CN203423848U - Novel PCB coil - Google Patents
Novel PCB coil Download PDFInfo
- Publication number
- CN203423848U CN203423848U CN201320413388.9U CN201320413388U CN203423848U CN 203423848 U CN203423848 U CN 203423848U CN 201320413388 U CN201320413388 U CN 201320413388U CN 203423848 U CN203423848 U CN 203423848U
- Authority
- CN
- China
- Prior art keywords
- via hole
- pcb
- coil
- circuit board
- novel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 9
- 238000005530 etching Methods 0.000 claims abstract description 8
- 239000004020 conductor Substances 0.000 claims abstract description 5
- 239000002356 single layer Substances 0.000 claims abstract description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 4
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 4
- 239000011241 protective layer Substances 0.000 claims description 4
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 4
- 239000010410 layer Substances 0.000 abstract description 10
- 238000004804 winding Methods 0.000 abstract description 8
- 230000003071 parasitic effect Effects 0.000 abstract description 6
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
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- Coils Or Transformers For Communication (AREA)
Abstract
The utility model discloses a novel PCB coil. The novel PCB coil is characterized in that the PCB coil includes a single-layer double-faced PCB; a plurality of through holes are disposed on the PCB, and the through holes are arranged in order in two rows respectively at the internal side and the external side; etching wiring is carried out on the upper surface and lower surface of the PCB; the through holes are filled with conducting material which connects an upper copper wire and a lower copper wire in an electrical manner; and a colophony protection layer is printed on the surface of the wires wired. The novel PCB coil is beneficial in that: winding number, wire length and uniformity of a coil can be controlled accurately though employing the PCB, and winding single-layer coils on the PCB. The PCB coil is formed by using unified etching in modern printed circuit board technology, so that parameter consistency of each single PCB coil is guaranteed. In addition, simple serial connection combination is employed between the coils, so that the parasitic capacitance between adjacent coils becomes smaller.
Description
Technical field
The utility model relates to electromagnetic element technical field, is specifically related to a kind of novel PC B coil.
Background technology
Traditional mutual inductor coil is all generally enamelled wire to be wound on to the iron core of rigidity, on the flexible pipe of non magnetic skeleton or flexibility, forms.In order to improve coefficient of mutual inductance, increase induced voltage, generally can be on skeleton when coiling the enamelled wire of coiling multilayer repeatedly back and forth, to increase the number of turn of coil.Such method can be brought following problems:
The cross-sectional area of every layer line circle and line length disunity.The coil of innermost layer is to be directly wound on skeleton, so the cross-sectional area of innermost layer coil is exactly the cross-sectional area of skeleton.And outer field coil is to be wound on the basis of inner coil, therefore when calculating its cross-sectional area, must consider the thickness of inner coil.So just cause much more often around one deck coil, its cross-sectional area is the thickness that increases one deck coils just more, and outer field coil, and individual layer line length also can be longer.When assessment coil mutual inductance, the cross-sectional area of every layer line circle and line length disunity will bring error.
Because outer coil is directly wound on inner coil, between two-layer coil, distance is very near, causes can having larger parasitic capacitance between layers, and the number of plies is more, and parasitic capacitance is also just larger.These parasitic capacitances can reduce frequency response and the bandwidth of coil, cause the voltage signal and the tested current signal that induce to occur deviation.Measuring the occasion of variable signal fast such as thunder-strike current and surge current especially, the impact of parasitic capacitance is more obvious.
Even direct winding of single-layer-coil on level and smooth skeleton, our present used coil winding machine also can not guarantee that the number of turn of whole loop length interior loop is uniformly distributed.And in the situation that carrying out multilayer winding, outer coil is wrapped on rough inner coil, the coiling uniformity is difficult to guarantee more.Only have in theory coil completely symmetrically just to there is best antijamming capability, so the inhomogeneous meeting of the coiling of lattice coil bring the problem of signal interference.
Utility model content
The purpose of this utility model is for the deficiencies in the prior art, and a kind of preparation method of PCB coil is provided, and the PCB coil of preparing by the method.By adopting PCB circuit board, and on PCB circuit board winding of single-layer-coil, make the designer accurately number of turn of control coil, line length and the uniformity.The production of PCB coil is by modern printed circuit board process, to unify etching to form, thereby guarantees the parameter consistency of each monolithic PCB coil.
The technical scheme that the utility model adopted is for achieving the above object:
A B coil, it comprises a single-layer double-side PCB circuit board; On described PCB circuit board, be provided with a plurality of via holes, and the double ordered arrangement in described via hole medial and lateral; At upper surface and the lower surface of described PCB circuit board, carry out respectively etching wiring; In described via hole, be filled with the electric conducting material that upper and lower copper wire is electrically connected; On connected up surface, scribble rosin protective layer.
Described PCB circuit board is ring-like or non-ring-like.
Described via hole, the corresponding setting in medial and lateral.
Via hole top, inside and outside both sides or end, lead to respectively terminals at the upper surface of PCB circuit board.
The upper surface of PCB circuit board, from via hole top, inside and outside both sides, outside the first via hole connects inner side the second via hole, or inner side first via hole connection outside the second via hole, is then linked in sequence successively; The lower surface of PCB circuit board, from via hole top, inside and outside both sides, inner side the first via hole is connected with outside the first via hole, is then linked in sequence successively.
The beneficial effects of the utility model are: by adopting PCB circuit board, and on PCB circuit board winding of single-layer-coil, make the designer accurately number of turn of control coil, line length and the uniformity.The production of PCB coil is by modern printed circuit board process, to unify etching to form, thereby guarantees the parameter consistency of each monolithic PCB coil, has good electromagnetic performance.Simultaneously interconnected between coil is simple tandem compound, thereby the parasitic capacitance between adjacent windings can be smaller.
Accompanying drawing explanation
Fig. 1 is the overall structure schematic diagram of U-shaped PCB coil;
Fig. 2 is the structural representation of ring-like PCB coil.
In figure: 1.PCB circuit board 2. via hole 3. copper wire 4. inner side the first via holes
5. inner side second via hole 6. outside first via hole 7. outside the second via holes
8. terminals A9. terminals B
Embodiment
Embodiment 1: referring to Fig. 1, and a kind of U-shaped two-sided PCB coil that the present embodiment provides, it comprises an individual layer U-shaped PCB circuit board 1; On described U-shaped PCB circuit board 1, be provided with a plurality of via holes 2, and the described via hole 2 double ordered arrangements in medial and lateral; At upper surface and the lower surface of described U-shaped PCB circuit board 1, carry out respectively etching wiring; In described via hole 2, be filled with electric conducting material, this via hole sinks copper conducting levels by plating, and upper and lower copper wire 3 is electrically connected; On connected up surface, scribble rosin protective layer.
Described via hole 2, the corresponding setting in medial and lateral.
Via hole 2 tops, inside and outside both sides or end, lead to respectively a terminals A8 and terminals B9 at the upper surface of U-shaped PCB circuit board 1.
The upper surface of U-shaped PCB circuit board 1, from via hole 2 tops, inside and outside both sides, outside first is crossed 6 holes and is connected inner side the second via hole 5, or inner side first via hole 4 connection outside the second via holes 7, is then linked in sequence successively; The lower surface of U-shaped PCB circuit board 1, from via hole 2 tops, inside and outside both sides, inner side the first via hole 4 is connected with outside the first via hole 6, is then linked in sequence successively.
Embodiment 2: referring to Fig. 2, and the ring-like PCB coil that the present embodiment provides, its structure is substantially the same manner as Example 1, and its difference is:
A PCB coil, it comprises the two-sided PCB circuit board 1 of an individual layer annular; On described ring-shaped P CB circuit board 1, be provided with a plurality of via holes 2, and the described via hole 2 double ordered arrangements in medial and lateral; At upper surface and the lower surface of described ring-shaped P CB circuit board 1, carry out respectively etching wiring; In described via hole 2, be filled with electric conducting material, via hole sinks copper by plating, and upper and lower copper wire 3 is electrically connected; On connected up surface, scribble rosin protective layer.
Described via hole 2, the corresponding setting in medial and lateral.
Via hole 2 tops, inside and outside both sides or end, lead to respectively a terminals A8 and terminals B9 at the upper surface of ring-shaped P CB circuit board 1.
The upper surface of ring-shaped P CB circuit board 1, from via hole 2 tops, inside and outside both sides, outside first is crossed 6 holes and is connected inner side the second via hole 5, or inner side first via hole 4 connection outside the second via holes 7, is then linked in sequence successively; The lower surface of ring-shaped P CB circuit board 1, from via hole 2 tops, inside and outside both sides, inner side the first via hole 4 is connected with outside the first via hole 6, is then linked in sequence successively.
But the foregoing is only better possible embodiments of the present utility model, not in order to limit to the scope of the claims of the present utility model, therefore the equivalent structure that all utilization the utility model specifications and accompanying drawing content are done changes, be all included in protection range of the present utility model.
Claims (5)
1. a novel PC B coil, is characterized in that, it comprises a single-layer double-side PCB circuit board; On described PCB circuit board, be provided with a plurality of via holes, and the double ordered arrangement in described via hole medial and lateral; At upper surface and the lower surface of described PCB circuit board, carry out respectively etching wiring; In described via hole, be filled with the electric conducting material that upper and lower copper wire is electrically connected; On connected up surface, scribble rosin protective layer.
2. novel PC B coil according to claim 1, is characterized in that, described PCB circuit board is ring-like or non-ring-like.
3. novel PC B coil according to claim 1, is characterized in that, described via hole, the corresponding setting in medial and lateral.
4. novel PC B coil according to claim 1, is characterized in that, via hole top, inside and outside both sides or end lead to respectively terminals at the upper surface of PCB circuit board.
5. novel PC B coil according to claim 1, is characterized in that, the upper surface of PCB circuit board, from via hole top, inside and outside both sides, outside the first via hole connects inner side the second via hole, or inner side first via hole connection outside the second via hole, is then linked in sequence successively; The lower surface of PCB circuit board, from via hole top, inside and outside both sides, inner side the first via hole is connected with outside the first via hole, is then linked in sequence successively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320413388.9U CN203423848U (en) | 2013-07-11 | 2013-07-11 | Novel PCB coil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320413388.9U CN203423848U (en) | 2013-07-11 | 2013-07-11 | Novel PCB coil |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203423848U true CN203423848U (en) | 2014-02-05 |
Family
ID=50022937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320413388.9U Expired - Lifetime CN203423848U (en) | 2013-07-11 | 2013-07-11 | Novel PCB coil |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203423848U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103384456A (en) * | 2013-07-11 | 2013-11-06 | 优利德科技(中国)有限公司 | A kind of preparation method of PCB coil and PCB coil |
| CN105430909A (en) * | 2015-11-17 | 2016-03-23 | 深圳崇达多层线路板有限公司 | Manufacturing method for coil plate |
-
2013
- 2013-07-11 CN CN201320413388.9U patent/CN203423848U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103384456A (en) * | 2013-07-11 | 2013-11-06 | 优利德科技(中国)有限公司 | A kind of preparation method of PCB coil and PCB coil |
| CN105430909A (en) * | 2015-11-17 | 2016-03-23 | 深圳崇达多层线路板有限公司 | Manufacturing method for coil plate |
| CN105430909B (en) * | 2015-11-17 | 2018-04-24 | 深圳崇达多层线路板有限公司 | A kind of production method of coil plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 523808 No. 6 industrial North Road, Songshan Lake high tech Industrial Development Zone, Dongguan, Guangdong Patentee after: UNI-TREND TECHNOLOGY (CHINA) Co.,Ltd. Address before: 523808 No. 6 industrial North Road, Songshan Lake high tech Industrial Development Zone, Dongguan, Guangdong Patentee before: UNI-TREND TECHNOLOGY (CHINA) Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140205 |