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CN203223889U - Display device provided with heat conduction structure and heat conduction structure - Google Patents

Display device provided with heat conduction structure and heat conduction structure Download PDF

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Publication number
CN203223889U
CN203223889U CN2013202471170U CN201320247117U CN203223889U CN 203223889 U CN203223889 U CN 203223889U CN 2013202471170 U CN2013202471170 U CN 2013202471170U CN 201320247117 U CN201320247117 U CN 201320247117U CN 203223889 U CN203223889 U CN 203223889U
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CN
China
Prior art keywords
thermal conductive
conductive zone
backlight
heat conduction
zone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2013202471170U
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Chinese (zh)
Inventor
徐振春
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Shanghai Ding Electronic Technology (Group) Co., Ltd.
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SHANGHAI DINGWEI SOFTWARE TECHNOLOGY Co Ltd
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Priority to CN2013202471170U priority Critical patent/CN203223889U/en
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Publication of CN203223889U publication Critical patent/CN203223889U/en
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Abstract

The utility model relates to a display device provided with a heat conduction structure and the heat conduction structure. The display device comprises a liquid crystal panel, a light conduction board, a backlight source, a reflection film and the heat conduction structure. The heat conduction structure is a sheet-shaped base material having the heat conduction capacity, and comprises a first heat conduction area, a bending area and a second heat conduction area, wherein the first heat conduction area is located on the first face of the backlight source; the second heat conduction area is attached to the back face of the reflection film and located on the second face which is opposite to the first face of the backlight source; the bending area is connected with the first heat conduction area and the second heat conduction area, is bent from the first face of the backlight source to the second face, and transmits the heat produced by the backlight source from the first heat conduction area to the second heat conduction area. According to the display device, the heat conduction structure is attached to the backlight source directly, no medium obstructions exist between the backlight source and the heat conduction structure, the heat conduction effect is good, and heat of light-emitting devices is prevented from gathering on the front face of the display device and heating a screen body.

Description

Display unit and conductive structure with conductive structure
Technical field
The utility model relates to display unit, relates in particular to a kind of display unit and conductive structure with conductive structure.
Background technology
Mobile phone, increasing and the effect screen of the size of used LCD screen requires more and more higher in the electric terminals such as panel computer PAD, correspondingly, quantity as the employed luminescent device of backlight (majority is LED) in this type of LCD MODULE (LCM) is also more and more, it is more and more tightr to arrange, as shown in Figure 1, a plurality of LED10 tight distribution are on the circuit substrate 20 of LCM side, form backlight, thereby cause in its caloric value of the concentrated area of luminescent device than higher, make display module screen body (front) heating, this must impact the LCD MODULE performance, can have influence on consumer's experience.Thereby, in the backlight of LCD MODULE, use radiator structure, the phenomenon that is difficult for exhaling to improve this heat too to concentrate is the technical problem that must consider in the industry.
Prior art solutions is: one deck heat conducting film is pasted at the back at the chase of LCM periphery, solves the problem that the heat of luminescent device on the backlight is concentrated.Yet the major defect of this scheme is: 1) heat conducting film is in the end to be attached to LCM(LCD Module, LCD MODULE) back side, the production process of assembling terminal can increase manufacturing procedure one, influences production efficiency and processing cost.2) because the size of heat conducting film is bigger, and heat conducting film itself is soft, is difficult for attaching, and occurs attaching irregular problem easily.And in case when attaching again after will attaching irregular heat conducting film and tearing, the heat conducting film internal structure is vulnerable to damage, causes losing heat-conducting effect again, thereby increase cost.3) heat conducting film is attached to LCM outside, is collided in LCM assembling and transportation easily and problem such as wearing and tearing, can have influence on the heat transfer efficiency of heat conducting film.4) between heat conducting film and the LED heater every one deck chase, one deck reflectance coating and one deck flexible PCB (FPC), heat can not directly effectively be transmitted on the heat conducting film, and heat conduction can only conductive back heat, also have the part heat to be transmitted to the front, heat transfer efficiency is poor slightly.5) heat conducting film that pastes of the LCM back side has taken most areas of back side chase, can have influence on the ground connection of LCM chase and the ground connection of FPC.6) the structural entity planarization is not good, and FPC and heat conducting film lap structure can be thicker, thereby needs electronics such as mobile phone knot terminal structurally to do to dodge.
Summary of the invention
In view of this, the utility model provides a kind of display unit and conductive structure with conductive structure, good heat conduction effect, and the heat that reduces luminescent device makes the heating of screen body in the gathering of the front of display unit.
For achieving the above object, the utility model provides a kind of display unit with conductive structure on the one hand, comprise: liquid crystal panel, LGP, backlight and reflectance coating, described backlight is positioned at the side of LGP, described liquid crystal panel, LGP and reflectance coating stack gradually, described backlight, LGP are positioned at the front of described reflectance coating, and
Conductive structure, described conductive structure are one to have the flat substrates of the capacity of heat transmission, comprising: first thermal conductive zone, bending district and second thermal conductive zone;
Described first thermal conductive zone is positioned at first of described backlight;
Described second thermal conductive zone pastes mutually with the reverse side of described reflectance coating, is positioned at first second of deviating from mutually with described backlight;
Described bending district connects described first thermal conductive zone and second thermal conductive zone, and is bent to described second by first face of described backlight, and the heat that described backlight is produced is passed to described second thermal conductive zone by described first thermal conductive zone.
In the novel a kind of specific embodiment of this enforcement, the width in described bending district when described bending district, first thermal conductive zone and second thermal conductive zone lie on same plane, forms " worker " font structure less than the width of described first thermal conductive zone and second thermal conductive zone.
In the novel a kind of specific embodiment of this enforcement, described backlight comprises a plurality of LEDs, and described a plurality of LED are arranged at flexible PCB FPC and go up the backlight that forms strip, and first thermal conductive zone of described conductive structure is attached on this FPC.
In the novel a kind of specific embodiment of this enforcement, the area of described first thermal conductive zone conforms to the area of the FPC of described LED region.
In the novel a kind of specific embodiment of this enforcement, described second thermal conductive zone is attached at the reverse side of described reflectance coating, and the area of described second thermal conductive zone is less than or equal to the area of described reflectance coating.
In the novel a kind of specific embodiment of this enforcement, described display unit also comprises: the metal framework, described metal framework is fixed into one with described liquid crystal panel, LGP, backlight, reflectance coating and conductive structure.
In the novel a kind of specific embodiment of this enforcement, described conductive structure has a plurality of described first thermal conductive zones and corresponding a plurality of described bending district.
On the other hand, the utility model also provides a kind of conductive structure, and described conductive structure is one to have the flat substrates of the capacity of heat transmission, comprising: first thermal conductive zone, bending district and second thermal conductive zone;
Described first thermal conductive zone is positioned at first of thermal source;
Described second thermal conductive zone is positioned at first second of deviating from mutually with described thermal source;
Described bending district connects described first thermal conductive zone and second thermal conductive zone, and is bent to described second by first face of described thermal source, and the heat that described thermal source is produced is passed to described second thermal conductive zone by described first thermal conductive zone.
In the novel a kind of specific embodiment of this enforcement, the width in described bending district when described bending district, first thermal conductive zone and second thermal conductive zone lie on same plane, forms " worker " font structure less than the width of described first thermal conductive zone and second thermal conductive zone.
In the novel a kind of specific embodiment of this enforcement, described thermal source is luminescent device, and described luminescent device is arranged on the circuit substrate, and described first thermal conductive zone pastes mutually with this circuit substrate.
The display unit with conductive structure and conductive structure that the utility model provides, conductive structure is directly pasted mutually with backlight, make that no medium intercepts between backlight and the conductive structure, the heat that can effectively backlight be sent is transmitted to the back side, good heat conduction effect, the heat that reduces luminescent device makes the heating of screen body in the gathering of the front of display unit.
Description of drawings
Fig. 1 is the schematic diagram of backlight among the existing LCD MODULE LCM;
Fig. 2 is the cross-sectional view of the display unit with conductive structure that provides of the utility model;
Fig. 3 is the structural representation of the conductive structure that provides of the utility model after open and flat;
Fig. 4 is the Facad structure schematic diagram after conductive structure that the utility model provides is attached at reflectance coating;
Fig. 5 is the front schematic view after the conductive structure assembling that provides of the utility model;
Fig. 6 is the partial cutaway schematic after the conductive structure assembling that provides of the utility model;
Fig. 7 is the structural representation of another conductive structure of providing of the utility model.
The specific embodiment
Below by drawings and Examples, the technical solution of the utility model is described in further detail.
Fig. 2 is the cross-sectional view of the display unit with conductive structure that provides of present embodiment, and as shown in Figure 2, this display unit comprises: conductive structure 1, backlight 2, LGP 3, reflectance coating 4 and liquid crystal panel 5.
Backlight 2 comprises luminescent device 21 and circuit board 22, in order to produce light source.Luminescent device 21 can be cold cathode fluorescent tube (CCFL), light emitting diode (LED) etc., and the most common is LED.Circuit board 22 can printed circuit board (PCB) (PCB), flexible PCB (FPC) etc., and that adopt usually in slim electric terminal is the FPC of more frivolous softness.Be LED with luminescent device 21 in the utility model, circuit board 22 is example for FPC.It is luminous that LGP 3 is used for that luminous lamp strip linear luminous is transformed into face.Backlight 2 is formed backlight module with LGP 3, is used to liquid crystal panel 5 that area source is provided.Reflectance coating 4 is used for strengthening the exitance of LGP 3 light, and the light in the LGP 3 is reflexed to exiting surface.Liquid crystal panel 5 is generally LCD (LCD).Usually as shown in Figure 2, backlight 2 is positioned at the side of LGP 3, and liquid crystal panel 5, LGP 3 and reflectance coating 4 stack gradually, and the front of reflectance coating 4 is exiting surface, and liquid crystal panel 5 and LGP 3 are positioned at the front of reflectance coating 4.
Conductive structure 1 is one to have the flat substrates of the capacity of heat transmission, Fig. 3 is the structural representation of the conductive structure that provides of the utility model after open and flat, as shown in Figure 3, conductive structure 1 comprises: first thermal conductive zone 11, bending district 12 and second thermal conductive zone 13, the width in bending district 12 is less than the width of first thermal conductive zone 11 and second thermal conductive zone 13, when bending district's 12, first thermal conductive zone 11 and second thermal conductive zone 13 lie on same plane, form " worker " font structure.
Second thermal conductive zone 13 of conductive structure 1 pastes mutually with the reverse side of reflectance coating 4, specifically can be that to attach also can be the state of being close to.When assembling, can earlier second thermal conductive zone 13 of conductive structure 1 be attached at the reverse side of reflectance coating 4, as shown in Figure 4, second thermal conductive zone 13 is bonded to one with reflectance coating 4.
Fig. 5 is the front schematic view after 1 assembling of the conductive structure that provides of the utility model, Fig. 6 is the partial cutaway schematic after the conductive structure assembling, as shown in Figure 5 and Figure 6, first thermal conductive zone 11 of conductive structure 1 pastes mutually with the circuit board 22 of backlight 2, is positioned at first of backlight 2.The luminescent device 21 of backlight 2 comprises a plurality of LED, and a plurality of LED arrange by the paster mode and are arranged at circuit board 22(flexible PCB FPC) the last backlight that forms strip.LED and first thermal conductive zone 11 lay respectively at the both sides of FPC, and the heat that LED produces is passed to first thermal conductive zone 11 by FPC, because FPC is thinner usually, and good heat conduction effect, first thermal conductive zone 11 can effectively conduct the heat that LED produces.Usually, the area of first thermal conductive zone 11 conforms to the area of the FPC of LED region, and size is close.
Second thermal conductive zone 13 is attached at the reverse side of reflectance coating 4, is positioned at first second of deviating from mutually with the luminescent device 21 of backlight 2.For the ease of processing, the area of second thermal conductive zone 13 is less than or equal to the area of reflectance coating 4.
Bending district 12 connects first thermal conductive zone 11 and second thermal conductive zone 13, and be bent to described second by first face of backlight 21, the heat that backlight 21 is produced is passed to second thermal conductive zone 13 by first thermal conductive zone 11, assemble in the front of display unit with the heat of avoiding backlight 21 to produce, the heat that backlight 21 is produced conducts to the back side, simultaneously can increase area of dissipation, rapidly heat radiation.Like this, the conductive structure 1 of first thermal conductive zone 11,12 and second thermal conductive zone, 13 formation of bending district can coat the backlight 2 of luminescent device 21 regions in the display unit.
As shown in Figure 2, this display unit can also comprise: improved optics film 6, main circuit board 7 and metal framework 8.
Improved optics film 6 is arranged at before the exiting surface 31 of LGP 3, is used for improving the optical effect of backlight, and it is bad to avoid occurring serious rainbow effect etc.Improved optics diaphragm 6 can be diffusion sheet, prismatic lens, inverse edge eyeglass (Turning Prism Sheet), brightness enhancement film (Brightness Enhancement Film, BEF), reflective brightness enhancement film (Dual Brightness Enhancement Film, DBEF), non-multilayer membrane type reflective polarizers (Diffused Reflective Polarize Film, DRPF) or the composite sheet of any combination of Denging.
Main circuit board 7 is connected with liquid crystal panel 5, is used for driving and controlling the demonstration of liquid crystal panel.This main circuit board 7 is electrically connected with backlight 2 by winding displacement etc., and for the ease of follow-up assembling, the winding displacement of connection is reserved with certain-length usually, and main circuit board 7 can be held on the back side of metal framework 8.
Metal framework 8 is fixed into one with liquid crystal panel 5, LGP 3, backlight 2, reflectance coating 4 and conductive structure 1.Like this, conductive structure 1 is positioned at display unit inside, in transportation, can not be damaged to conductive structure 1, carrying out when subsequent group is dressed up terminal can not be damaged to conductive structure 1 in the disassembly process, do not influence simultaneously the planarization of display unit integral body, do not influence the ground connection property of main circuit board and the chase of display unit yet, make the reliability of display unit good.
In the assembling process of display unit, earlier large-area second thermal conductive zone 13 and reflectance coating 4 are fitted and do after the preliminary treatment, LGP 3 and backlight 2 are packed into, reinstall pretreated reflectance coating 4, and with bending district 12 bendings of the conductive structure 1 of " worker " font, first thermal conductive zone 11 is affixed on the circuit substrate 22 of backlight 2, assemble other film materials and metal outer frame etc. again, more convenient, can save production cost.
For the backlight 2 that adapts to different structure, conductive structure 1 also can have a plurality of first thermal conductive zones 11 and corresponding a plurality of bendings district 12.For example, be the backlight lamp tube of L type for luminescent device, backlight is positioned at two sides of LGP, and as shown in Figure 7, then this conductive structure 1 comprises two first thermal conductive zones 11,11 ' and two bending district 12,12 '.
The display unit with conductive structure that the utility model provides is directly pasted conductive structure with backlight mutually, makes that no medium intercepts between backlight and the conductive structure, and the heat that can effectively backlight be sent is transmitted to the back side, good heat conduction effect.Conductive structure of the present utility model is positioned at display unit inside, make it in dismounting and transportation, can not be damaged to conductive structure, do not influence simultaneously the planarization of display unit integral body, do not influence the ground connection property of main circuit board and the chase of display unit yet, make the reliability of display unit good.And, more convenient in the backlight that can be directly during production the reflectance coating that has been made of one and heat conducting film be assembled into display unit, can save production cost.
The above-described specific embodiment; the purpose of this utility model, technical scheme and beneficial effect are further described; institute is understood that; the above only is the specific embodiment of the present utility model; and be not used in and limit protection domain of the present utility model; all within spirit of the present utility model and principle, any modification of making, be equal to replacement, improvement etc., all should be included within the protection domain of the present utility model.

Claims (10)

1. display unit with conductive structure, comprise liquid crystal panel, LGP, backlight and reflectance coating, described backlight is positioned at the side of LGP, described liquid crystal panel, LGP and reflectance coating stack gradually, described backlight, LGP are positioned at the front of described reflectance coating, it is characterized in that described display unit also comprises:
Conductive structure, described conductive structure is the flat substrates with capacity of heat transmission, comprising: first thermal conductive zone, bending district and second thermal conductive zone;
Described first thermal conductive zone is positioned at first of described backlight;
Described second thermal conductive zone pastes mutually with the reverse side of described reflectance coating, is positioned at first second of deviating from mutually with described backlight;
Described bending district connects described first thermal conductive zone and second thermal conductive zone, and is bent to described second by first face of described backlight, and the heat that described backlight is produced is passed to described second thermal conductive zone by described first thermal conductive zone.
2. display unit according to claim 1, it is characterized in that, the width in described bending district when described bending district, first thermal conductive zone and second thermal conductive zone lie on same plane, forms " worker " font structure less than the width of described first thermal conductive zone and second thermal conductive zone.
3. display unit according to claim 1 is characterized in that, described backlight comprises a plurality of LEDs, and described a plurality of LED are arranged at the backlight that forms strip on the circuit board, and first thermal conductive zone of described conductive structure is attached on the described circuit board.
4. display unit according to claim 3 is characterized in that, the area of described first thermal conductive zone conforms to the area of the circuit board of described LED region.
5. display unit according to claim 1 is characterized in that, described second thermal conductive zone is attached at the reverse side of described reflectance coating, and the area of described second thermal conductive zone is less than or equal to the area of described reflectance coating.
6. display unit according to claim 1 is characterized in that, described display unit also comprises: the metal framework, described metal framework is fixed into one with described liquid crystal panel, LGP, backlight, reflectance coating and conductive structure.
7. display unit according to claim 1 is characterized in that, described conductive structure has a plurality of described first thermal conductive zones and corresponding a plurality of described bending district.
8. a conductive structure is characterized in that, this conductive structure is the flat substrates with capacity of heat transmission, comprising: first thermal conductive zone, bending district and second thermal conductive zone;
Described first thermal conductive zone is positioned at first of thermal source;
Described second thermal conductive zone is positioned at first second of deviating from mutually with described thermal source;
Described bending district connects described first thermal conductive zone and second thermal conductive zone, and is bent to described second by first face of described thermal source, and the heat that described thermal source is produced is passed to described second thermal conductive zone by described first thermal conductive zone.
9. conductive structure according to claim 8, it is characterized in that, the width in described bending district when described bending district, first thermal conductive zone and second thermal conductive zone lie on same plane, forms " worker " font structure less than the width of described first thermal conductive zone and second thermal conductive zone.
10. conductive structure according to claim 8 is characterized in that, described thermal source is luminescent device, and described luminescent device is arranged on the circuit substrate, and described first thermal conductive zone pastes mutually with this circuit substrate.
CN2013202471170U 2013-05-06 2013-05-06 Display device provided with heat conduction structure and heat conduction structure Expired - Fee Related CN203223889U (en)

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Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103873616A (en) * 2014-03-06 2014-06-18 京东方科技集团股份有限公司 Display module and mobile communication device
CN105674147A (en) * 2016-01-14 2016-06-15 京东方科技集团股份有限公司 Backlight module and display device
CN105759498A (en) * 2016-03-01 2016-07-13 京东方科技集团股份有限公司 Display device
WO2016169182A1 (en) * 2015-04-24 2016-10-27 京东方科技集团股份有限公司 Display device
CN106847080A (en) * 2017-01-17 2017-06-13 维沃移动通信有限公司 A kind of display screen module and mobile terminal
CN106878510A (en) * 2017-04-11 2017-06-20 北京京东方茶谷电子有限公司 A kind of back light source structure, display panel and device
WO2018166035A1 (en) * 2017-03-17 2018-09-20 武汉华星光电技术有限公司 Backlight module and liquid display device
CN108986681A (en) * 2018-07-27 2018-12-11 维沃移动通信有限公司 A kind of backlit display screen and mobile terminal
WO2019000711A1 (en) * 2017-06-28 2019-01-03 武汉华星光电技术有限公司 Backlight module and liquid crystal display device
CN109618542A (en) * 2019-01-13 2019-04-12 进佳科技(国际)有限公司 Mobile Terminal with Heat Concentration and Conduction Function
CN110312394A (en) * 2019-06-27 2019-10-08 Oppo广东移动通信有限公司 A casing, a casing assembly, an electronic device, and a method for controlling the lighting of the casing
CN110312393A (en) * 2019-06-27 2019-10-08 Oppo广东移动通信有限公司 Electronic equipment and soft light assembly thereof
CN110398861A (en) * 2019-09-03 2019-11-01 东莞市利锦电子有限公司 A plastic iron with reflector function
CN112180632A (en) * 2020-10-22 2021-01-05 武汉华星光电技术有限公司 Chip heat radiation structure and liquid crystal display device
CN113050315A (en) * 2019-12-26 2021-06-29 乐金显示有限公司 Display device

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103873616A (en) * 2014-03-06 2014-06-18 京东方科技集团股份有限公司 Display module and mobile communication device
WO2016169182A1 (en) * 2015-04-24 2016-10-27 京东方科技集团股份有限公司 Display device
US10613271B2 (en) 2015-04-24 2020-04-07 Boe Technology Group Co., Ltd. Display device with heat dissipation plate
CN105674147A (en) * 2016-01-14 2016-06-15 京东方科技集团股份有限公司 Backlight module and display device
CN105759498B (en) * 2016-03-01 2020-03-31 京东方科技集团股份有限公司 Display device
CN105759498A (en) * 2016-03-01 2016-07-13 京东方科技集团股份有限公司 Display device
CN106847080A (en) * 2017-01-17 2017-06-13 维沃移动通信有限公司 A kind of display screen module and mobile terminal
CN106847080B (en) * 2017-01-17 2019-09-27 维沃移动通信有限公司 A display module and mobile terminal
WO2018166035A1 (en) * 2017-03-17 2018-09-20 武汉华星光电技术有限公司 Backlight module and liquid display device
CN106878510A (en) * 2017-04-11 2017-06-20 北京京东方茶谷电子有限公司 A kind of back light source structure, display panel and device
CN106878510B (en) * 2017-04-11 2019-07-30 北京京东方茶谷电子有限公司 A backlight structure, display panel and device
WO2019000711A1 (en) * 2017-06-28 2019-01-03 武汉华星光电技术有限公司 Backlight module and liquid crystal display device
CN108986681B (en) * 2018-07-27 2021-01-08 维沃移动通信有限公司 Backlight display screen and mobile terminal
CN108986681A (en) * 2018-07-27 2018-12-11 维沃移动通信有限公司 A kind of backlit display screen and mobile terminal
CN109618542A (en) * 2019-01-13 2019-04-12 进佳科技(国际)有限公司 Mobile Terminal with Heat Concentration and Conduction Function
CN110312393A (en) * 2019-06-27 2019-10-08 Oppo广东移动通信有限公司 Electronic equipment and soft light assembly thereof
CN110312394A (en) * 2019-06-27 2019-10-08 Oppo广东移动通信有限公司 A casing, a casing assembly, an electronic device, and a method for controlling the lighting of the casing
CN110312394B (en) * 2019-06-27 2021-03-19 Oppo广东移动通信有限公司 Shell, shell assembly, electronic equipment and shell light-emitting control method
CN110398861A (en) * 2019-09-03 2019-11-01 东莞市利锦电子有限公司 A plastic iron with reflector function
CN113050315A (en) * 2019-12-26 2021-06-29 乐金显示有限公司 Display device
US12089381B2 (en) 2019-12-26 2024-09-10 Lg Display Co., Ltd. Display device
CN113050315B (en) * 2019-12-26 2025-01-10 乐金显示有限公司 Display device
CN112180632A (en) * 2020-10-22 2021-01-05 武汉华星光电技术有限公司 Chip heat radiation structure and liquid crystal display device
CN112180632B (en) * 2020-10-22 2021-10-08 武汉华星光电技术有限公司 Chip heat radiation structure and liquid crystal display device
US11789199B2 (en) 2020-10-22 2023-10-17 Wuhan China Star Optoelectronics Technology Co., Ltd. Chip heat dissipation structure and liquid crystal display device

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Owner name: SHANGHAI DINGWEI ELECTRONICS TECHNOLOGY (GROUP) CO

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Address after: 200121, room 2, building 4091, 116 South Road, Shanghai, Pudong New Area

Patentee after: Shanghai Ding Electronic Technology (Group) Co., Ltd.

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Granted publication date: 20131002

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CF01 Termination of patent right due to non-payment of annual fee