CN203264929U - Spraying device - Google Patents

Abstract

The utility model discloses a spraying device, it disposes in the top of a base plate. The spraying device comprises a plurality of liquid conveying pipes, a plurality of nozzles and a pump. The nozzles are respectively connected with the liquid conveying pipes. The pump is connected with the liquid conveying pipe. The pump is suitable for respectively injecting liquid into the liquid conveying pipes at different flow rates, and the liquid in each liquid conveying pipe is sprayed onto the substrate in a mist mode through the corresponding nozzle.

Description

sprinkler

technical field

The utility model relates to a spraying device, in particular to a spraying device applied to the wet manufacturing process of circuit substrates. the

Background technique

The spraying method adopted in the wet manufacturing process of circuit substrates mainly uses spraying devices to allow liquid substances to spread in the air and land on the surface of objects. Therefore, the user does not need to use a smear tool to smear these spraying substances on the surface of the object, and can spray a thin layer of the spraying substance on the surface of the object through the spraying device. In practical applications, the container containing the spraying substance will be equipped with a spray head, and the spraying substance will be sprayed out by operating the spray head, so that it can be evenly distributed in the air. the

Since all kinds of electronic devices today require light, thin, short, small appearance and diversified functions, the copper foil circuit on the substrate in the electronic device is relatively more and more refined, so that it can be used in On the substrate of the same area, a circuit sufficient to meet the requirements is laid out. How to make the liquid sprayed by the spraying device enter into a smaller circuit gap has become the main problem to be solved in the design of the spraying device today. the

Utility model content

The purpose of this utility model is to provide a spraying device, which uses a pump to inject a liquid into the liquid delivery pipe at different flow rates, and the liquid in each liquid delivery pipe is sprayed to the substrate in a mist-like manner through the corresponding nozzle superior. the

To achieve the above purpose, the spraying device of the present invention is arranged above a substrate. The spraying device includes a plurality of liquid delivery pipes, a plurality of nozzles and a pump. The nozzles are respectively connected to the liquid delivery pipes. The pump is connected to the liquid delivery pipe, wherein the pump is suitable for injecting a liquid into the liquid delivery pipe with different flows, and the liquid in each liquid delivery pipe is sprayed onto the substrate in a mist-like manner through a corresponding nozzle. the

In an embodiment of the present invention, the liquid includes etching liquid or water. the

In one embodiment of the present invention, there is a first distance between the substrate and each nozzle, and the first distance is between 10mm and 20mm. the

In an embodiment of the present invention, there is a second distance between the above two adjacent nozzles, and the second distance is between tens of millimeters and hundreds of millimeters. the

In an embodiment of the present invention, the diameter of each nozzle is between 50 microns and 500 microns. the

The utility model has the advantage that the spraying device injects a liquid into the liquid delivery pipes with different flow rates through the pump, and the liquid in each liquid delivery pipe is sprayed onto the substrate in a mist-like manner through the corresponding nozzles . Therefore, when the spraying device is applied to the wet manufacturing process of the circuit substrate, in addition to effectively avoiding over-etching of the thin circuit to ensure the integrity of the circuit, it can also effectively etch the circuit substrate to a predetermined level. thickness. the

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail together with the accompanying drawings. the

Description of drawings

Fig. 1 is a schematic diagram of a spraying device according to an embodiment of the present invention. the

Symbol Description

10: Substrate

100: sprinkler

110: liquid delivery pipe

120: Nozzle

130: pump

D1: the first distance

D2: second distance

L: liquid

Detailed ways

FIG. 1 is a schematic diagram of a spraying device according to an embodiment of the present invention. Please refer to FIG. 1 , in this embodiment, a spraying device 100 is disposed above a substrate 10 , wherein the spraying device 100 includes a plurality of liquid delivery pipes 110 , a plurality of nozzles 120 and a pump 130 . The nozzles 120 are respectively connected to the liquid delivery pipes 110 . The pump 130 is connected to the liquid delivery tube 110 . In particular, the pump 130 is adapted to inject a liquid L into the liquid delivery pipes 110 at different flow rates, and the liquid L in each liquid delivery pipe 110 is sprayed to the substrate 10 in a mist-like manner through the corresponding nozzles 120 superior. the

More specifically, the liquid L is, for example, etching solution or water, and the pump 130, for example, applies a working pressure, preferably, the working pressure is between 15 kg/cm2 and 30 kg/cm2, and is controlled by pressure A valve (not shown) injects the liquid L into the liquid delivery pipe 110 at different flow rates. In this embodiment, there is a first distance D1 between the substrate 10 and each nozzle 120, and the first distance D1 is, for example, between 10 mm and 20 mm, which can effectively spray the atomized liquid L to on the substrate 10. Furthermore, there is a second distance D2 between two adjacent nozzles 120 , and the second distance D2 may be between tens of millimeters and hundreds of millimeters. In this way, only a small portion of the atomized liquid L sprayed by two adjacent nozzles 120 overlaps, which can effectively control the spraying amount of each nozzle 120 on a local area of the substrate 10 to improve the yield of the manufacturing process. In addition, in this embodiment, the diameter of the nozzle 120 is, for example, between 50 microns and 500 microns. the

Since the spraying device 100 of this embodiment injects a liquid L into the liquid delivery pipe 110 at different flow rates through the pump 130, and the liquid L in each liquid delivery pipe 110 passes through the corresponding nozzle 120 in a mist-like manner. sprayed onto the substrate 10. Therefore, when the spraying device 100 is applied to the wet manufacturing process of the circuit substrate (not shown), in addition to effectively avoiding the over-etching of the thin circuit (not shown), to ensure the integrity of the circuit, it can also Effectively uniformly etch the circuit substrate to a predetermined thickness. the

In summary, the spraying device of the present invention injects a liquid into the liquid delivery pipes at different flow rates through the pump, and the liquid in each liquid delivery pipe is sprayed to the substrate in a mist-like manner through the corresponding nozzles superior. Therefore, when the spraying device is applied to the wet manufacturing process of circuit substrates, over-etching of thin circuits can be effectively avoided, so as to ensure the integrity of circuits. the

Claims (5)

1. A spraying device configured above a substrate, characterized in that the spraying device comprises: a plurality of liquid delivery pipes; A plurality of nozzles are respectively connected to the liquid delivery pipes; and A pump connected to the liquid delivery pipes, wherein the pump is suitable for injecting a liquid into the liquid delivery pipes with different flow rates, and the liquid in each liquid delivery pipe passes through the corresponding nozzle in a mist-like sprayed onto the substrate. the 2. The spraying device according to claim 1, wherein the liquid comprises etching liquid or water. the 3 . The spraying device according to claim 1 , wherein there is a first distance between the substrate and each of the nozzles, and the first distance is between 10 mm and 20 mm. 4 . the 4. The spraying device according to claim 1, wherein there is a second distance between two adjacent nozzles, and the second distance is between tens of millimeters and hundreds of millimeters. the 5. The spraying device as claimed in claim 1, wherein the diameter of each nozzle is between 50 microns and 500 microns. the

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