CN203689316U - Heat dissipation module for notebook computer CPU - Google Patents
Heat dissipation module for notebook computer CPU Download PDFInfo
- Publication number
- CN203689316U CN203689316U CN201320799323.2U CN201320799323U CN203689316U CN 203689316 U CN203689316 U CN 203689316U CN 201320799323 U CN201320799323 U CN 201320799323U CN 203689316 U CN203689316 U CN 203689316U
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- Prior art keywords
- heat radiation
- radiating fin
- plate body
- heat dissipation
- heat
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- 230000017525 heat dissipation Effects 0.000 title abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000010949 copper Substances 0.000 claims abstract description 25
- 229910052802 copper Inorganic materials 0.000 claims abstract description 25
- 230000005855 radiation Effects 0.000 claims description 65
- 230000000712 assembly Effects 0.000 claims description 15
- 238000000429 assembly Methods 0.000 claims description 15
- 238000005452 bending Methods 0.000 claims description 14
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- 238000009434 installation Methods 0.000 claims description 6
- 239000004411 aluminium Substances 0.000 claims description 5
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 8
- 238000000034 method Methods 0.000 description 11
- 238000003466 welding Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000008447 perception Effects 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a heat dissipation module for a notebook computer CPU, which comprises a heat dissipation plate body, a copper sheet, two flat heat pipes, a fan and a heat dissipation fin component, wherein a rectangular hole is formed in the heat dissipation plate body; bulges are arranged on the two sides of the rectangular hole; the two sides of the copper sheet are riveted with the lower surfaces of the bulges; a baffle is arranged on each bulge; bent parts are arranged on the left side and the right side of the heat dissipation plate body respectively; mounting support lugs are arranged on each bent part; mistakenly-mounting preventing codes are formed at four corners of the heat dissipation plate body respectively; the two heat pipes are tabular, clamped between the two baffles side by side, and connected with the heat dissipation fin component; the heat dissipation fin component is mounted at the air outlet of the fan; the heat dissipation fin component is manufactured in two different specifications, heat dissipation fins of the same specification are buckled together, and then the two groups of heat dissipation fins are reversely buckled into a whole. The heat dissipation module is reasonable in design, simple in structure, easy to implement, convenient to use and assemble, and excellent in assembling strength and heat dissipation effect.
Description
Technical field
The utility model relates to a kind of notebook CPU heat radiation module.
Background technology
Along with improving constantly of the heat-generating electronic elements power such as central processing unit (CPU), heat dissipation problem is more and more subject to people's attention, all the more so in notebook computer.
In field of radiating, technology adopts heat radiation module to dispel the heat to heat-generating electronic elements conventionally now, at present, the heat radiation module that most of notebook computers use is generally made up of the heat radiation plate body of fan, heat pipe, copper sheet, fin and aluminum etc., the two ends of this heat pipe are separately fixed in heat radiation plate body and fins group, and fins group is arranged on the air outlet of fan.Copper sheet is welded on heat radiation plate body, and molten heat-conducting cream adhering chip is passed through on the surface of copper sheet, because the heat sink surface of aluminum can form highly stable oxide layer, and therefore usually bad welding of the welding of copper sheet, weld strength is poor, is prone to loosening.Secondly, existing heat pipe is to be also welded on heat radiation plate body, and welding effect is poor, heat radiation module assembly process complexity.On existing heat radiation plate body, there is no mistake proofing mark, when processing, assembling, easily make mistakes.
Existing radiating fin group is to be all made up of multiple radiating fins, conventionally snap together and form in the mode of vertical stack by a kind of radiating fin of specification, one sidewall of radiating fin is plane, and another sidewall is buckling surface, and a side of buckling surface has the fastening point of multiple protrusion buckling surfaces.After installation, there will be radiating fin group front end smooth, tail end fastens the phenomenon that point protrudes, and one side affects attractive in appearance, on the other hand also can scratch setter or damage computer inner body.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of copper sheet and heat radiation plate body to be connected firmly, heat pipe does not need welding, assembly process is simple, good heat dissipation effect, can effectively avoid the tail end of radiating fin group to occur the notebook CPU heat radiation module that the phenomenon of button point protrusion occurs.
The technical solution of the utility model is as follows: a kind of notebook CPU heat radiation module, comprise heat radiation plate body (1), copper sheet (2), two heat pipes (8), fan (9) and heat radiation fin assemblies (10), it is characterized in that: described heat radiation plate body (1) comprises a rectangular slab, be provided with along its length rectangular opening (1a) at the middle part of rectangular slab, the both sides on the long limit of described rectangular opening (1a) are provided with convex closure (3), the both sides of described copper sheet (2) are riveted on the lower surface of the convex closure (3) of rectangular opening (1a) both sides, the upper side near rectangular opening (1a) of each described convex closure (3) is provided with baffle plate (4), a left side for described heat radiation plate body (1), right side is respectively equipped with downward bending (5), on a left side for described heat radiation plate body (1), the two ends of the bending (5) on right side are respectively equipped with installs journal stirrup (6), on described installation journal stirrup (6), be provided with mounting hole (7), on four angles of described heat radiation plate body (1), be respectively equipped with anti-miscoding (A, B, C, D), described heat pipe (8) is flat, two described heat pipes (8) are contained on copper sheet (2) side by side along the length direction of heat radiation plate body (1), and all stretch out outside copper sheet (2) at the two ends of described heat pipe (8), two described heat pipes (8) are clamped between two baffle plates (4), wherein one end of two described heat pipes (11) is connected with heat radiation fin assemblies (10), described heat radiation fin assemblies (10) is arranged on the air outlet of described fan (9), described heat radiation fin assemblies (10) comprises the first radiating fin (10-1) and the second radiating fin (10-2), described the first radiating fin, the second radiating fin (10-1, 10-2), have " U " shape groove, described the first radiating fin (10-1) snaps together and forms the first radiating fin group in the mode of vertical stack, described the second radiating fin (10-2) snaps together and forms the second radiating fin group in the mode of vertical stack, the tail end of the tail end of described the first radiating fin group and the second radiating fin group is relative and be buckled into one, and the common heat-transfer pipe passage (F) that forms " U " shape of " U " shape groove of " U " shape groove of the first radiating fin (10-1) and the second radiating fin (10-2), two described heat pipes (8) end is arranged in the heat-transfer pipe passage (F) of heat radiation fin assemblies (10).
Adopt technique scheme, in the both sides of rectangular opening of heat radiation plate body, convex closure is set, copper sheet is fixed on to the lower surface of convex closure by the mode of riveted joint, do not need welding, constant intensity is good.Secondly, two heat pipes are contained on copper sheet, and before being stuck in the baffle plate of two convex closures, by two baffle plate stationary positioned, do not need welding, and assembly process is simple.Secondly, heat pipe directly contacts with copper sheet, and the heat that chip is delivered on copper sheet is taken away, and radiating effect is better.Finally, we arrange bending in the both sides of heat radiation plate body, at the two ends of bending, installation journal stirrup is set, increase on the one hand the intensity of plate body, on the other hand, the installed surface of journal stirrup and CPU is installed and can be realized well laminating, and directly more easily process than bending on journal stirrup is directly being installed in the both sides bending of heat radiation plate body.On four angles of heat radiation plate body, anti-miscoding is set respectively, avoids makeing mistakes in production run, while avoiding assembling, make mistakes.Heat radiation module good heat dissipation effect, easy to assembly.Radiating fin component is become to two kinds of different size manufactures, after first the radiating fin of specification of the same race being snapped together, be more oppositely buckled into one, the mode of this reverse fastening, the phenomenon generation of effectively having avoided the fastening point of radiating fin buckling surface to protrude by two groups; And on first, second radiating fin, offer dexterously " U " shape groove, and all radiating fins snap together formation " U " the heat pipe passage heating tube of shape passes through.There is the features such as simple in structure, easy for installation, compact.
In technique scheme: the length of described convex closure (3) is less than the length of rectangular opening (1a), and described convex closure (3) is positioned at the middle part of rectangular opening (1a) both sides.
In technique scheme: described bending (5) is 100-120 degree with the angle (a) of heat radiation plate body (1).
In technique scheme: through salient point, riveted joint is fixed on convex closure (3) described copper sheet (2).
In technique scheme: described heat radiation plate body (1) is stamped to form by aluminium alloy.Easy to process.
In technique scheme: the aluminium sheet that described the first radiating fin (10-1), the second radiating fin (10-2) are 0.2mm by thickness L1 is respectively stamped to form, the thickness L2 of described first, second radiating fin (10-1,10-2) is respectively 1.2mm.Aluminium sheet quality is light, simultaneously good heat dissipation effect.
Beneficial effect: the utility model is reasonable in design, simple in structure, enforcement is easy, easy to use, easy to assembly, and assembling intensity is good, good heat dissipation effect, can effectively avoid the tail end of radiating fin group to occur what the phenomenon of a button protrusion occurred.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the structural representation of heat radiation plate body;
Fig. 3 is the front elevation of heat radiation fin assemblies of the present utility model.
Fig. 4 is the stereographic map of Fig. 3.
Fig. 5 is the structural representation of single radiating fin.
Embodiment
Below in conjunction with drawings and Examples, the utility model is described in further detail:
Upper and lower, left and right of the present utility model, front and back are the relative position in representative graph only, does not represent the absolute position of product.
As Figure 1-5, notebook CPU of the present utility model heat radiation module mainly by heat radiation plate body 1, copper sheet 2, convex closure 3, baffle plate 4, bending 5, the parts such as journal stirrup 6, mounting hole 7, two heat pipes 8, fan 9 and heat radiation fin assemblies 10 be installed formed, described heat radiation plate body 1 is a rectangular slab of being made up of aluminium alloy, middle part at rectangular slab is provided with rectangular opening 1a along its length, the both sides on the long limit of described rectangular opening 1a are provided with convex closure 3, the length of described convex closure 3 is less than the length of rectangular opening 1a, and described convex closure 3 is positioned at the middle part of rectangular opening 1a both sides.The lower surface of the convex closure 3 that is riveted on rectangular opening 1a both sides is riveted in the both sides of described copper sheet 2 by salient point, a side near rectangular opening 1a on each described convex closure 3 is provided with baffle plate 4, described baffle plate 4 is positioned at the middle part of convex closure 3, the left and right side of described heat radiation plate body 1 is respectively equipped with downward bending 5, described bending 5 is 100-120 degree with the angle a of heat radiation plate body 1, be respectively equipped with journal stirrup 6 is installed at the two ends of the bending 5 of the left and right side of described heat radiation plate body 1, on described installation journal stirrup 6, be provided with mounting hole 7.Heat radiation plate body 1 is arranged on CPU above by the mounting hole 7 of installing on journal stirrup 6, on four angles of described heat radiation plate body 1, is respectively equipped with anti-miscoding A, B, C, D, avoids makeing mistakes in the time producing and assemble.Described heat pipe 8 is flat, two described heat pipes 8 are contained on copper sheet 2 side by side along the length direction of heat radiation plate body 1, and all stretch out outside copper sheet 2 at the two ends of described heat pipe 8, two described heat pipes 8 are clamped between two baffle plates 4, wherein one end of two described heat pipes 11 extends to heat radiation fin assemblies 10 and is connected, and described heat radiation fin assemblies 10 is arranged on the air outlet of described fan 9.Described heat radiation fin assemblies 10 is made up of some the first radiating fin 10-1, some the second radiating fin 10-2, and the first radiating fin 10-1 and the second radiating fin 10-2 are the radiating fin of two kinds of different sizes.On the first radiating fin 10-1, the second radiating fin 10-2, have " U " shape groove.The first radiating fin 10-1 snaps together and forms the first radiating fin group in the mode of vertical stack, the second radiating fin 10-2 snaps together and forms the second radiating fin group in the mode of vertical stack, the tail end of the tail end of the first radiating fin group and the second radiating fin group is relative and be buckled into one, fastens direction as shown by arrows in FIG..The first radiating fin group and the second radiating fin group adopt the reverse direction assembling fastening, and make the both ends of the surface of whole computer CPU radiating fin group not have button point protrusion.Preferably, the first radiating fin 10-1 equates with the height of the second radiating fin 10-2, and the first radiating fin 10-1 also equates with the width of the second radiating fin 10-2, makes associative perception stronger.The common heat-transfer pipe passage F that forms " U " shape of " U " shape groove of " U " shape groove of the first radiating fin 10-1 and the second radiating fin 10-2, heat-transfer pipe passage F heating tube 8 passes through.Preferably, the aluminium sheet that the first radiating fin 10-1, the second radiating fin 10-2 are 0.2mm by thickness L1 is respectively stamped to form, and the thickness L2 of first, second radiating fin 10-1,10-2 is respectively 1.2mm.Aluminium sheet quality is light, simultaneously good heat dissipation effect.Two described heat pipe 8 ends are contained in heat-transfer pipe passage F.
Claims (6)
1. a notebook CPU heat radiation module, comprise heat radiation plate body (1), copper sheet (2), two heat pipes (8), fan (9) and heat radiation fin assemblies (10), it is characterized in that: described heat radiation plate body (1) comprises a rectangular slab, be provided with along its length rectangular opening (1a) at the middle part of rectangular slab, the both sides on the long limit of described rectangular opening (1a) are provided with convex closure (3), the both sides of described copper sheet (2) are riveted on the lower surface of the convex closure (3) of rectangular opening (1a) both sides, the upper side near rectangular opening (1a) of each described convex closure (3) is provided with baffle plate (4), a left side for described heat radiation plate body (1), right side is respectively equipped with downward bending (5), on a left side for described heat radiation plate body (1), the two ends of the bending (5) on right side are respectively equipped with installs journal stirrup (6), on described installation journal stirrup (6), be provided with mounting hole (7), on four angles of described heat radiation plate body (1), be respectively equipped with anti-miscoding (A, B, C, D), described heat pipe (8) is flat, two described heat pipes (8) are contained on copper sheet (2) side by side along the length direction of heat radiation plate body (1), and all stretch out outside copper sheet (2) at the two ends of described heat pipe (8), two described heat pipes (8) are clamped between two baffle plates (4), wherein one end of two described heat pipes (11) is connected with heat radiation fin assemblies (10), described heat radiation fin assemblies (10) is arranged on the air outlet of described fan (9), described heat radiation fin assemblies (10) comprises the first radiating fin (10-1) and the second radiating fin (10-2), described the first radiating fin, the second radiating fin (10-1, 10-2), have " U " shape groove, described the first radiating fin (10-1) snaps together and forms the first radiating fin group in the mode of vertical stack, described the second radiating fin (10-2) snaps together and forms the second radiating fin group in the mode of vertical stack, the tail end of the tail end of described the first radiating fin group and the second radiating fin group is relative and be buckled into one, and the common heat-transfer pipe passage (F) that forms " U " shape of " U " shape groove of " U " shape groove of the first radiating fin (10-1) and the second radiating fin (10-2), two described heat pipes (8) end is arranged in the heat-transfer pipe passage (F) of heat radiation fin assemblies (10).
2. a kind of notebook CPU heat radiation module according to claim 1, is characterized in that: the length of described convex closure (3) is less than the length of rectangular opening (1a), and described convex closure (3) is positioned at the middle part of rectangular opening (1a) both sides.
3. a kind of notebook CPU heat radiation module according to claim 1, is characterized in that: described bending (5) is 100-120 degree with the angle (a) of heat radiation plate body (1).
4. a kind of notebook CPU heat radiation module according to claim 1, is characterized in that: through salient point, riveted joint is fixed on convex closure (3) described copper sheet (2).
5. a kind of notebook CPU heat radiation module according to claim 1, is characterized in that: described heat radiation plate body (1) is stamped to form by aluminium alloy.
6. a kind of notebook CPU heat radiation module according to claim 1, it is characterized in that: the aluminium sheet that described the first radiating fin (10-1), the second radiating fin (10-2) are 0.2mm by thickness L1 is respectively stamped to form, the thickness L2 of described first, second radiating fin (10-1,10-2) is respectively 1.2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320799323.2U CN203689316U (en) | 2013-12-08 | 2013-12-08 | Heat dissipation module for notebook computer CPU |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320799323.2U CN203689316U (en) | 2013-12-08 | 2013-12-08 | Heat dissipation module for notebook computer CPU |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203689316U true CN203689316U (en) | 2014-07-02 |
Family
ID=51011194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320799323.2U Expired - Fee Related CN203689316U (en) | 2013-12-08 | 2013-12-08 | Heat dissipation module for notebook computer CPU |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203689316U (en) |
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2013
- 2013-12-08 CN CN201320799323.2U patent/CN203689316U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140702 Termination date: 20141208 |
|
| EXPY | Termination of patent right or utility model |