CN202841818U - Chassis cooling structure - Google Patents

Abstract

A heat dissipation structure of a casing mainly comprises a receiving portion on the surface of a portion of the casing corresponding to a planned heat source, and a plurality of evenly arranged and distributed through-holes penetrating the casing are provided in the receiving portion. A heat conducting member capable of quickly guiding the heat to diffuse evenly is attached to the position corresponding to the receiving portion on the inner side of the casing to guide the heat of the heat source to diffuse rapidly laterally. In addition, a barrier member is attached to the position corresponding to the receiving portion on the outer side of the casing to cooperate with the heat conducting member to clamp the receiving portion so that each through-hole forms a heat-insulating space isolated from the outside, thereby achieving the effect of avoiding heat concentration and rapidly dissipating heat.

Description

Chassis cooling structure

technical field

The utility model relates to a heat dissipation structure of a casing, in particular to a structure which can block heat transfer and avoid excessive concentration of heat at a predetermined part of the casing.

Background technique

When traditional electronic devices are in use, heat will be generated by the internal heat source (central processing unit, power crystal or other similar components). If the heat source is directly diffused, the temperature of the nearby local casing surface will be too high ; Therefore, it is more common to use a heat-conducting component with better heat-conducting efficiency (for example: a heat pipe) to partially arrange it on the heat source, and to install a heat-dissipating component on the other end of the heat-conducting component to increase the heat dissipation effect (For example: heat sink, fan), use the heat conduction component to transfer the heat of the heat source to other parts, and then radiate it, so as to reduce the excessive concentration of heat and cause the local temperature to be too high.

However, if the above complex and expensive heat dissipation mechanism is applied to electronic products with simple structure and low price, it is not economical; therefore, how to solve the problem of excessive heat concentration with a simpler structure and lower cost The lack of causing excessively high temperature at local locations is an urgent task for all related businesses.

In view of the above-mentioned limitations in the heat resistance and heat dissipation design of known casings, the creators researched ways to improve these deficiencies, and finally produced the utility model.

Contents of the invention

The technical problem to be solved by the utility model is: aiming at the deficiencies of the above-mentioned prior art, provide a heat dissipation structure of the casing, which can effectively improve the heat resistance effect of specific parts on the casing, and avoid the abnormality of the surface of the casing caused by heat concentration temperature change.

In order to solve the above-mentioned technical problems, the technical solution adopted by the utility model is: a casing heat dissipation structure, which at least includes a casing, and is characterized in that it also includes a heat conduction element and a barrier element that can quickly guide the heat to spread evenly, A receiving part is provided on the surface of the casing corresponding to a preset heat source, and several through holes penetrating through the casing are arranged on the receiving part; The blocking element is attached to the outer side of the casing at a position corresponding to the receiving part, and cooperates with the clamping of the heat conducting element to isolate the communication between each through hole and the outside.

Preferably, the above barrier is a barrier that can block heat transfer and diffusion.

According to the above structure, the accommodating part is an accommodating recess recessed on the surface of the casing.

According to the above structure, the plurality of through holes are evenly arranged and distributed in the receiving portion.

According to the above structure, the edge of the heat conducting element covers the portion including the peripheral edge of the receiving portion and forms a side portion.

According to the above structure, wherein the side part has a heat dissipation surface layer which can improve heat dissipation performance.

According to the above structure, the casing is composed of a casing base and a casing cover, and the receiving part is arranged on the casing cover.

According to the above structure, a heat source is provided inside the casing at a position corresponding to the receiving portion.

In this way, the heat resistance effect of specific parts on the casing can be effectively improved, and the abnormal temperature change on the surface of the casing caused by heat concentration can be avoided; the heat dissipation effect of specific parts on the casing can be improved, and the overall heat dissipation efficiency can be improved.

In order to obtain a more specific understanding of the above-mentioned purpose, effect and characteristics of the present utility model, the description is as follows according to the following drawings:

Description of drawings

Fig. 1 is an exploded view of the structure of the first embodiment of the utility model.

Fig. 2 is an overall combined sectional view of the first embodiment of the utility model.

Fig. 3 is an overall combined sectional view of the second embodiment of the utility model.

Label description

1.....Case 11....Case cover

111...Accommodating parts

12....Shell seat 2.....heat conduction parts

21....Joint part 22....Side part

3...Barrier 4...Heat source

40....Circuit board 5.....Heat dissipation surface layer

Detailed ways

Referring to Fig. 1 and Fig. 2, it can be seen that the structure of the first embodiment of the present utility model mainly includes: casing 1, heat conduction element 2 and barrier element 3, etc., wherein the casing 1 can have different designs according to different designs. In this embodiment, the casing 1 is formed by the relative combination of the casing base 12 and the casing cover 11, and the circuit board 40 and related electronic components are accommodated inside the casing 1, and in the The circuit board 40 is preset with a heat source 4 that can generate heat (it can be a central processing unit, a power crystal or other similar heating components), and the surface of the casing 1 (cover 11) corresponding to the heat source 4 is provided with a There is a receiving part 111 (the receiving part 111 can be a recessed receiving part), and several through holes 112 evenly arranged and distributed through the casing 1 (case cover 11 ) are provided on the receiving part 111 .

The heat conduction element 2 is a member that can quickly guide and spread heat evenly, and can be in various shapes according to different requirements. In this embodiment, the heat conduction element 2 is a sheet-shaped body that is larger than the receiving portion 111. It has a joint part 21 (which can be a concave configuration corresponding to the receiving part 111), so as to be attached to the position corresponding to the receiving part 111 on the inner surface side of the casing 1 (case cover 11), and the edge of the heat conducting element 2 covers the The surrounding parts of the receiving part 111 form side parts 22 respectively.

The barrier member 3 is a sheet-like body, and is attached to the receiving portion 111 , and cooperates with the clamping of the heat-conducting member 2 , so that each through hole 112 forms a heat-insulating space isolated from the outside.

In actual application, since the through holes 112 in the receiving part 111 are isolated from the outside, a heat insulation state that is not conducive to heat conduction is formed; when the heat generated by the heat source 4 is transferred to the heat conduction element 2, the heat conduction The part 2 can quickly and laterally guide and spread the heat evenly, so as to reduce the accumulation of heat in the position of the receiving part 111, and most of the heat dissipated from the heat conducting part 2 is difficult to pass through the heat insulation space formed by the through holes 112. And only a small part of the heat passing through the through holes 112 is blocked by the barrier 3 and cannot be freely dissipated from the receiving part 111, so as to avoid heat concentration and cause an abnormal temperature rise on the local surface of the casing 1. situation.

In the above-mentioned structure, the barrier member 3 can be designed according to different needs and has the characteristics of blocking heat transfer and diffusion; or has the same characteristics as the heat conduction member 2, which can guide the heat evenly and quickly, so that it can avoid heat concentration in the The effect of the receiving part 111.

Referring to Fig. 3, it can be seen that the structure of the second embodiment of the present invention mainly includes: a heat dissipation surface layer 5, and parts such as the same casing 1, heat conduction element 2, and barrier element 3 as the first embodiment described above, wherein The heat dissipation surface layer 5 is made of a material that quickly guides the heat to radiate outward, and is arranged on the surface of the side part 22 of the heat conduction element 2, so that after the heat conduction element 2 receives the heat from the heat source 4, most of the heat can be passed through The heat dissipation surface layer 5 on the surface of the side portion 22 spreads out rapidly, so as to enhance the effect of heat dissipation and avoid heat concentration.

Based on the above, the heat dissipation structure of the casing of the present invention can indeed achieve the effect of improving the heat resistance effect of the nameplate of the casing and avoiding the effect of abnormal temperature rise caused by heat concentration. It is indeed a novel and progressive creation. An application for a new patent is proposed; however, the above description is only a description of the preferred embodiment of the present utility model, and any changes, modifications, changes or equivalent replacements extended according to the technical means and scope of the present utility model shall also fall into the scope of the present invention. Within the patent application scope of the utility model.

Claims (18)

1. A casing heat dissipation structure, which at least includes a casing, characterized in that: it also includes a heat conduction member and a barrier that can quickly guide heat to spread evenly, and the surface of the casing corresponding to a preset heat source is provided with a The receiving part is provided with several through holes through the housing; the heat conduction element is attached to the position corresponding to the receiving part inside the housing; the barrier is attached to the outer side of the housing corresponding to the receiving part position, and cooperate with the clamping of the heat conducting member to isolate the communication between each through hole and the outside. 2. A casing heat dissipation structure, which at least includes a casing, and is characterized in that: it also includes a heat conducting element that can quickly guide heat to spread evenly and a barrier that can block heat transfer and diffusion, and the casing corresponds to a preset A receiving part is provided on the surface of the part where the heat source is located, and several through holes through the casing are provided on the receiving part; The outer side of the shell corresponds to the location of the receiving part, and cooperates with the clamping of the heat conducting element to isolate the communication between each through hole and the outside. 3. The heat dissipation structure of the casing according to claim 1 or 2, wherein the accommodating portion is a receiving recess recessed on the surface of the casing. 4. The heat dissipation structure of the casing according to claim 1 or 2, wherein the plurality of through holes are evenly arranged and distributed in the receiving portion. 5 . The heat dissipation structure of the casing according to claim 1 , wherein the edge of the heat conducting element covers a portion including a peripheral edge of the receiving portion, and forms a side portion. 5 . 6 . The heat dissipation structure of the casing according to claim 3 , wherein the edge of the heat conducting element covers a portion including a side of a periphery of the receiving portion, and forms a side portion. 7 . 7 . The heat dissipation structure of the casing as claimed in claim 5 , wherein the surface of the side part has a heat dissipation surface layer capable of improving heat dissipation performance. 7 . 8. The heat dissipation structure of the casing according to claim 6, wherein the surface of the side part has a heat dissipation surface layer that can improve heat dissipation performance. 9 . The heat dissipation structure of the casing according to claim 1 , wherein the casing is composed of a casing base and a casing cover, and the receiving portion is disposed on the casing cover. 10 . 10 . The heat dissipation structure of the casing according to claim 3 , wherein the casing is composed of a casing base and a casing cover, and the receiving portion is disposed on the casing cover. 11 . 11. The heat dissipation structure of the casing according to claim 5, wherein the casing is composed of a casing base and a casing cover, and the receiving portion is disposed on the casing cover. 12. The heat dissipation structure of the casing according to claim 6, wherein the casing is composed of a casing base and a casing cover, and the receiving part is arranged on the casing cover. 13 . The heat dissipation structure of the casing according to claim 1 , wherein a heat source is provided inside the casing at a position corresponding to the receiving portion. 14 . 14. The heat dissipation structure of the casing according to claim 3, wherein a heat source is provided inside the casing at a position corresponding to the receiving portion. 15 . The heat dissipation structure of the casing according to claim 5 , wherein a heat source is provided inside the casing at a position corresponding to the receiving portion. 15 . 16. The heat dissipation structure of the casing according to claim 6, wherein a heat source is provided inside the casing at a position corresponding to the receiving part. 17. The heat dissipation structure of the casing according to claim 9, wherein a heat source is provided inside the casing at a position corresponding to the receiving portion. 18 . The heat dissipation structure of the casing according to claim 10 , wherein a heat source is provided inside the casing at a position corresponding to the receiving portion. 19 .

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