CN201828175U - heat pipe radiator - Google Patents

Abstract

The utility model discloses a heat pipe formula radiator, including base plate, container, a plurality of finned tube, liquid filling portion and liquid working medium, its characterized in that: the upper surface of the base plate extends upwards to form the container, the fin tubes extend out of the container, the container is provided with container cavities, the fin tubes are provided with tube cavities, the tube cavities are communicated with the container cavities to form sealed cavities, the liquid working medium is filled in the container cavities of the sealed cavities, and the liquid filling part is arranged on the sealed cavities. This heat pipe formula radiator has base plate, container, a plurality of finned tube and liquid filling portion, and these parts link together and form the integral type structure, simple structure, and the shape rule, liquid working medium dress is in the container intracavity in sealed chamber, and liquid working medium evenly distributed is on the whole base plate face in the container intracavity and from this whole base plate face on the heat absorption, and liquid working medium is big from base plate heat absorption area, and the base plate heat evenly scatters and disappears, has improved radiating efficiency and radiating effect.

Description

Heat pipe radiator

technical field

The utility model relates to a heat sink for small heat transfer elements such as electronics, machinery, and chemical industry, in particular to a heat pipe type heat sink for semiconductor devices such as diodes and printed circuit boards. the

Background technique

The traditional fin-type radiator uses a single thermal conductivity of the material for heat conduction. The heat transfer efficiency is low, the volume is large, the mass is heavy, the material is large, and the cost is high. It is difficult to achieve the purpose of heat dissipation for devices that require low temperature. the

Utility model content

The purpose of the utility model is to provide a heat pipe radiator with simple structure, which can improve heat dissipation efficiency and heat dissipation effect. the

In order to achieve the above purpose, the heat pipe radiator provided by the utility model includes a base plate, a container, several finned tubes, a liquid-filled part and a liquid working medium, and is characterized in that: the upper surface of the base plate extends upwards to form the container, The plurality of finned tubes are extended from the container, the container has a container cavity, the finned tube has a tube cavity, and the tube cavities communicate with the container cavity to form a sealed cavity with an integral structure, so The liquid working medium is installed in the container cavity of the sealed cavity, and the liquid filling part is arranged on the sealed cavity. the

As mentioned above, the heat pipe radiator of the utility model has a base plate, a container, several finned tubes and a liquid-filled part. These parts are connected together to form an integrated structure with a simple structure and a regular shape. In the container cavity, the liquid working medium is evenly distributed on the entire substrate surface in the container cavity and absorbs heat from the entire substrate surface. The liquid working medium absorbs heat from the substrate with a large area, and the heat of the substrate is evenly dissipated, and there is no localized heat distribution. In order to solve the problems of traditional heat pipes independently distributed on the hot substrate, the contact area between the liquid working medium and the heat source of the substrate is small, and there is no heat pipe distribution area on the substrate, the heat dissipation rate is slow, the heat concentration leads to uneven heat dissipation, and local heat is difficult to dissipate, etc. Problems, especially for electronic heating elements such as semiconductor diodes and chips with high heat flux density and concentrated heat distribution, it has better heat dissipation efficiency and heat dissipation effect. the

Preferably, the base plate is in the shape of a plate, the upper surface of the base plate extends upwards to form a container wall, the top edge of the container wall extends inwards to form a container cover, and several through holes are opened on the container cover, and the through holes The edge of the hole extends upwards and then extends inwards to form the finned tube, and the container surrounding wall and container cover form the container. the

Preferably, the upper surface of the base plate located in the surrounding wall of the container extends upwards to form the bottom wall of the container. the

Preferably, the finned tube is in the shape of a flat hollow cuboid. the

Preferably, the finned tube is hollow and trapezoidal in shape with a narrow top and a wide bottom. the

Preferably, the finned tube is in the shape of a hollow circular tube. the

Preferably, the finned tube is provided with several fins, and these fins have a heat dissipation function, which increases the heat dissipation area and enhances the heat transfer effect. the

Preferably, the fins are hollow, and the hollow part communicates with the lumen of the finned tube, and the hollow part communicates with the finned tube, and the vaporized liquid working medium can enter the hollow part of the finned tube Inside, it condenses into a liquid working medium, which flows back to the hot end by gravity or capillary siphon, and reciprocates to achieve the effect of strengthening heat dissipation. the

Preferably, the liquid filling pipe is arranged on the surrounding wall of the container. the

Description of drawings

Fig. 1 is the perspective view of the first embodiment of the utility model heat pipe radiator;

Fig. 2 is the sectional view of I-I place shown in Fig. 1;

Fig. 3 is a cross-sectional view of the second embodiment of the heat pipe radiator of the present invention. the

The reference signs in the figure are explained as follows:

Heat pipe radiator 100/100’ substrate 10

Container 20 Container wall 21

Container cover 22 through hole 221

Container chamber 23 Finned tube 30/30’

Lumen 31/31’ Seal Chamber 32

Fin 33 Liquid-filled part 40

Main body of liquid filling part 41 Sealing part 42

Liquid Working Fluid 50

Detailed ways

In order to describe the technical content, structural features, achieved goals and effects of the present utility model in detail, the following will be described in detail in conjunction with the embodiments and accompanying drawings. the

Please refer to FIG. 1 and FIG. 2, which discloses a first embodiment of the utility model heat pipe radiator 100, including a substrate 10, a container 20, several finned tubes 30, a liquid filling part 40 and a liquid working medium 50, the substrate The upper surface of 10 extends upwards to form a container 20 , from which several finned tubes 30 extend, and liquid working medium 50 is accommodated in the container 20 . The base plate 10, the container 20, the finned tubes 30 and the liquid-filled part 40 are made of the same or different materials with high thermal conductivity. the

The substrate 10 is roughly in the shape of a flat cuboid (the substrate 10 is not limited to a flat cuboid, and other shapes such as ellipsoids and cylinders are also acceptable), and the material is evenly distributed, so that the heat on the substrate 10 is evenly distributed, and the contact with the heat source is an evaporation area. , can transmit heat to the liquid working medium 50 in time, and has good heat conduction performance. the

The upper surface of the substrate 10 extends upwards to form a container wall 21, and the top edge of the container wall 21 extends inwards to form a container cover 22. The container wall 21 and the container cover 22 form a container 20, and the container 20 has a container cavity 23. The container cavity 23 is surrounded by the container wall 21 , the container cover 22 and the base plate 10 . The liquid working medium 50 is contained in the container cavity 23 . A plurality of through holes 221 are opened on the container cover 22 , edges of the through holes 221 extend upwards and then extend inwards to form a plurality of finned tubes 30 . the

The finned tube 30 is in the shape of a flat hollow cuboid and has lumens 31 extending up and down. These lumens 31 communicate with the container cavity 23 of the container 20 to form a sealed cavity 32 of an integral structure. the

The finned tube 30 is provided with several fins 33 , and the fins 33 are formed by extending obliquely upward from the side of the finned tube 30 , of course, they can also be arranged on the finned tube 30 obliquely downward or vertically or in other directions. Several fins 33 are evenly or non-uniformly distributed on the finned tubes 30, and distributed symmetrically or asymmetrically on each finned tube 30, and the fins 33 on two adjacent finned tubes 30 are within a certain height range Staggered arrangement. Fins 33 are distributed on the finned tube 30, and the fins 33 have a heat dissipation function, which increases the heat dissipation area of the heat pipe radiator 100 of the present utility model and enhances the heat dissipation effect. the

When the fins 33 are arranged obliquely upward on the finned tube 30, they can also be made hollow, and the hollow part communicates with the lumen 31 of the finned tube 30, and the liquid working medium 50 can enter the finned tube when it is vaporized. Inside the hollow part of 30, the liquid working substance 50 is condensed and flowed back to the hot end (container cavity 23) by gravity or capillary siphon effect, and the reciprocating cycle achieves the effect of strengthening heat dissipation. the

The liquid filling part 40 is connected with the sealing cavity 32 and has a liquid filling part main body 41 and a sealing part 42. The liquid filling part main body 41 is designed in a hollow tubular shape with a hollow channel (not shown) in the middle, and one end thereof is fixed to the container of the container 20 On the surrounding wall 21, the hollow channel communicates with the sealing cavity 32, and serves as an inlet channel for filling the liquid working medium 50 into the sealing cavity 32. The sealing part 42 seals the other end of the liquid-filled part main body 41, and seals the hollow channel, thereby making the sealing Cavity 32 forms a seal with the hollow passage. The liquid filling part 40 can not only be used as an inlet part for filling the sealed cavity 32 with the liquid working medium 50 , but also can be used as an inlet part for the sealed cavity 32 to be evacuated. the

Of course, the liquid-filled part 40 can also be of other structures or shapes, but it only needs to have an inlet part that fills the liquid working medium 50 as the sealed cavity 32 and evacuates the sealed cavity 32 . Similarly, the liquid filling part 40 can be arranged on the surrounding wall 21 of the container, or on the finned tube 30 . the

When the heat pipe radiator 100 of the present invention is in use, an appropriate amount of liquid working medium 50 is filled into the container 20 through the liquid filling part 40. The liquid working medium 50 can have a high latent heat of vaporization, a suitable vaporization temperature, good fluidity, and stability. Strong fluid working medium, such as organic or inorganic working medium such as methanol and acetone. The liquid working medium 50 completely covers the substrate 10 , and is evenly heated without heat flow dead zone, and each part can achieve the same heat dissipation effect. After the liquid working medium 50 is injected, a certain degree of vacuum can be extracted from the liquid filling part 40 according to the properties of the liquid working medium 50 . the

When the heat pipe radiator 100 of the utility model is in operation, the substrate 10 is in contact with the heat source, and the heat on the heat source is quickly transferred to the substrate 10. Since the liquid working medium 50 contained in the container cavity 23 covers the container cavity 23 in a large area The entire surface of the substrate 10 inside and absorb heat from the entire surface of the substrate 10, the liquid working medium 50 absorbs heat from the substrate 10 with a large area, so the heat on the substrate 10 can be quickly transferred to the liquid working medium 50 covering it , the liquid working medium 50 vaporizes when it reaches the saturated vapor pressure, absorbs heat from the substrate 10 during the vaporization process and takes the heat away, and flows upward along the lumen 31 of the finned tube 30 , at the cold end of the finned tube 30 (upper end) dissipates heat and condenses into liquid working medium 50, which flows back to the hot end (container cavity 23) by gravity or capillary siphon effect, and reciprocates to achieve the effect of strengthening heat dissipation. the

Please refer to Fig. 3, which reveals the second embodiment of the heat pipe radiator 100' of the present invention. This embodiment is similar to the first embodiment, the difference is that the finned tube 30' is a hollow ladder with a narrow top and a wide bottom. shape, the lumen 31' is also in the shape of a trapezoid with a narrow top and a wide bottom. the

The third embodiment of the heat pipe radiator of the present invention is similar to the first embodiment, the difference lies in that the finned tube is in the shape of a hollow circular tube. the

In summary, the heat pipe radiator 100 of the present utility model has an integrated structure, which has a base plate 10, a container 20, several finned tubes 30, a liquid filling part 40, and a liquid working medium 50. It has a regular shape and a simple structure. The liquid working medium 50 in 23 is evenly distributed on the entire surface of the substrate 10, the heat of the substrate 10 is evenly dissipated, and there is no problem such as localized heat distribution, thereby solving the problem that the traditional heat pipe is independently distributed on the hot substrate, and the contact area between the liquid working medium and the heat source of the substrate Small, and there is no heat pipe distribution area on the substrate, there are problems such as slow heat dissipation rate, uneven heat dissipation caused by heat concentration, and local heat is difficult to dissipate, especially for electronic heating elements such as semiconductor diodes and chips with high heat flux density and concentrated heat distribution. The heat dissipation efficiency and heat dissipation effect. the

The heat pipe radiator 100 of the utility model has an integrated structure and a compact structure. There is a certain gap between each finned tube 30, the air interlayer is evenly distributed and the heat flow area is evenly distributed, the internal heat transfer efficiency is high, and the external air flow resistance is small. , Regular, small size. When the heat source substrate 10 starts to work, the liquid working medium 50 of the heat pipe radiator can quickly absorb and vaporize heat, and transfer the heat out, which solves the heat dissipation problem of small heat source devices. the

What is disclosed above is only the preferred embodiment of the heat pipe radiator of the present utility model, and certainly cannot limit the scope of rights of the present utility model with this, so equivalent changes made according to the patent scope of the heat pipe radiator of the present utility model, for example The upper surface of the substrate located in the surrounding wall of the container extends upwards to form the bottom wall of the container, etc., which still fall within the scope of the present invention. the

Claims (9)

1. heat-pipe type radiator, comprise substrate, container, several finned tubes, topping up portion and liquid refrigerant, it is characterized in that: described upper surface of base plate extends upward and forms described container, described several finned tubes are extended out by described container, described container has container chamber, and described finned tube has tube chamber, and these tube chambers and described container chamber are communicated with and form the annular seal space of monolithic construction, described liquid refrigerant is contained in the container chamber of described annular seal space, and described topping up portion is arranged on the annular seal space.

2. heat-pipe type radiator as claimed in claim 1, it is characterized in that: described substrate is tabular, this upper surface of base plate extends upward and forms the container leg, this container leg top margin formation container top that extends internally, offer several through holes on this container top, extending internally after the edge of these through holes extends upward forms described finned tube, and described container leg and container top form described container.

3. heat-pipe type radiator as claimed in claim 2 is characterized in that: the upper surface that is positioned at described container leg of described substrate extends upward the formation vessel bottom wall.

4. heat-pipe type radiator as claimed in claim 2 is characterized in that: described finned tube is the rectangular-shaped of flat hollow.

5. heat-pipe type radiator as claimed in claim 2 is characterized in that: described finned tube is the up-narrow and down-wide ladder type shape of hollow.

6. heat-pipe type radiator as claimed in claim 2 is characterized in that: described finned tube is the pipe shape of hollow.

7. heat-pipe type radiator as claimed in claim 1 is characterized in that: described finned tube is provided with several fins.

8. heat-pipe type radiator as claimed in claim 7 is characterized in that: described fin is hollow form, and the part of its hollow is communicated with the described tube chamber of described finned tube.

9. heat-pipe type radiator as claimed in claim 1 is characterized in that: described topping up pipe is arranged on the described container leg.

Images