CN203298238U

CN203298238U - Light-emitting diode (LED) support and LED

Info

Publication number: CN203298238U
Application number: CN2013203776778U
Authority: CN
Inventors: 邓江波; 胡康乐; 陈兴荣; 何辉
Original assignee: Shenzhen Absen Optoelectronic Co Ltd
Current assignee: Shenzhen Absen Optoelectronic Co Ltd
Priority date: 2013-06-27
Filing date: 2013-06-27
Publication date: 2013-11-20
Anticipated expiration: 2023-06-27

Abstract

Disclosed are an LED support and an LED. According to the LED support, a first jumper bonding pad, a second jumper bonding pad, a third jumper bonding pad, a fourth jumper bonding pad, a first LED bonding pad group and a second LED bonding pad group are arranged on a base plate; an input end of the first LED bonding pad group is connected with the first jumper bonding pad, and an output end is connected with the second jumper bonding pad; the input end of the first LED bonding pad group is also connected with an anode access point; an input end of the second LED bonding pad group is connected with the third jumper bonding pad, and an output end is connected with the fourth jumper bonding pad; the output end of the second LED bonding pad group is also connected with a cathode access point. By the aid of the LED support and the LED, an LED chip circuit can be compatible with different driving voltages, no power driver is required to be used, and service lives of LED lamp products are greatly prolonged.

Description

LED support and LED

Technical Field

The utility model relates to a LED technical field especially relates to a self can compatible different drive voltage's LED support.

Background

At present, with the rapid development of LED lighting, LED lighting lamps have a trend of replacing traditional incandescent lamps and fluorescent tubes with the advantages of high lighting efficiency, long service life, high reliability, energy conservation and environmental protection, and all regions around the world have a law in succession to limit the use of incandescent lamps. However, because the voltage of the conventional LED light source is low, different driving power supplies are often required to be additionally arranged to satisfy the voltage of the LED in the normal operating state.

However, the cost of the driving power supply is high, so that the price of the whole lamp is influenced, the service life of the driving power supply is far shorter than that of the LED light source, and the service life of the whole lamp can be greatly reduced; aiming at different common voltages in different regions, the LED circuit can not be compatible, so that the competitiveness of the LED circuit on the market is weaker than that of a fluorescent tube, and the civil popularization of the LED lighting lamp is greatly resisted.

SUMMERY OF THE UTILITY MODEL

The utility model aims at remedying above-mentioned defect, provide a LED support that self can compatible different driving voltage.

In order to achieve the purpose, the utility model provides a LED bracket, which comprises a substrate provided with a positive electrode access point and a negative electrode access point, wherein the substrate is also provided with a first jumper wire bonding pad, a second jumper wire bonding pad, a third jumper wire bonding pad and a fourth jumper wire bonding pad;

the substrate is provided with a first LED bonding pad group and a second LED bonding pad group, and the first LED bonding pad group and the second LED bonding pad group both comprise a plurality of LED bonding pads which are connected in series and used for packaging LED chips; wherein,

the input end of the first LED bonding pad group is connected with the first jumper bonding pad, and the output end of the first LED bonding pad group is connected with the second jumper bonding pad;

the input end of the second LED bonding pad group is connected with the third jumper bonding pad, and the output end of the second LED bonding pad group is connected with the fourth jumper bonding pad;

the input end of the first LED pad group is also connected with the positive electrode access point; the output end of the second LED pad group is also connected with the negative pole access point.

Preferably, a fifth jumper pad connected with the output end of the first LED pad group is further disposed on the substrate.

Preferably, a sixth jumper pad connected with the input end of the second LED pad group is further disposed on the substrate.

Preferably, the number of the LED pads in the first LED pad group is 4.

Preferably, the number of the LED pads in the second LED pad group is 4.

Preferably, the substrate is covered with an insulating layer.

Preferably, the LED pads are connected through gold wires.

The utility model discloses still further provide a LED, include the LED support and encapsulate the LED chip on this LED support, the LED support adopts foretell LED support.

Adopt the utility model discloses a LED support and LED, to current needs add drive power supply's LED support and LED and compare, at first, under the power consumption environment of difference and different LED chip specifications, choose suitable series connection or parallelly connected mode for use respectively to LED pad group, satisfy the work that LED lamp homoenergetic is normal under the power consumption environment of different national areas and the LED chip specification of difference. Secondly, the LED bracket of the utility model enables the LED chip circuit to be compatible with different driving voltages without using a driving power supply; the service life of the existing driving power supply is far shorter than that of the light source, and when the driving power supply is not needed, the service life of the LED lamp product can be greatly prolonged.

Drawings

Fig. 1 is a schematic structural diagram of an LED bracket according to a preferred embodiment of the present invention;

fig. 2 is a schematic diagram of a physical structure of the LED support shown in fig. 1.

The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

The utility model provides a LED support.

Referring to fig. 1 and 2, fig. 1 is a schematic structural diagram of an LED bracket according to a preferred embodiment of the present invention; fig. 2 is a schematic diagram of a physical structure of the LED support shown in fig. 1.

The utility model discloses LED support includes base plate 1, and integrated first LED pad group 10a and second LED pad group 10b on base plate 1, wherein first LED pad group 10a and second LED pad group 10b all include 4 LED pads 11 of establishing ties; the LED bonding pads 11 are used for packaging LED chips, and the LED bonding pads 11 are preferably connected by gold wires.

The substrate 1 is further provided with a positive electrode access point 20 and a negative electrode access point 30, and a first jumper pad 41, a second jumper pad 42, a third jumper pad 43, and a fourth jumper pad 44.

The input end of the first LED bonding pad group 10a is divided into two paths, the first path is connected to the positive electrode access point 20, and the other path is connected to the first jumper bonding pad 41;

the output end of the first LED bonding pad group 10a is connected to the second jumper bonding pad 42;

the input end of the second LED bonding pad group 10b is connected to the third jumper bonding pad 43;

the output end of the second LED bonding pad group 10b is divided into two paths, the first path is connected to the negative electrode access point 30, and the other path is connected to the fourth jumper bonding pad 44.

In the using process, the utility model discloses use the domestic alternating voltage of the most commonly used 192-.

When the operating voltage born by the LED chip is 24-28V, in order to enable the voltage at the two ends of the circuit to adapt to the household 192-224V alternating voltage, the second jumper bonding pad 42 is connected with the third jumper bonding pad 43, so that a series circuit of the first LED bonding pad group 10a and the second LED bonding pad group 10b is formed, the voltage of each LED chip is within the standard specification range of 24-28V, and the voltage of the whole circuit is 192-224V.

Meanwhile, in order to adapt to different countries and regions, such as domestic household voltage of 96-112V commonly used in Japan, the utility model discloses a working voltage that LED chips bear is 24-28V's specification, connects first jumper pad 41 with third jumper pad 43 respectively, and second jumper pad 42 is connected with fourth jumper pad 44, forms first LED pad group 10a and second LED pad group 10b parallelly connected, and the voltage of every LED chip is in 24-28V's standard specification range, and the voltage of the whole circuit is 96-112V.

Of course, in the above-mentioned using process, there may be LED chips with other specifications than the operating voltages 48-55V and 24-28V of the above-mentioned common LED high-voltage chip, and when different common voltages are used, then according to different situations, the number of the LED bonding pads 11 in the above-mentioned first LED bonding pad group 10a and the second LED bonding pad group 10b of the present invention can be correspondingly increased or decreased. For example, the common household voltage is 384-.

Adopt the utility model discloses an above-mentioned LED support compares to current needs add drive power supply's LED support, at first, under the power consumption environment of difference and different LED chip specifications, chooses suitable series connection or parallelly connected mode for use respectively to LED pad group, satisfies the work that LED lamp homoenergetic is normal under the power consumption environment of different national areas and the LED chip specification of difference. Secondly, the LED bracket of the utility model enables the LED chip circuit to be compatible with different driving voltages without using a driving power supply; the service life of the existing driving power supply is far shorter than that of the light source, and when the driving power supply is not needed, the service life of the LED lamp product can be greatly prolonged.

In the above embodiment, in an actual LED support product, the substrate is further provided with the fifth jumper pad 45 and the sixth jumper pad 46 for transfer. The first jumper pad 41, the second jumper pad 42, the third jumper pad 43, and the fourth jumper pad 44 may be inconvenient to connect to each other when disposed on the substrate 1, and in order to facilitate the connection of the first LED pad group 10a and the second LED pad group 10b into a circuit between the pads, a second path is further included at an output end of the first LED pad group 10a, and the second path is connected to the fifth jumper pad 45. The fifth jumper pad 45 may be positioned to facilitate connection with other jumper pads for intermediate connection. Based on the same principle and action, the input terminal of the second LED bonding pad group 10b further includes a second path connected to the sixth jumper bonding pad 46, and the sixth jumper bonding pad 46 is similar to the fifth jumper bonding pad 45 in action and is also arranged at a position convenient for connection with other jumper bonding pads to serve as an intermediate connection. For example, when the serial connection is required, the second jumper pad 42 and the third jumper pad 43 are far away from each other on the substrate, or are separated by other intermediate devices, so that the connection is inconvenient, the fifth jumper pad 45 may be used to replace the second jumper pad 42 to be connected to the input end of the second LED pad group 10b, and the sixth jumper pad 46 may be used to replace the third jumper pad 43 to be connected to the output end of the first LED pad group 10 a. When parallel connection is required, the fifth jumper pad 45 may be used instead of the second jumper pad 42, or the sixth jumper pad 46 may be used instead of the third jumper pad 43.

In the above embodiment, the LED chip is preferably fixed on the LED pad 11 by glue, the electrode of the LED pad 11 connected to the LED chip is made of silver-plated copper or nickel-plated gold, and the LED chip is connected to the circuit by gold wire. Meanwhile, when a circuit is formed by connecting the jumper wire pads in series or in parallel, the corresponding jumper wire pads are connected by adopting solder paste or resistors according to the required connection mode, and then the circuit is formed.

Specifically, in the above embodiment of the present invention, in order to make the safety of the LED support higher, the LED support substrate 1 is covered with an insulating layer, and of course, the LED bonding pads 11, the above-mentioned each jumper bonding pad, and the access points of the positive and negative electrodes need to be exposed, so as to facilitate the installation of the LED chip and the connection of the circuit.

The utility model further provides a LED, which comprises an LED bracket and an LED chip; the LED support comprises a substrate 1, wherein a first LED bonding pad group 10a and a second LED bonding pad group 10b are integrated on the substrate 1, and the first LED bonding pad group 10a and the second LED bonding pad group 10b respectively comprise 4 LED bonding pads 11 which are connected in series; the LED bonding pads 11 are used for packaging LED chips, and the LED bonding pads 11 are preferably connected by gold wires.

Adopt the utility model discloses an above-mentioned LED has all characteristics of above-mentioned LED support, compares with current LED, at first, under the power consumption environment of difference and different LED chip specifications, chooses suitable series connection or parallelly connected mode for use respectively to LED pad group, satisfies the work that LED lamp homoenergetic is normal under the power consumption environment of different national areas and the LED chip specification of difference. Secondly, the LED bracket of the utility model enables the LED chip circuit to be compatible with different driving voltages without using a driving power supply; the service life of the existing driving power supply is far shorter than that of the light source, and when the driving power supply is not needed, the service life of the LED lamp product can be greatly prolonged.

The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent flow changes made by the contents of the specification and the drawings, or directly or indirectly applied to other related technical fields, are included in the same way in the protection scope of the present invention.

Claims

1. An LED support comprises a substrate provided with a positive electrode access point and a negative electrode access point, and is characterized in that a first jumper wire bonding pad, a second jumper wire bonding pad, a third jumper wire bonding pad and a fourth jumper wire bonding pad are further arranged on the substrate;

2. The LED mount according to claim 1, wherein a fifth jumper pad connected to an output terminal of the first LED pad group is further provided on the substrate.

3. The LED mount according to claim 1, wherein a sixth jumper pad connected to an input terminal of the second LED pad group is further provided on the substrate.

4. The LED support of claim 1, wherein the number of LED pads in the first LED pad set is 4.

5. The LED support of claim 1, wherein the number of LED pads in the second LED pad set is 4.

6. The LED support of claim 1, wherein the substrate is covered with an insulating layer.

7. The LED support of claim 1, wherein the LED pads are connected by gold wire.

8. An LED comprising an LED support and an LED chip packaged on the LED support, wherein the LED support is the LED support of any one of claims 1 to 7.