CN203151860U - Bendable metal-base printed circuit board - Google Patents
Bendable metal-base printed circuit board Download PDFInfo
- Publication number
- CN203151860U CN203151860U CN 201320101653 CN201320101653U CN203151860U CN 203151860 U CN203151860 U CN 203151860U CN 201320101653 CN201320101653 CN 201320101653 CN 201320101653 U CN201320101653 U CN 201320101653U CN 203151860 U CN203151860 U CN 203151860U
- Authority
- CN
- China
- Prior art keywords
- metal
- printed circuit
- circuit board
- base printed
- based layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 73
- 239000002184 metal Substances 0.000 claims abstract description 73
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910052802 copper Inorganic materials 0.000 claims abstract description 17
- 239000010949 copper Substances 0.000 claims abstract description 17
- 229910000679 solder Inorganic materials 0.000 claims abstract description 10
- 230000004888 barrier function Effects 0.000 claims description 19
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000005452 bending Methods 0.000 description 20
- 238000005516 engineering process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
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- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The utility model provides a bendable metal-base printed circuit board, which comprises a metal substrate, a PI insulating layer, a copper circuit layer and a solder mask layer. One surface of the PI insulating layer is adhered to the metal substrate and the copper circuit layer is formed on the other surface of the PI insulating layer. The solder mask layer is also formed on the other surface of the PI insulating layer and is provided with a window. The copper circuit layer is exposed through the window to form an electrical connection area. The other surface of the metal substrate, which is not bonded with the PI insulating layer, is provided with a v-shaped groove. The depth of the v-shaped groove is smaller than the thickness of the metal substrate. According to the technical scheme of the utility model, the bottom of the metal substrate of the metal-base printed circuit board is cut to be provided with a groove and then the bendable metal-base printed circuit board is prepared along with the adoption of the PI insulating layer. The bendable metal-base printed circuit board is simple in structure and low in manufacturing cost, and the weight of the metal-base printed circuit board is also reduced.
Description
Technical field
The utility model relates to the printed-board technology field, is specifically related to a kind of bent metal base printed circuit board.
Background technology
In recent years, led light source is because the remarkable advantage that its life-span is long, light efficiency is high, radiation is low and low in energy consumption has obtained extensive use in various fields.
LED also can produce a large amount of heats when high brightness output is provided, therefore, under high-temperature work environment, problems such as colour cast, brightness reduction, shortening in useful life can take place LED, even fault immediately can occur.For avoiding occurring the problems referred to above, require the substrate of carrying LED can derive the heat that produces when LED works in time, fully, be extensive use of metal base printed circuit board at present and carried LED to satisfy the requirement to the substrate heat conductivility.
Existing metal base printed circuit board comprises metal-based layer, high heat conductive insulating dielectric layer and copper layer line layer.The insulating medium layer effect of edge effect and bonded metal basic unit, copper layer line layer of drawing last breath that electrifies, the inorganic filler powder of the high heat conduction of its general employing and epoxy resin are mixed with and form, can not carry out bending process, and metal-based layer is dull and stereotyped sheet material, cause above-mentioned metal base printed circuit board can't satisfy the LED lighting device to the diversified demand of led light source module shape for the preparation of the led light source module of flat shape.
The utility model content
In view of this, be necessary the problem mentioned at background technology to provide a kind of metal base printed circuit board for the preparation of bent led light source module.
The purpose of this utility model is achieved through the following technical solutions:
A kind of bent metal base printed circuit board, it comprises:
Metal-based layer;
PI insulating barrier, surface thereof adhere to described metal-based layer;
Copper layer line road, it is formed at another surface of described PI insulating barrier;
Solder mask, another surface that it also is formed at described PI insulating barrier offers window on this solder mask, thus exposed formation the in described copper layer line road that is positioned at the window place is electrically connected the zone;
Offer the V-type groove on another surface that does not adhere to described PI insulating barrier of described metal-based layer, the degree of depth of described V-type groove is less than the thickness of described metal-based layer.
Described metal-based layer is the thin plate with toughness that is prepared from by aluminium, copper or stainless steel, and its thickness is between 0.5-2.0mm.
The degree of depth of described V-type groove is the 1/3-2/3 of the thickness of described metal-based layer.
The drift angle of described V-type groove is greater than 30 °.
Compared with prior art, the utility model possesses following advantage:
Only need the metal-based layer bottom cutting V-type groove at metal base printed circuit board, and use PI material insulating barrier just can prepare bent metal base printed circuit board, simple in structure, preparation cost is low, and helps to alleviate the weight of metal base printed circuit board.
Description of drawings
Fig. 1 is the not bending state cross-sectional view of the utility model embodiment one;
Fig. 2 is the bending state cross-sectional view of the utility model embodiment one;
Fig. 3 is the not bending state cross-sectional view of the utility model embodiment two;
Fig. 4 is the not bending state cross-sectional view of the utility model embodiment three;
Fig. 5 is the bending state cross-sectional view of the utility model embodiment three.
Embodiment
Embodiment one:
As shown in Figure 1, the described bent metal base printed circuit board of present embodiment comprises: metal-based layer 1; The PI(polyimides) insulating barrier 2, and surface thereof adheres to this metal-based layer 1; Copper layer line road 3, it is formed at another surface of PI insulating barrier 2; Solder mask 4, it also is formed at another surface of PI insulating barrier 2, offers window on this solder mask 4, thus described copper layer line road 3 exposed formation that are positioned at the window place are electrically connected the zone, are used for connecting electronic devices and components.Wherein, offer V-type groove 5 on another surface that described metal-based layer 1 does not adhere to described PI insulating barrier 2.The degree of depth of described V-type groove 5 is less than the thickness of described metal-based layer 1.
Described metal-based layer 1 is the thin plate with certain toughness that is prepared from by aluminium, copper or stainless steel and other metal materials, and its thickness can be between 0.5-2.0mm.
The degree of depth of V-type groove 5 is preferably the 1/3-2/3 of metal-based layer 1 thickness.
The angle of V-type groove 5 and the degree of depth can design according to the material of metal-based layer 1 and the angle of bend of thickness and metal base printed circuit board needs, preferably the drift angle of V-type groove 5 is greater than 30 °, and satisfies the angle of bend greater than described metal base printed circuit board needs simultaneously.
Because metal substrate 1 can be along the 5 places bending of V-type groove, and PI insulating barrier 2 is fit to carry out bending process, therefore metal base printed circuit board can be as shown in Figure 2 along V-type groove 5 to a lateral bending song opposite with described copper layer line road 3, thereby realize the bending of metal base printed circuit board.
Because metal-based layer 1 thickness at described V-type groove 1 place is less, therefore when metal-based layer 1 is crooked, the bending resistance at V-type groove 5 places is little than the metal-based layer 1 at unslotted place, and metal-based layer 1 is easy to carry out bending at these V-type groove 5 places, makes described V-type groove 5 play the effect of location bending position; On the other hand, V-type groove 5 can reduce the stress that metal base printed circuit board produces when crooked, avoids bending position stress excessive and cause metal base printed circuit board to damage.
Embodiment two:
As shown in Figure 3, the described bent metal base printed circuit board of present embodiment and embodiment one described metal base printed circuit board structure proximate, difference is: what offer on the side surface that the metal-based layer 10 of present embodiment does not adhere to PI insulating barrier 20 is U-shaped groove 50.
Compare with the V-type groove, it is littler to offer the metal base printed circuit board of U-shaped groove 50 resistance when crooked, therefore metal base printed circuit board is easier to carry out bending operation, in addition, the stress that produces when crooked than the V-type groove when U-shaped groove 50 is crooked is little, is conducive to guarantee the electric property of metal base printed circuit board.
The width of described U-shaped groove and the degree of depth can be set as the case may be, and preferably, the degree of depth of U-shaped groove is 1/4 to 3/4 of these metal-based layer 10 thickness, and the width of U-shaped groove is 1.0-5.0mm.
Should be understood that, the groove of offering on the metal-based layer of the bent metal base printed circuit board of the utility model is not limited to V-type groove, the U-shaped groove in above-mentioned two execution modes, in fact, the shape of groove can not be restricted, as long as it makes the thickness of bending position of metal base printed circuit board be thinned, for example can also offer deep-slotted chip breaker, dovetail groove etc.; Also can offer multiple difform groove at the metal-based layer of same metal base printed circuit board, to satisfy the different bending needs of metal base printed circuit board different piece.
Embodiment three:
Present embodiment provides a kind of led light source module of Application Example two described metal base printed circuit boards, and as shown in Figure 4, this led light source module comprises: metal-based layer 10; The PI(polyimides) insulating barrier 20, and surface thereof adheres to this metal-based layer 10; Copper layer line road 30, it is formed at another surface of described PI insulating barrier 20; Solder mask 40, it also is formed at another surface of PI insulating barrier 20, offers window on this solder mask 40, and copper layer line road 30 exposed formation that are positioned at the window place are electrically connected the zone, and described electrical connection zone comprises the LED pad 70 for assembled LED lamp pearl; LED lamp pearl 60, it is fixed on the described LED pad 70 and with described LED pad 70 by welding or other modes and is electrically connected.Wherein, offer U-shaped groove 50 on the side surface that does not adhere to described PI insulating barrier 20 of described metal-based layer 10.
As shown in Figure 5, described U-shaped groove 60 is divided into first area 80 and second area 90 with described led light source module, the led light source module can be along this U-shaped groove 50 to a lateral bending song relative with described LED lamp pearl 60 so that first area 80 and second area 90 form certain angle.
Understand easily, can be as required at the metal-based layer 10 of led light source module a plurality of U-shaped grooves 50 be set, thereby can make the led light source module form predetermined 3D shape along these U-shaped groove 50 bendings, to satisfy the LED lighting device to the diversified demand of led light source module shape.
Understand easily, the led light source module of the utility model is not limited to embodiment three described technical schemes, for example: described U-shaped groove can also be substituted by embodiment one described V-type groove, deep-slotted chip breaker or dovetail groove etc., also can offer multiple difform groove at the metal-based layer of same led light source module, to satisfy the different bending needs of led light source module different piece.
Claims (4)
1. bent metal base printed circuit board, it is characterized in that: it comprises:
Metal-based layer;
PI insulating barrier, surface thereof adhere to described metal-based layer;
Copper layer line road, it is formed at another surface of described PI insulating barrier;
Solder mask, another surface that it also is formed at described PI insulating barrier offers window on this solder mask, thus exposed formation the in described copper layer line road that is positioned at the window place is electrically connected the zone;
Offer the V-type groove on another surface that does not adhere to described PI insulating barrier of described metal-based layer, the degree of depth of described V-type groove is less than the thickness of described metal-based layer.
2. bent metal base printed circuit board according to claim 1, it is characterized in that: described metal-based layer is the thin plate with toughness that is prepared from by aluminium, copper or stainless steel, and its thickness is between 0.5-2.0mm.
3. bent metal base printed circuit board according to claim 1 and 2, it is characterized in that: the degree of depth of described V-type groove is the 1/3-2/3 of the thickness of described metal-based layer.
4. bent metal base printed circuit board according to claim 1, it is characterized in that: the drift angle of described V-type groove (5) is greater than 30 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320101653 CN203151860U (en) | 2013-03-06 | 2013-03-06 | Bendable metal-base printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320101653 CN203151860U (en) | 2013-03-06 | 2013-03-06 | Bendable metal-base printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203151860U true CN203151860U (en) | 2013-08-21 |
Family
ID=48979347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320101653 Expired - Fee Related CN203151860U (en) | 2013-03-06 | 2013-03-06 | Bendable metal-base printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203151860U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103987186A (en) * | 2014-04-30 | 2014-08-13 | 美的集团武汉制冷设备有限公司 | Circuit board, display component and air conditioner |
| CN107859429A (en) * | 2017-10-13 | 2018-03-30 | 广州番禺职业技术学院 | A kind of big tree planting soil enclosing structure of environment-friendly type afforestation and its construction method |
| CN107869186A (en) * | 2017-10-27 | 2018-04-03 | 广州番禺职业技术学院 | A kind of assembled architecture flare window construction and its manufacture method |
| CN111031688A (en) * | 2019-12-31 | 2020-04-17 | 四会富仕电子科技股份有限公司 | A bendable substrate and method of making the same |
| CN112974580A (en) * | 2021-05-11 | 2021-06-18 | 四川英创力电子科技股份有限公司 | Bent circuit board and processing equipment and method thereof |
-
2013
- 2013-03-06 CN CN 201320101653 patent/CN203151860U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103987186A (en) * | 2014-04-30 | 2014-08-13 | 美的集团武汉制冷设备有限公司 | Circuit board, display component and air conditioner |
| CN107859429A (en) * | 2017-10-13 | 2018-03-30 | 广州番禺职业技术学院 | A kind of big tree planting soil enclosing structure of environment-friendly type afforestation and its construction method |
| CN107869186A (en) * | 2017-10-27 | 2018-04-03 | 广州番禺职业技术学院 | A kind of assembled architecture flare window construction and its manufacture method |
| CN111031688A (en) * | 2019-12-31 | 2020-04-17 | 四会富仕电子科技股份有限公司 | A bendable substrate and method of making the same |
| CN112974580A (en) * | 2021-05-11 | 2021-06-18 | 四川英创力电子科技股份有限公司 | Bent circuit board and processing equipment and method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130821 Termination date: 20190306 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |