CN203311373U - Touch panel - Google Patents
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- CN203311373U CN203311373U CN2013203066961U CN201320306696U CN203311373U CN 203311373 U CN203311373 U CN 203311373U CN 2013203066961 U CN2013203066961 U CN 2013203066961U CN 201320306696 U CN201320306696 U CN 201320306696U CN 203311373 U CN203311373 U CN 203311373U
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Abstract
The utility model discloses a touch panel. The touch panel comprises a transparent cover plate, a transparent conducting film and a display device which are sequentially overlapped, wherein the transparent conducting film comprises a transparent substrate, a conducting line arranged on one side of the flexible transparent substrate, a first conducting layer arranged on one side of an induction zone and a first lead electrode arranged on one side of an edge zone, wherein the transparent substrate comprises a body and a flexible base plate; the width of the flexible base plate is smaller than that of the body; the body comprises the induction zone and the edge zone positioned at the edge of the induction zone; the first conducting layer comprises first conducting silk threads which are intersected one another; and the first conducting layer is electrically connected with the conducting line through the first lead electrode. The transparent conducting film of the touch panel ensures that the first conducting layer, the second conducting layer and the conducting line are arranged on the same transparent substrate, so that a conducting film and a flexible circuit board are formed, and compared with the traditional conducting film and flexible circuit board requiring laminating process, so as to be laminated, the transparent conducting film of the touch panel does not require laminating process any more, and the production efficiency is improved.
Description
Technical field
The utility model relates to the touch-screen field, particularly relates to a kind of contact panel.
Background technology
Capacitive touch screen is to utilize the electric current induction of human body to carry out work, and when finger touch was on metal level, user and capacitance touch screen surfaces formed a coupling capacitance, so finger siphons away a very little electric current from contact point.This electric current is respectively from the electrode on four jiaos of capacitive touch screen, flowing out, and the electric current of these four electrodes of flowing through is directly proportional to the distance of finger to four jiaos, and controller, by the accurate Calculation to these four current ratios, draws the position of touch point.
Nesa coating is a kind of film that has satisfactory electrical conductivity and have high transmission rate at visible light wave range.Nesa coating has been widely used in the fields such as flat pannel display, photovoltaic device, contact panel and electromagnetic screen at present, has the extremely wide market space.
Flexible PCB is to take polyimide or mylar a kind ofly to have height reliability, an excellent flexible printed circuit as what base material was made.Be called for short soft board or FPC(Flexible Printed Circuit), have that distribution density is high, lightweight, the characteristics of thin thickness.Nesa coating is connected with external circuits by FPC, thereby the position signalling of nesa coating perception is transferred in processor, identifies, and determines touch location.
Traditional, when the nesa coating of contact panel is connected with external circuits by FPC, first by the laminating of the lead-in wire of FPC and nesa coating zone, then and printed circuit board (Printed Circuit Board, PCB) be connected, cause production efficiency lower.
The utility model content
Based on this, be necessary the contact panel that provides a kind of production efficiency high.
A kind of contact panel, comprise the transparent overlay, nesa coating and the display device that stack gradually;
Described nesa coating comprises:
Transparent substrates, described transparent substrates comprise body and the flexible base, board extended to form from described body one end, and the width of described flexible base, board is less than the width of described body, the rim area that described body comprises induction zone and is positioned at described induction zone edge;
Be located at the conducting circuit of described flexible and transparent substrate one side;
Be located at the first conductive layer of described induction zone one side, described the first conductive layer comprises cross one another the first conductive thread;
Be located at the first lead-in wire electrode of described rim area one side, described the first conductive layer and described conducting link tester are crossed described the first lead-in wire electrode and are electrically connected to.
In embodiment, the surface of described induction zone offers the first conduction groove therein, and described the first conductive layer is contained in described the first conduction groove;
Described the first lead-in wire electrode is embedded at the surface of described rim area or the surface that described the first lead-in wire electrode directly is located at described rim area.
In embodiment, described nesa coating also comprises the second conductive layer and the second lead-in wire electrode therein, and the surface that described induction zone is relative with described the first conductive layer offers the second conduction groove, and described the second conductive layer is contained in described second and conducts electricity groove;
Described the second lead-in wire electrode is embedded at the surface of described rim area or the surface that described the second lead-in wire electrode directly is located at described rim area, and described the second conductive layer and described conducting link tester are crossed described the second lead-in wire electrode and be electrically connected to.
In embodiment, described nesa coating also comprises hypothallus, the second conductive layer and the second lead-in wire electrode therein, and described hypothallus is located at the surface of described transparent substrates away from described the first conductive layer;
The described hypothallus corresponding with described induction zone offers the second conduction groove away from the surface of described transparent substrates, and described the second conductive layer is contained in described the second conduction groove;
Described the second lead-in wire electrode is embedded at the surface of the described hypothallus corresponding with described induction zone or the surface that described the second lead-in wire electrode directly is located at the described hypothallus corresponding with described induction zone, and described the second conductive layer and described conducting link tester are crossed described the second lead-in wire electrode and be electrically connected to.
Therein in embodiment, described nesa coating also comprises hypothallus, the second conductive layer and the second lead-in wire electrode, described hypothallus is located at the surface of described the first conductive layer, the described hypothallus corresponding with described induction zone offers the second conduction groove away from the surface of described transparent substrates, and described the second conductive layer is contained in described the second conduction groove;
Described the second lead-in wire electrode is embedded at the surface of the described hypothallus corresponding with described rim area or directly is located at the surface of the described hypothallus corresponding with described rim area, and described the second conductive layer and described conducting link tester are crossed described the second lead-in wire electrode and be electrically connected to.
Therein in embodiment, described nesa coating also comprises the first hypothallus that is arranged on described transparent substrates surface, described the first hypothallus offers the first conduction groove away from the surface of described transparent substrates, and described the first conductive layer is contained in described the first conduction groove;
Described the first lead-in wire electrode is embedded at the surface of described first hypothallus corresponding with described rim area or the surface that described the first lead-in wire electrode directly is located at described first hypothallus corresponding with described rim area.
Therein in embodiment, described nesa coating also comprises the second hypothallus, the second conductive layer and the second lead-in wire electrode, described the first hypothallus, transparent substrates and the second hypothallus are cascading, described the second hypothallus offers the second conduction groove away from the surface of described transparent substrates, and described the second conductive layer is contained in described the second conduction groove;
Described the second lead-in wire electrode is embedded at the surface of described second hypothallus corresponding with described induction zone or the surface that described the second lead-in wire electrode directly is located at described second hypothallus corresponding with described induction zone, and described the second conductive layer and described conducting link tester are crossed described the second lead-in wire electrode and be electrically connected to.
Therein in embodiment, described nesa coating also comprises the second hypothallus, the second conductive layer and the second lead-in wire electrode, described the second matrix is located at described the first conductive layer surface, described the second hypothallus offers the second conduction groove away from the surface of described the first conductive layer, and described the second conductive layer is contained in described the second conduction groove;
Described the second lead-in wire electrode is embedded at the surface of described second hypothallus corresponding with described induction zone or the surface that described the second lead-in wire electrode directly is located at described second hypothallus corresponding with described induction zone, and described the second conductive layer and described conducting link tester are crossed described the second lead-in wire electrode and be electrically connected to.
In embodiment, described the first conduction bottom portion of groove is nonplanar structure therein, and described the second conduction bottom portion of groove is nonplanar structure.
In embodiment, the width of described the first conduction groove is 0.2 μ m～5 μ m, is highly 2 μ m～6 μ m therein, highly and the ratio of width be greater than 1;
The width of described the second conduction groove is 0.2 μ m～5 μ m, is highly 2 μ m～6 μ m, and the ratio of height and width is greater than 1.
Therein in embodiment, described the first lead-in wire electrode is latticed or strip, latticed described the first lead-in wire electrode comprises cross one another the first conductive lead wire, and the minimum widith of the described first lead-in wire electrode of strip is 10 μ m～200 μ m, is highly 5 μ m～20 μ m;
Described the second lead-in wire electrode is latticed or strip, and latticed described the second lead-in wire electrode comprises cross one another the second conductive lead wire, and the minimum widith of the described second lead-in wire electrode of strip is 10 μ m～200 μ m, is highly 5 μ m～20 μ m.
In embodiment, described conducting circuit is latticed or strip therein, and latticed described conducting circuit is intersected to form by the conducting silk thread.
In embodiment, described nesa coating also comprises protective clear layer therein, and described protective clear layer coats described transparent substrates, the first conductive layer, the second conductive layer, the first lead-in wire electrode, the second lead-in wire electrode and conducting circuit at least partly.
In embodiment, the visible light transmissivity of described nesa coating is not less than 86% therein.
The transparent substrates of the nesa coating of above-mentioned contact panel comprises body and flexible base, board, thereby the first conductive layer, the second conductive layer and conducting circuit are arranged on same transparent substrates and form conducting film and flexible PCB, than traditional conducting film and flexible PCB, need attaching process to fit, the nesa coating of above-mentioned contact panel does not need attaching process, has improved production efficiency.
The accompanying drawing explanation
Fig. 1 is the structural representation of the contact panel of an embodiment;
Fig. 2 is the structural representation on the nesa coating edge of an embodiment;
Fig. 3 is the structural representation of an embodiment bottom portion of groove;
Fig. 4 is the structural representation of the conductive grid of an embodiment;
Fig. 5 is the structural representation of the conductive grid of another embodiment;
Fig. 6 is the cross-sectional view of the nesa coating of another embodiment;
Fig. 7 is the cross-sectional view of the nesa coating of another embodiment;
Fig. 8 is the cross-sectional view of the nesa coating of another embodiment;
Fig. 9 is the cross-sectional view of the nesa coating of another embodiment;
Figure 10 is the cross-sectional view of the nesa coating of another embodiment;
Figure 11 is the cross-sectional view of the nesa coating of another embodiment;
Figure 12 is the cross-sectional view of the nesa coating of another embodiment;
Figure 13 is the cross-sectional view of the nesa coating of another embodiment;
Figure 14 is the cross-sectional view of the nesa coating of another embodiment;
Figure 15 is the cross-sectional view of the nesa coating of another embodiment;
Figure 16 is the cross-sectional view of the nesa coating of another embodiment;
Figure 17 is the part section structural representation of the nesa coating of an embodiment.
Embodiment
For the ease of understanding the utility model, below with reference to relevant drawings, the utility model is described more fully.In accompanying drawing, provided preferred embodiment of the present utility model.But the utility model can be realized in many different forms, is not limited to embodiment described herein.On the contrary, provide the purpose of these embodiment be make the understanding of disclosure of the present utility model more comprehensively thorough.
Unless otherwise defined, all technology of using of this paper and scientific terminology are with to belong to the implication that those skilled in the art of the present utility model understand usually identical.The term used in instructions of the present utility model herein, just in order to describe the purpose of specific embodiment, is not intended to be restriction the utility model.
As shown in Figure 1, the contact panel of an embodiment, comprise the transparent overlay 200, nesa coating 100 and the display device 300 that stack gradually.
Transparent overlay can be identical with existing product with display device, do not repeat them here.
Following emphasis is described nesa coating 100.
Please refer to Fig. 1 and Fig. 2, the nesa coating 100 of an embodiment, comprise transparent substrates 10, the first conductive layer 20 and the first lead-in wire electrode 30 and conducting circuit.
The material of transparent substrates 10 can be polyethylene terephthalate (Polyethylene terephthalate, PET) or thermoplastic.Thermoplastic can be polycarbonate (Polycarbonate, PC) or polymethylmethacrylate (polymethylmethacrylate, PMMA).
The surface of induction zone 112 offers the first conduction groove.The surface of rim area 114 offers the first electrode groove.The first conduction groove and the first electrode groove are positioned at homonymy.
Flexible base, board 120 offers the conducting groove.Conducting groove and the first conduction groove homonymy.
For convenience of description, in case of no particular description, the first conduction groove, the first electrode groove and conducting groove are referred to as groove.In conjunction with Fig. 3, bottom portion of groove is non-parallel structure.Bottom portion of groove can be " V " font, " W " font, arc or waveform." V " font of bottom portion of groove, " W " font, arc or corrugated amplitude are at 500nm～1 μ m.Trench bottom is arranged to " V " font, " W " font, arc or waveform, after conductive material is filled in to groove, during dry solidification, can be reduced the contraction of conductive material.Conductive material is filled in to groove and solidify to form the first conductive thread, the first conductive lead wire and conducting silk thread, the performance of conductive material is had good protective effect and prevents conductive material polycondensation in drying course and disconnect.The width of groove can be 0.2 μ m～5 μ m, highly can be 2 μ m～6 μ m, and the ratio of height and width is greater than 1.
The first conductive layer 20 is contained in the first conduction groove.The first conductive layer 20 is latticed.In conjunction with Fig. 4 and Fig. 5, the grid of the first conductive layer 20 can be regular grid (Fig. 4) or random grid (Fig. 5).The first conductive layer 20 comprises cross one another the first conductive thread.The first conductive layer 20 is solidify to form by the conductive material that is filled in the first conduction groove.The material of the first conductive layer 20 can be conducting metal.Conducting metal can be silver or copper.
The first lead-in wire electrode 30 is contained in the first electrode groove.The first lead-in wire electrode 30 and the first conductive layer 20 homonymies.The first conductive layer 20 and conducting link tester are crossed the first lead-in wire electrode 30 and are electrically connected to.The first conductive layer 20 and conducting link tester are crossed the first lead-in wire electrode 30 and are electrically connected to, and are passed to the conducting circuit with the touch signal that induction zone is detected.
The first lead-in wire electrode 30 can be latticed or strip.Latticed the first lead-in wire electrode 30 comprises cross one another the first conductive lead wire.In conjunction with Fig. 4 and Fig. 5, the grid of the first lead-in wire electrode 30 can be regular grid (Fig. 4) or random grid (Fig. 5).The first lead-in wire electrode 30 is solidify to form by the conductive material that is filled in the first electrode groove.The material of the first lead-in wire electrode 30 can be conducting metal.Conducting metal can be silver or copper.
The minimum widith of the first lead-in wire electrode 30 of strip can be 10 μ m～200 μ m, highly can be 5 μ m～20 μ m.
The conducting circuit can be latticed or strip.Latticed conducting circuit comprises cross one another conducting silk thread.In conjunction with Fig. 4 to Fig. 5, the grid of conducting circuit can be regular grid (Fig. 4) or random grid (Fig. 5).The conducting circuit is solidify to form by the conductive material that is filled in the conducting groove.The material of conducting circuit can be conducting metal.Conducting metal can be silver or copper.
As shown in Figure 6, the first lead-in wire electrode 30 can also directly be located at the surface of rim area, the first lead-in wire electrode 30 and the first conductive layer 20 homonymies.Now, the first lead-in wire electrode 30 forms by serigraphy, exposure imaging or inkjet printing.
The nesa coating of another embodiment as shown in Figure 7 comprises the structure of nesa coating as shown in Figure 1, in addition, also comprises the second conductive layer 40 and the second lead-in wire electrode 50.The identical structure of nesa coating as shown in Figure 8 and nesa coating does not as shown in Figure 1 repeat them here.
The second conductive layer 40 is latticed.The surface that induction zone is relative with the first conductive layer 20 offers the second conduction groove, and the second conductive layer 40 is contained in the second conduction groove.
The surface of rim area offers the second electrode groove, and the second lead-in wire electrode 50 is accommodated and the second electrode groove.The second lead-in wire electrode 50 and the second conductive layer 40 are positioned at homonymy, and the second conductive layer 40 and conducting link tester are crossed the second lead-in wire electrode 50 and be electrically connected to.
Be appreciated that as shown in Figure 8, the first lead-in wire electrode 30 can directly be located at the surface of rim area, and the first lead-in wire electrode 30 and the first conductive layer 20 are positioned at homonymy.The second lead-in wire electrode 50 directly is located at another surface of rim area, and the second lead-in wire electrode 50 and the second conductive layer 40 are positioned at homonymy.
The nesa coating of another embodiment as shown in Figure 9 comprises the structure of nesa coating as shown in Figure 1, in addition, also comprises hypothallus 60, the second conductive layer 40 and the second lead-in wire electrode 50.The identical structure of nesa coating as shown in Figure 9 and nesa coating does not as shown in Figure 1 repeat them here.
The surface of the hypothallus 60 corresponding with rim area offers the second electrode groove, the second lead-in wire electrode 50 is contained in the second electrode groove, the second lead-in wire electrode 50 and the second conductive layer 40 are positioned at homonymy, and the second conductive layer 40 and conducting link tester are crossed the second lead-in wire electrode 50 and be electrically connected to.
Be appreciated that as shown in figure 10, the first lead-in wire electrode 30 also can directly be located at the surface of rim area, and the first lead-in wire electrode 30 and the first conductive layer 20 are positioned at homonymy.The second lead-in wire electrode 50 also can directly be located at the surface of the hypothallus corresponding with rim area 60, and the second lead-in wire electrode 50 and the second conductive layer 40 are positioned at homonymy.
For convenience of description, above-mentioned Fig. 7 is to the second conduction groove and the second electrode groove general designation groove of the nesa coating of embodiment shown in Figure 10.In conjunction with Fig. 3, bottom portion of groove can be non-parallel structure.Bottom portion of groove can be " V " font, " W " font, arc or waveform." V " font of bottom portion of groove, " W " font, arc or corrugated amplitude are at 500nm～1 μ m.Bottom portion of groove is arranged to " V " font, " W " font, arc or waveform, after conductive material is filled in to groove, during dry solidification, can be reduced the contraction of conductive material.Conductive material is filled in to the second conduction groove and the second electrode groove and solidify to form the second conductive thread and the second lead-in wire electrode, the performance of conductive material is had good protective effect and prevents conductive material polycondensation in drying course and disconnect.The width of groove can be 0.2 μ m～5 μ m, highly can be 2 μ m～6 μ m, and the ratio of height and width is greater than 1.
The flexible base, board (not shown) of the nesa coating of the embodiment that above-mentioned Fig. 7 is extremely shown in Figure 10 is at least one.When flexible base, board was one, flexible base, board offered the conducting groove, and the first lead-in wire electrode 30 and the second lead-in wire electrode 50 are electrically connected to the conducting groove.When flexible base, board 120 is 2.2 flexible base, boards all offer the conducting groove.The first lead-in wire electrode 30 and the second lead-in wire electrode 50 are electrically connected to 2 conducting grooves respectively.
The grid of the second conductive layer 40 of the nesa coating of the embodiment that above-mentioned Fig. 7 is extremely shown in Figure 10 can be regular grid (Fig. 5) or random grid (Fig. 6).The second conductive layer 40 comprises cross one another the second conductive thread.The second conductive layer 40 is solidify to form by the conductive material that is filled in the second conduction groove.The material of the second conductive layer 40 can be conducting metal.Conducting metal can be silver or copper.
The second lead-in wire electrode 50 of the nesa coating of the embodiment that above-mentioned Fig. 7 is extremely shown in Figure 10 can be latticed or strip.Latticed the second lead-in wire electrode 50 comprises cross one another the second conductive lead wire.In conjunction with Fig. 5 to Fig. 6, the grid of the second lead-in wire electrode 50 can be regular grid (Fig. 5) or random grid (Fig. 6).The second lead-in wire electrode 50 is solidify to form by the conductive material that is filled in the second electrode groove.The material of the second lead-in wire electrode 50 can be conducting metal.Conducting metal can be silver or copper.The minimum widith of the second lead-in wire electrode 50 of strip can be 10 μ m～200 μ m, highly can be 5 μ m～20 μ m.
The material of the hypothallus 60 of the nesa coating of above-mentioned Fig. 9 and embodiment shown in Figure 10 can be UV glue, impression glue or polycarbonate.
The nesa coating of another embodiment as shown in figure 11, comprise transparent substrates 10, the first hypothallus 70, the first conductive layer 20 and the first lead-in wire electrode 30 and conducting circuit 40.
The material of transparent substrates 10 can be polyethylene terephthalate (Polyethyleneterephthalate, PET) or thermoplastic.Thermoplastic can be, polycarbonate (Polycarbonate, PC) or polymethylmethacrylate (polymethylmethacrylate, PMMA).Certainly, the material of transparent substrates 10 also can glass or other transparent materials.
The first hypothallus 70 is arranged on the surface of transparent substrates 10, and the first hypothallus 70 offers the first conduction groove away from the surface of transparent substrates 10, and the first conductive layer 20 is contained in the first conduction groove.
The material of the first hypothallus 70 can be UV glue, impression glue or polycarbonate.
Flexible base, board 120 offers the conducting groove.Conducting groove and the first conduction groove homonymy.
The surface of described first hypothallus 70 corresponding with rim area offers the first conduction groove.The first conduction groove and the first electrode groove are positioned at homonymy.The first lead-in wire electrode 30 is contained in a conduction groove.
For convenience of description, in case of no particular description, the first conduction groove, the first electrode groove and conducting groove are referred to as groove.In conjunction with Fig. 3, bottom portion of groove can be non-parallel structure.Bottom portion of groove can be " V " font, " W " font, arc or waveform." V " font of bottom portion of groove, " W " font, arc or corrugated amplitude are at 500nm～1 μ m.Trench bottom is arranged to " V " font, " W " font, arc or waveform, after conductive material is filled in to groove, during dry solidification, can be reduced the contraction of conductive material.Conductive material is filled in to groove and solidify to form the first conductive thread, the first conductive lead wire and conducting silk thread, the performance of conductive material is had good protective effect and prevents conductive material polycondensation in drying course and disconnect.The width of groove can be 0.2 μ m～5 μ m, highly can be 2 μ m～6 μ m, and the ratio of height and width is greater than 1.
The first conductive layer 20 is latticed.In conjunction with Fig. 4 to Fig. 5, the grid of the first conductive layer 20 can be regular grid (Fig. 4) or random grid (Fig. 5).The first conductive layer 20 comprises cross one another the first conductive thread.The first conductive layer 20 is solidify to form by the conductive material that is filled in the first conduction groove.The material of the first conductive layer 20 can be conducting metal.Conducting metal can be silver or copper.
The first lead-in wire electrode 30 and the first conductive layer 20 homonymies.The first conductive layer 20 and conducting link tester are crossed the first lead-in wire electrode 30 and are electrically connected to.The first conductive layer 20 and conducting link tester are crossed the first lead-in wire electrode 30 and are electrically connected to, and are passed to the conducting circuit with the touch signal that induction zone is detected.
The first lead-in wire electrode 30 can be latticed or strip.Latticed the first lead-in wire electrode 30 comprises cross one another the first conductive lead wire.In conjunction with Fig. 4 to Fig. 5, the grid of the first lead-in wire electrode 30 can be regular grid (Fig. 4) or random grid (Fig. 5).The first lead-in wire electrode 30 is solidify to form by the conductive material that is filled in the first electrode groove.The material of the first lead-in wire electrode 30 can be conducting metal.Conducting metal can be silver or copper.
The minimum widith of the first lead-in wire electrode 30 of strip can be 10 μ m～200 μ m, highly can be 5 μ m～20 μ m.
Conducting circuit 60 can be latticed or strip.
As shown in figure 12, the first lead-in wire electrode 30 can also directly be located at the surface of first hypothallus 70 corresponding with rim area.
The nesa coating of another embodiment as shown in figure 13 comprises the structure of nesa coating as shown in Figure 1, in addition, also comprises the second hypothallus 80, the second conductive layer 40 and the second lead-in wire electrode 50.The identical structure of nesa coating as shown in figure 13 and nesa coating does not as shown in figure 11 repeat them here.
The first hypothallus 70, transparent substrates 10 and the second hypothallus 80 are cascading.The second hypothallus 80 offers the second conduction groove away from the surface of transparent substrates 10, and the second conductive layer 40 is contained in the second conduction groove.
The surface of second hypothallus 80 corresponding with induction zone offers the second electrode groove, and the second lead-in wire electrode 50 is accommodated and the second electrode groove.The second lead-in wire electrode 50 and the second conductive layer 40 are positioned at homonymy, and the second conductive layer 40 and conducting link tester are crossed the second lead-in wire electrode 50 and be electrically connected to.
Be appreciated that as shown in figure 14, the first lead-in wire electrode 30 also can directly be located at the surface of first hypothallus 70 corresponding with induction zone, and the first lead-in wire electrode 30 and the first conductive layer 20 are positioned at homonymy.The second lead-in wire electrode 50 also can directly be located at the surface of second hypothallus 80 corresponding with induction zone, and the second lead-in wire electrode 50 and the second conductive layer 40 are positioned at homonymy.
The nesa coating of another embodiment as shown in figure 15 comprises the structure of nesa coating as shown in Figure 1, in addition, also comprises the second hypothallus 80, the second conductive layer 40 and the second lead-in wire electrode 50.The identical structure of nesa coating as shown in figure 15 and nesa coating does not as shown in figure 11 repeat them here.
The second hypothallus 80 is located at the surface of the first conductive layer 20, and the second hypothallus 80 offers the second conduction groove away from the surface of the first conductive layer 20, and the second conductive layer 40 is contained in the second conduction groove.
The table of second hypothallus 80 corresponding with induction zone offers the second electrode groove, and the second lead-in wire electrode 50 is contained in the second electrode groove.The second lead-in wire electrode 50 and the second conductive layer 40 are positioned at homonymy, and the second conductive layer 40 and conducting link tester are crossed the second lead-in wire electrode 50 and be electrically connected to.
In conjunction with Figure 17, the second hypothallus 80 is provided with hole 82, the second lead-in wire electrodes 50 and passes the surface of hole 82 through the first conductive layer 20, and then is connected with the conducting line electricity.Between the second lead-in wire electrode 50 and the first conductive layer 20, insulation arranges.Certainly, in other embodiments, the second lead-in wire electrode 50 also can be connected to conducting circuit 70 from the side, thereby is connected with the conducting line electricity.
Be appreciated that as shown in figure 16, the first lead-in wire electrode 30 also can directly be located at the surface of first hypothallus 70 corresponding with induction zone, and the first lead-in wire electrode 30 and the first conductive layer 20 are positioned at homonymy.The second lead-in wire electrode 50 also can directly be located at the surface of second hypothallus 80 corresponding with induction zone, and the second lead-in wire electrode 50 and the second conductive layer 40 are positioned at homonymy.
The flexible base, board (not shown) of the nesa coating of the embodiment that above-mentioned Figure 13 is extremely shown in Figure 16 is at least one.When flexible base, board was one, flexible base, board offered the conducting groove, and the first lead-in wire electrode 30 and the second lead-in wire electrode 50 are electrically connected to the conducting groove.When flexible base, board 120 is 2.2 flexible base, boards all offer the conducting groove.The first lead-in wire electrode 30 and the second lead-in wire electrode 50 are electrically connected to 2 conducting grooves respectively.
For convenience of description, above-mentioned Figure 13 is to the second conduction groove and the second electrode groove general designation groove of the nesa coating of embodiment shown in Figure 16.In conjunction with Fig. 3, bottom portion of groove can be non-parallel structure.Bottom portion of groove can be " V " font, " W " font, arc or waveform." V " font of bottom portion of groove, " W " font, arc or corrugated amplitude are at 500nm～1 μ m.Bottom portion of groove is arranged to " V " font, " W " font, arc or waveform, after conductive material is filled in to groove, during dry solidification, can be reduced the contraction of conductive material.Conductive material is filled in to the second conduction groove and the second electrode groove and solidify to form the second conductive thread and the second lead-in wire electrode, the performance of conductive material is had good protective effect and prevents conductive material polycondensation in drying course and disconnect.The width of groove can be 0.2 μ m～5 μ m, highly can be 2 μ m～6 μ m, and the ratio of height and width is greater than 1.
The grid of the second conductive layer 40 of the nesa coating of the embodiment that above-mentioned Figure 13 is extremely shown in Figure 16 can be regular grid (Fig. 4) or random grid (Fig. 5).The second conductive layer 40 comprises cross one another the second conductive thread.The second conductive layer 40 is solidify to form by the conductive material that is filled in the second conduction groove.The material of the second conductive layer 40 can be conducting metal.Conducting metal can be silver or copper.
The second lead-in wire electrode 50 of the nesa coating of the embodiment that above-mentioned Figure 13 is extremely shown in Figure 16 can be latticed or strip.Latticed the second lead-in wire electrode 50 comprises cross one another the second conductive lead wire.In conjunction with Fig. 4 to Fig. 5, the grid of the second lead-in wire electrode 50 can be regular grid (Fig. 4) or random grid (Fig. 5).The second lead-in wire electrode 50 is solidify to form by the conductive material that is filled in the second electrode groove.The material of the second lead-in wire electrode 50 can be conducting metal.Conducting metal can be silver or copper.The minimum widith of the second lead-in wire electrode 50 of strip can be 10 μ m～200 μ m, highly can be 5 μ m～20 μ m.
The material of the second hypothallus 80 of the nesa coating of the embodiment that above-mentioned Figure 13 is extremely shown in Figure 16 can be UV glue, impression glue or polycarbonate.
Above-mentioned nesa coating 100 can also comprise the protective clear layer (not shown), and protective clear layer coats transparent substrates 10, the first conductive layer 20, the second conductive layer 40, the first lead-in wire electrode 30, the second lead-in wire electrode 50 and conducting circuit 60 at least partly.The material of protective clear layer can be ultraviolet cured adhesive (UV glue), impression glue or polycarbonate.Nesa coating 100 is provided with the oxidation that protective clear layer can effectively prevent conductive material.
The visible light transmissivity of above-mentioned nesa coating 100 is not less than 86%.
Above-mentioned touch panel comprises nesa coating 100, the transparent substrates 10 of nesa coating comprises body 110 and flexible base, board 120, by the first conductive layer 20, thereby the second conductive layer 40 and conducting circuit 60 are arranged on same transparent substrates 10 and form conducting film and flexible PCB, than traditional conducting film and flexible PCB, need attaching process to fit, above-mentioned nesa coating 100 does not need attaching process, improved production efficiency, when the flexible joint parts are connected with external unit, can adopt laminating, or be provided with male end or female end at the flexible joint ends, direct and external unit carries out socket connection.Simultaneously, owing to not needing attaching process, save manufacturing cost, improved the generation yield of product.Therefore, can improve the formation efficiency of above-mentioned touch panel and generate yield.
The above embodiment has only expressed several embodiment of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be as the criterion with claims.
Claims (14)
1. a contact panel, is characterized in that, comprises the transparent overlay, nesa coating and the display device that stack gradually;
Described nesa coating comprises:
Transparent substrates, described transparent substrates comprise body and the flexible base, board extended to form from described body one end, and the width of described flexible base, board is less than the width of described body, the rim area that described body comprises induction zone and is positioned at described induction zone edge;
Be located at the conducting circuit of described flexible and transparent substrate one side;
Be located at the first conductive layer of described induction zone one side, described the first conductive layer comprises cross one another the first conductive thread;
Be located at the first lead-in wire electrode of described rim area one side, described the first conductive layer and described conducting link tester are crossed described the first lead-in wire electrode and are electrically connected to.
2. contact panel according to claim 1, is characterized in that, the surface of described induction zone offers the first conduction groove, and described the first conductive layer is contained in described the first conduction groove;
Described the first lead-in wire electrode is embedded at the surface of described rim area or the surface that described the first lead-in wire electrode directly is located at described rim area.
3. contact panel according to claim 2, it is characterized in that, described nesa coating also comprises the second conductive layer and the second lead-in wire electrode, and the surface that described induction zone is relative with described the first conductive layer offers the second conduction groove, and described the second conductive layer is contained in described the second conduction groove;
Described the second lead-in wire electrode is embedded at the surface of described rim area or the surface that described the second lead-in wire electrode directly is located at described rim area, and described the second conductive layer and described conducting link tester are crossed described the second lead-in wire electrode and be electrically connected to.
4. contact panel according to claim 2, is characterized in that, described nesa coating also comprises hypothallus, the second conductive layer and the second lead-in wire electrode, and described hypothallus is located at the surface of described transparent substrates away from described the first conductive layer;
The described hypothallus corresponding with described induction zone offers the second conduction groove away from the surface of described transparent substrates, and described the second conductive layer is contained in described the second conduction groove;
Described the second lead-in wire electrode is embedded at the surface of the described hypothallus corresponding with described induction zone or the surface that described the second lead-in wire electrode directly is located at the described hypothallus corresponding with described induction zone, and described the second conductive layer and described conducting link tester are crossed described the second lead-in wire electrode and be electrically connected to.
5. contact panel according to claim 2, it is characterized in that, described nesa coating also comprises hypothallus, the second conductive layer and the second lead-in wire electrode, described hypothallus is located at the surface of described the first conductive layer, the described hypothallus corresponding with described induction zone offers the second conduction groove away from the surface of described transparent substrates, and described the second conductive layer is contained in described the second conduction groove;
Described the second lead-in wire electrode is embedded at the surface of the described hypothallus corresponding with described rim area or directly is located at the surface of the described hypothallus corresponding with described rim area, and described the second conductive layer and described conducting link tester are crossed described the second lead-in wire electrode and be electrically connected to.
6. contact panel according to claim 1, it is characterized in that, described nesa coating also comprises the first hypothallus that is arranged on described transparent substrates surface, described the first hypothallus offers the first conduction groove away from the surface of described transparent substrates, and described the first conductive layer is contained in described the first conduction groove;
Described the first lead-in wire electrode is embedded at the surface of described first hypothallus corresponding with described rim area or the surface that described the first lead-in wire electrode directly is located at described first hypothallus corresponding with described rim area.
7. contact panel according to claim 6, it is characterized in that, described nesa coating also comprises the second hypothallus, the second conductive layer and the second lead-in wire electrode, described the first hypothallus, transparent substrates and the second hypothallus are cascading, described the second hypothallus offers the second conduction groove away from the surface of described transparent substrates, and described the second conductive layer is contained in described the second conduction groove;
Described the second lead-in wire electrode is embedded at the surface of described second hypothallus corresponding with described induction zone or the surface that described the second lead-in wire electrode directly is located at described second hypothallus corresponding with described induction zone, and described the second conductive layer and described conducting link tester are crossed described the second lead-in wire electrode and be electrically connected to.
8. contact panel according to claim 6, it is characterized in that, described nesa coating also comprises the second hypothallus, the second conductive layer and the second lead-in wire electrode, described the second matrix is located at described the first conductive layer surface, described the second hypothallus offers the second conduction groove away from the surface of described the first conductive layer, and described the second conductive layer is contained in described the second conduction groove;
Described the second lead-in wire electrode is embedded at the surface of described second hypothallus corresponding with described induction zone or the surface that described the second lead-in wire electrode directly is located at described second hypothallus corresponding with described induction zone, and described the second conductive layer and described conducting link tester are crossed described the second lead-in wire electrode and be electrically connected to.
9. according to the described nesa coating of any one in claim 3～5 and 7～8, it is characterized in that, described the first conduction bottom portion of groove is nonplanar structure, and described the second conduction bottom portion of groove is nonplanar structure.
10. contact panel according to claim 9, is characterized in that, the width of described the first conduction groove is 0.2 μ m～5 μ m, is highly 2 μ m～6 μ m, and the ratio of height and width is greater than 1;
The width of described the second conduction groove is 0.2 μ m～5 μ m, is highly 2 μ m～6 μ m, and the ratio of height and width is greater than 1.
11. according to the described contact panel of any one in claim 3～5 and 7～8, it is characterized in that, described the first lead-in wire electrode is latticed or strip, latticed described the first lead-in wire electrode comprises cross one another the first conductive lead wire, the minimum widith of the described first lead-in wire electrode of strip is 10 μ m～200 μ m, is highly 5 μ m～20 μ m;
Described the second lead-in wire electrode is latticed or strip, and latticed described the second lead-in wire electrode comprises cross one another the second conductive lead wire, and the minimum widith of the described second lead-in wire electrode of strip is 10 μ m～200 μ m, is highly 5 μ m～20 μ m.
12. contact panel according to claim 1, is characterized in that, described conducting circuit is latticed or strip, and latticed described conducting circuit is intersected to form by the conducting silk thread.
13. contact panel according to claim 1; it is characterized in that; described nesa coating also comprises protective clear layer, and described protective clear layer coats described transparent substrates, the first conductive layer, the second conductive layer, the first lead-in wire electrode, the second lead-in wire electrode and conducting circuit at least partly.
14. contact panel according to claim 1, is characterized in that, the visible light transmissivity of described nesa coating is not less than 86%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203066961U CN203311373U (en) | 2013-05-30 | 2013-05-30 | Touch panel |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203066961U CN203311373U (en) | 2013-05-30 | 2013-05-30 | Touch panel |
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| Publication Number | Publication Date |
|---|---|
| CN203311373U true CN203311373U (en) | 2013-11-27 |
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| CN2013203066961U Expired - Fee Related CN203311373U (en) | 2013-05-30 | 2013-05-30 | Touch panel |
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| CN (1) | CN203311373U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103279240A (en) * | 2013-05-30 | 2013-09-04 | 南昌欧菲光科技有限公司 | Touch panel |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103279240A (en) * | 2013-05-30 | 2013-09-04 | 南昌欧菲光科技有限公司 | Touch panel |
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