CN203607386U - Glue injection packaging structure of novel fingerprint sensor - Google Patents
Glue injection packaging structure of novel fingerprint sensor Download PDFInfo
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- CN203607386U CN203607386U CN201320396504.0U CN201320396504U CN203607386U CN 203607386 U CN203607386 U CN 203607386U CN 201320396504 U CN201320396504 U CN 201320396504U CN 203607386 U CN203607386 U CN 203607386U
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- injecting glue
- fingerprint sensor
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- metal frame
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- 239000003292 glue Substances 0.000 title claims abstract description 83
- 238000002347 injection Methods 0.000 title abstract description 8
- 239000007924 injection Substances 0.000 title abstract description 8
- 238000004806 packaging method and process Methods 0.000 title abstract 2
- 229910052751 metal Inorganic materials 0.000 claims abstract description 70
- 239000002184 metal Substances 0.000 claims abstract description 69
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 239000000463 material Substances 0.000 claims abstract description 19
- 230000003068 static effect Effects 0.000 claims abstract description 16
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 10
- 238000007514 turning Methods 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 7
- 238000001746 injection moulding Methods 0.000 abstract description 2
- 238000011031 large-scale manufacturing process Methods 0.000 abstract description 2
- 230000005611 electricity Effects 0.000 abstract 2
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000001574 biopsy Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000011840 criminal investigation Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
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- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The utility model provides the glue injection packaging structure of a novel fingerprint sensor, which comprises a glue injection element, a substrate, an I-shaped slotted metal frame and a fingerprint sensor bare chip. The glue injection part is in the form of a fixed element made of glue injection materials through the glue injection process. The upper surface of the metal edge strip of the I-shaped slotted metal frame is in the same horizontal plane with the upper surface of the fingerprint sensor bare chip. According to the technical scheme of the utility model, due to the adoption of the glue injection process of low cost and easy large-scale production, the mold opening cost required for the expensive injection molding process is saved. Meanwhile, the easily conductive electro-static discharge (ESD) type I-shaped slotted metal frame is embedded into the fingerprint sensor bare chip, and is attached onto the ESD electrostatic discharge region of the front surface of the substrate by means of the conductive glue. In this way, the static electricity on fingers can be effectively conducted to the ground, so that the damaged to the fingerprint sensor bare chip caused by the static electricity on fingers can be avoided. Moreover, due to the arrangement of a conductive land grid array (LGA) or a ball grid array (BGA) on the back surface of the substrate, the connection of the fingerprint sensor with the printed circuit board is realized.
Description
Technical field
The utility model has about a kind of fingerprint sensor, relates in particular to a kind of novel finger print transducer injecting glue encapsulating structure
Background technology
Bio-identification, as Secure Application, due to its ease for use and unforgeable to a certain extent, is just applied in criminal investigation field very early.The demand of authentication in recent years constantly increases, and along with the public's progressively acceptance and approval, Automated Fingerprint Identification System will be more widely used.Sweep fingerprint sensor, by sliding finger to detect fingerprint at strip sensor surface, has little, low in energy consumption, the low-cost advantage of volume, is suitable for being applied in the occasions such as mobile phone, smart phone, PDA, USBKey or movable storage device.Described transducer can be electric resistance sensor, capacitance sensor and inductance sensor etc.
Static is many by friction or dry air and insulant friction generation mutually between insulator object, when it energy accumulation to a certain extent, when the insulator of its neutralization of overslaugh again stops incessantly, there is violent electric discharge, be static discharge (ESD), at this moment ceiling voltage can reach several thousand and even several ten thousand volts, certainly will cause damage to electrostatic sensitive assembly.Carry static because people knows from experience, in the time that finger contact with sweep fingerprint sensor chip, static discharge can damage fingerprint sensor chip, even makes fingerprint sensor chip electrostatic breakdown and cause chip damage seriously time.
Can resist the impact of static discharge in order to make sliding fingerprint acquiring device, the first way is to make an exposed metal level in sensor chip surface generally to adopt craft of gilding, make near the static of chip surface can conducting to the earth terminal of system, but, the semiconductor technology of making the metal level that this layer of a few μ m are thick is very complicated, the biggest problem is this craft of gilding, can not be compatible with the CMOS manufacturing process of standard because introducing metallic element gold, can production manufacturability very poor, yield is very low, and production cost is very high.The second way is, after chip is adopted to Shooting Technique encapsulation, antistatic metal frame to be buckled on chip, and by four grounded metal frame welded corner joint on pcb board.Adopt the method, need to buy expensive injection molding machine, fund input in early stage is very large; Again because metal frame is to snap onto on packaged chip, metal frame and fingerprint collecting district can not combine closely, anti-static effect is poor, and the volume of whole fingerprint capturer is also larger, moreover metal frame will be welded on user's pcb board, erection welding complex process rate of finished products is low, electrostatic leakage poor effect.
Summary of the invention
For addressing the above problem, a kind of novel finger print transducer injecting glue encapsulating structure that the utility model provides, comprises injecting glue part, substrate, " work " type slotted metal frame and fingerprint sensor bare chip, and described injecting glue part is the fixture that injecting glue material injecting glue forms; Described " work " type slotted metal frame comprises metal edge strip, rectangle housing and " work " type groove, described " work " type groove comprises injecting glue groove and chip mounting groove, symmetrical two metal edge strips that are provided with on described " work " type slotted metal frame, the upper surface of the upper surface of described metal edge strip and fingerprint sensor bare chip is on a horizontal plane; The upper surface symmetry of described substrate be provided with two ESD electrostatic leakage regions, " work " type slotted metal frame cover is imbedded to fingerprint sensor bare chip and be bonded in the ESD electrostatic leakage region of substrate front side by conducting resinl, the static that finger is produced is transmitted to ESD electrostatic leakage region by metal edge strip, described ESD electrostatic leakage region is connected with the ESD ground pad of substrate back, by being connected of " work " type slotted metal frame, ESD electrostatic leakage region and ESD ground pad static being transmitted to ground; The back side of described substrate is provided with conduction tin ball, as ball grid array (BGA) or conductive plate grid array (LGA), for realizing the connection of fingerprint capturer and printed circuit board; The pad at four diagonal angles of described substrate back place is ESD ground connection tin ball or ESD ground pad, and mid portion is other welding tin ball or pad.
Between described injecting glue part and fingerprint sensor bare chip, be provided with resistance glue part, stop that the injecting glue material that is injected into injecting glue groove invades fingerprint collecting region; Between described resistance glue part and fingerprint sensor bare chip and " work " type slotted metal frame upper surface, be 45 degree turnings.
The two ends groove of " work " type groove of described " work " type slotted metal frame is injecting glue groove, and described injecting glue groove is used for adding injecting glue material and forms injecting glue part; The intermediate groove of " work " type groove of described " work " type slotted metal frame is chip mounting groove, described fingerprint sensor bare chip is arranged in the chip mounting groove of " work " type slotted metal frame, and the size of described chip mounting groove is slightly larger than fingerprint sensor bare chip; Adopt conducting resinl to fill the space between fingerprint sensor bare chip and " work " type slotted metal frame, and guarantee that the upper surface of filling the rear upper surface of conducting resinl and the upper surface of fingerprint sensor bare chip and " work " type slotted metal frame is on a horizontal plane.
On described fingerprint sensor bare chip, be provided with bare chip pin, by bonding lead, bare chip pin connected with the pin that is connected of substrate front side, realize the electric connection of fingerprint sensor bare chip and substrate; Add after injecting glue material bonding lead, bare chip pin and be connected pin and be completely wrapped in the injecting glue part being formed by injecting glue material injecting glue.
A kind of novel finger print transducer injecting glue encapsulating structure that the utility model provides adopts low cost, is easy to the injection process of large-scale production, save the necessary die sinking expense of expensive molding process, adopted the ESD of easy conductive " work " type slotted metal frame cover of releasing to imbed fingerprint sensor bare chip and be bonded in the ESD electrostatic leakage region of substrate front side by conducting resinl.When finger sliding contact fingerprint sensor chip, finger first contacts with the metal edge strip of " work " row slotted metal frame all the time, and " work " type slotted metal frame is connected with ESD electrostatic leakage region, and electrostatic leakage region is connected with the ESD ground pad of substrate back, by being connected of " work " type slotted metal frame, ESD electrostatic leakage region and ESD ground pad, effectively by finger on static be transmitted to ground, prevent from pointing static fingerprint sensor bare chip damaged.Substrate back adopts conductive plate grid array (LGA) form or ball grid array (BGA) form to realize the connection of this fingerprint sensor and printed circuit board.
Accompanying drawing explanation
Fig. 1 is biopsy cavity marker devices perspective view of the present utility model;
Fig. 2 is that master of the present utility model looks perspective view;
Fig. 3 is the cut away view of overlooking of the present utility model;
Fig. 4 is that the master of " work " described in the utility model type slotted metal frame looks exploded view;
Fig. 5 is the stereogram of " work " described in the utility model type slotted metal frame;
Fig. 6 is conductive plate grid array (LGA) figure of substrate back described in the utility model;
Fig. 7 is that substrate master described in the utility model looks perspective view;
Fig. 8 is ball grid array (BGA) figure of substrate back described in the utility model.
Embodiment
Further explain the utility model with reference to accompanying drawing 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5, Fig. 6, Fig. 7, Fig. 8, a kind of novel finger print transducer injecting glue encapsulating structure that the utility model provides, comprises injecting glue part 1, substrate 2, " work " type slotted metal frame 3 and fingerprint sensor bare chip 4.
Described injecting glue part 1 is the fixture that injecting glue material injecting glue forms, and the injecting glue material of its use is translucent or opaque plastics.Described substrate 2 adopts plastics or ceramic material.Described " work " type slotted metal frame adopts conductance high and have an alloy material of certain degree of hardness.
Between described injecting glue part 1 and fingerprint sensor bare chip 4, be provided with resistance glue part 6; stop that the injecting glue material that is injected into injecting glue groove B invades fingerprint collecting region; between described resistance glue part 6 and fingerprint sensor bare chip 4 and " work " type slotted metal frame 3 upper surfaces, be 45 degree turnings; be conducive to protect the bare chip pin 61 of the fingerprint sensor being connected with bonding lead 7; and in the time that finger is spent inclined-plane physical contact with 45 of resistance glue part 6; can more be conducive to finger sliding, increase the comfortableness that user experiences.
Described " work " type slotted metal frame 3 comprises metal edge strip 31, rectangle housing 32 and " work " type groove C, described " work " type groove C comprises injecting glue groove B and chip mounting groove D, symmetrical two metal edge strips 31 that are provided with on described " work " type slotted metal frame 3, the upper surface of the upper surface of described metal edge strip 31 and fingerprint sensor bare chip 4 is on a horizontal plane.The two ends groove of " work " type groove C of described " work " type slotted metal frame 3 is injecting glue groove B, and described injecting glue groove B is used for adding injecting glue material and forms injecting glue part 1.The intermediate groove of " work " type groove C of described " work " type slotted metal frame 3 is chip mounting groove D, described fingerprint sensor bare chip 4 is arranged in the chip mounting groove D of " work " type slotted metal frame 3, the size of described chip mounting groove D is slightly larger than fingerprint sensor bare chip 4, be conducive to the installation of fingerprint sensor bare chip 4, thereby there is certain space between fingerprint sensor bare chip 4 and " work " type slotted metal frame 3, the utility model adopts conducting resinl 5 to fill the space A between fingerprint sensor bare chip 4 and " work " type slotted metal frame 3, and guarantee that the upper surface of filling the rear upper surface of conducting resinl 5 and the upper surface of fingerprint sensor bare chip 4 and " work " type slotted metal frame 3 is on a horizontal plane, avoid piling up because pointing frequent scraping fingerprint sensor bare chip 4 surface formation spots the finger measuring ability that affects fingerprint sensor bare chip 4.
The upper surface symmetry of described substrate 2 be provided with two ESD electrostatic leakage regions 8, " work " type slotted metal frame 3 is overlapped to the ESD electrostatic leakage region 8 of imbedding fingerprint sensor bare chip 4 and being bonded in substrate 2 fronts by conducting resinl, the static that finger is produced is transmitted to ESD electrostatic leakage region 8 by metal edge strip 31, described electrostatic leakage region 8 is connected with the ESD ground pad 21 at substrate 2 back sides, with being connected of ESD ground pad 21, static is transmitted to ground by " work " type slotted metal frame 3, ESD electrostatic leakage region 8.
The back side of described substrate 2 can be provided with conduction tin ball, as ball grid array (BGA) (Fig. 8) or conductive plate grid array (LGA) (Fig. 6).For realizing the connection of this fingerprint capturer and printed circuit board.The pad at described substrate 2 Si Ge diagonal angle, back side places is ESD ground connection tin ball or ESD ground pad 21, mid portion and dispense unillustrated part for other welding tin ball or pad (as circular tin ball 22 and square pad 23).
On described fingerprint sensor bare chip 4, be provided with bare chip pin 61. and by bonding lead 7, bare chip pin 61 connected with the pin 24 that is connected in substrate 2 fronts, realize the electric connection of fingerprint sensor bare chip 4 and substrate 2.Add after injecting glue material, bonding lead 7, bare chip pin 61 and be connected pin 24 and be completely wrapped in the injecting glue part 1 being formed by injecting glue material injecting glue, be subject to extraneous erosion infringement to prevent bonding lead 7, bare chip pin 61 and to be connected pin 24, and have influence on the useful life of fingerprint sensor.
The preparation process of a kind of novel finger print transducer injecting glue encapsulating structure that the utility model provides.
Fingerprint sensor bare chip 4 is installed to substrate 2 fronts, bonding lead 7 is realized the connection between fingerprint sensor bare chip 4 and substrate 2 fronts, " work " type slotted metal frame 3 is overlapped to the ESD electrostatic leakage region 8 of imbedding fingerprint sensor bare chip 4 and being bonded in substrate front side by conducting resinl, make the metal edge strip 31 of " work " type slotted metal frame 3 and the upper surface of fingerprint sensor bare chip 4 on a horizontal plane.Injecting glue material is injected in two injecting glue groove B of " work " type slotted metal frame 3 two ends symmetries, resistance glue part 6 stops that the injecting glue material that is injected into injecting glue groove B invades fingerprint collecting region, the side of resistance glue part 6 and surface, fingerprint collecting district form 45 degree turnings, injecting glue part 1 height forming after injecting glue is a little more than fingerprint sensor bare chip 4 surfaces and form 45 degree turnings, be conducive to protect the bare chip pin 61 of the fingerprint sensor being connected with bonding lead 7, and in the time that finger is spent inclined-plane physical contact with 45 of resistance glue part 6, can more be conducive to finger sliding, increase the comfortableness that user experiences.
Those skilled in the art, not departing under the condition of the definite spirit and scope of the present utility model of claims, can also carry out various modifications to above content.Therefore scope of the present utility model is not limited in above explanation, but determined by the scope of claims.
Claims (4)
1. a novel finger print transducer injecting glue encapsulating structure, comprises injecting glue part, substrate, " work " type slotted metal frame and fingerprint sensor bare chip, it is characterized in that, described injecting glue part is the fixture that injecting glue material injecting glue forms; Described " work " type slotted metal frame comprises metal edge strip, rectangle housing and " work " type groove, described " work " type groove comprises injecting glue groove and chip mounting groove, symmetrical two metal edge strips that are provided with on described " work " type slotted metal frame, the upper surface of the upper surface of described metal edge strip and fingerprint sensor bare chip is on a horizontal plane; The upper surface symmetry of described substrate be provided with two ESD electrostatic leakage regions, " work " type slotted metal frame cover is imbedded to fingerprint sensor bare chip and be bonded in the ESD electrostatic leakage region of substrate front side by conducting resinl, the static that finger is produced is transmitted to ESD electrostatic leakage region by metal edge strip, described ESD electrostatic leakage region is connected with the ESD ground pad of substrate back, by being connected of " work " type slotted metal frame, ESD electrostatic leakage region and ESD ground pad static being transmitted to ground; The back side of described substrate is provided with conduction tin ball, as ball grid array (BGA) or conductive plate grid array (LGA), for realizing the connection of fingerprint capturer and printed circuit board; The pad at four diagonal angles of described substrate back place is ESD ground connection tin ball or ESD ground pad, and mid portion is other welding tin ball or pad.
2. a kind of novel finger print transducer injecting glue encapsulating structure according to claim 1, is provided with resistance glue part between described injecting glue part and fingerprint sensor bare chip, stop that the injecting glue material that is injected into injecting glue groove invades fingerprint collecting region; Between described resistance glue part and fingerprint sensor bare chip and " work " type slotted metal frame upper surface, be 45 degree turnings.
3. a kind of novel finger print transducer injecting glue encapsulating structure according to claim 2, the two ends groove of " work " type groove of described " work " type slotted metal frame is injecting glue groove, and described injecting glue groove is used for adding injecting glue material and forms injecting glue part; The intermediate groove of " work " type groove of described " work " type slotted metal frame is chip mounting groove, described fingerprint sensor bare chip is arranged in the chip mounting groove of " work " type slotted metal frame, and the size of described chip mounting groove is slightly larger than fingerprint sensor bare chip; Adopt conducting resinl to fill the space between fingerprint sensor bare chip and " work " type slotted metal frame, and guarantee that the upper surface of filling the rear upper surface of conducting resinl and the upper surface of fingerprint sensor bare chip and " work " type slotted metal frame is on a horizontal plane.
4. a kind of novel finger print transducer injecting glue encapsulating structure according to claim 3, on described fingerprint sensor bare chip, be provided with bare chip pin, by bonding lead, bare chip pin is connected with the pin that is connected of substrate front side, realize the electric connection of fingerprint sensor bare chip and substrate; Add after injecting glue material bonding lead, bare chip pin and be connected pin and be completely wrapped in the injecting glue part being formed by injecting glue material injecting glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320396504.0U CN203607386U (en) | 2013-07-05 | 2013-07-05 | Glue injection packaging structure of novel fingerprint sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320396504.0U CN203607386U (en) | 2013-07-05 | 2013-07-05 | Glue injection packaging structure of novel fingerprint sensor |
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| Publication Number | Publication Date |
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| CN203607386U true CN203607386U (en) | 2014-05-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201320396504.0U Expired - Fee Related CN203607386U (en) | 2013-07-05 | 2013-07-05 | Glue injection packaging structure of novel fingerprint sensor |
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| CN (1) | CN203607386U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104269393A (en) * | 2014-09-15 | 2015-01-07 | 江苏长电科技股份有限公司 | Metal framework and electrostatic discharging ring integrated structure for fingerprint sensor and manufacturing method thereof |
| CN104282631A (en) * | 2013-07-04 | 2015-01-14 | 成都方程式电子有限公司 | Novel fingerprint sensor glue injection structure |
| TWI645535B (en) * | 2016-12-23 | 2018-12-21 | 敦捷光電股份有限公司 | Fingerprint sensing identification device with antistatic structure |
| TWI655742B (en) * | 2016-12-22 | 2019-04-01 | 敦捷光電股份有限公司 | Packaging structure with antistatic structure |
-
2013
- 2013-07-05 CN CN201320396504.0U patent/CN203607386U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104282631A (en) * | 2013-07-04 | 2015-01-14 | 成都方程式电子有限公司 | Novel fingerprint sensor glue injection structure |
| CN104269393A (en) * | 2014-09-15 | 2015-01-07 | 江苏长电科技股份有限公司 | Metal framework and electrostatic discharging ring integrated structure for fingerprint sensor and manufacturing method thereof |
| TWI655742B (en) * | 2016-12-22 | 2019-04-01 | 敦捷光電股份有限公司 | Packaging structure with antistatic structure |
| TWI645535B (en) * | 2016-12-23 | 2018-12-21 | 敦捷光電股份有限公司 | Fingerprint sensing identification device with antistatic structure |
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| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20171110 Address after: 518101 Guangdong city of Shenzhen province Baoan District Fuyong street Xintian Road No. 71-6 Funing High-tech Industrial Park building F F301 Patentee after: Shenzhen Ruiwei Technology Co. Ltd. Address before: 610041 Sichuan, Chengdu hi tech Zone Tianfu Avenue South extension of the new high-tech incubator Park, building A-E-3, No. 1 Patentee before: Chengdu Finchos Electron Co., Ltd. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200409 Address after: 518000 No.103, No.3, Fuyong first industrial village, Zhengcheng 1st Road, Xintian community, Fuhai street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Fengyu Technology Co., Ltd Address before: 518101 Guangdong city of Shenzhen province Baoan District Fuyong street Xintian Road No. 71-6 Funing High-tech Industrial Park building F F301 Patentee before: SHENZHEN ZHIRUIWEI TECHNOLOGY Co.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140521 Termination date: 20200705 |
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| CF01 | Termination of patent right due to non-payment of annual fee |