-02-22 | 努比亚技术有限公司 | Cover plate and smart phone |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206472427U (en) | 2016-09-28 | 2017-09-05 | 华为技术有限公司 | Radiating structure for electronic equipment and electronic equipment |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2598039Y (en) * | 2002-12-06 | 2004-01-07 | 李秉彧 | Improved heat radiation structure of small loudspeaker embedded thin material space |
| CN102223590B (en) * | 2010-04-14 | 2014-04-09 | 财团法人工业技术研究院 | Planar speaker with heat dissipation structure and heat dissipation method for planar speaker |
| CN202334626U (en) * | 2011-11-29 | 2012-07-11 | 四川华立德科技有限公司 | Mobile phone structure facilitating heat dissipation |
-
2014
- 2014-01-03 CN CN201420003850.2U patent/CN203722986U/en not_active Expired - Fee Related
- 2014-04-29 WO PCT/CN2014/076468 patent/WO2015139357A1/en not_active Ceased
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106453702A (en) * | 2016-09-28 | 2017-02-22 | 努比亚技术有限公司 | Cover plate and smart phone |
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| Publication number | Publication date |
|---|---|
| WO2015139357A1 (en) | 2015-09-24 |
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Granted publication date: 20140716 Termination date: 20160103 |