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CN203337694U - 一种测试探针 - Google Patents

一种测试探针 Download PDF

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Publication number
CN203337694U
CN203337694U CN2013202918019U CN201320291801U CN203337694U CN 203337694 U CN203337694 U CN 203337694U CN 2013202918019 U CN2013202918019 U CN 2013202918019U CN 201320291801 U CN201320291801 U CN 201320291801U CN 203337694 U CN203337694 U CN 203337694U
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CN
China
Prior art keywords
probe
test
test probe
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2013202918019U
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English (en)
Inventor
聂林红
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Shenzhen Ulmt Technology Co Ltd
Original Assignee
Shenzhen Ce Way Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Ce Way Technology Co Ltd filed Critical Shenzhen Ce Way Technology Co Ltd
Priority to CN2013202918019U priority Critical patent/CN203337694U/zh
Application granted granted Critical
Publication of CN203337694U publication Critical patent/CN203337694U/zh
Priority to JP2016515631A priority patent/JP2016520835A/ja
Priority to US14/894,467 priority patent/US9791473B2/en
Priority to PCT/CN2014/078526 priority patent/WO2014190894A1/zh
Priority to CN201480030386.9A priority patent/CN105308464A/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

本实用新型公开一种测试探针，其主要适用于测试装置对印刷电路板进行电性测试中，该印刷电路板上设置有若干金手指，其中，所述测试探针设置于该测试装置上，该测试探针主要包括对应穿出该测试装置的本体以及设置于该本体一末端且其内为中空的探针针头，所述探针各对应于该印刷电路板上的金手指设置且该探针内为中空的探针针头对应插接于金手指上。本实用新型不仅简单方便，加工难度降低，且在测试过程中上电稳定。

Description

一种测试探针
技术领域
本实用新型涉及一种测试探针，尤其涉及一种主要应用于印刷电路板上的测试探针。
背景技术
在生产印刷电路板的过程中需要对印刷电路板进行电性测试，以判断印刷电路板各组件的电性参数（例如阻值、容值或感抗等）是否合乎标准。
常见的印刷电路板的测试方式是在印刷电路板上设置测试点，将锡膏印刷于测试点表面，通过自动化测试设备或在线测试设备，以探针直接接触测试点的锡膏部位以取得相关的电性参数。
目前的在线测试设备中的探针组装比较困难，对通孔的加工要求较高，且上电不稳定。
实用新型内容
本实用新型提出一种测试探针，以解决目前的探针组装比较困难，对通孔的加工要求较高，且上电不稳定的技术问题。
本实用新型提出一种测试探针，其主要适用于测试装置对印刷电路板进行电性测试中，该印刷电路板上设置有若干金手指，其中，所述测试探针设置于该测试装置上，该测试探针主要包括对应穿出该测试装置的本体以及设置于该本体一末端且其内为中空的探针针头，所述探针各对应于该印刷电路板上的金手指设置且该探针内为中空的探针针头对应插接于金手指上。
优选地，所述探针本体为长条形。
优选地，所述测试装置包括针板，该针板上设置有供探针穿出并固定于针板上的通孔。
本实用新型具有如下有益效果：此种组装方式不仅简单方便，加工难度降低，且在测试过程中上电稳定。
附图说明
图1是本实用新型一种测试探针一实施例中探针及金手指的结构示意图；
图2是本实用新型一种测试探针一实施例中探针应用于测试印刷电路板的结构示意图。
具体实施方式
请参照图1及图2所示，本实用新型提供了一种测试探针，不仅简单方便，加工难度降低，且在测试过程中上电稳定。
上述测试探针201主要适用于测试装置对印刷电路板10进行电性测试的过程中，该印刷电路板10上设置有若干金手指101，于本实施例中，该测试装置包括针板20，该针板20上设置有若干通孔202，该针板20与该印刷电路板10相对设置，且该针板20位于该印刷电路板10正上方。
上述测试探针201主要包括本体2011以及设置于该本体2011一末端的探针针头2012，所述本体2011为长条形，该本体2011对应穿出该针板20上设有的通孔202且固定于该针板20上，并且设置于该本体2011一末端的探针针头2012外露于该针板20的一侧面，所述探针针头2012内为中空，所述测试探针201各对应于该印刷电路板10上的金手指101的位置设置，以于在进行电性测试时，该针板20向靠近印刷电路板10的方向运动，以令该测试探针201内为中空的探针针头2012对应插接于该印刷电路板10的金手指101上，即可上电进行相应的测试。
以上所述仅为本实用新型的较佳实施例而已，并不用以限制本实用新型，凡在本实用新型的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本实用新型的保护范围之内。

Claims (3)

1.一种测试探针，其适用于测试装置对印刷电路板进行电性测试中，该印刷电路板上设置有若干金手指，其特征在于，所述测试探针设置于该测试装置上，该测试探针主要包括对应穿出该测试装置的本体以及设置于该本体一末端且其内为中空的探针针头，所述探针各对应于该印刷电路板上的金手指设置且该探针内为中空的探针针头对应插接于金手指上。
2.根据权利要求1所述的测试探针，其特征在于，所述探针本体为长条形。
3.根据权利要求1或2所述的测试探针，其特征在于，所述测试装置包括针板，该针板上设置有供探针穿出并固定于针板上的通孔。
CN2013202918019U 2013-05-27 2013-05-27 一种测试探针 Expired - Fee Related CN203337694U (zh)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN2013202918019U CN203337694U (zh) 2013-05-27 2013-05-27 一种测试探针
JP2016515631A JP2016520835A (ja) 2013-05-27 2014-05-27 テストプローブ、テストプローブアセンブリ及びテストプラットフォーム
US14/894,467 US9791473B2 (en) 2013-05-27 2014-05-27 Test probe, test probe component and test platform
PCT/CN2014/078526 WO2014190894A1 (zh) 2013-05-27 2014-05-27 测试探针、测试探针组件及测试平台
CN201480030386.9A CN105308464A (zh) 2013-05-27 2014-05-27 测试探针、测试探针组件及测试平台

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014190894A1 (zh) * 2013-05-27 2014-12-04 深圳市策维科技有限公司 测试探针、测试探针组件及测试平台
CN104391238A (zh) * 2014-12-03 2015-03-04 京东方科技集团股份有限公司 一种探针和测试设备
US12498398B2 (en) 2023-02-23 2025-12-16 Snap-On Incorporated Electrical testing device with probe having an adjustable angle
US12504442B2 (en) 2023-02-23 2025-12-23 Snap-On Incorporated Electrical testing device with probe having portions with different cross-sectional areas

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CN107749538B (zh) * 2017-11-10 2024-03-12 江苏特创科技有限公司 一种接口端测试组件及接口端测试装置
CN110208582A (zh) * 2019-07-08 2019-09-06 深圳市美锐精密电子有限公司 一种pcb检测探针及其制造方法
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Publication number Priority date Publication date Assignee Title
WO2014190894A1 (zh) * 2013-05-27 2014-12-04 深圳市策维科技有限公司 测试探针、测试探针组件及测试平台
CN105308464A (zh) * 2013-05-27 2016-02-03 深圳市策维科技有限公司 测试探针、测试探针组件及测试平台
US9791473B2 (en) 2013-05-27 2017-10-17 Shenzhen Ceway Technology Co., Ltd. Test probe, test probe component and test platform
CN104391238A (zh) * 2014-12-03 2015-03-04 京东方科技集团股份有限公司 一种探针和测试设备
US12498398B2 (en) 2023-02-23 2025-12-16 Snap-On Incorporated Electrical testing device with probe having an adjustable angle
US12504442B2 (en) 2023-02-23 2025-12-23 Snap-On Incorporated Electrical testing device with probe having portions with different cross-sectional areas

Also Published As

Publication number Publication date
JP2016520835A (ja) 2016-07-14
US9791473B2 (en) 2017-10-17
WO2014190894A1 (zh) 2014-12-04
US20160116502A1 (en) 2016-04-28
CN105308464A (zh) 2016-02-03

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Address after: 518110 Guangdong Province, Shenzhen city Longhua District Guanlan street Zhangkeng diameter Wai Industrial Zone Road No. 14 Ai Li Emmett Industrial Park

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