CN202053164U - 一种抛光垫清洁装置及抛光装置 - Google Patents
一种抛光垫清洁装置及抛光装置 Download PDFInfo
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- CN202053164U CN202053164U CN2011201231749U CN201120123174U CN202053164U CN 202053164 U CN202053164 U CN 202053164U CN 2011201231749 U CN2011201231749 U CN 2011201231749U CN 201120123174 U CN201120123174 U CN 201120123174U CN 202053164 U CN202053164 U CN 202053164U
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| CN2011201231749U CN202053164U (zh) | 2011-04-25 | 2011-04-25 | 一种抛光垫清洁装置及抛光装置 |
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| CN2011201231749U CN202053164U (zh) | 2011-04-25 | 2011-04-25 | 一种抛光垫清洁装置及抛光装置 |
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| CN202053164U true CN202053164U (zh) | 2011-11-30 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103722486A (zh) * | 2012-10-11 | 2014-04-16 | 中芯国际集成电路制造(上海)有限公司 | 一种化学机械研磨方法及装置 |
| CN106141905A (zh) * | 2016-08-22 | 2016-11-23 | 上海华力微电子有限公司 | 一种晶圆研磨头清洗装置及清洗方法 |
| CN108214286A (zh) * | 2016-12-21 | 2018-06-29 | 罗门哈斯电子材料Cmp控股股份有限公司 | 清洁cmp抛光垫的方法 |
| CN110977709A (zh) * | 2018-09-28 | 2020-04-10 | 台湾积体电路制造股份有限公司 | 化学机械研磨方法及设备 |
| US11275024B2 (en) | 2018-03-13 | 2022-03-15 | Nippon Telegraph And Telephone Corporation | Method for estimating production location |
| CN115634882A (zh) * | 2022-10-24 | 2023-01-24 | 湖北鼎锐半导体有限公司 | 一种cmp抛光垫清洁装置及清洁方法 |
| CN117564917A (zh) * | 2024-01-15 | 2024-02-20 | 北京芯美达科技有限公司 | 一种多晶金刚石抛光设备 |
-
2011
- 2011-04-25 CN CN2011201231749U patent/CN202053164U/zh not_active Expired - Fee Related
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103722486B (zh) * | 2012-10-11 | 2016-10-05 | 中芯国际集成电路制造(上海)有限公司 | 一种化学机械研磨方法及装置 |
| CN103722486A (zh) * | 2012-10-11 | 2014-04-16 | 中芯国际集成电路制造(上海)有限公司 | 一种化学机械研磨方法及装置 |
| CN106141905A (zh) * | 2016-08-22 | 2016-11-23 | 上海华力微电子有限公司 | 一种晶圆研磨头清洗装置及清洗方法 |
| CN106141905B (zh) * | 2016-08-22 | 2018-06-29 | 上海华力微电子有限公司 | 一种晶圆研磨头清洗装置及清洗方法 |
| CN108214286A (zh) * | 2016-12-21 | 2018-06-29 | 罗门哈斯电子材料Cmp控股股份有限公司 | 清洁cmp抛光垫的方法 |
| CN108214286B (zh) * | 2016-12-21 | 2020-03-20 | 罗门哈斯电子材料Cmp控股股份有限公司 | 清洁cmp抛光垫的方法 |
| US11275024B2 (en) | 2018-03-13 | 2022-03-15 | Nippon Telegraph And Telephone Corporation | Method for estimating production location |
| CN110977709A (zh) * | 2018-09-28 | 2020-04-10 | 台湾积体电路制造股份有限公司 | 化学机械研磨方法及设备 |
| CN110977709B (zh) * | 2018-09-28 | 2021-07-30 | 台湾积体电路制造股份有限公司 | 化学机械研磨方法及设备 |
| TWI782235B (zh) * | 2018-09-28 | 2022-11-01 | 台灣積體電路製造股份有限公司 | 化學機械研磨方法及設備 |
| US12409529B2 (en) | 2018-09-28 | 2025-09-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Vacuum assembly for chemical mechanical polishing |
| CN115634882A (zh) * | 2022-10-24 | 2023-01-24 | 湖北鼎锐半导体有限公司 | 一种cmp抛光垫清洁装置及清洁方法 |
| CN117564917A (zh) * | 2024-01-15 | 2024-02-20 | 北京芯美达科技有限公司 | 一种多晶金刚石抛光设备 |
| CN117564917B (zh) * | 2024-01-15 | 2024-04-02 | 北京芯美达科技有限公司 | 一种多晶金刚石抛光设备 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130515 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
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| TR01 | Transfer of patent right |
Effective date of registration: 20130515 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111130 Termination date: 20180425 |
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| CF01 | Termination of patent right due to non-payment of annual fee |