CN203167508U - Electronic device with rotatable circuit board - Google Patents
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- CN203167508U CN203167508U CN 201320130015 CN201320130015U CN203167508U CN 203167508 U CN203167508 U CN 203167508U CN 201320130015 CN201320130015 CN 201320130015 CN 201320130015 U CN201320130015 U CN 201320130015U CN 203167508 U CN203167508 U CN 203167508U
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Abstract
Description
技术领域technical field
本实用新型涉及一种电子装置,特别涉及一种应用可旋转电路板执行散热功能的电子装置。The utility model relates to an electronic device, in particular to an electronic device using a rotatable circuit board to perform a heat dissipation function.
背景技术Background technique
电子装置内部因组件作动会产生热量,因此一般会对应发热组件(例如中央处理单元、图形处理单元等)设置散热模块,来提供电子装置内部的散热效果。现有的电子装置的散热方式大多以风扇或热管等配合散热鳍片的设置,与空气或热传导介质进行热交换。The internal components of the electronic device will generate heat due to the action. Therefore, a heat dissipation module is generally installed corresponding to the heat-generating components (such as a central processing unit, a graphics processing unit, etc.) to provide heat dissipation inside the electronic device. Existing heat dissipation methods of electronic devices mostly use fans or heat pipes in conjunction with the arrangement of heat dissipation fins to exchange heat with air or heat transfer media.
随着整体系统与内部处理芯片的效能增进,使得其散热需求也随着增加,往往需要设置较大型的风扇、较大面积的散热鳍片或对应的热管回路配置等,以便提供装置更佳的散热效率。然而,前述散热组件的设置相对地需要预留更多的内部空间,对于内部空间有限的电子装置而言,如何能妥善安排其内部空间的组件,对设计制造者而言是一大考验。倘若这些散热组件的配置必须增加电子装置的厚度,又与现行电子装置的轻薄化趋势背道而驰,如此一来对制造者同样会造成困扰。As the performance of the overall system and internal processing chips increases, the heat dissipation requirements also increase. It is often necessary to install larger fans, larger heat dissipation fins, or corresponding heat pipe circuit configurations, etc., in order to provide better performance for the device. cooling efficiency. However, the disposition of the above-mentioned heat dissipation components relatively needs to reserve more internal space. For electronic devices with limited internal space, how to properly arrange the components in the internal space is a big test for designers and manufacturers. If the configuration of these heat dissipation components must increase the thickness of the electronic device, and runs counter to the current trend of thinning and thinning the electronic device, it will also cause troubles to the manufacturer.
因此,如何能针对现有设计进一步改良,以设计出能符合轻薄化设计又能确保装置的散热效率的电子装置,实为一值得研究的课题。Therefore, how to further improve the existing design to design an electronic device that can meet the light and thin design and ensure the heat dissipation efficiency of the device is really a topic worthy of research.
实用新型内容Utility model content
有鉴于此,本实用新型的主要目的是提供一种应用可旋转电路板执行散热功能的电子装置,以解决现有技术存在的电子装置因内部设置大体积散热器而占用过多空间且无法达到轻薄化设计的技术问题。In view of this, the main purpose of this utility model is to provide an electronic device using a rotatable circuit board to perform heat dissipation function, so as to solve the problem that the electronic device in the prior art takes up too much space due to the large-volume radiator installed inside and cannot achieve Technical issues of thin and light design.
为达到上述的目的,本实用新型的具有可旋转电路板的电子装置,包括装置本体、旋转模块及主电路板。装置本体包括电源供应模块。旋转模块设置于装置本体内。主电路板结合于旋转模块,使得主电路板可通过旋转模块相对装置本体旋转,主电路板包括至少一发热组件及至少一鳍片结构,各鳍片结构对应各发热组件而设置。当电源供应模块供电至旋转模块时,旋转模块会驱动主电路板相对于装置本体执行一旋转操作,来通过处于旋转操作中的至少一鳍片结构进行散热。To achieve the above purpose, the electronic device with a rotatable circuit board of the present invention includes a device body, a rotating module and a main circuit board. The device body includes a power supply module. The rotating module is arranged in the device body. The main circuit board is combined with the rotating module so that the main circuit board can rotate relative to the device body through the rotating module. The main circuit board includes at least one heating element and at least one fin structure, and each fin structure is arranged corresponding to each heating element. When the power supply module supplies power to the rotation module, the rotation module will drive the main circuit board to perform a rotation operation relative to the device body to dissipate heat through at least one fin structure in rotation operation.
在本实用新型的一实施例中,该电源供应模块通过该旋转模块供电至该主电路板。In an embodiment of the present invention, the power supply module supplies power to the main circuit board through the rotating module.
在本实用新型的一实施例中,该旋转模块包括电性接触部,且该主电路板还包括电连接件,于该旋转操作中该电连接件保持与该电性接触部的电性连接,以使该电源供应模块能通过该旋转模块供电至该主电路板。In one embodiment of the present invention, the rotating module includes an electrical contact portion, and the main circuit board further includes an electrical connector, and the electrical connector maintains electrical connection with the electrical contact portion during the rotating operation , so that the power supply module can supply power to the main circuit board through the rotating module.
在本实用新型的一实施例中,该旋转模块包括第一感应组件,且该主电路板还包括第二感应组件,于该旋转操作中通过该第一感应组件与该第二感应组件间的电磁感应,以使该电源供应模块能通过该旋转模块供电至该主电路板。In an embodiment of the present invention, the rotation module includes a first sensing component, and the main circuit board further includes a second sensing component, and the rotation between the first sensing component and the second sensing component Electromagnetic induction enables the power supply module to supply power to the main circuit board through the rotating module.
在本实用新型的一实施例中,该装置本体还包括控制模块,且该主电路板包括无线传输模块,该装置本体与该主电路板之间通过该控制模块与该无线传输模块进行无线信号传输。In an embodiment of the present invention, the device body further includes a control module, and the main circuit board includes a wireless transmission module, and the device body and the main circuit board carry out wireless signals through the control module and the wireless transmission module. transmission.
在本实用新型的一实施例中,该装置本体还包括多个接口设备,各该接口设备通过该控制模块与该主电路板进行信号传输。In an embodiment of the present invention, the device body further includes a plurality of interface devices, and each interface device performs signal transmission with the main circuit board through the control module.
在本实用新型的一实施例中,该多个接口设备包括输入输出端口模块、储存模块及网络通信模块。In an embodiment of the present invention, the plurality of interface devices include an input and output port module, a storage module and a network communication module.
在本实用新型的一实施例中,该装置本体包括多个散热孔,该多个散热孔设置在该装置本体的周边。In an embodiment of the present invention, the device body includes a plurality of heat dissipation holes, and the plurality of heat dissipation holes are arranged around the periphery of the device body.
在本实用新型的一实施例中,该鳍片结构设置在该主电路板靠近外侧边缘的部位。In an embodiment of the present invention, the fin structure is disposed near the outer edge of the main circuit board.
通过本实用新型的设计,电子装置可通过主电路板自身的旋转与装置本体内部的空气进行热对流,以产生高效率的热交换效果,而无需额外设置风扇等散热组件,有效减少内部空间的使用;并且此设计可令装置整体的温度平均分布,不易产生局部区域温度过高的状态。Through the design of the utility model, the electronic device can conduct heat convection with the air inside the device body through the rotation of the main circuit board itself, so as to produce a high-efficiency heat exchange effect, without additional heat dissipation components such as fans, effectively reducing the internal space. use; and this design can make the overall temperature distribution of the device even, and it is not easy to produce a state where the temperature in a local area is too high.
附图说明Description of drawings
图1是本实用新型的具有可旋转电路板的电子装置的结构爆炸图;Fig. 1 is the exploded view of the structure of the electronic device with rotatable circuit board of the present utility model;
图2是本实用新型的具有可旋转电路板的电子装置于运作状态下的示意图;FIG. 2 is a schematic view of the electronic device with a rotatable circuit board in the operating state of the present utility model;
图3是本实用新型的具有可旋转电路板的电子装置以非接触方式对主电路板供电的示意图;3 is a schematic diagram of the electronic device with a rotatable circuit board of the present invention supplying power to the main circuit board in a non-contact manner;
图4A是本实用新型的具有可旋转电路板的电子装置以接触方式对主电路板供电的另一实施例的结构爆炸图。FIG. 4A is an exploded view of another embodiment of the electronic device with a rotatable circuit board that supplies power to the main circuit board in a contact manner.
图4B是本实用新型的具有可旋转电路板的电子装置以接触方式对主电路板供电的示意图。4B is a schematic diagram of the electronic device with a rotatable circuit board of the present invention supplying power to the main circuit board in a contact manner.
其中,附图标记:Among them, reference signs:
电子装置1 装置本体10
电源供应模块11 控制模块12
接口设备13 散热孔14
旋转模块20、20a 转子21
定子22 电性接触部221
第一感应组件23 主电路板30、30a、30bThe
发热组件31 鳍片结构32
无线传输模块33 电连接件34Wireless transmission module 33
第二感应组件35 供电组件36
具体实施方式Detailed ways
为能了解本实用新型的技术内容,特举出较佳实施例说明如下。In order to understand the technical content of the present utility model, the preferred embodiments are particularly described as follows.
请先参考图1是本实用新型的具有可旋转电路板的电子装置1的结构爆炸图。在本实用新型的一实施例中,本实用新型可应用于计算机装置,例如笔记本电脑、台式计算机等,但本实用新型不以此为限,也可应用于具有类似架构的其他电子装置。Please refer to FIG. 1 , which is an exploded view of the structure of an
如图1所示,电子装置1包括装置本体10、旋转模块20及主电路板30。装置本体10可为电子装置1的壳体,其内部包括电源供应模块11、控制模块12及多个接口设备13。电源供应模块11用以供应装置本体10内各组件所需的电力,在本实施例中,装置本体10可为一电池单元。控制模块12主要用以管控装置本体10内各组件与主电路板30之间的信号传输及处理。As shown in FIG. 1 , the
多个接口设备13则用以提供电子装置1的各项功能,例如在本实施例中,多个接口设备13可包括用以与外部装置进行数据传输的输入输出端口模块、用以储存数据的储存模块及用以提供网络联机功能的网络通信模块等,但本实用新型不以此为限,也可包括如扬声器、光驱等具有特定功能的其他接口设备。The plurality of
此外,装置本体10还包括多个散热孔14,各散热孔14设置在装置本体10的周边部位,以供装置本体10内部的热空气能自多个散热孔14排出。在本实施例中,多个散热孔14分设于装置本体10后端的两侧,使得热空气自装置本体10内部排出的路径不易受其他接口设备所阻挡,但多个散热孔14的设置位置可依据装置本体10内部组件配置不同而改变。In addition, the
旋转模块20固定设置于装置本体10内,且旋转模块20与电源供应模块11电性连接,使得旋转模块20可通过电源供应模块11供电并加以驱动,而相对装置本体10旋转。在本实施例中,旋转模块20为具有转子21及定子22的马达组件,定子22固定于装置本体10,而转子21的一端固定于主电路板30,另一端则可转动地固定于定子22处。The rotating
主电路板30与旋转模块20的转子21彼此结合固定,使得转子21相对于定子22旋转时,转子21能带动主电路板30相对于装置本体10旋转。主电路板30包括至少一发热组件31、至少一鳍片结构32及无线传输模块33,发热组件31在执行大量运算处理时会产生热能,例如中央处理单元(CPU)、图形处理单元(GPU)等主要处理组件。在本实施例中,为配合令主电路板30易于执行旋转操作,主电路板30采用一圆盘状设计,以其圆心部位结合转子21;但主电路板30的形式也可随需求不同而改变。The
各鳍片结构32对应各发热组件31而设置,例如鳍片结构32可视需求直接叠设在发热组件31上;或将鳍片结构32设置于主电路板30上较空旷处,再以其他导热件将发热组件31产生的热传导至鳍片结构32。其中鳍片结构32设置在主电路板30靠近外侧边缘的部位,使得主电路板30旋转时可提供鳍片结构32较大的旋转路径,以利于散热。无线传输模块33则用以与装置本体10的控制模块12进行无线信号传输,以便与控制模块12或其他接口设备13进行沟通。Each
以下请一并参考图1及图2。图2是本实用新型的具有可旋转电路板的电子装置1于运作状态下的示意图。当本实用新型的电子装置1的电源开启后,装置本体10的电源供应模块11会开始供电至旋转模块20,此时旋转模块20会被驱动而带动主电路板30相对于装置本体1执行一旋转操作。通过主电路板30所执行的旋转操作,至少一鳍片结构32也随着旋转并与四周空气产生热对流效应,以利于装置散热的进行;而经热交换后的空气可通过装置本体10周边的多个散热孔14排出。此外,本实用新型的电子装置1也可针对鳍片结构32的各鳍片角度加以调整,使主电路板旋转时能将热空气更均匀地四散于装置本体1内部。Please refer to Figure 1 and Figure 2 together below. FIG. 2 is a schematic diagram of the
除了前述供电至旋转模块20以驱动主电路板30达到散热效果外,要让主电路板30上的各组件能顺利运作,必须顺利供电给主电路板30。因此,本实用新型的电子装置1主要以电源供应模块11为供电来源,并通过旋转模块20对主电路板30进行供电。In addition to the aforementioned power supply to the
请一并参考图1及图3。图3是本实用新型的具有可旋转电路板的电子装置1以非接触方式对主电路板30供电的示意图。需注意的是,为了清楚说明主电路板30与旋转模块20间的组件相对关系,在图3中省略了装置本体10及主电路板30上的部分组件,特此说明。Please refer to Figure 1 and Figure 3 together. FIG. 3 is a schematic diagram of the
如图1及图3所示,在本实施例中,旋转模块20包括第一感应组件23,其固定设置于定子22处;此第一感应组件23电性连接电源供应模块11,以接收来自电源供应模块11的电源供应。主电路板30还包括第二感应组件35,其设置于主电路板30面对定子22的一侧,且第二感应组件35电性连接主电路板30上的供电组件36,此供电组件36可处理并供应主电路板30上各组件所需的电源。此处第一感应组件23及第二感应组件35均为一感应线圈,但本实用新型不以此为限。As shown in FIG. 1 and FIG. 3 , in this embodiment, the
当旋转模块20由电源供应模块11供电以驱动主电路板30执行旋转操作时,第一感应组件23因供电而产生电磁感应,并开始影响到第二感应组件35而产生共振现象,使得通过第一感应组件23可以向第二感应组件35进行无线电力传输效果。因此,电源供应模块11即可通过此旋转模块20的第一感应组件23及主电路板30的第二感应组件35间的电磁感应,供电至主电路板30的供电组件36,以提供主电路板30运作时所需电源。When the
除了前述无线电力供应的设计外,本实用新型也可应用组件间直接电性接触来提供主电路板30所需电力。请一并参考图4A及图4B。图4A是本实用新型的具有可旋转电路板的电子装置以接触方式对主电路板30a供电的另一实施例的结构爆炸图;图4B是本实用新型的具有可旋转电路板的电子装置以接触方式对主电路板供电的示意图。需注意的是,为了清楚说明主电路板30a与旋转模块20a间的组件相对关系,在图4A及图4B中省略了装置本体10及主电路板30a上的部分组件,特此说明。如图4A及图4B所示,在本实施例中,旋转模块20a的定子22包括电性接触部221,此电性接触部221电性连接电源供应模块11,以接收来自电源供应模块11的电源供应;此电性接触部221为以导电性佳的金属等材质所制成的片状结构件,例如一环形片。In addition to the aforementioned design of wireless power supply, the present invention can also use direct electrical contact between components to provide the power required by the
主电路板30a还包括电连接件34,电连接件34设置于主电路板30a面对定子22的一侧,且电连接件34电性连接主电路板30a上的供电组件36,此供电组件36可处理并供应主电路板30a上各组件所需的电源。电连接件34可为一金属弹性接脚,在一般状态下,主电路板30a的电连接件34即直接接触旋转模块20a的定子22的电性接触部221。The
当旋转模块20a由电源供应模块11供电以驱动主电路板30a执行旋转操作过程中,由于主电路板30a的电连接件34仍保持与定子22的电性接触部221的电性连接状态,使得主电路板30a与旋转模块20a之间通过电连接件34配合定子22的电性接触部221形成一电源供应路径;因此,电源供应模块11能通过此电源供应路径供电至主电路板30a的供电组件36,以提供主电路板30a运作时所需电源。When the
借此,本实用新型的电子装置可通过主电路板自身的旋转,以热对流方式进行散热,无需额外设置风扇等散热组件,有效减少内部空间的使用;而主电路板可通过旋转模块的对应组件以接触或非接触方式取得所需电源,使得主电路板上各组件能顺利运作。Thereby, the electronic device of the present utility model can dissipate heat by heat convection through the rotation of the main circuit board itself, without additional heat dissipation components such as fans, effectively reducing the use of internal space; and the main circuit board can be rotated through the corresponding The components obtain the required power in a contact or non-contact manner, so that each component on the main circuit board can operate smoothly.
当然,本实用新型还可有其它多种实施例,在不背离本实用新型精神及其实质的情况下,熟悉本领域的技术人员当可根据本实用新型作出各种相应的改变和变形,但这些相应的改变和变形都应属于本实用新型所附的权利要求的保护范围。Of course, the utility model can also have other various embodiments, and those skilled in the art can make various corresponding changes and deformations according to the utility model without departing from the spirit and essence of the utility model, but These corresponding changes and deformations should all belong to the protection scope of the appended claims of the present utility model.
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320130015 CN203167508U (en) | 2013-03-21 | 2013-03-21 | Electronic device with rotatable circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320130015 CN203167508U (en) | 2013-03-21 | 2013-03-21 | Electronic device with rotatable circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN203167508U true CN203167508U (en) | 2013-08-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320130015 Expired - Fee Related CN203167508U (en) | 2013-03-21 | 2013-03-21 | Electronic device with rotatable circuit board |
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| Country | Link |
|---|---|
| CN (1) | CN203167508U (en) |
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2013
- 2013-03-21 CN CN 201320130015 patent/CN203167508U/en not_active Expired - Fee Related
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130828 |
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| CF01 | Termination of patent right due to non-payment of annual fee |