CN203254606U - 一种dip引线框塑封模具 - Google Patents
一种dip引线框塑封模具 Download PDFInfo
- Publication number
- CN203254606U CN203254606U CN 201320226315 CN201320226315U CN203254606U CN 203254606 U CN203254606 U CN 203254606U CN 201320226315 CN201320226315 CN 201320226315 CN 201320226315 U CN201320226315 U CN 201320226315U CN 203254606 U CN203254606 U CN 203254606U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- dip
- boss
- plastic package
- horizontal bar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000465 moulding Methods 0.000 claims abstract description 11
- 238000003825 pressing Methods 0.000 claims description 18
- 239000000084 colloidal system Substances 0.000 abstract description 15
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 5
- 238000003475 lamination Methods 0.000 abstract 4
- 238000004806 packaging method and process Methods 0.000 description 13
- 101100028951 Homo sapiens PDIA2 gene Proteins 0.000 description 3
- 102100036351 Protein disulfide-isomerase A2 Human genes 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Images
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320226315 CN203254606U (zh) | 2013-04-28 | 2013-04-28 | 一种dip引线框塑封模具 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320226315 CN203254606U (zh) | 2013-04-28 | 2013-04-28 | 一种dip引线框塑封模具 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203254606U true CN203254606U (zh) | 2013-10-30 |
Family
ID=49467210
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320226315 Expired - Lifetime CN203254606U (zh) | 2013-04-28 | 2013-04-28 | 一种dip引线框塑封模具 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203254606U (zh) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105244292A (zh) * | 2015-11-04 | 2016-01-13 | 上海凯虹电子有限公司 | 具有不规则形齿槽的塑封模具及去除溢胶的方法 |
| CN106684064A (zh) * | 2016-12-28 | 2017-05-17 | 上海凯虹科技电子有限公司 | 高密度封装体、引线框架、封装单元及封装方法 |
-
2013
- 2013-04-28 CN CN 201320226315 patent/CN203254606U/zh not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105244292A (zh) * | 2015-11-04 | 2016-01-13 | 上海凯虹电子有限公司 | 具有不规则形齿槽的塑封模具及去除溢胶的方法 |
| CN105244292B (zh) * | 2015-11-04 | 2018-07-20 | 上海凯虹电子有限公司 | 具有不规则形齿槽的塑封模具及去除溢胶的方法 |
| CN106684064A (zh) * | 2016-12-28 | 2017-05-17 | 上海凯虹科技电子有限公司 | 高密度封装体、引线框架、封装单元及封装方法 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: DIP (dual-in-line package) lead frame plastic package mold Effective date of registration: 20190507 Granted publication date: 20131030 Pledgee: China Postal Savings Bank Limited by Share Ltd. Suining Sui branch Pledgor: SICHUAN MOUNTEK ELECTRONIC TECHNOLOGY CO.,LTD. Registration number: 2019510000053 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 629000 No.11, Dequan road Microelectronics Industrial Park, Suining Economic Development Zone, Sichuan Province Patentee after: Sichuan Mingtai Microelectronics Technology Co.,Ltd. Address before: 629000 No.11, Dequan road Microelectronics Industrial Park, Suining Economic Development Zone, Sichuan Province Patentee before: SICHUAN MOUNTEK ELECTRONIC TECHNOLOGY CO.,LTD. |
|
| CP01 | Change in the name or title of a patent holder | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220328 Granted publication date: 20131030 Pledgee: China Postal Savings Bank Limited by Share Ltd. Suining Sui branch Pledgor: SICHUAN MOUNTEK ELECTRONIC TECHNOLOGY CO.,LTD. Registration number: 2019510000053 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20131030 |
|
| CX01 | Expiry of patent term |