CN203178973U - Conductive wafer and touch screen - Google Patents
Conductive wafer and touch screen Download PDFInfo
- Publication number
- CN203178973U CN203178973U CN 201320156541 CN201320156541U CN203178973U CN 203178973 U CN203178973 U CN 203178973U CN 201320156541 CN201320156541 CN 201320156541 CN 201320156541 U CN201320156541 U CN 201320156541U CN 203178973 U CN203178973 U CN 203178973U
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- Prior art keywords
- conductive
- lead
- golden finger
- groove
- circuit board
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000000465 moulding Methods 0.000 claims description 37
- 239000000758 substrate Substances 0.000 claims description 29
- 239000004020 conductor Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 239000002041 carbon nanotube Substances 0.000 claims description 3
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 3
- 239000002322 conducting polymer Substances 0.000 claims description 3
- 229920001940 conductive polymer Polymers 0.000 claims description 3
- 229910021389 graphene Inorganic materials 0.000 claims description 3
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 claims description 3
- 230000001939 inductive effect Effects 0.000 abstract description 2
- 239000003292 glue Substances 0.000 abstract 7
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000004744 fabric Substances 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 235000015110 jellies Nutrition 0.000 description 3
- 239000008274 jelly Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000001467 acupuncture Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model relates to a conductive wafer which comprises a base plate and further comprises a molded glue layer and a plurality of leads electrically connected with a circuit board, wherein the molded glue layer is attached to one side of the base plate, and a latticed groove is arranged in one side, away from the base plate, of the molded glue layer. Each lead comprises a conductive lattice accommodated in the groove. The molded glue layer is attached to one side of the base plate, latticed groove is arranged in one side, away from the base plate, of the molded glue layer, and the conductive lattice is accommodated in the groove to form the leads, so that the conductive wafer is formed. The conductive wafer is arranged on an inductive element. The leads of the conductive wafer are electrically connected with the circuit board through an anisotropic conductive adhesive. Therefore, the contact area of the leads and the molded glue layer is increased by accommodating the conductive lattices of the leads in the groove and adopting the latticed structure, so that the leads and the molded glue layer are more closely combined, therefore, the leads are not likely to fall off or be scratched. The conductive performance of the conductive wafer is ensured and the using performance of the touch screen is improved. The utility model provides the touch screen with the conductive wafer.
Description
Technical field
The utility model relates to the touch screen technology field, particularly relates to a kind of golden finger and touch-screen.
Background technology
Touch-screen is a kind of inductive arrangement that receives input signals such as touch.Touch-screen has given information interaction brand-new looks, is a kind of brand-new information interaction equipment.The development of touch screen technology has caused the common concern of domestic and international information medium circle.Wherein, (FlexiblePrintedCircuitBoard FPCB) is electrically connected the conductive layer of touch-screen, is positioned at the lead-in wire electrode end, and the part that is used for being electrically connected with circuit board is called golden finger by go between electrode and printed circuit board (PCB).
At present, the golden finger position generally all is to go out the acupuncture needle lead by serigraphy, perhaps go out the acupuncture needle lead with laser again at whole printed silver slurry of join domain earlier, the golden finger that this dual mode obtains is because the silver slurry is attached to conductive layer surface, the phenomenon that scratches or come off appears easily, thereby make the golden finger poor electric conductivity, influence the usability of touch-screen.
The utility model content
Based on this, be necessary to scratch easily or come off at golden finger, influence the problem of usability, a kind of golden finger and touch-screen are provided.
A kind of golden finger, comprise substrate, also comprise moulding glue-line and a plurality of lead that can be electrically connected with circuit board, described moulding glue-line is attached to described substrate one side, described moulding glue-line is provided with latticed groove away from a side of described substrate, and described lead comprises the conductive grid that is contained in the described groove.
Among embodiment, the thickness of described lead is not more than the degree of depth of described groove therein.
Among embodiment, the conductive grid of described lead is solidify to form by the conductive material that is filled in the described groove therein, and described conductive material is metal, Graphene, conducting polymer, carbon nano-tube or tin indium oxide.
Among embodiment, described lead can be electrically connected with circuit board by the anisotropic conductive that comprises a plurality of conducting spheres therein, and maximum diameter of a circle is less than the mean value of distance between described all adjacent conductive ball in the described grid cell institute region.
Among embodiment, the maximum diameter of a circle of described grid cell is not more than 50 μ m, and is not less than 5 μ m therein.
Among embodiment, described moulding glue-line is attached to described substrate through the surface of plasma pretreatment therein.
A kind of touch-screen, comprise sensing element, circuit board and the anisotropic conductive that is provided with a plurality of conducting spheres also comprise described golden finger, described golden finger is arranged on the described sensing element, and the lead of described golden finger is electrically connected with described circuit board by the conducting sphere of described anisotropic conductive.
Therein among embodiment, the grid cell that the diameter of described conducting sphere is not less than described lead surrounds the maximum diameter of a circle in the zone, and the grid cell that is not more than described lead surrounds 1.2 times of the interior greatest circle diameter in zone
Above-mentioned golden finger and touch-screen, adhere to the moulding glue-line in substrate one side, offer latticed groove at the moulding glue-line away from a side of substrate, conductive grid is contained in this groove and forms lead, constitute golden finger, golden finger is arranged at sensing element, and the lead of golden finger is electrically connected with circuit board by anisotropic conductive.So, be contained in groove by the conductive grid with lead, adopt fenestral fabric, increase the contact area of lead and moulding glue-line, it is tightr that lead is combined with the moulding glue-line, thereby make lead be not easy to come off or scratch, the electric conductivity of guaranty money's finger, the usability of raising touch-screen.
Description of drawings
Fig. 1 is the structural representation of the touch-screen that contains this golden finger among one of them embodiment of the utility model;
Fig. 2 is the structure for amplifying synoptic diagram at A place among Fig. 1;
Fig. 3 is another visual angle structural representation at B place among Fig. 2;
Fig. 4 is the conductor structure synoptic diagram of golden finger shown in Figure 1;
Fig. 5 is the structure for amplifying synoptic diagram at C place among Fig. 4;
Fig. 6 is another embodiment structure for amplifying synoptic diagram at C place among Fig. 4;
Fig. 7 is the another embodiment structure for amplifying synoptic diagram at C place among Fig. 4.
Embodiment
For the ease of understanding the utility model, with reference to relevant drawings the utility model is described more fully below.Provided first-selected embodiment of the present utility model in the accompanying drawing.But the utility model can be realized with many different forms, be not limited to embodiment described herein.On the contrary, providing the purpose of these embodiment is to make to disclosure of the present utility model more thoroughly comprehensively.
In Fig. 1, Fig. 2 and embodiment shown in Figure 3, a kind of golden finger 100, comprise substrate 110, moulding glue-line 120 and a plurality of lead 130 that can be electrically connected with circuit board, moulding glue-line 120 is attached to substrate 110 1 sides, moulding glue-line 120 is provided with latticed groove 122 away from a side of substrate 110, and lead 130 comprises the conductive grid 132 that is contained in groove 122.
Above-mentioned golden finger 100, at substrate 110 1 sides coating jelly, form moulding glue-line 120, offer latticed groove 122 at moulding glue-line 120 away from a side of substrate 110, the conductive grid 132 of lead 130 is contained in this groove 122 formation leads 130, constitute golden finger 100, golden finger 100 is arranged at sensing element, and golden finger 100 is electrically connected with circuit board by anisotropic conductive.The conductive grid 132 of lead 130 is contained in groove 122 formation leads 130, adopt fenestral fabric, increase the contact area of lead 130 and moulding glue-line 120, make lead 130 tightr with 120 combinations of moulding glue-line, thereby make lead 130 be not easy to come off or scratch, the guaranty money points 100 electric conductivity, improves the usability of touch-screen.
Wherein, the material of substrate 110 can be good with transparent insulation material for glass, acrylic resin, polyethylene terephthalate, polycarbonate plastic etc.The thickness of substrate 110 can be 25 μ m～1mm, and for the integral light-transmitting effect of the product that guarantees to be provided with this substrate 110, the thickness of substrate 110 can further be set to 50 μ m～0.7mm.
Wherein, the material of moulding glue-line 120 can be thermoplastic polymer, thermosetting polymer, UV cure polymer etc.The thickness of moulding glue-line 120 can be 1 μ m～10 μ m, and for the integral light-transmitting effect of the product that guarantees to be provided with this moulding glue-line 120, the thickness of moulding glue-line 120 can further be set to 2 μ m～5 μ m.
See also Fig. 3; therein among embodiment; the thickness of lead 130 is not more than the degree of depth of groove 122; thereby the conductive material of lead 130 can not surpass the surface level of groove 122 openings; can further strengthen the protection to lead 130; make lead 130 be not easy more to come off or scratch, the guaranty money points 100 electric conductivity, improves the usability of touch-screen.
See also Fig. 3, among embodiment, the conductive grid 132 of lead 130 is solidify to form by the conductive material that is filled in the groove 122 therein.Particularly, impress out latticed groove 122 away from a side of substrate 110 by impressing mould at moulding glue-line 120, by blade coating technology conductive material is filled in groove 122 again, and carry out sintering process and form conductive grid 132, constitute lead 130.Conductive material is filled in groove 122 forms many metal line 1324, according to these metal wires 1324 intersection formation conductive grids 132 of shape of groove 122.Adopt fenestral fabric, make lead 130 tight with 120 combinations of moulding glue-line, thereby lead 130 is not easy to come off or scratch, the guaranty money points 100 electric conductivity, improves the usability of touch-screen.
Wherein, conductive material is filled in the groove 122 can form many metal line 1324, and these metal wires 1324 can intersection constitute conductive grid 132, and power grid 132 comprises a plurality of grid cells 1320.
Wherein, in order to guarantee the electric conductivity of lead 130, the thickness that conductive material is filled in latticed groove 122 formed metal wires 1324 can rationally be set to 1 μ m～10 μ m, and the width of metal wire 1324 can rationally be set to 0.5 μ m～5 μ m.In the electric conductivity that guarantees lead 130, golden finger 100 comprises many leads 130, for the ease of structural design and the winding displacement of lead 130, the thickness of this metal wire 1324 also can further rationally be set to 2 μ m～5 μ m, and the reasonable wide of metal wire 1324 is set to 2 μ m～5 μ m.
Wherein, the conductive material of this lead 130 can be metal, Graphene, conducting polymer, carbon nano-tube or tin indium oxide.Specifically can adopt gold, silver, copper, aluminium, nickel, zinc or a kind of in the alloy of the two at least wherein, because of these metal material prices relatively cheap, so can reduce cost.In the present embodiment, the conductive material that adopts is silver.
Wherein, conductive grid 132 comprises a plurality of grid cells 1320.According to the difference to the lattice demand, can make the grid cell 1320 of all conductive grids 132 all identical, namely conductive grid 132 is the conductive grid 132 of rule.Particularly, grid cell 1320 is regular polygon, as square, rhombus, regular hexagon etc.Among the embodiment as shown in Figure 5, grid cell 1320 is square.Among another embodiment as shown in Figure 6, grid cell 1320 is rhombus.
Among the another embodiment as shown in Figure 7, can also make the grid cell 1320 of at least two conductive grids 132 inequality, namely conductive grid 132 is irregular conductive grid 132.
See also Fig. 2, among embodiment, moulding glue-line 120 is attached to described substrate 110 through the surface of plasma pretreatment therein.Particularly, carry out plasma pretreatment on substrate 110 1 surfaces, again at this surface coating jelly, solidify to form moulding glue-line 120, the greasy dirt that so can remove substrate 110 surfaces etc. is dirty, make substrate 110 surface ionizations simultaneously, thereby strengthen the bond strength on moulding glue-line 120 and substrate 110 surfaces.Even it is pointed out that and do not carry out plasma pretreatment, can realize that also moulding glue-line 120 is attached to the purpose of substrate 110 1 sides.
See also Fig. 6, therein among embodiment, lead 130 is electrically connected with circuit board by anisotropic conductive, and anisotropic conductive comprises a plurality of conducting spheres, and the diameter of the greatest circle 1322 of grid cell 1320 is less than the mean value of distance between all adjacent conductive balls.Wherein, anisotropic conductive comprises a plurality of conducting spheres, and anisotropic conductive mainly is by these conducting spheres circuit board to be communicated with the lead 130 of golden finger 100.In order to guarantee that conducting sphere can be fully and circuit board, and the lead 130 of golden finger 100 connects, avoid conducting sphere to fall into fully in the zone that grid cell 1320 surrounds and do not contact with circuit board, so the diameter of greatest circle 1322 that grid cell 1320 rationally is set is less than the mean value of distance between all adjacent conductive balls.
Wherein, anisotropic conductive is to utilize conducting particles to connect the IC chip to make it to become conducting with substrate 110 electrode between the two, and the while can be avoided conducting short circuit between adjacent two electrodes again, and only reaches the purpose in a certain direction conducting.In the present embodiment, adopt anisotropic conductive that lead 130 is electrically connected with circuit board, but the guaranty money point 100 a specific direction conduction, avoids short circuit occurring in the process that is electrically connected.
Particularly, the conducting sphere of anisotropic conductive has usually through the heating pressurized treatments and by pressure break, conducting sphere is randomly distributed in the anisotropic conductive, through spacing distribution Histogram statistics, the mean value of distance is about 50 μ m between all adjacent conductive balls, so in order to guarantee that conducting sphere can be fully and circuit board, and the lead 130 of golden finger 100 connects, the diameter of the greatest circle 1322 of grid cell 1320 can rationally be set to be not more than 50 μ m.This grid cell 1320 is by imprinting moulding again, and in order to guarantee imprinting moulding effect and production process requirement, the diameter of the greatest circle 1322 of grid cell 1320 can rationally be set to as many as 5 μ m.
In Fig. 1, Fig. 2 and embodiment shown in Figure 3, a kind of touch-screen, comprise sensing element, circuit board, be provided with anisotropic conductive and the golden finger 100 of a plurality of conducting spheres, golden finger 100 is arranged on the sensing element, and the lead 130 of golden finger 100 is electrically connected with described circuit board by the conducting sphere of anisotropic conductive.
Above-mentioned touch-screen, at substrate 110 1 sides coating jelly, form moulding glue-line 120, offer latticed groove 122 at moulding glue-line 120 away from a side of substrate 110, the conductive grid 132 of lead 130 is contained in this groove 122 formation leads 130, constitutes golden finger 100, golden finger 100 is arranged at sensing element, golden finger 100 is electrically connected with circuit board by the conducting sphere of anisotropic conductive, thereby sensing element is electrically connected with circuit board.The conductive grid 132 of lead 130 is contained in groove 122 formation leads 130, adopt fenestral fabric, increase the contact area of lead 130 and moulding glue-line 120, make lead 130 tightr with 120 combinations of moulding glue-line, thereby make lead 130 be not easy to come off or scratch, the guaranty money points 100 electric conductivity, improves the usability of touch-screen.
Wherein, anisotropic conductive is to adhere to adhesive tape by a plurality of conducting spheres to form.Adopt anisotropic conductive that lead 130 is electrically connected with circuit board, but the guaranty money point 100 a specific direction conduction, avoids short circuit occurring in the process that is electrically connected.
See also Fig. 6, therein among embodiment, the diameter of described conducting sphere is not less than the diameter of the greatest circle 1322 in 1320 regions of grid cell of described lead 130, and is not more than 1.2 times of greatest circle 1322 diameters in 1320 regions of grid cell of described lead 130.Golden finger 100 is electrically connected with circuit board by the conducting sphere of anisotropic conductive, particularly, anisotropic conductive is pressed on golden finger 100, lead 130 employing fenestral fabrics because of golden finger 100, if grid cell 1320 is too little, can cause unavoidably when pressing, constitute the metal wire 1324 disconnected knots of grid, influence the electric conductivity of golden finger 100.If grid cell 1320 is too big, can cause conducting sphere just to fall in the zone that grid cell 1320 surrounds unavoidably, thereby cause conducting sphere to overlap with metallicity 1324, causing can't conducting, surround the diameter of the greatest circle 1322 in the zone so the grid cell 1320 that the diameter of described conducting sphere is not less than described lead 130 rationally is set, and the grid cell 1320 that is not more than described lead 130 surrounds 1.2 times of greatest circle 1322 diameters in the zone.
Particularly, the conducting sphere of anisotropic conductive has usually through the heating pressurized treatments and by pressure break, conducting sphere is randomly distributed in the anisotropic conductive, through spacing distribution Histogram statistics, the mean value of distance is about 50 μ m between all adjacent conductive balls, so in order to guarantee that conducting sphere can be fully and circuit board, and the lead 130 of golden finger 100 connects, the diameter of the greatest circle 1322 of grid cell 1320 can rationally be set to be not more than 50 μ m.This grid cell 1320 is by imprinting moulding again, and in order to guarantee imprinting moulding effect and production process requirement, the diameter of the greatest circle 1322 of grid cell 1320 can rationally be set to as many as 5 μ m.
The above embodiment has only expressed several embodiment of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model claim.Should be pointed out that for the person of ordinary skill of the art under the prerequisite that does not break away from the utility model design, can also make some distortion and improvement, these all belong to protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be as the criterion with claims.
Claims (8)
1. golden finger, comprise substrate, it is characterized in that, also comprise moulding glue-line and a plurality of lead that can be electrically connected with circuit board, described moulding glue-line is attached to described substrate one side, described moulding glue-line is provided with latticed groove away from a side of described substrate, and described lead comprises the conductive grid that is contained in the described groove.
2. golden finger according to claim 1 is characterized in that, the thickness of described lead is not more than the degree of depth of described groove.
3. golden finger according to claim 1 is characterized in that, the conductive grid of described lead is solidify to form by the conductive material that is filled in the described groove, and described conductive material is metal, Graphene, conducting polymer, carbon nano-tube or tin indium oxide.
4. golden finger according to claim 3, it is characterized in that, described lead can be electrically connected with circuit board by the anisotropic conductive that comprises a plurality of conducting spheres, and maximum diameter of a circle is less than the mean value of distance between described all adjacent conductive ball in the described grid cell institute region.
5. golden finger according to claim 4 is characterized in that, the maximum diameter of a circle of described grid cell is not more than 50 μ m, and is not less than 5 μ m.
6. according to any described golden finger of claim 1 to 5, it is characterized in that described moulding glue-line is attached to described substrate through the surface of plasma pretreatment.
7. touch-screen, comprise sensing element, circuit board and the anisotropic conductive that is provided with a plurality of conducting spheres, it is characterized in that, also comprise as any described golden finger of claim 1 to 6, described golden finger is arranged on the described sensing element, and the lead of described golden finger is electrically connected with described circuit board by the conducting sphere of described anisotropic conductive.
8. touch-screen according to claim 7, it is characterized in that, the grid cell that the diameter of described conducting sphere is not less than described lead surrounds the maximum diameter of a circle in the zone, and the grid cell that is not more than described lead surrounds 1.2 times of the interior greatest circle diameter in zone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320156541 CN203178973U (en) | 2013-03-30 | 2013-03-30 | Conductive wafer and touch screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320156541 CN203178973U (en) | 2013-03-30 | 2013-03-30 | Conductive wafer and touch screen |
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| Publication Number | Publication Date |
|---|---|
| CN203178973U true CN203178973U (en) | 2013-09-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320156541 Expired - Fee Related CN203178973U (en) | 2013-03-30 | 2013-03-30 | Conductive wafer and touch screen |
Country Status (1)
| Country | Link |
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| CN (1) | CN203178973U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103412663A (en) * | 2013-03-30 | 2013-11-27 | 深圳欧菲光科技股份有限公司 | Golden finger and touch screen |
| US9179547B2 (en) | 2013-03-30 | 2015-11-03 | Shenzhen O-Film Tech Co., Ltd. | Gold finger and touch screen |
| CN106527795A (en) * | 2016-10-24 | 2017-03-22 | 京东方科技集团股份有限公司 | Metal contact structure of binding region of touch screen, preparation method and display apparatus |
| CN106662954A (en) * | 2015-07-31 | 2017-05-10 | 株式会社藤仓 | Wiring body assembly, structure with conductor layer, and touch sensor |
-
2013
- 2013-03-30 CN CN 201320156541 patent/CN203178973U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103412663A (en) * | 2013-03-30 | 2013-11-27 | 深圳欧菲光科技股份有限公司 | Golden finger and touch screen |
| CN103412663B (en) * | 2013-03-30 | 2014-10-29 | 深圳欧菲光科技股份有限公司 | Golden finger and touch screen |
| US9179547B2 (en) | 2013-03-30 | 2015-11-03 | Shenzhen O-Film Tech Co., Ltd. | Gold finger and touch screen |
| CN106662954A (en) * | 2015-07-31 | 2017-05-10 | 株式会社藤仓 | Wiring body assembly, structure with conductor layer, and touch sensor |
| CN106527795A (en) * | 2016-10-24 | 2017-03-22 | 京东方科技集团股份有限公司 | Metal contact structure of binding region of touch screen, preparation method and display apparatus |
| CN106527795B (en) * | 2016-10-24 | 2019-06-21 | 京东方科技集团股份有限公司 | Metal contact structure, preparation method and display device of touch screen binding area |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130904 Termination date: 20190330 |
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| CF01 | Termination of patent right due to non-payment of annual fee |