CN203136413U - Thermal conduction structure with low thermal resistance for embedded systems - Google Patents

Abstract

A heat conduction structure with low thermal resistance of an embedded system is characterized in that a plurality of butt joint parts which are provided with a concave part and elastic positioning sheets at the periphery of the concave part and can be respectively combined and positioned are arranged on the surface of a body of a heat dissipation seat, a joint part which is provided with a heat conduction pipe and can be combined and positioned is formed outwards at the periphery of the concave part, the joint part at one side of the heat conduction pipe is combined and positioned on the joint part, the joint part at the other side of the heat conduction pipe extends into the concave part and is combined and positioned with a heat conduction block to be in a suspension state, and the elastic positioning sheets are combined and positioned on the positioning parts at the periphery of the heat conduction block and the butt joint part of the heat dissipation seat, so that the acting force of the elastic positioning sheets on the heat conduction block can be the same, the pressure of the heat conduction block elastically abutted against the surface of a heating source of a circuit board is ensured to be in a stable and, and the overall heat dissipation effect is improved.

Description

Thermal conduction structure with low thermal resistance for embedded systems

technical field

The utility model provides a heat conduction structure with low thermal resistance for an embedded system, especially refers to a plurality of elastic positioning pieces that can be elastically stretched on the heat conduction block, so that the heat conduction block elastically sticks to the surface of the heat source of the circuit board and the pressure is stable and balanced. The tighter fit can effectively reduce its thermal resistance and improve the overall heat dissipation effect.

Background technique

Press, today's electronic technology is growing at a rapid rate, making the computer development trend towards the direction of strong computing functions and fast speed, and with the application of computers, industrial computer servers, embedded systems or other system hosts tend to develop at a high speed , the temperature generated during the operation of its central processing unit, image processor, etc. is also relatively high, so how to use the heat dissipation structure to ensure normal operation at the allowable temperature has been regarded as an urgent problem to be solved by the industry.

Furthermore, the current common practice in the industry is to attach the heat sink to the surface of the heat source of the circuit board to form an optimized heat dissipation structure, and when applying heat sources of different heights, it is usually necessary to use a thicker heat conduction sheet to cover A variety of heat source heights, or heat sinks with different structural sizes must be designed to individually correspond to different heat source heights. If the sharing of heat sinks is considered, thicker heat conduction sheets are required, which will inevitably result in lower thermal resistance. To improve, and considering the low thermal resistance, it is necessary to use a variety of different size heat sinks.

However, considering the problem of high thermal resistance, heat sinks generally use a certain thickness of heat-conducting medium, and the increase or decrease of the heat-conducting medium will affect the increase or decrease of thermal resistance value. The heat dissipation module closer to the heat source and the heat sink can effectively reduce the thickness of the heat conduction medium, thereby reducing the thermal resistance value. As shown in FIG. The insertion groove A11 for multiple heat pipes A2 to be positioned against, and hollow holes A12 are provided on one side of the insertion groove A11, and the end A21 on one side of the heat pipe A2 is welded to the insertion groove A11, and the other side of the heat pipe A2 The end A21 extends into the hollow hole A12, and a metal block A3 is welded on the surface of the end A21, and the metal block A3 is located on the corners of the two sides of the end A21. There are multiple through holes for the screw A32 to pass through A31, the spring A33 can be compressed and put into the gap formed between the metal block A3 and the base A1, and the screw A32 passes through the spring A33, and then locked into the hollow hole of the base A1 The lock holes A13 corresponding to the two sides of the A12 are locked and combined into one body.

However, the metal block A3 of the known cooling module A is buffered by multiple springs A33. Although the metal block A3 can move up and down against the heat source in contact with the circuit board, the heat pipe A2 can be moved through the hollow hole A12 of the base A1. The elastic effect can be achieved by the supporting point, so that the metal block A3 is in closer contact with the heat source to reduce its thermal resistance, but the assembly of the perforated A31 of the metal block A3 with the spring A33 will occupy the contact area of the heat pipe A2, thus affecting the heat pipe A2. The heat dissipation efficiency of the heat source absorbed by the metal block A3 is conducted to the base A1, and the spring A33 elastically supports the four corners of the metal block A3 to achieve the effect of equal force, but if one side of the metal block A3 and The pressure formed after the heat pipe A2 is welded is relatively high, which will cause the metal block A3 to easily tilt and cause inconsistent pressure. At the same time, the heat conduction is limited to a specific side, and the excessive pressure of the metal block A3 will cause damage or damage to the structure of the specific side. Destruction affects the stability of the overall structure; in addition, when the multiple springs A33 are assembled, the springs A33 must first be compressed before they can be smoothly placed between the metal block A3, the through hole A31 and the base A1, which not only causes the spring A33 to operate It is very inconvenient and increases the difficulty of locking the screw A32 through the spring A33 in alignment, which is unfavorable for quick assembly, so it needs to be redesigned by those in this industry to effectively solve it.

Utility model content

The purpose of the utility model is to provide a heat conduction structure with low thermal resistance for an embedded system, so as to improve the defects in the known technology.

In order to achieve the above purpose, the low thermal resistance heat conduction structure of the embedded system provided by the utility model includes a heat sink, a heat pipe, a heat conduction block and an elastic positioning piece, wherein:

The surface of the body of the cooling seat is provided with a concave portion and a plurality of butt joints around the concave portion that can be combined and positioned by the elastic positioning pieces respectively, and at least one joint portion that can be combined and positioned by the heat pipe is formed outwardly from the peripheral edge of the concave portion ;

The connecting part of the heat-discharging end on one side of the heat-conducting pipe is combined and positioned on the joint of the heat-dissipating seat, while the connecting part of the heat-absorbing end on the other side of the heat-conducting pipe extends into and is in a suspended state at the recess ;

The heat conduction block is aligned with the concave part of the heat sink, and is combined with the joint part of the heat pipe heat absorption end, and there are multiple positioning parts around the heat conduction block, and the heat source of the default circuit board is attached to the surface of the heat conduction block ;

The two sides of the elastic positioning piece are respectively combined with the docking part positioned on the heat sink and the positioning part of the heat conduction block, and are elastically stretched on the heat conduction block by a plurality of elastic positioning pieces, so that the heat conduction block elastically sticks to the heat generated by the default circuit board Pressure equalization on the source surface creates a tight fit.

The heat conduction structure with low thermal resistance of the embedded system, wherein the recess of the heat sink is formed with a hollow hole, and extends outward from the periphery of the hollow hole to the adjacent other side of the body to form at least one inwardly turning concave shape junction.

The heat conduction structure with low thermal resistance of the embedded system, wherein the butt joint portion of the heat sink and the positioning portion of the heat conduction block respectively have lock holes and screw holes, and the two sides of the elastic positioning piece respectively have a first connecting portion and a second connecting portion. Connecting part, the first connecting part is provided with a through hole that can be threaded and locked into the screw hole of the positioning part for locking combination, and the second connecting part is provided with a through hole that can be threaded and locked into the docking part A limit hole for locking combination in the lock hole.

The low thermal resistance heat conduction structure of the embedded system, wherein the butt joint of the heat sink is located inside the locking hole, and is provided with a step-shaped notch extending to the recess for elastic deformation and displacement of the elastic positioning piece.

The heat conduction structure with low thermal resistance of the embedded system, wherein the positioning portion of the heat conduction block is located at the periphery of the screw hole to form a step-shaped groove outwardly into which the first connecting portion of the elastic positioning piece can extend.

The heat conduction structure with low thermal resistance of the embedded system, wherein the junction of the heat dissipation seat is formed with a larger fixed groove, and the junction of the heat pipe is provided with a heat dissipation part that is combined and positioned in the fixed groove, and A heat conduction sheet is pasted on the surface of the heat dissipation part.

The low thermal resistance heat conduction structure of the embedded system, wherein the bottom surface of the heat dissipation part is concavely provided with a positioning groove for the connecting part of the heat conduction pipe to be embedded to form abutment.

The heat conduction structure with low thermal resistance of the embedded system, wherein the bottom surface of the heat conduction block is located inside the positioning part is concavely provided with a positioning groove for the engagement part of the heat conduction tube to be embedded to form abutment.

The heat conduction structure with low thermal resistance of the embedded system, wherein a phase change heat conduction sheet is attached on the surface of the heat conduction block.

The heat conduction structure with low thermal resistance of the embedded system, wherein a deformation part is formed between the first connection part and the second connection part of the elastic positioning piece for further continuous bending, and the limiting hole of the second connection part can be a Long or round.

The positive effect of the utility model is:

1) The low thermal resistance heat conduction structure of the embedded system of the present invention is that the surface of the body of the heat sink is provided with a recess and a plurality of docking parts for the elastic positioning piece to be combined and positioned, and the periphery of the recess is formed outwardly for The junction part where the heat pipe is combined, and the joint part at one side of the heat pipe is combined with the joint part, while the joint part at the other side of the heat pipe protrudes into the recess and is combined with the heat conduction block to be positioned in a suspended state, and The positioning part around the heat conduction block and the butt joint of the heat sink are combined with elastic positioning pieces, so that the multiple elastic positioning pieces can be elastically stretched on the heat conduction block with the same force to ensure that the heat conduction block is elastically attached to the circuit board. The pressure on the surface of the heat source reaches a stable and balanced state, so that the heat conduction block and the heat source are in contact with each other more closely, so as to effectively reduce their thermal resistance and improve the overall heat dissipation effect.

2) The heat conduction structure with low thermal resistance of the embedded system of the present utility model is that the connecting part of the heat pipe is provided with a heat dissipation part combined with the joint part of the heat dissipation seat, and a heat conduction sheet is attached to the surface of the heat dissipation part and the heat conduction block. And the heat conduction sheet is used to fill the predetermined gap formed between the heat source, the heat dissipation part, and the heat conduction block, as well as the uneven surface, small defects or tolerances caused in the manufacturing process, and the liquid compound will be released after the phase change of the heat conduction sheet. It flows evenly within the pressure range and completely covers the working area of the heat source to prevent overflow caused by too much heat dissipation paste. At the same time, it has the use characteristics of heat dissipation paste, and can use multiple elastic positioning pieces through the heat conduction block. The overall configuration that is elastically attached to the heat source and tightly attached can relatively reduce the thickness required for the use of the heat conduction sheet, thereby further reducing the thermal resistance.

3) The heat conduction structure with low thermal resistance of the embedded system of the present invention is that the first connection part and the second connection part at the two sides of the elastic positioning piece are respectively combined with the positioning part of the heat conduction block and the docking part of the heat sink. The screw passes through the through hole of the first connecting part through the hollow hole formed by the concave part, and then locks into the corresponding screw hole on the positioning part, while the second connecting part corresponds to the butt joint part of the heat sink, and is formed by The screw goes down through the limit hole, and then locked into the corresponding lock hole on the docking part, the heat conduction block can be aligned with the concave part of the heat sink, so that the surrounding area of the heat conduction block is elastically pulled by the plurality of elastic positioning pieces The supporting function is in a suspended state, thereby achieving the effects of simple structure, easy assembly and accurate positioning.

4) The heat conduction structure with low thermal resistance of the embedded system of the present invention is that when the heat source of the circuit board is in operation, the heat dissipation part and the heat conduction block of the heat sink made of aluminum or copper can absorb the heat energy generated by the heat source, and When the heat energy is conducted to the heat-absorbing end of the heat-conducting tube, the internal working fluid of the heat-conducting tube can use capillary or gravity to continue the convective cycle of liquid-vapor two-phase change to carry a large amount of heat energy, and then quickly conduct it to the heat-emitting end on the other side far away from the heat-conducting block. The heat sink made of aluminum or copper increases the overall heat dissipation area, and assists the heat source of the circuit board to quickly bring the accumulated heat to the outside for dissipation, which has a good heat dissipation effect.

Description of drawings

Fig. 1 is a three-dimensional appearance view of the utility model.

Fig. 2 is a three-dimensional exploded view of the utility model.

Fig. 3 is a three-dimensional exploded view of another viewing angle of the utility model.

Fig. 4 is a side sectional view of the utility model.

Fig. 5 is a three-dimensional exploded view of a preferred embodiment of the present invention before assembly.

Fig. 6 is a side sectional view of a preferred embodiment of the present invention when assembled.

Fig. 7 is a side sectional view of a preferred embodiment of the present invention after assembly.

Fig. 8 is a three-dimensional exploded view of another preferred embodiment of the present invention.

FIG. 9 is a perspective view of a conventional heat dissipation module.

Explanation of main component symbols in the attached drawings:

1 heat sink, 11 body, 12 recess, 121 hollow hole, 13 butt joint, 131 lock hole, 132 missing slot, 14 joint, 141 fixing slot, 15 stud;

2 heat pipes, 21 connecting part, 22 heat dissipation part, 221 positioning groove, 23 heat conducting sheet;

3 heat conducting block, 31 positioning part, 311 screw hole, 312 groove, 32 positioning groove, 33 heat conducting sheet;

4 elastic positioning piece, 41 first connecting part, 411 through hole, 412 screw, 42 second connecting part, 421 limit hole, 422 screw, 43 deformation part;

5 circuit boards, 51 heat sources, 52 perforations, 53 screws;

A cooling module, A1 base, A11 slot, A12 hollow hole, A13 key hole, A2 heat pipe, A21 end, A3 metal block, A31 perforation, A32 screw, A33 spring.

Detailed ways

The technical means and structure adopted by the utility model are described in detail in conjunction with the accompanying drawings for the preferred embodiments of the utility model, and its structure and function are as follows for complete understanding.

Please refer to Fig. 1, 2, 3, and 4, which are the three-dimensional appearance diagram, the three-dimensional exploded view, the three-dimensional exploded view of another angle of view and the side sectional view of the present utility model. It can be clearly seen from the figure that the utility model In order to include the heat sink 1, the heat pipe 2, the heat conduction block 3 and the elastic positioning piece 4, the main components and features of the utility model are described in detail below, wherein:

The heat sink 1 is a plate-shaped body 11, and a recess 12 and a plurality of butt joints 13 around the recess 12 are provided on one side of the body 11, and a hollow hole 121 is formed at the recess 12, and then The periphery of the hollow hole 121 extends outwards to the adjacent other side of the body 11 to form at least one concave joint 14 that turns inwards, and the joints 14 are combined with flat and bent heat pipes 2 . A large rectangular fixing groove 141 is formed at the turning point of one of the joint parts 14, and a plurality of studs 15 are respectively provided on the surface of the body 11 of the heat sink 1 at the recess 12, the docking part 13 and the outer periphery of the joint part 14. , and a locking hole 131 is formed on the butt joint portion 13 , and a step-shaped notch 132 extending to the concave portion 12 is provided at the inner side of the locking hole 131 .

The two sides of the heat pipe 2 are respectively provided with a connecting portion 21, and one of the connecting portions 21 is provided with a cooling portion 22 which can be composed of a plurality of cooling fins (not shown in the figure) or a heat conducting block. The bottom surface of 22 is concavely provided with a positioning groove 221 for the connecting portion 21 to be embedded to form abutment, and a heat conducting sheet 23 is attached on the surface of the heat dissipation portion 22 .

The heat conduction block 3 is generally rectangular, and a plurality of positioning parts 31 with longitudinal screw holes 311 are provided at the corners around the heat conduction block 3, and a stepped groove 312 is formed on the periphery of each screw hole 311 outward. , and the bottom surface of the heat conduction block 3 located inside the positioning portion 31 is recessed with a positioning groove 32 , and a phase change heat conduction sheet 33 is attached on the surface of the heat conduction block 3 .

The two sides of the elastic positioning piece 4 are respectively provided with a first connecting portion 41 and a second connecting portion 42. The first connecting portion 41 is provided with a circular through hole 411 for a screw 412 to pass through, and is located at the second connecting portion. 42 is provided with an elongated limiting hole 421 for a screw 422 to pass through.

When the utility model is assembled, the heat pipes 2 are respectively embedded in the joints 14 corresponding to the body 11 of the heat sink 1, and the connecting portion 21 on one side of the heat pipe 2 is formed against the joint 14 of the body 11. After pasting, it is combined into one body by welding, and the connecting part 21 on the other side of the heat pipe 2 is extended into and located in the hollow hole 121 of the recess 12 in a suspended state, and then the heat conduction block 3 is placed in the corresponding part of the recess 12. After the hollow hole 121 is hollowed out, and the joint part 21 of the heat pipe 2 is embedded in the positioning groove 32 of the heat conduction block 3 to form abutment, it can be combined into one body by welding, and the heat dissipation part 22 is placed in the joint part 14 In the fixed groove 141 of the heat pipe 2, the joint part 21 of the heat pipe 2 and the positioning groove 221 of the heat dissipation part 22 are formed to be in contact with each other, and then combined into one body by welding, and the joint parts 21 at the two sides of the heat pipe 2 are respectively connected to the joint part. 14. The positioning groove 32 of the heat conduction block 3, and the heat dissipation part 22 and the fixing groove 141 of the joint part 14 are combined into one body by welding. Or other combination methods become one after being firmly joined.

Continue to position the first connecting portion 41 and the second connecting portion 42 at both sides of the plurality of elastic positioning pieces 4 to be respectively combined with the positioning portion 31 of the heat conduction block 3 and the butt joint portion 13 of the heat sink 1, so that the first connecting portion 41 respectively extend into the step-shaped groove 312 of the positioning part 31, and the screw 412 passes through the through hole 411 from the hollow hole 121 of the concave part 12 upwards, and then locks into the corresponding screw hole on the positioning part 31 311, and the second connecting part 42 corresponds to the docking part 13 of the heat sink 1, and the screw 422 passes down through the limiting hole 421, and then locks into the corresponding locking hole 131 on the docking part 13. Locked and combined into one, the heat conduction block 3 can be aligned with the recess 12 of the heat sink 1, so that the bottom of the heat conduction block 3 is in a suspended state by the elastic tension of the plurality of elastic positioning pieces 4, and then the structure is achieved. Simple, easy to assemble and accurate positioning effect.

Furthermore, the first connecting portion 41 and the second connecting portion 42 at both sides of the elastic positioning piece 4 of the present utility model are preferably implemented to be locked and combined with the positioning portion 31 of the heat conducting block 3 and the docking portion 13 of the heat sink 1 respectively. However, in actual application, welding, riveting, heat-conducting adhesive bonding or other bonding methods can also be used to securely join and then become one. The concave part 12 of the heat sink 1 is formed with a hollow hole 121 only In a preferred implementation state, a hole (not shown) can also be formed. If the hollow hole 121 is used as an illustration, the screw 412 of the elastic positioning piece 4 can pass through the through hole 411 from the hollow hole 121 upwards. Then, lock it into the corresponding screw hole 311 on the positioning part 31. However, if the hole is used as an illustration, the first connecting part 41 can be attached to the surface of the heat conduction block 3, so that the screw 412 can pass through the hole. After passing down through the through hole 411, it is locked into the corresponding screw hole 311 on the positioning part 31 and locked into one body, so that the heat conducting block 3 is in a suspended state at the concave part 12 of the heat sink 1, and the above-mentioned Simple modifications and equivalent structural changes should be included in the patent scope covered by the utility model in the same way.

Please refer to Figures 5, 6, and 7 in combination, which are the perspective exploded view of the preferred embodiment of the present invention before assembly, the side view section view during assembly and the side view section view after assembly, which can be clearly seen from the figure , wherein the surface of the circuit board 5 is provided with at least one heat source 51 which can be a central processing unit, an image processor or a chip, etc. The corresponding heat conduction sheets 23, 33 on the heat dissipation part 22 of the heat sink 1 and the heat conduction block 3, the perforations 52 on the circuit board 5 will be respectively aligned with the studs 15 of the body 11, and the screws 53 will pass through the perforations 52 After that, it is locked into the studs 15 and combined to form a whole, so that the circuit board 5 can be raised by the studs 15 without contacting the heat sink 1, and the heat conduction sheets 23, 33 are used to fill the heat source 51, the predetermined gap formed between the heat dissipation part 22 and the heat conduction block 3, as well as the uneven surface, small defects or tolerances caused in the manufacturing process, and the liquid compound will be uniform in the pressure range after the phase change of the heat conduction plate 33 Flow, and completely cover the working area of the heat source 51, so as to prevent overflow caused by too much coating of heat dissipation paste, and at the same time have the use characteristics of heat dissipation paste.

However, when the heat source 51 of the circuit board 5 abuts on the heat conduction block 3 , the heat conduction block 3 can be displaced downward at the recess 12 of the heat sink 1 by the pushing force, and is linked to the heat conduction pipe 2 One connecting part 21 and the first connecting part 41 of the elastic positioning piece 4 are respectively positioned on the heat sink 1 by combining the other connecting part 21 and the second connecting part 42 as a support point, and are elastically deformed and displaced downward, so that they can be connected through the butt joint. The slot 132 of the part 13 provides the space required for the elastic deformation of the elastic positioning piece 4, and at the same time, the force generated by the elastic stretching of the plurality of elastic positioning pieces 4 on the heat conduction block 3 is the same, so as to ensure that the heat conduction block 3 is elastically attached to the heat conduction block 3. The pressure on the surface of the heat source 51 reaches a stable and balanced state, so that the contact between the heat conduction block 3 and the heat source 51 forms a closer fit to effectively reduce thermal resistance, and the heat conduction block 3 can be elastically resisted by a plurality of elastic positioning pieces 4 The overall configuration that sticks to the heat source 51 and closely fits to relatively reduce the thickness required for the use of the heat conducting sheet 33, so that the thermal resistance is further reduced, and the hollow hole 121 structure design of the recess 12 of the heat sink 1 can also be used The space required for the elastic deformation of the heat conduction block 3 and the plurality of elastic positioning pieces 4 is provided, and the overall height is reduced and thinner, so as to meet the design requirements of light, thin and short products.

In addition, when the heat source 51 of the circuit board 5 is in operation, the heat dissipation part 22 of the heat sink 1 and the heat conduction block 3 can be made of aluminum or copper to absorb the heat energy generated by the heat source 51 and conduct the heat energy to the heat pipe 2. On the heat-absorbing end, the internal working fluid of the heat-conducting tube 2 can continue to carry out the convective circulation of the liquid-vapor two-phase change by capillary or gravity to carry a large amount of heat energy, and then quickly conduct it to the aluminum or The heat sink 1 made of copper increases the overall heat dissipation area, which can assist the heat source 51 of the circuit board 5 to quickly bring out the accumulated heat to the outside for dissipation, and improve the overall heat dissipation efficiency, thus having a good cooling effect and cooling effect.

Please refer to Fig. 2, 5, 7, and 8 at the same time, which are the three-dimensional exploded view of the present utility model, the three-dimensional exploded view of the preferred embodiment before assembly, the side view sectional view after assembly and the three-dimensional view of another preferred embodiment From the exploded view, it can be clearly seen from the figure that the limiting hole 421 of the second connecting part 42 of the elastic positioning piece 4 of the present invention is preferably implemented as a long shape, which not only facilitates the alignment and locking of the screw 422 into the heat sink 1 at the lock hole 131 of the docking part 13, and can provide the distance required for the second connecting part 42 to move along the screw 422, so as to increase the height range of the downward displacement of the heat conduction block 3 at the recess 12, but in actual application , it is also possible to further continuously bend between the first connecting portion 41 and the second connecting portion 42 at both sides of the elastic positioning piece 4 to form an S-shaped, W-shaped or other shaped deformation portion 43, and make the second connecting portion The limiting hole 421 of 42 cooperates with the deformation part 43 to form a circle, and because there are many types of the elastic positioning piece 4, its thickness, various shapes, etc. can also be changed according to requirements or different structural designs, thereby providing the elastic positioning piece 4 with elasticity. The margin required for deformation can effectively prevent excessive deformation or structural damage of the elastic positioning piece 4 .

The above-mentioned detailed description is only for the description of a preferred feasible embodiment of the utility model, but this embodiment is not used to limit the scope of patent application of the utility model, and all others are completed without departing from the technical spirit disclosed in the utility model The equivalent changes and modification changes should be included in the patent scope covered by the utility model.

Claims (10)

1. the conductive structure of an embedded system low thermal resistance is characterized in that, includes radiating seat, heat pipe, heat-conducting block and elasticity spacer, wherein:

Locate around a recess and the recess can be for the elasticity spacer respectively in conjunction with the plural docking section of location in order to be provided with on the body surface of this radiating seat institute tool, and be formed with at least one outwardly by the recess peripheral region can be for the junction surface of heat pipe in conjunction with the location;

The convergence part of this heat pipe one side place release end of heat institute tool is positioned on the junction surface of radiating seat for combination, and the convergence part of other side place heat absorbing end institute tool of heat pipe is then stretched into and is positioned at the recess place and is a vacant state;

This heat-conducting block is the recess place that is aligned with radiating seat, and is combined the location with the convergence part of heat pipe heat absorbing end, and locates to be provided with plural location division around the heat-conducting block, and supports the pyrotoxin that posts the acquiescence circuit board on the heat-conducting block surface;

These elasticity spacer two side places are respectively in conjunction with being positioned the docking section of radiating seat and the location division of heat-conducting block, and by plural elasticity spacer elasticity stay bolt on heat-conducting block, heat-conducting block elasticity is supported be affixed on the lip-deep isostasy of pyrotoxin of acquiescence circuit board to form and fits tightly.

2. according to the conductive structure of the described embedded system low thermal resistance of claim 1, it is characterized in that, wherein the recess place of this radiating seat is for being formed with hollow hole, and extended outwardly by the hollow hole peripheral region and to be formed with at least one inwardly recess junction surface of turnover to the adjacent side place in addition of body.

3. according to the conductive structure of the described embedded system low thermal resistance of claim 1, it is characterized in that, wherein the location division of the docking section of this radiating seat and heat-conducting block is for having lockhole and screw respectively, elasticity spacer two side places then have first connecting portion and second connecting portion respectively, its first connecting portion is provided with and can wears and locks the through hole that closes in the screw internal lock access node of location division for screw, and is positioned at second connecting portion and is provided with to wear for screw and locks the spacing hole that closes in the lockhole internal lock access node of docking section.

4. according to the conductive structure of the described embedded system low thermal resistance of claim 3, it is characterized in that, wherein be positioned at the inboard place of lockhole on the docking section of this radiating seat and extend to recess for the terrace shape short slot of elasticity spacer strain displacement for being provided with.

5. according to the conductive structure of the described embedded system low thermal resistance of claim 3, it is characterized in that, wherein be positioned at the screw peripheral region on the location division of this heat-conducting block for being formed with the terrace shape groove that can stretch into for first connecting portion of elasticity spacer outwardly.

6. according to the conductive structure of the described embedded system low thermal resistance of claim 1, it is characterized in that, wherein place, the junction surface of this radiating seat is for being formed with the bigger holddown groove of area, and be provided with in the convergence part of heat pipe in conjunction with the radiating part that is positioned in the holddown groove, and be pasted with a conducting strip on the radiating part surface.

7. according to the conductive structure of the described embedded system low thermal resistance of claim 6, it is characterized in that wherein this place, radiating part bottom surface supports the location notch that pastes for being concaved with to embed for the convergence part of heat pipe to form.

8. according to the conductive structure of the described embedded system low thermal resistance of claim 1, it is characterized in that wherein this heat-conducting block bottom surface is positioned at inboard place, location division and supports the location notch that pastes for being concaved with to embed for the convergence part of heat pipe to form.

9. according to the conductive structure of the described embedded system low thermal resistance of claim 1, it is characterized in that, wherein on this heat-conducting block surface for being pasted with the phase change conducting strip.

10. according to the conductive structure of the described embedded system low thermal resistance of claim 1, it is characterized in that, wherein be formed with variant part for further bending continuously between first connecting portion of this elasticity spacer and second connecting portion, and the spacing hole of second connecting portion can be microscler shape or a circle.

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