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CN203337570U - Detecting system - Google Patents

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CN203337570U
CN203337570U CN2013204303076U CN201320430307U CN203337570U CN 203337570 U CN203337570 U CN 203337570U CN 2013204303076 U CN2013204303076 U CN 2013204303076U CN 201320430307 U CN201320430307 U CN 201320430307U CN 203337570 U CN203337570 U CN 203337570U
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substrate
ccd
image information
detection
data
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陈程
吕艳明
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BOE Technology Group Co Ltd
Hefei BOE Optoelectronics Technology Co Ltd
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Hefei BOE Optoelectronics Technology Co Ltd
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Abstract

本实用新型实施例提供一种检测系统,包括图像采集设备,数据处理设备,以及基板承载设备,通过图像采集设备获取基板的二维图像信息,再由数据处理设备根据图像采集设备获取的二维图像信息及预先设定的基板规格标准数据来检测基板是否缺损,由于根据图像采集设备获取的二维图像信息及预先设定的基板规格标准数据对基板进行检测时,可以根据多个方面的规格标准数据进行检测,因此不易出现漏检测,检测精度也较高,可以有效的提高基板缺损检测的精度。

The embodiment of the utility model provides a detection system, including an image acquisition device, a data processing device, and a substrate carrying device. Image information and preset substrate specification standard data to detect whether the substrate is defective, because when detecting the substrate based on the two-dimensional image information acquired by the image acquisition device and the preset substrate specification standard data, it can be based on various specifications Standard data is used for detection, so missing detection is not easy to occur, and the detection accuracy is also high, which can effectively improve the accuracy of substrate defect detection.

Description

检测系统Detection Systems

技术领域technical field

本实用新型涉及显示技术领域,尤其涉及一种检测系统。The utility model relates to the field of display technology, in particular to a detection system.

背景技术Background technique

液晶显示器面板包括彩膜基板和阵列基板,彩膜基板和阵列基板都是以玻璃基板作为最基本的原材料进行不同的工艺加工而成的。其中阵列基板的制造过程通常需要循环执行成膜、曝光、刻蚀和剥离这几个工艺以制成多图案层。由于玻璃基板上的玻璃厚度较薄,通常在0.3-0.7mm,在生产过程中玻璃边缘极易破碎或破损,玻璃一旦破损或破碎,会对产品和设备造成严重影响。The liquid crystal display panel includes a color filter substrate and an array substrate, and the color filter substrate and the array substrate are both processed with glass substrates as the most basic raw materials through different processes. The manufacturing process of the array substrate usually needs to perform several processes of film formation, exposure, etching and stripping in cycles to form multi-pattern layers. Since the thickness of the glass on the glass substrate is relatively thin, usually 0.3-0.7mm, the edge of the glass is easily broken or broken during the production process. Once the glass is broken or broken, it will have a serious impact on products and equipment.

通常阵列基站或彩膜基板的基板缺损检测方法主要有真空吸附报警和在基板运行方向的边缘设置摄像头来记录边缘是否缺损。其中真空吸附报警即为对基板进行真空吸附,检测吸附后的真空度,若达不到预设的真空度,则确定基站破损,进行报警。但是这种方法容易受到真空供应压力波动、台板平整度、基板轻微形变的影响,因此容易出现误报警或漏检;在基板运行方向的边缘设置摄像头来记录边缘是否缺损则只能检测到基板行进方向边缘的缺损,而对与行进方向垂直的基板边缘缺损无法检测,因此,目前的基板缺损检测方法不能有效的检测基站的缺损状况,检测精度较低。Usually, the substrate defect detection methods for array base stations or color filter substrates mainly include vacuum adsorption alarms and setting cameras on the edges of the substrate running direction to record whether the edges are defective. The vacuum adsorption alarm is to perform vacuum adsorption on the substrate and detect the vacuum degree after adsorption. If the preset vacuum degree cannot be reached, it is determined that the base station is damaged and an alarm is issued. However, this method is susceptible to fluctuations in vacuum supply pressure, flatness of the platen, and slight deformation of the substrate, so it is prone to false alarms or missed inspections; if a camera is installed on the edge of the substrate’s running direction to record whether the edge is defective, only the substrate can be detected Defects on the edge of the traveling direction, but defects on the edge of the substrate perpendicular to the traveling direction cannot be detected. Therefore, the current substrate defect detection method cannot effectively detect the defect of the base station, and the detection accuracy is low.

发明内容Contents of the invention

本实用新型实施例提供一种检测系统,以提高基板缺损检测的精度。The embodiment of the utility model provides a detection system to improve the accuracy of substrate defect detection.

一种检测系统,包括:A detection system comprising:

用于获取基板的二维图像信息的图像采集设备;An image acquisition device for acquiring two-dimensional image information of the substrate;

用于根据所述二维图像信息及预先设定的基板规格标准数据检测所述基板是否缺损的数据处理设备,与所述图像采集设备相连。A data processing device for detecting whether the substrate is defective based on the two-dimensional image information and preset substrate specification data is connected to the image acquisition device.

本实用新型实施例提供一种检测系统,包括图像采集设备,数据处理设备,通过图像采集设备获取基板的二维图像信息,再由数据处理设备根据图像采集设备获取的二维图像信息及预先设定的基板规格标准数据来检测基板是否缺损,由于根据图像采集设备获取的二维图像信息及预先设定的基板规格标准数据对基板进行检测时,可以根据多个方面的规格标准数据进行检测,因此不易出现漏检测,检测精度也较高,可以有效的提高基板缺损检测的精度。The embodiment of the utility model provides a detection system, including an image acquisition device and a data processing device. The two-dimensional image information of the substrate is obtained by the image acquisition device, and then the data processing device is based on the two-dimensional image information obtained by the image acquisition device and the pre-set Based on the specified substrate specification standard data to detect whether the substrate is defective, because when the substrate is detected according to the two-dimensional image information obtained by the image acquisition device and the pre-set substrate specification standard data, it can be detected according to the specification standard data in multiple aspects, Therefore, missing detection is less likely to occur, and the detection accuracy is relatively high, which can effectively improve the detection accuracy of the substrate defect.

附图说明Description of drawings

图1为本实用新型实施例提供的检测系统的结构示意图之一;Fig. 1 is one of the structural representations of the detection system provided by the embodiment of the utility model;

图2为本实用新型实施例提供的一种图像采集设备的结构示意图;Fig. 2 is a schematic structural diagram of an image acquisition device provided by an embodiment of the present invention;

图3为本实用新型实施例提供的检测系统的结构示意图之二;Fig. 3 is the second structural diagram of the detection system provided by the embodiment of the utility model;

图4为本实用新型实施例提供的基板承载设备结构示意图之一;Fig. 4 is one of the structural schematic diagrams of the substrate carrying equipment provided by the embodiment of the present invention;

图5为本实用新型实施例提供的基板承载设备结构示意图之二;Fig. 5 is the second schematic diagram of the structure of the substrate carrying device provided by the embodiment of the present invention;

图6为本实用新型实施例提供的一种数据处理设备结构示意图;Fig. 6 is a schematic structural diagram of a data processing device provided by an embodiment of the present invention;

图7为本实用新型实施例提供的一种较佳的检测系统结构示意图。Fig. 7 is a schematic structural diagram of a preferred detection system provided by the embodiment of the present invention.

具体实施方式Detailed ways

本实用新型实施例提供一种检测系统,包括图像采集设备,数据处理设备,以及基板承载设备,通过图像采集设备获取基板的二维图像信息,再由数据处理设备根据图像采集设备获取的二维图像信息及预先设定的基板规格标准数据来检测基板是否缺损,由于根据图像采集设备获取的二维图像信息及预先设定的基板规格标准数据对基板进行检测时,可以根据多个方面的规格标准数据进行检测,因此不易出现漏检测,检测精度也较高,可以有效的提高基板缺损检测的精度。The embodiment of the utility model provides a detection system, including an image acquisition device, a data processing device, and a substrate carrying device. Image information and preset substrate specification standard data are used to detect whether the substrate is defective. Since the substrate is detected according to the two-dimensional image information acquired by the image acquisition device and the preset substrate specification standard data, it can be based on various specifications. Standard data is used for detection, so missing detection is not easy to occur, and the detection accuracy is also high, which can effectively improve the accuracy of substrate defect detection.

如图1所示,本实用新型实施例提供一种检测系统,包括:As shown in Figure 1, the embodiment of the present invention provides a detection system, including:

用于获取基板的二维图像信息的图像采集设备101;An image acquisition device 101 for acquiring two-dimensional image information of the substrate;

用于根据二维图像信息及预先设定的基板规格标准数据检测基板是否缺损的数据处理设备102,与图像采集设备101相连。The data processing device 102 for detecting whether the substrate is defective based on the two-dimensional image information and the preset substrate specification standard data is connected to the image acquisition device 101 .

通过图像采集设备101获取基板的二维图像信息,再由数据处理设备102根据图像采集设备101获取的二维图像信息及预先设定的基板规格标准数据来检测基板是否缺损。由于根据图像采集设备101扫描得到的二维图像信息及预先设定的基板规格标准数据对基板进行检测时,可以根据形状、面积等多个方面的规格进行检测,因此不易出现漏检测,检测精度也较高。The two-dimensional image information of the substrate is obtained by the image acquisition device 101, and then the data processing device 102 detects whether the substrate is defective according to the two-dimensional image information obtained by the image acquisition device 101 and the preset substrate specification standard data. Since the substrate can be detected according to the two-dimensional image information scanned by the image acquisition device 101 and the preset standard data of the substrate specification, it can be detected according to various specifications such as shape and area, so it is not easy to miss detection, and the detection accuracy Also higher.

其中,基板可以是显示器件制作过程中的显示基板、衬底基板等已形成或尚未形成有器件图形的各类基板,且不限制显示类型,例如可以为液晶显示、电致发光显示等;Wherein, the substrate may be a display substrate, a base substrate, and other various substrates with or without device graphics formed in the manufacturing process of the display device, and the display type is not limited, for example, it may be a liquid crystal display, an electroluminescent display, etc.;

图像采集设备可以为现有的任意类型的具备二维图像采集功能的设备,本实用新型实施例中以电荷耦合元件(Charge Coupled Device,CCD)扫描设备为例进行说明。The image acquisition device can be any type of existing equipment with two-dimensional image acquisition function. In the embodiment of the utility model, a charge coupled device (Charge Coupled Device, CCD) scanning device is taken as an example for illustration.

具体的,如图2所示,图像采集设备101包括:Specifically, as shown in FIG. 2, the image acquisition device 101 includes:

CCD201、与CCD201相连的CDD驱动电路202及连接在CCD201上的透镜203,其中透镜203用于增大CCD201的扫描宽度。The CCD201, the CDD drive circuit 202 connected to the CCD201 and the lens 203 connected to the CCD201, wherein the lens 203 is used to increase the scanning width of the CCD201.

实际应用中,可以根据基板在像元方向上的宽度确定透镜203的放大或者缩小倍数,以使基板在像元方向上的宽度在CCD201的扫描宽度之内。In practical applications, the magnification or reduction factor of the lens 203 can be determined according to the width of the substrate in the direction of the pixel, so that the width of the substrate in the direction of the pixel is within the scanning width of the CCD 201 .

其中,CCD201可以具体为:Among them, CCD201 can be specifically:

线阵CCD201;或者Linear array CCD201; or

面阵CCD201。Area array CCD201.

较佳的,如图3所示,本实用新型实施例提供的检测系统还包括:用于承载基板的基板承载设备103,位于图像采集设备101的下方;Preferably, as shown in FIG. 3 , the detection system provided by the embodiment of the present invention further includes: a substrate carrying device 103 for carrying the substrate, located below the image acquisition device 101 ;

具体的,当CCD201为线阵CCD201时,由于线阵CCD201能够以逐行的形式读出各像元数据,因此基板承载设备103可以为如图4所示的传送式基板承载设备103,设置在透镜203的下方,当基板放置在传送式基板承载设备103后,可以由传送式基板承载设备103的伺服电机以固定的转速驱动传送式基板承载设备103上的传送带沿一定的方向运动,从而带动基板以同样的速度运动,使线阵CCD201能够对基板承载设备103中承载基板的位置的各像元数据逐行扫描,得到该表面的二维图像信息。Specifically, when the CCD201 is a linear array CCD201, since the linear array CCD201 can read out each pixel data row by row, the substrate carrying device 103 can be a transfer type substrate carrying device 103 as shown in FIG. Below the lens 203, when the substrate is placed on the conveying substrate carrying device 103, the servo motor of the conveying substrate carrying device 103 can drive the conveyor belt on the conveying substrate carrying device 103 to move in a certain direction at a fixed speed, thereby driving The substrate moves at the same speed, so that the linear array CCD 201 can scan the data of each pixel at the position where the substrate is carried in the substrate carrying device 103 line by line to obtain two-dimensional image information of the surface.

当CCD201为面阵CCD201,由于面阵CCD201可以直接扫描得到基板承载设备103中承载基板的位置的二维图像信息,因此基板承载设备103可以为如图5所示的面板式基板承载设备103,设置在透镜203的下方。When the CCD201 is an area array CCD201, since the area array CCD201 can directly scan to obtain the two-dimensional image information of the position of the substrate carrying device 103, the substrate carrying device 103 can be a panel-type substrate carrying device 103 as shown in Figure 5, set under the lens 203.

当然,本领域的技术人员可以采用其他可行方式设置图像采集设备101和基板承载设备103,此处仅提供两种较佳的设置方式,不再一一叙述。Of course, those skilled in the art can adopt other feasible ways to set up the image acquisition device 101 and the substrate carrying device 103 , and only two preferred setting ways are provided here, which will not be described one by one.

实际应用中,如图6所示,数据处理设备102包括:In practical applications, as shown in FIG. 6, the data processing device 102 includes:

用于根据该面的二维图像信息确定基板的二维灰度数据的数模转换卡601,与图像采集设备101相连;The digital-to-analog conversion card 601 for determining the two-dimensional grayscale data of the substrate according to the two-dimensional image information of the surface is connected to the image acquisition device 101;

用于根据二维灰度数据及预先设定的基板规格标准数据检测基板是否缺损的处理器602,与数模转换卡601相连。The processor 602 for detecting whether the substrate is defective according to the two-dimensional grayscale data and the preset substrate specification standard data is connected with the digital-to-analog conversion card 601 .

其中处理器602可以具体为:计算机(personal computer,PC);或者现场可编程门阵列(field programmable gata array,FPGA);或者复杂可编程逻辑器件(complex programmable logic device,CPLD)。The processor 602 may specifically be: a computer (personal computer, PC); or a field programmable gate array (field programmable gata array, FPGA); or a complex programmable logic device (complex programmable logic device, CPLD).

处理器602根据CCD201获取的二维图像信息及预先设定的基板规格标准数据检测置于基板承载设备103上的基板的方式有很多,较佳的,可以根据基板的多方面的规格标准数据及CCD201扫描得到的二维图像信息进行检测,以提高对基板检测的精度,本实用新型实施例提供两种较佳的实施方式。There are many ways for the processor 602 to detect the substrate placed on the substrate carrying device 103 according to the two-dimensional image information obtained by the CCD 201 and the preset substrate specification standard data. The two-dimensional image information scanned by the CCD201 is detected to improve the detection accuracy of the substrate. The embodiment of the present invention provides two preferred implementation modes.

第一种实施方式为根据二维图像信息确定基板的面积,则预先设定的基板规格标准数据为预先设定的基板面积数据,则获取基板的二维图像信息,可以通过CCD201获取基板承载设备103中承载基板的位置的二维图像信息的方式实现,再通过数模转换卡601将体现二维图像信息的电信号转换为数字信号,形成该面的二维灰度数据,即可获得基板的二维灰度数据,则处理器602可以根据预先设定的阈值确定二维灰度数据中对应基板的灰度数据对应的像元,其中预先设定的阈值可以根据基板及基板承载设备103承载基板的面的灰度确定的可以区别基板及基板承载设备103的阈值,例如,当基板的灰度值为5,而基板承载设备103的灰度值为0时,可以将阈值设定为4,则在处理器602确定二维灰度数据中对应基板的灰度数据对应的像元时,可以将灰度值大于4的像元确定为对应基板的像元,较佳的,将对应基板的像元点标识为1,将对应基板承载设备103的像元点标识为0,从而标识出基板在扫描得到的二维图像信息中的分布,得到一个二维的0,1值分布点阵。The first embodiment is to determine the area of the substrate according to the two-dimensional image information, then the preset substrate specification standard data is the preset substrate area data, then the two-dimensional image information of the substrate is obtained, and the substrate carrying equipment can be obtained through the CCD201 In 103, the two-dimensional image information of the position of the substrate is carried, and then the electrical signal reflecting the two-dimensional image information is converted into a digital signal through the digital-to-analog conversion card 601 to form the two-dimensional grayscale data of the surface, and the substrate can be obtained. two-dimensional grayscale data, the processor 602 can determine the pixel corresponding to the grayscale data of the corresponding substrate in the two-dimensional grayscale data according to the preset threshold value, wherein the preset threshold value can be based on the substrate and the substrate carrying device 103 The grayscale of the surface carrying the substrate determines the threshold that can distinguish the substrate from the substrate carrying device 103. For example, when the grayscale value of the substrate is 5 and the grayscale value of the substrate carrying device 103 is 0, the threshold can be set as 4, when the processor 602 determines the pixel corresponding to the grayscale data of the corresponding substrate in the two-dimensional grayscale data, the pixel whose grayscale value is greater than 4 can be determined as the pixel corresponding to the substrate, preferably, the corresponding The pixel point of the substrate is marked as 1, and the pixel point corresponding to the substrate carrying device 103 is marked as 0, so as to identify the distribution of the substrate in the scanned two-dimensional image information, and obtain a two-dimensional 0,1 value distribution point array.

由于获取的二维图像信息是经过透镜203放大或缩小的,因此要再根据透镜203的放大或缩小系数及二维图像信息中每一像元的面积,确定一个常数值,则通过公式

Figure BDA00003523946600051
可以确定基板的实际面积,其中aij为二维的0,1值分布点阵第i行中第j个像元的0,1值,C为确定的常数值,则将确定的面积值与预先设定的基板面积数据进行比较,若确定的面积值小于预先设定的基板面积数据,则可以确定基板存在缺损。Since the acquired two-dimensional image information is enlarged or reduced by the lens 203, a constant value must be determined according to the enlargement or reduction coefficient of the lens 203 and the area of each pixel in the two-dimensional image information, then by the formula
Figure BDA00003523946600051
The actual area of the substrate can be determined, where a ij is the 0,1 value of the jth pixel in the i-th row of the two-dimensional 0,1 value distribution lattice, and C is a determined constant value, then the determined area value and Compared with the preset substrate area data, if the determined area value is smaller than the preset substrate area data, it can be determined that there is a defect in the substrate.

第二种实施方式为根据二维图像信息确定基板的轮廓,则预先设定的基板规格标准数据为预先设定的基板轮廓数据,实际应用中,可以通过与第一种实施方式相同的方法得到一个二维的0,1值分布点阵。The second embodiment is to determine the outline of the substrate according to the two-dimensional image information, and the preset substrate specification standard data is the preset substrate outline data. In practical applications, it can be obtained by the same method as the first embodiment. A two-dimensional lattice of 0,1 value distribution.

再根据二维灰度点阵确定基板的轮廓,并与预先设定的基板轮廓数据相比较,从而确定基板是否缺损。Then determine the outline of the substrate according to the two-dimensional grayscale dot matrix, and compare it with the preset outline data of the substrate to determine whether the substrate is defective.

如图7所示,本实用新型实施例提供一种具体的检测系统,包括:As shown in Figure 7, the embodiment of the present invention provides a specific detection system, including:

线阵CCD201,与线阵CCD201相连的CCD201驱动电路,与线阵CCD201相连的透镜203,与线阵CCD201相连,且位于透镜203下方的传送式基板承载设备103,与线阵CCD201相连的数模转换卡601,以及与数模转换卡601相连的处理器602。Linear array CCD201, CCD201 driving circuit connected to linear array CCD201, lens 203 connected to linear array CCD201, transmission type substrate carrying equipment 103 connected to linear array CCD201 and located below lens 203, digital-analog connected to linear array CCD201 A conversion card 601, and a processor 602 connected to the digital-to-analog conversion card 601.

其中数模转换卡601用于根据线阵CCD201扫描得到的二维图像信息确定二维数据矩阵,处理器602用于根据二维数据矩阵及预先设定的基板面积数据和预先设定的基板轮廓数据检测基板是否缺损。Among them, the digital-to-analog conversion card 601 is used to determine the two-dimensional data matrix according to the two-dimensional image information scanned by the linear array CCD201, and the processor 602 is used to determine the two-dimensional data matrix according to the two-dimensional data matrix and the preset substrate area data and the preset substrate outline. The data detects whether the substrate is defective.

本实用新型实施例提供一种检测系统,包括图像采集设备101,数据处理设备102,以及基板承载设备103,通过图像采集设备101获取基板的二维图像信息,再由数据处理设备102根据图像采集设备获取的二维图像信息及预先设定的基板规格标准数据来检测基板是否缺损,由于根据图像采集设备101获取的二维图像信息及预先设定的基板规格标准数据对基板进行检测时,可以根据多个方面的规格标准数据进行检测,因此不易出现漏检测,检测精度也较高,可以有效的提高基板缺损检测的精度。The embodiment of the utility model provides a detection system, including an image acquisition device 101, a data processing device 102, and a substrate carrying device 103. The two-dimensional image information acquired by the equipment and the preset substrate specification standard data are used to detect whether the substrate is defective. Since the substrate is detected according to the two-dimensional image information acquired by the image acquisition device 101 and the preset substrate specification standard data, it can The detection is carried out according to the specification standard data in many aspects, so it is not easy to miss detection, and the detection accuracy is also high, which can effectively improve the accuracy of substrate defect detection.

显然,本领域的技术人员可以对本实用新型进行各种改动和变型而不脱离本实用新型的精神和范围。这样,倘若本实用新型的这些修改和变型属于本实用新型权利要求及其等同技术的范围之内,则本实用新型也意图包含这些改动和变型在内。Obviously, those skilled in the art can make various changes and modifications to the utility model without departing from the spirit and scope of the utility model. In this way, if these modifications and variations of the utility model fall within the scope of the claims of the utility model and equivalent technologies thereof, the utility model is also intended to include these modifications and variations.

Claims (9)

1. a detection system, is characterized in that, comprising:
For obtaining the image capture device of two-dimensional image information of substrate;
For according to described two-dimensional image information and the whether damaged data processing equipment of the described substrate of predefined substrate specification standards Data Detection, with described image capture device, be connected.
2. the system as claimed in claim 1, is characterized in that, also comprises:
For the substrate bearing equipment of bearing substrate, be positioned at the below of described image capture device.
3. the system as claimed in claim 1, is characterized in that, described image capture device is specially:
Charge coupled cell CCD scanning device.
4. system as described as claim 1 or 3, is characterized in that, described image capture device comprises:
CCD, the CDD driving circuit be connected with described CCD and be connected to the lens for the sweep length that increases described CCD on described CCD.
5. system as claimed in claim 4, is characterized in that, described CCD is specially:
Line array CCD; Perhaps
Area array CCD.
6. system as claimed in claim 5, is characterized in that, described CCD is line array CCD, and described system also comprises:
For the transfer type substrate load bearing equipment of bearing substrate, be positioned at the below of described lens.
7. system as claimed in claim 5, is characterized in that, described CCD is area array CCD, and described system also comprises:
For the panel type substrate bearing equipment of bearing substrate, be positioned at the below of described lens.
8. the system as claimed in claim 1, is characterized in that, described data processing equipment comprises:
Be connected the digital-to-analog conversion card of the two dimensional gray data of described substrate with described image capture device for determining according to described two-dimensional image information;
For according to described two dimensional gray data and the whether damaged processor of the described substrate of predefined substrate specification standards Data Detection, with described digital-to-analog conversion card, be connected.
9. system as claimed in claim 8, is characterized in that, described processor is specially: computer PC; Perhaps
On-site programmable gate array FPGA; Perhaps
Complex programmable logic device (CPLD).
CN2013204303076U 2013-07-17 2013-07-17 Detecting system Expired - Fee Related CN203337570U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104897692A (en) * 2015-06-16 2015-09-09 中信戴卡股份有限公司 Online detection system and method for finish turning effects of aluminum alloy castings
WO2016138744A1 (en) * 2015-03-02 2016-09-09 京东方科技集团股份有限公司 Display panel surface flatness detection device and method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016138744A1 (en) * 2015-03-02 2016-09-09 京东方科技集团股份有限公司 Display panel surface flatness detection device and method
US9964403B2 (en) 2015-03-02 2018-05-08 Boe Technology Group Co., Ltd. Device and method for detecting flatness of surface of display panel
CN104897692A (en) * 2015-06-16 2015-09-09 中信戴卡股份有限公司 Online detection system and method for finish turning effects of aluminum alloy castings

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