CN203376989U - Transparent conductive film - Google Patents
Transparent conductive film Download PDFInfo
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- CN203376989U CN203376989U CN201320463307.6U CN201320463307U CN203376989U CN 203376989 U CN203376989 U CN 203376989U CN 201320463307 U CN201320463307 U CN 201320463307U CN 203376989 U CN203376989 U CN 203376989U
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- conductive layer
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Abstract
The utility model provides a transparent conductive film, which comprises a substrate, a first conductive layer and a first lead electrode, wherein one side of the substrate is provided with a sensing area and a lead area located at the edge of the sensing area; the first conductive layer comprises grid-shaped first conductive patterns, the first conductive patterns are configured in the sensing area and the lead area and connected with each other, and the first conductive patterns are formed by conductive wires; the first lead electrode is configured in the lead area and electrically connected with the first conductive layer; and the width of the first conductive pattern in the sensing area is less than the width of the conductive wire of the first conductive pattern located in the lead area. According to the transparent conductive film provided by the utility model, the width of grid lines of the sensing area i.e., a visible area, is less than the width of grid lines of the lead area i.e., a non-visual area, so that the conductivity is greatly increased when the first lead electrode is connected with the grid lines of the non-visual area.
Description
Technical field
The utility model relates to touch screen technology, relates in particular to a kind of nesa coating.
Background technology
Nesa coating is a kind of film that has good conductivity and have higher light transmittance at visible light wave range, nesa coating is widely used in the fields such as flat panel display, photovoltaic device, contact panel and electromagnetic shielding at present, has the extremely wide market space.
Nesa coating is to receive the sensing element of the input signals such as touch in touch-screen, at present, indium tin oxide layer (hereinafter referred to as the ITO layer) is vital part in nesa coating, although the develop rapidly at a tremendous pace of the manufacturing technology of touch-screen, but take the projecting type capacitor screen as example, too large change does not occur in the basic manufacturing process of ITO layer in recent years, always inevitably needs the ITO plated film, and ITO is graphical.
Indium is a kind of metal material of costliness, therefore using ITO as the material of conductive layer, promote to a great extent the cost of upper touch-screen, moreover, the ITO conductive layer is in graphical technique, whole the ITO film plated need be carried out to etching, to form the ITO pattern, in this technique, a large amount of ITO is etched, cause a large amount of noble metal wastes, and caused environmental pollution, ITO material and corresponding technique make the touch-screen cost high.
In addition, the lead-in wire electrode of conducting film and the electric conductivity of conductive layer junction are not fine, there will be the weak situation that obtains of conductivity.
The utility model content
The utility model provides a kind of nesa coating, and for overcoming defect of the prior art, the electric conductivity that strengthens conducting film lead-in wire electrode and conductive layer junction also reduces the cost of touch-screen greatly.
A kind of nesa coating that the utility model provides, described nesa coating comprises:
Substrate, described substrate one side is provided with induction zone and is positioned at the lead district at described induction zone edge;
The first conductive layer comprises and is latticed the first conductive pattern that described the first conductive pattern is disposed at described induction zone and lead district and is connected to each other, and described the first conductive pattern consists of conductor wire;
The first lead-in wire electrode, be disposed at described lead district, and described the first lead-in wire electrode is electrically connected to described the first conductive layer;
Wherein, the conductor wire width that is positioned at described first conductive pattern of described induction zone is less than the conductor wire width of described the first conductive pattern that is positioned at described lead district.
Particularly, described induction zone all disposes described the first conductive pattern, described lead district partial configuration has described the first conductive pattern, and the first conductive pattern that is positioned at described lead district is extended to form by the first conductive pattern lead district peripheral to it that is positioned at described induction zone.
Further, be positioned at the conductor wire width maximum of edge for being connected with described the first lead-in wire electrode of the first conductive pattern of described lead district.
Wherein, also comprise and be positioned in described substrate or be positioned at the second conductive layer on described the first conductive layer and the second lead-in wire electrode, described the second conductive layer comprises and is latticed the second conductive pattern, and described the second conductive pattern consists of described conductor wire; Described the second lead-in wire electrode is electrically connected to described the second conductive layer.
Further, described the second conductive layer and the second lead-in wire electrode all are located at the another side of described substrate, and described the second conductive layer is positioned at the relative projected area of described induction zone and extends to the projected area that is positioned at described lead district; Described the second lead-in wire electrode is positioned at the relative projected area of described lead district and is electrically connected to the second conductive pattern of the projected area that is positioned at described lead district; The conductor wire width of described the second conductive pattern that is positioned at the projected area of described induction zone is less than the conductor wire width of described second conductive pattern of the projected area that is positioned at described lead district.
Further, described the second conductive layer is located on described the first conductive layer, and is provided with insulating barrier between described the first conductive layer and described the second conductive layer, and the projection of described the second conductive layer is positioned at described induction zone and extends to described lead district; Described the second lead-in wire electrode is disposed on described insulating barrier, and the second conductive pattern that the projection of described the second lead-in wire electrode is positioned at described lead district and is positioned at described lead district with projection is electrically connected to; The conductor wire width that projection is positioned at described second conductive pattern of described induction zone is less than the conductor wire width that projection is positioned at described second conductive pattern of described lead district.
Particularly, described substrate is provided with latticed groove, and the conductor wire of described the first conductive pattern all is embedded in described latticed groove.
Further, between described the first conductive layer and described substrate, have the first hypothallus, described latticed groove is located on described the first hypothallus, and described the first conductive pattern is embedded in described latticed groove.
Wherein, there is the first hypothallus between described the first conductive layer and described substrate, there is the second hypothallus between described the second conductive layer and described substrate, be equipped with latticed groove on described the first hypothallus and the second hypothallus, described the first conductive pattern is embedded in the described latticed groove be opened on the first hypothallus, and described the second conductive pattern is embedded in the described latticed groove be opened on the second hypothallus.
Wherein, there is the first hypothallus between described the first conductive layer and described substrate, insulating barrier between described the first conductive layer and described the second conductive layer forms the second hypothallus, be equipped with latticed groove on described the first hypothallus and the second hypothallus, described the first conductive pattern is embedded in the described latticed groove be opened on the first hypothallus, and described the second conductive pattern is embedded in the described latticed groove be opened on the second hypothallus.
The nesa coating that the utility model provides, induction zone be the grid line live width of visible range to be less than lead district be non-visible range grid line live width, when such the first lead-in wire electrode is connected with the grid line of non-visible range, greatly strengthened electric conductivity.
The accompanying drawing explanation
The front schematic view of substrate in the nesa coating that Fig. 1 provides for the utility model embodiment mono-;
The vertical view of the nesa coating that Fig. 2 provides for the utility model embodiment mono-;
The cutaway view of the nesa coating that Fig. 3 provides for the utility model embodiment mono-;
The partial sectional view of the sub pattern of the nesa coating that Fig. 4 provides for the utility model embodiment bis-;
The upward view of the nesa coating that Fig. 5 provides for the utility model embodiment bis-;
The partial sectional view of the sub pattern of the nesa coating that Fig. 6 provides for the utility model embodiment tri-;
The vertical view of the nesa coating that Fig. 7 provides for the utility model embodiment tri-;
The cutaway view of the nesa coating that Fig. 8 provides for the utility model embodiment tetra-;
The partial sectional view of the sub pattern of the nesa coating that Fig. 9 provides for the utility model embodiment five;
The partial sectional view of the sub pattern of the nesa coating that Figure 10 provides for the utility model embodiment six;
The cutaway view of the nesa coating that Figure 11 provides for the utility model embodiment seven;
The partial sectional view of the sub pattern of the nesa coating that Figure 12 provides for the utility model embodiment eight;
The cutaway view of the nesa coating that Figure 13 provides for the utility model embodiment nine;
Square net schematic diagram in the nesa coating that Figure 14 provides for the utility model embodiment;
Regular hexagonal cell schematic diagram in the nesa coating that Figure 15 provides for the utility model embodiment;
Network schematic diagram in the nesa coating that Figure 16 provides for the utility model embodiment;
Random polygonal mesh schematic diagram in the nesa coating that Figure 17 provides for the utility model embodiment.
Embodiment
Embodiment mono-
As Figure 1-3, the utility model embodiment provides a kind of nesa coating, and nesa coating comprises substrate 1, the first conductive layer 1a, the first lead-in wire electrode 1b;
The first conductive layer 1a comprises and is latticed the first conductive pattern that the first conductive pattern is disposed at induction zone 11 and lead district 12 and is connected to each other, and the first conductive pattern consists of conductor wire;
The first lead-in wire electrode 1b, be disposed at lead district 12, the first lead-in wire electrode 1b and be electrically connected to 1a with the first conductive layer;
Wherein, the conductor wire width that is positioned at the first conductive pattern 11a of induction zone is less than the conductor wire width of the first conductive pattern 12a that is positioned at lead district.
The nesa coating that the utility model provides, induction zone is that to be less than lead district be non-visible range grid line live width to the grid line live width of visible range, when such the first lead-in wire electrode is connected with the grid line of non-visible range, the resistance of the wire of junction will reduce, thereby greatly strengthened electric conductivity, above-mentioned grid line is exactly conductor wire.The first conductive pattern is arranged and is formed by a plurality of sub pattern, and sub pattern is latticed and is continuous, and the concrete shape of sub pattern is not limit at this, rectangular in the present embodiment, and each sub pattern is connected with one first lead-in wire electrode, forms an electrode.
Preferred implementation as above-described embodiment, as shown in Figure 1 and Figure 2, induction zone 11 all disposes the first conductive pattern, lead district 12 partial configurations have the first conductive pattern, and the first conductive pattern 12a that is positioned at lead district is extended to form by the first conductive pattern 11a lead district peripheral to it that is positioned at induction zone.There is not blind spot in this arrangement induction zone, guaranteed and induction zone and lead district between the stronger conductivity of the first conductive pattern.
As the preferred implementation of above-described embodiment, for further increasing the conductivity between lead-in wire electrode and conductive layer, be positioned at the conductor wire width maximum of edge 13a for being connected with the first lead-in wire electrode 1b of the first conductive pattern 12a of lead district.Because this edge 13a directly is connected with the first lead-in wire electrode 1b, therefore increased the live width of this place's conductor wire, because the resistance of wire and the cross-sectional area of conductor wire are inverse ratio, be equivalent to reduce the resistance of junction, strengthened the conductivity between lead-in wire electrode and conductive layer.
On the basis of above-described embodiment, referring to Fig. 4-7, for further increasing the electric conductivity of conducting film and the sensitivity of touch-screen, nesa coating also comprises and is positioned in substrate 1 or is positioned at the second conductive layer 2a on the first conductive layer 1a and the second lead-in wire electrode 2b, the second conductive layer 2a comprises and is latticed the second conductive pattern, and the second conductive pattern consists of above-mentioned conductor wire; The second lead-in wire electrode 2b is electrically connected to the second conductive layer 2a.Following two kinds of embodiments are specifically arranged:
Embodiment bis-
A kind of execution mode is as follows, conducting film is the single-layer double-side structure, referring to Fig. 4, Fig. 5, the another side that the second conductive layer 2a and the second lead-in wire electrode 2b all are located at substrate 1 i.e. the opposing one side with induction zone and lead district are set, and the second conductive layer 2a is positioned at the relative projected area of induction zone and extends to the projected area that is positioned at lead district; The second lead-in wire electrode 2b is positioned at the relative projected area of lead district and is electrically connected to the second conductive pattern 22a of the projected area that is positioned at lead district; The conductor wire width of the second conductive pattern 21a that is positioned at the projected area of induction zone is less than the conductor wire width of the second conductive pattern 22a of the projected area that is positioned at lead district.Increase the conductivity between the second conductive layer and the second lead-in wire electrode.The same, be further to increase the second conductive layer and the second conductivity gone between between electrode, the edge 23a of the second conductive pattern 22a that is positioned at the projected area of lead district can be arranged to maximum for the conductor wire width be connected with the second lead-in wire electrode 2b.
Embodiment tri-
Another kind of execution mode is as follows, conducting film is the single-surface double-layer structure, and referring to Fig. 6, Fig. 7, the second conductive layer 2a is located on the first conductive layer 1a, and be provided with insulating barrier 30 between the first conductive layer 1a and the second conductive layer 2a, and the projection of the second conductive layer 2a is positioned at induction zone and extends to lead district; The second lead-in wire electrode 2b is disposed on insulating barrier 30, and the second conductive pattern 22a ' that the projection of the second lead-in wire electrode 2b is positioned at lead district and is positioned at lead district with projection is electrically connected to; The conductor wire width that projection is positioned at the second conductive pattern 21a ' of induction zone is less than the conductor wire width that projection is positioned at the second conductive pattern 22a ' of lead district.Increase the conductivity between the second conductive layer and the second lead-in wire electrode.The same, for further increasing the conductivity between the second conductive layer and the second lead-in wire electrode, the edge 23a ' that projection can be positioned to the second conductive pattern 22a ' of lead district is arranged to maximum for the conductor wire width be connected with the second lead-in wire electrode 2b.
In embodiment mono-and embodiment bis-, all in substrate 1, be provided with latticed groove, the conductor wire of the first conductive pattern or the second conductive pattern all is embedded in above-mentioned latticed groove.The protection conductor wire is not frayed.
Latticed groove specifically can be compressing by mould, and electric conducting material is heated into liquid pouring can form conductive pattern to latticed groove.The electric conducting material that forms the first conductive layer and the second conductive layer can be the electric conducting materials such as silver, copper, conducting polymer, ITO.The first lead-in wire electrode or the second lead-in wire electrode can be filled by above-mentioned electric conducting material formation in the latticed groove set in advance, with the formation structure of above-mentioned conductive layer.
Embodiment tetra-
As shown in Figure 8, have the first hypothallus 10 between the first conductive layer 1a and substrate 1, latticed groove is located on the first hypothallus 10, and the first conductive pattern is embedded in above-mentioned latticed groove.
Embodiment five
As shown in Figure 9, there is the first hypothallus 10 between the first conductive layer 1a and substrate 1, there is the second hypothallus 20 between the second conductive layer 2a and substrate 1, be equipped with latticed groove on the first hypothallus 10 and the second hypothallus 20, the first conductive pattern and the second conductive pattern are embedded at respectively in latticed groove.The first conductive pattern is embedded in the described latticed groove be opened on the first hypothallus, and the second conductive pattern is embedded in the described latticed groove be opened on the second hypothallus.
Embodiment six
As shown in figure 10, there is the first hypothallus 10 between the first conductive layer 1a and substrate 1, insulating barrier between the first conductive layer 1a and the second conductive layer 2a forms the second hypothallus 20, be equipped with latticed groove on the first hypothallus 10 and the second hypothallus 20, the first conductive pattern and the second conductive pattern are embedded at respectively in described latticed groove.The first conductive pattern is embedded in the described latticed groove be opened on the first hypothallus, and the second conductive pattern is embedded in the described latticed groove be opened on the second hypothallus.
Embodiment seven, eight, nine
Above-mentioned the first conductive layer 1a, the second conductive layer 2a and lead-in wire electrode also can adopt following exposure technology to be formed in substrate 1 and form bulge-structure, as shown in Figure 11-13, at first be coated with the electric conducting material of sensitization in the lead-in wire zone, be placed with shadow shield in the above, then light irradiates it, it is exposed, then carried out etching, formed the lead-in wire electrode of bulge-structure.Substrate 1 can be selected the materials such as PET or glass, and light transmittance is good, easy-formation.The lead-in wire electrode can also form by silk screen printing, etching, impression or inkjet printing.
The first conductive layer or the second conductive layer surface also comprise protective clear layer, and described protective clear layer is UV glue, impression glue or Merlon.The first hypothallus 10 and 20 cementations of the second hypothallus, for increasing the adhesion of electric conducting material and substrate.
Form the grid of the first conductive pattern and the grid of the second conductive pattern and can be the random polygonal mesh shown in the network shown in the regular hexagonal cell shown in the square mesh shown in Figure 14, Figure 15, Figure 16 or Figure 17, several networks have been provided in upper figure, certainly can also be other regular polygons, can be also the lattices such as rectangle, parallelogram, random polygon.
Finally it should be noted that: above each embodiment, only in order to the technical solution of the utility model to be described, is not intended to limit; Although with reference to aforementioned each embodiment, the utility model is had been described in detail, those of ordinary skill in the art is to be understood that: its technical scheme that still can put down in writing aforementioned each embodiment is modified, or some or all of technical characterictic wherein is equal to replacement; And these modifications or replacement do not make the essence of appropriate technical solution break away from the scope of each embodiment technical scheme of the utility model.
Claims (10)
1. a nesa coating, is characterized in that, described nesa coating comprises:
Substrate, described substrate one side is provided with induction zone and is positioned at the lead district at described induction zone edge;
The first conductive layer comprises and is latticed the first conductive pattern that described the first conductive pattern is disposed at described induction zone and lead district and is connected to each other, and described the first conductive pattern consists of conductor wire;
The first lead-in wire electrode, be disposed at described lead district, and described the first lead-in wire electrode is electrically connected to described the first conductive layer;
Wherein, the conductor wire width that is positioned at described first conductive pattern of described induction zone is less than the conductor wire width of described the first conductive pattern that is positioned at described lead district.
2. nesa coating according to claim 1, it is characterized in that, described induction zone all disposes described the first conductive pattern, described lead district partial configuration has described the first conductive pattern, and the first conductive pattern that is positioned at described lead district is extended to form by the first conductive pattern lead district peripheral to it that is positioned at described induction zone.
3. nesa coating according to claim 2, is characterized in that, is positioned at the conductor wire width maximum of edge for being connected with described the first lead-in wire electrode of the first conductive pattern of described lead district.
4. according to the arbitrary described nesa coating of claim 1-3, it is characterized in that, also comprise and be positioned in described substrate or be positioned at the second conductive layer and the second lead-in wire electrode on described the first conductive layer, described the second conductive layer comprises and is latticed the second conductive pattern, and described the second conductive pattern consists of described conductor wire; Described the second lead-in wire electrode is electrically connected to described the second conductive layer.
5. nesa coating according to claim 4, it is characterized in that, described the second conductive layer and the second lead-in wire electrode all are located at the another side of described substrate, and described the second conductive layer is positioned at the relative projected area of described induction zone and extends to the projected area that is positioned at described lead district; Described the second lead-in wire electrode is positioned at the relative projected area of described lead district and is electrically connected to the second conductive pattern of the projected area that is positioned at described lead district; The conductor wire width of described the second conductive pattern that is positioned at the projected area of described induction zone is less than the conductor wire width of described second conductive pattern of the projected area that is positioned at described lead district.
6. nesa coating according to claim 4, it is characterized in that, described the second conductive layer is located on described the first conductive layer, and be provided with insulating barrier between described the first conductive layer and described the second conductive layer, and the projection of described the second conductive layer is positioned at described induction zone and extends to described lead district; Described the second lead-in wire electrode is disposed on described insulating barrier, and the second conductive pattern that the projection of described the second lead-in wire electrode is positioned at described lead district and is positioned at described lead district with projection is electrically connected to; The conductor wire width that projection is positioned at described second conductive pattern of described induction zone is less than the conductor wire width that projection is positioned at described second conductive pattern of described lead district.
7. according to the arbitrary described nesa coating of claim 1-3, it is characterized in that, described substrate is provided with latticed groove, and the conductor wire of described the first conductive pattern all is embedded in described latticed groove.
8. nesa coating according to claim 7, it is characterized in that, have the first hypothallus between described the first conductive layer and described substrate, described latticed groove is located on described the first hypothallus, and described the first conductive pattern is embedded in described latticed groove.
9. nesa coating according to claim 5, it is characterized in that, there is the first hypothallus between described the first conductive layer and described substrate, there is the second hypothallus between described the second conductive layer and described substrate, be equipped with latticed groove on described the first hypothallus and the second hypothallus, described the first conductive pattern is embedded in the described latticed groove be opened on the first hypothallus, and described the second conductive pattern is embedded in the described latticed groove be opened on the second hypothallus.
10. nesa coating according to claim 6, it is characterized in that, there is the first hypothallus between described the first conductive layer and described substrate, insulating barrier between described the first conductive layer and described the second conductive layer forms the second hypothallus, be equipped with latticed groove on described the first hypothallus and the second hypothallus, described the first conductive pattern is embedded in the described latticed groove be opened on the first hypothallus, and described the second conductive pattern is embedded in the described latticed groove be opened on the second hypothallus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320463307.6U CN203376989U (en) | 2013-07-31 | 2013-07-31 | Transparent conductive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320463307.6U CN203376989U (en) | 2013-07-31 | 2013-07-31 | Transparent conductive film |
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| Publication Number | Publication Date |
|---|---|
| CN203376989U true CN203376989U (en) | 2014-01-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201320463307.6U Expired - Fee Related CN203376989U (en) | 2013-07-31 | 2013-07-31 | Transparent conductive film |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104347155A (en) * | 2013-07-31 | 2015-02-11 | 南昌欧菲光科技有限公司 | Transparent conducting film |
| CN105094406A (en) * | 2014-05-20 | 2015-11-25 | 恒颢科技股份有限公司 | Touch panel, routing structure and routing structure forming method |
| CN105278739A (en) * | 2014-07-17 | 2016-01-27 | 财团法人工业技术研究院 | Sensing structure |
-
2013
- 2013-07-31 CN CN201320463307.6U patent/CN203376989U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104347155A (en) * | 2013-07-31 | 2015-02-11 | 南昌欧菲光科技有限公司 | Transparent conducting film |
| CN105094406A (en) * | 2014-05-20 | 2015-11-25 | 恒颢科技股份有限公司 | Touch panel, routing structure and routing structure forming method |
| CN105278739A (en) * | 2014-07-17 | 2016-01-27 | 财团法人工业技术研究院 | Sensing structure |
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| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140101 Termination date: 20150731 |
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| EXPY | Termination of patent right or utility model |