CN201845774U - High color rendering white light LED module - Google Patents

Abstract

The utility model discloses a high-resolution white LED module, which comprises a high thermal conductivity substrate and an LED chip, the high thermal conductivity substrate includes a metal substrate and a ceramic substrate, and the LED chip includes at least one red LED chip and a blue LED chip. The blue LED chip is provided with a phosphor layer; the LED chip is directly fixedly connected to the high thermal conductivity substrate; the high thermal conductivity substrate is also provided with a circuit layer, when the high thermal conductivity substrate is a metal substrate, An insulating layer is provided between the circuit layer and the metal substrate, and the LED chips are electrically connected through the circuit layer. The beneficial effects are: the blue LED chip is provided with a phosphor layer, which can easily change the color temperature, and together with the red LED chip, can be mixed into high-resolution white light. The processing technology such as slurry crystal solidification does not need other processing technology, the thermal resistance is low, the whole product structure is simple, and the production cost is low.

Description

High Clarity White LED Module

technical field

The utility model relates to an LED lighting product, in particular to a white light LED module group with high color rendering.

Background technique

With the rapid development of LED technology and the maturity of high-power LED production technology, its low power consumption, high efficiency, small size, light weight and long life and many other advantages make it widely used. The development of high-power LED packaging technology , has greatly accelerated the application of high-power LEDs in the lighting and display fields, especially in the display field, such as projection equipment, which not only has strict requirements on the heat dissipation of LED chips, but also requires LED chip modules to produce high-resolution white light. To meet the needs of applications, the current low thermal resistance and high-power light-emitting diode modules have complex production processes and complex product structures. They require insulating layers, copper clad layers, electrode layers and outer insulating layers. There is a pit in the center of the metal substrate. LED The chip is installed in the pit, resulting in more processing steps and higher production costs, and the insulating layer under the copper clad laminate also increases the thermal resistance. In addition, there are two ways to generate high-resolution white light: one is to use multi-color LED chips to mix colors to produce white light. The advantage of this method is that it can obtain high-color rendering white light, but the disadvantage is that it is difficult to adjust the color temperature, because each LED chip There are differences in parameters, resulting in low production efficiency, unstable product quality, and low light efficiency. It is difficult to accurately obtain LED chip modules with high-resolution white light that meet the requirements. Another method is to use a variety of phosphors to mix to obtain white light with high color rendering. This method leads to low overall light efficiency due to the low efficiency of red powder. The color index drops, but the color temperature rises sharply, which is difficult to get practical.

Utility model content

In order to solve the above problems, the purpose of this utility model is to provide a high-quality high-display white LED chip module with simple production process, stable quality, high light efficiency and parameters meeting the requirements. Its core is to use a single stable high-efficiency yellow powder and red light chip to synthesize stable and high-efficiency white light with high color rendering index.

In order to achieve the above purpose, the technical solution of the utility model is: a high-resolution white LED module, including a high thermal conductivity substrate and an LED chip, the high thermal conductivity substrate includes a metal substrate and a ceramic substrate,

The LED chips include at least one red LED chip and at least one blue LED chip;

A phosphor layer is provided on the blue LED chip;

The LED chip is directly fixedly connected to the high thermal conductivity substrate;

A circuit layer is also provided on the high thermal conductivity substrate. When the high thermal conductivity substrate is a metal substrate, an insulating layer is provided between the circuit layer and the metal substrate, and the LED chips are electrically connected through the circuit layer.

Preferably, the phosphor layer is a yellow phosphor layer.

Preferably, the red LED chip and the blue LED chip are respectively connected in parallel/series; or the two kinds of LED chips are connected in parallel/series together.

Preferably, the LED chip further includes at least one green LED chip, and the red LED chip, the blue LED chip and the green LED chip are respectively connected in parallel/series; or wherein two kinds of LED chips are connected in parallel/series together, and the other One kind of LED chip is individually connected in parallel/series; or all three kinds of LED chips are connected in parallel/series together.

Preferably, the LED module with high display white light may also be provided with a protective cover, the protective cover includes a frame and a transparent window arranged on the frame or integrated with the frame, and the protective cover is arranged on the LED the top of the chip.

Preferably, the high-resolution white LED module is further provided with a temperature monitoring device, and the temperature monitoring device is electrically connected to an electric control device for controlling the power on or off of the high-resolution white LED module.

Preferably, the high-resolution white LED module is also provided with an overheat protection device, the overheat protection device is a thermistor, and the thermistor is connected in series between the LED chip and the power supply.

Preferably, the metal substrate includes a copper substrate, an aluminum substrate and a silver substrate, and the ceramic substrate includes an alumina ceramic substrate and an aluminum nitride ceramic substrate.

Preferably, the LED chip further includes a white LED chip or a yellow LED chip.

Preferably, optical positioning holes for auxiliary positioning are also provided on the high thermal conductivity substrate.

The beneficial effect of adopting this technical solution is: the blue LED chip is provided with a phosphor layer, which can easily change the color temperature, and together with the red LED chip, can be mixed into high-resolution white light, and the LED chip is directly fixedly connected on the metal substrate, Processing techniques such as welding and silver paste crystal bonding can be used, without other processing techniques, low thermal resistance, simple structure of the whole product, and low production cost.

Description of drawings

Fig. 1 is a cross-sectional view of Embodiment 1 of a high-power LED packaging module of the present invention;

Fig. 2 is a schematic diagram of Embodiment 1 of a high-power LED packaging module of the present invention;

Fig. 3 is a schematic diagram of Embodiment 2 of a high-power LED packaging module of the present invention;

Fig. 4 is a schematic diagram of Embodiment 3 of a high-power LED packaging module of the present invention;

Fig. 5 is a graph of light intensity after mixing colors of blue light and yellow light in the prior art;

Fig. 6 is the light intensity curve diagram after the yellow light and red light mixed colors produced by the blue light of the present invention and the yellow fluorescent powder layer;

Fig. 7 is a schematic diagram of Embodiment 5 of a high-power LED packaging module of the present invention;

Fig. 8 is a circuit connection diagram of Embodiment 5 of a high-power LED packaging module of the present invention;

Fig. 9 is a schematic diagram of Embodiment 6 of a high-power LED packaging module of the present invention;

Fig. 10 is a circuit connection diagram of Embodiment 6 of a high-power LED packaging module of the present invention.

The corresponding part names indicated by numbers and letters in the figure:

11. Metal substrate 12. Ceramic substrate 2. LED chip 21. Blue LED chip 22. Red LED chip 23. Green LED chip 24. Phosphor powder layer 3. Circuit layer strip 41. Frame 42. Transparent window 5. Temperature sensor 6. Insulation layer 7. Pin 8. Optical positioning hole

Detailed ways

Below in conjunction with accompanying drawing and specific embodiment, the utility model is described in further detail.

Example 1,

As shown in Figures 1 and 2, a high-resolution white LED module includes a high thermal conductivity substrate and an LED chip 2, the high thermal conductivity substrate is a metal substrate 11, and the LED chip 2 includes four red LED chips 22 and a blue LED chip 21 five, the arrangement of LED chips 2 of two colors is as shown in Figure 2;

A yellow phosphor layer 24 is provided on the blue LED chip 21;

The two kinds of LED chips 2 are directly fixedly connected to the metal substrate 11;

The metal substrate 11 is also provided with a circuit layer strip 3, that is, a strip-shaped circuit layer. An insulating layer 6 is provided between the circuit layer strip 3 and the metal substrate 11. The anodes of the two LED chips 2 are connected to one circuit layer strip 3. The cathodes thereof are commonly connected to another line layer strip 3, so that two kinds of LED chips 2 are connected in parallel, and a pair of pins 7 are drawn out on the metal substrate as an interface for controlling power supply.

Optical positioning holes 8 for auxiliary positioning are also provided on the metal substrate 11 to facilitate the installation and adjustment of the module.

This embodiment is also equipped with a protective cover and a temperature monitoring device. The protective cover includes a frame 41 and a transparent window 42 disposed on the frame 41 or integrated with the frame. The protective cover is arranged on the LED chip. The temperature monitoring device is a temperature sensor 5, and the temperature sensor 5 is electrically connected with the electric control device for controlling the power on or off of the LED module of high-resolution white light.

In this embodiment, a product with consistent color temperature can be obtained through adjustment of the yellow phosphor layer 24 through convenient debugging, so that the cost is lower, the procedure is simpler, and the quality is stable.

Fig. 5 is the light intensity curve figure after the prior art is mixed by blue light and yellow light, and Fig. 6 is the light intensity curve figure after the yellow light that the blue light of the present invention adds yellow fluorescent powder layer and red light mixes color; Through Fig. 5 and Comparison of Fig. 6 shows that the light intensity of the high-resolution white light produced by the utility model is obviously better than that of the prior art.

Example 2,

As shown in Figure 3, the rest is the same as that of Embodiment 1, the difference is that the blue LED chip 21 and the red LED chip 22 are divided into two independent groups, and these two groups of LED chips 2 pass through four different circuit layers insulated from each other. The bars 3 are connected in parallel respectively, and two pairs of pins corresponding to the blue LED chip 21 chipset and the red LED chip 22 chipset are drawn out on the metal substrate 11, so that the blue LED chip 21 chipset and the red LED chip 22 chipset can be controlled by the electric control device respectively. The red LED chip 22 chipset is used for control, which can realize more control expansion functions.

Example 3,

As shown in Figure 4, the rest are the same as in Embodiment 2, the difference is that there is one red LED chip 22, seven blue LED chips 21, and a green LED chip 23 is added, and the arrangement of three kinds of LED chips As shown in Figure 4, the red LED chip 22, the blue LED chip 21 and the green LED chip 23 are divided into three groups and connected in parallel respectively, and lead out three pairs corresponding to the red LED chip 22 chip group, the blue light LED chip 21 chip group and The pin 7 of the green LED chip 23 chip set can utilize the electric control device to control the blue light LED chip 21 chip set, the red light LED chip 22 chip set and the green light LED chip 23 chip set respectively, and can realize more Controls extended functionality.

Example 4,

The rest are the same as in Embodiment 3, except that this embodiment is also provided with an overheating protection device, which is a thermistor connected in series between the LED chip and the power supply, and when the chipset is overheated When the temperature increases, the resistance of the thermistor increases, reducing or even cutting off the power supply of the LED chip to achieve the purpose of controlling its temperature.

Example 5,

As shown in Figure 7 and Figure 8, the rest are the same as in Embodiment 4, the difference is that the blue LED chips 21 are divided into two groups, each group is four, and each group of blue LED chips 21 are connected in series, and then two groups of blue LED chips are connected in series. 21 are connected in parallel, and the blue LED chips 21 after parallel connection are connected in series with the red LED chips 22, and finally lead out a pair of pins 7, and all the LED chips 2 are simultaneously controlled by the electronic control device.

The arrangement of the two-color LED chips 2 is shown in FIG. 7 .

Example 6,

As shown in Figure 9 and Figure 10, the rest are the same as in Embodiment 4, the difference is that the blue LED chips 21 are divided into two groups, each group is four, and each group of blue LED chips 21 are connected in series, and then two groups of blue LED chips are connected in series. 21 are connected in parallel, the group of blue LED chips 21 connected in parallel leads to a pair of pins 7 at last, and the red LED chip 22 leads to a pair of pins 7 alone, so that the electric control device can control the blue LED chip 21 and the red LED chip 22 Control and adjustment are carried out separately, and the control function is expanded.

The arrangement of the two-color LED chips 2 is shown in FIG. 9 .

In the above embodiments, the metal substrate 11 includes a copper substrate, an aluminum substrate and a silver substrate, and a ceramic substrate including an alumina ceramic substrate and an aluminum nitride ceramic substrate may also be used.

White light LED chips or yellow light LED chips can also be added to the LED chipset to adjust the color temperature.

The beneficial effect of adopting this technical solution is: the blue LED chip is provided with a phosphor layer, which can easily change the color temperature, and together with the red LED chip, can be mixed into high-resolution white light, and the LED chip is directly fixedly connected on the metal substrate, Processing techniques such as welding and silver paste crystal bonding can be used, without other processing techniques, low thermal resistance, simple structure of the whole product, and low production cost.

The above is only the preferred embodiment of the utility model, it should be pointed out that, for those of ordinary skill in the art, without departing from the inventive concept of the utility model, some deformations and improvements can also be made. Belong to the protection scope of the utility model.

Claims (10)

1. A high display white LED module, comprising a high thermal conductivity substrate and an LED chip, the high thermal conductivity substrate comprising a metal substrate and a ceramic substrate, characterized in that, The LED chips include at least one red LED chip and at least one blue LED chip; A phosphor layer is provided on the blue LED chip; The LED chip is directly fixedly connected to the high thermal conductivity substrate; A circuit layer is also provided on the high thermal conductivity substrate. When the high thermal conductivity substrate is a metal substrate, an insulating layer is provided between the circuit layer and the metal substrate, and the LED chips are electrically connected through the circuit layer. 2. The high-resolution white LED module according to claim 1, wherein the phosphor layer is a yellow phosphor layer. 3. The high-resolution white LED module according to claim 2, wherein the red LED chip and the blue LED chip are respectively connected in parallel or in series; or the two kinds of LED chips are connected in parallel/series. 4. The LED module with high color display white light according to claim 2, wherein the LED chip further comprises at least one green LED chip, and the red LED chip, the blue LED chip and the green LED chip are respectively Parallel/serial connection; or two of the LED chips are connected in parallel/serial connection, and the other LED chip is connected in parallel alone; or all three LED chips are connected in parallel/serial connection. 5. The high-resolution white LED module according to any one of claims 1 to 4, wherein the high-resolution white LED module may also be provided with a protective cover, and the protective cover includes a frame and a or a transparent window integral with the frame, and the protective cover is arranged on the upper surface of the LED chip. 6. The high-definition white LED module according to claim 5, wherein the high-display white LED module is also provided with a temperature monitoring device, and the temperature monitoring device is connected with the LED for controlling the high-display white light. The electrical signal connection of the electronic control device for power on or off of the module. 7. The high-resolution white LED module according to claim 5, wherein the high-resolution white LED module is also provided with an overheating protection device, and the overheating protection device is a thermistor, and the thermal The sensitive resistor is connected in series between the LED chip and the power supply. 8. The LED module according to claim 5, wherein the metal substrate includes a copper substrate, an aluminum substrate, and a silver substrate, and the ceramic substrate includes an alumina ceramic substrate and an aluminum nitride ceramic substrate . 9. The high-resolution white LED module according to claim 5, wherein the LED chip further comprises a white LED chip or a yellow LED chip. 10 . The high-resolution white LED module according to claim 5 , wherein an optical positioning hole for assisting positioning is further provided on the high thermal conductivity substrate. 11 .

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