CN203180824U - Package of instant clock module - Google Patents
Package of instant clock module Download PDFInfo
- Publication number
- CN203180824U CN203180824U CN 201320092469 CN201320092469U CN203180824U CN 203180824 U CN203180824 U CN 203180824U CN 201320092469 CN201320092469 CN 201320092469 CN 201320092469 U CN201320092469 U CN 201320092469U CN 203180824 U CN203180824 U CN 203180824U
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- Prior art keywords
- circuit
- real
- clock module
- time clock
- packaging body
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- 239000013078 crystal Substances 0.000 claims abstract description 60
- 238000004806 packaging method and process Methods 0.000 claims abstract description 40
- 239000000919 ceramic Substances 0.000 claims abstract description 12
- 230000010355 oscillation Effects 0.000 claims description 18
- 239000010453 quartz Substances 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 238000012356 Product development Methods 0.000 description 5
- 239000000084 colloidal system Substances 0.000 description 5
- 238000013461 design Methods 0.000 description 5
- 238000012536 packaging technology Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
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- 238000012856 packing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Abstract
The utility model discloses an instant clock module's packaging body. The package of the real-time clock module comprises a control circuit die and a temperature compensated oscillator. The temperature compensation oscillator packaged by ceramic and the control circuit crystal grain are packaged together to form a packaging body of the real-time clock module.
Description
Technical field
The utility model is relevant with real-time clock module (RTC module), particularly about a kind of packaging body of real-time clock module.
Background technology
Industrial common crystal oscillator element (Crystal Oscillators) belongs to passive device, and it is to utilize the piezoelectric effect of quartz crystal to produce high-precision frequency of oscillation, and utilizes circuit design to improve quartz crystal frequency of oscillation (being the function of frequency multiplication).When the quartz crystal that is appropriately cut and arranges of electrode pair on using quartz crystal imposed electric field, quartz crystal will produce distortion.When extra electric field removed, quartz crystal namely can restore to the original state and send electric field, thereby produced voltage at electrode.What above-mentioned phenomenon namely claimed is " piezoelectric effect ".Such characteristic causes the behavior of quartz crystal in circuit, is similar to the rlc circuit that certain inductor, capacitor and resistor are formed, and the inductance capacitance resonance frequency in the rlc circuit has namely reflected the entity resonance frequency of quartz crystal.
The crystal oscillator element is if mainly can be divided into SPXO (Simple Packaged Crystal Oscillators according to functional characteristic, it is general crystal oscillator element, rely on the stability of crystal oscillator element own to produce clock pulse), TCXO (Temperature Compensated Crystal Oscillators, it is temperature-compensating crystal oscillator element, temperature-compensated loop IC, reducing its frequency changes because of temperature change), VCXO (Voltage Controlled Crystal Oscillators, it is voltage control crystal oscillator element, additional control voltage IC is with stabilized frequency) etc.
Please refer to Fig. 1, Fig. 1 illustrates the packaging body schematic diagram of real-time clock (Real-time clock) module that tradition has temperature compensation function.As shown in Figure 1, have in the packaging body 1 of real-time clock (Real-time clock) module of temperature compensation function in tradition, integrated circuit 10 comprises starting of oscillation circuit, temperature-compensation circuit and digital circuit.Please in the lump with reference to Fig. 1 and Fig. 2, after integrated circuit 10 is arranged on the support plate 14 jointly with crystal oscillator element 12 and is packaged in the colloid 18, just packaged real-time clock module 1 is sent in the thermostat CT of constant temperature tester table and carried out test program.
Yet, because the volume of crystal oscillator element 12 is quite big, make that the volume of packaging body 1 of real-time clock module is also very big, and the space of thermostat CT is limited, cause in each test program the product of the finishing quantity that can test simultaneously quite limited, seriously have influence on whole tested productivity, and then cause the rising of testing cost.
In addition, analog circuit and digital circuit have been integrated simultaneously in the integrated circuit 10.Because the noise jamming from digital circuit needs special the processing, in order to avoid influence the performance of analog circuit, adding digital circuit often needs to change according to different application, but analog circuit then needn't, so integrated circuit 10 adopts the mode of integrating analog circuits and digital circuit to cause inconvenience and waste in the product development design on the contrary.
Therefore, the utility model proposes a kind of packaging body of real-time clock module, to solve the above-mentioned variety of problems that prior art was suffered from.
The utility model content
A category of the present utility model is to propose a kind of packaging body of real-time clock module.In a specific embodiment, the packaging body of real-time clock module comprises control circuit crystal grain and temperature compensated oscillator.Temperature compensated oscillator couples control circuit crystal grain.Temperature compensated oscillator comprises crystal oscillator element, starting of oscillation circuit and temperature-compensation circuit.Crystal oscillator element, starting of oscillation circuit and temperature-compensation circuit are to be incorporated into together earlier, and through after the temperature-compensating program, again with the control circuit die package together.
In an embodiment, crystal oscillator element, starting of oscillation circuit and temperature-compensation circuit are to utilize ceramic packaging to be integrated into one.
In an embodiment, temperature compensated oscillator is a digital temperature compensated oscillator.
In an embodiment, control circuit crystal grain and temperature compensated oscillator are adjacent to be arranged on the support plate.
In an embodiment, control circuit crystal grain comprises a time counting circuit and a control logic circuit.
Compared to prior art, disclosed in the utility model is after elder generation adopts the ceramic packaging technology that temperature compensated temperature compensated oscillator is encapsulated in order to the packaging body that encapsulates the real-time clock module, again with the packaging body of the common encapsulation of control circuit crystal grain with formation real-time clock module.Owing to adopt the temperature compensated oscillator volume of ceramic packaging quite little, cause the volume of the packaging body of whole real-time clock module to be dwindled, so can test more real-time clock module simultaneously in the confined space of thermostat, promote tested productivity thus and reduce testing cost.Moreover temperature compensated oscillator only need adopt existing ceramic packaging technology and production equipment to encapsulate, and needn't additionally increase the cost of the equipment of buying more.
In addition, because the control circuit crystal grain in the packaging body of real-time clock module disclosed in the utility model only comprises digital circuit, do not combine with analog circuit, make the noise jamming of digital circuit be difficult for influencing the performance of analog circuit, and when digital circuit is desired to change according to different application, also needn't have influence on analog circuit, so can avoid inconvenience and waste in the product development design, promote product development efficiency effectively and shorten the exploitation time-histories.
Can describe in detail and appended graphic being further understood by following utility model about advantage of the present utility model and spirit.
Description of drawings
Fig. 1 illustrates the top view of the packaging body of known real-time clock module.
The packaging body volume that Fig. 2 illustrates known real-time clock module is bigger, causes thermostat only can hold the schematic diagram that less real-time clock module is tested simultaneously.
Fig. 3 illustrates the schematic diagram according to the packaging body of the real-time clock module of a specific embodiment of the present utility model.
Fig. 4 illustrates control circuit crystal grain in the real-time clock module and the functional block diagram of temperature compensated temperature compensated oscillator.
It is less that Fig. 5 illustrates the packaging body volume of real-time clock module of the present utility model, makes thermostat can hold the schematic diagram that more real-time clock module is tested simultaneously.
The main element symbol description:
1,3: the packaging body 10 of real-time clock module: integrated circuit
12,301: crystal oscillator element 14,34: support plate
16: pin 18,38: colloid
CT: thermostat 30: temperature compensated oscillator
32: control circuit crystal grain 35 ~ 37: lead
302: starting of oscillation circuit 303: temperature-compensation circuit
Ts: timing clock pulse cs: start the control clock pulse
320: time counting circuit 322: logic control circuit
Embodiment
According to a preferred embodiment of the present utility model packaging body that is a kind of real-time clock module.
Please refer to Fig. 3, Fig. 3 illustrates the schematic diagram of packaging body of the real-time clock module of this embodiment.As shown in Figure 3, the packaging body 3 of real-time clock module comprise temperature compensated oscillator (Temperature Compensated Crystal Oscillator, TCXO) 30, control circuit crystal grain (Control Circuit Die) 32, support plate 34, lead 35 ~ 37 and colloid 38.Temperature compensated oscillator 30 and control circuit crystal grain 32 are arranged on the support plate 34, and temperature compensated oscillator 30 couples by lead 37 and control circuit crystal grain 32; Temperature compensated oscillator 30 couples support plate 34 by lead 36; Control circuit crystal grain 32 couples support plate 34 by lead 35.
In the present embodiment, temperature compensated oscillator 30 can be digital temperature compensated oscillator (DTCXO), and its frequency of oscillation that provides is 32.768KHz, but not as limit.Control circuit crystal grain 32 comprises digital circuits such as time counting circuit 320 and logic control circuit 322, but also not as limit.Temperature compensated oscillator 30 and control circuit crystal grain 32 can be adjacent or stack and be arranged on the support plate 34, there is no specific restriction.
Support plate 34 can be common circuit board or substrate, for example printed circuit board (PCB) etc.It can be gold thread, copper cash, aluminum steel or other conductivity good alloy wire or metal wire that routing couples employed lead 35 ~ 37.Colloid 38 can be common packing colloid insulating material, and for example plastic material etc. as long as can envelope temperature compensated oscillator 30 and control circuit crystal grain 32, there is no specific restriction.
Also please refer to Fig. 4, Fig. 4 illustrates the functional block diagram of control circuit crystal grain 32 and temperature compensated oscillator 30 in the real-time clock module.As shown in Figure 4, temperature compensated oscillator 30 includes crystal oscillator element 301, starting of oscillation circuit 302 and temperature-compensation circuit 303, wherein crystal oscillator element 301 can be quartz crystal (Crystal), and crystal oscillator element 301 can form an oscillator (Oscillator) with starting of oscillation circuit 302.
In this embodiment, crystal oscillator element 301, starting of oscillation circuit 302 and temperature-compensation circuit 303 are to utilize ceramic packaging (Hermetic Package) together and formation temperature compensated oscillator 30.Generally speaking, ceramic packaging is mainly used in high-order market and sample markets in present semiconductor industry.High-order market refers to military discipline, space environment, particular surroundings (deep-sea or mineral products) or requires micro electronmechanical products such as air-tightness and Vacuum Package.Mainly be chip design company in order to obtain encapsulation back sample at short notice as for sample markets, in order to the product function checking and can share the shortcut that the dependence test environment is taked.
It should be noted that, can make its reduction in bulk to quite little because temperature compensated oscillator 30 adopts the ceramic packaging technology to encapsulate, so it is very many also can to make that the volume of packaging body 3 of whole real-time clock module dwindles than prior art, even can reach tens of times.Therefore, as shown in Figure 5, because the volume of the packaging body 3 of real-time clock module of the present utility model is less, makes thermostat CT can hold a fairly large number of real-time clock module simultaneously and test, so can promote tested productivity effectively and reduce testing cost.
Compared to prior art, the packaging body of real-time clock module disclosed in the utility model is after adopting the ceramic packaging technology that temperature compensated temperature compensated oscillator is encapsulated earlier, again with the packaging body of the common encapsulation of control circuit crystal grain with formation real-time clock module.Owing to adopt the temperature compensated oscillator volume of ceramic packaging quite little, cause the volume of the packaging body of whole real-time clock module to be dwindled, so can test more real-time clock module simultaneously in the confined space of thermostat, promote tested productivity thus and reduce testing cost.Moreover temperature compensated oscillator only need adopt existing ceramic packaging technology and production equipment to encapsulate, and needn't additionally increase the cost of the equipment of buying more.
In addition, because the control circuit crystal grain in the packaging body of real-time clock module disclosed in the utility model only comprises digital circuit, do not combine with analog circuit, make the noise jamming of digital circuit be difficult for influencing the performance of analog circuit, and when digital circuit is desired to change according to different application, also needn't have influence on analog circuit, so can avoid inconvenience and waste in the product development design, promote product development efficiency effectively and shorten the exploitation time-histories.
By the above detailed description of preferred embodiments, hope can be known description feature of the present utility model and spirit more, and is not to come category of the present utility model is limited with above-mentioned disclosed preferred embodiment.On the contrary, its objective is that hope can contain in the category of the claim that is arranged in the desire application of the utility model institute of various changes and tool equality.
Claims (5)
1. the packaging body of a real-time clock module is characterized in that, the packaging body of above-mentioned real-time clock module comprises:
One control circuit crystal grain; And
One temperature compensated oscillator couples above-mentioned control circuit crystal grain,
Wherein the said temperature compensated oscillator comprises a crystal oscillator element, a starting of oscillation circuit and a temperature-compensation circuit,
Wherein above-mentioned crystal oscillator element, above-mentioned starting of oscillation circuit and said temperature compensating circuit are to be incorporated into together earlier, and through after the temperature-compensating program, again with above-mentioned control circuit die package together.
2. the packaging body of real-time clock module as claimed in claim 1 is characterized in that, above-mentioned crystal oscillator element, above-mentioned starting of oscillation circuit and said temperature compensating circuit are to utilize ceramic packaging to be integrated into one.
3. the packaging body of real-time clock module as claimed in claim 1 is characterized in that, the said temperature compensated oscillator is a digital temperature compensated oscillator.
4. the packaging body of real-time clock module as claimed in claim 1 is characterized in that, above-mentioned control circuit crystal grain is adjacent with the said temperature compensated oscillator to be arranged on the support plate.
5. the packaging body of real-time clock module as claimed in claim 1 is characterized in that, above-mentioned control circuit crystal grain comprises a time counting circuit and a control logic circuit.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101210090U TWM443341U (en) | 2012-05-25 | 2012-05-25 | RTC module packaging object |
| TW101210090 | 2012-05-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203180824U true CN203180824U (en) | 2013-09-04 |
Family
ID=48089139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320092469 Expired - Fee Related CN203180824U (en) | 2012-05-25 | 2013-02-28 | Package of instant clock module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN203180824U (en) |
| TW (1) | TWM443341U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103427763A (en) * | 2012-05-25 | 2013-12-04 | 力祥半导体股份有限公司 | package of instant clock module and packaging method thereof |
-
2012
- 2012-05-25 TW TW101210090U patent/TWM443341U/en not_active IP Right Cessation
-
2013
- 2013-02-28 CN CN 201320092469 patent/CN203180824U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103427763A (en) * | 2012-05-25 | 2013-12-04 | 力祥半导体股份有限公司 | package of instant clock module and packaging method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM443341U (en) | 2012-12-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130904 Termination date: 20150228 |
|
| EXPY | Termination of patent right or utility model |