CN201828174U - Thin plate type low pressure thermosyphon plate driven by pressure gradient - Google Patents
Thin plate type low pressure thermosyphon plate driven by pressure gradient Download PDFInfo
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Abstract
Description
技术领域technical field
一种压力梯度驱动之薄板式低压热虹吸板,尤指一种可不须设置毛细结构即可传导热量,并更具热传效率的压力梯度驱动之薄板式低压热虹吸板。 A pressure gradient-driven thin-plate low-pressure thermosiphon plate, especially a pressure gradient-driven thin-plate low-pressure thermosiphon plate capable of conducting heat without providing a capillary structure and having higher heat transfer efficiency. the
背景技术Background technique
近年来随着电子半导体产业的蓬勃发展、制程技术的进步,并且在市场需求的趋势下,电子设备逐渐的走向轻薄短小的型态,但在外型尺寸逐渐缩小的过程中,功能及运算能力却是有增无减。像在信息产业中产值最高的笔记型计算机及桌上型计算机在实际运作时,便有多项电子零件产生热量,其中又以中央处理器CPU(Central Processing Unit)所产生之热量最大,此时散热片配合风扇所组成之散热器提供散热功能即扮演保护CPU之重要角色,使CPU维持在正常工作温度以发挥应有之功能,故CPU散热器为现今信息产业中重要之零组件。 In recent years, with the vigorous development of the electronic semiconductor industry, the progress of process technology, and under the trend of market demand, electronic equipment has gradually moved towards thinner and smaller shapes. It is unabated. For example, in the actual operation of notebook computers and desktop computers with the highest output value in the information industry, many electronic components generate heat, among which the CPU (Central Processing Unit) generates the most heat. The heat sink composed of the heat sink and the fan provides heat dissipation function and plays an important role in protecting the CPU, so that the CPU can be maintained at a normal operating temperature to perform its due function. Therefore, the CPU heat sink is an important component in the information industry today. the
所以近年来水冷技术开始被广泛的运用在个人计算机上,虽然水冷技术看似省去了体积庞大的散热片,但其实是将系统内热源的热搜集到工作液体中,然后再藉由热交换器统一与空气做热交换的动作,因为管路长度可以自行变更,所以热交换器的位置也较为弹性,也让热交换器(散热鳍片)的设计不会受到空间上的限制;但是水冷系统需要一个泵浦来推动工作液体流动,而且还需要一个储水箱,所以整个系统仍有泵浦可靠度问题、管路泄露问题...等,但因为个人计算机内的发热组件之热量不断增加,所以水冷式散热技术虽然不尽完美,仍然是目前市场上热管理与控制的最佳选择,不过,这是因为个人计算机之体积较庞大,而且外部也较无空间上限制,但在笔记型计算机就不同了,笔记型计算机目前越来越轻薄短小,根本就无法使用水 的散热技术,所以目前仍然是使用热管来做热转移,然后再使用散热鳍片做热交换的动作,除此之外,也只能尽量降低CPU的耗电功率。有鉴于此,业界无不积极寻找热通量更高的散热技术,以因应接踵而来的庞大散热需求。 Therefore, in recent years, water cooling technology has been widely used in personal computers. Although water cooling technology seems to save the bulky heat sink, it actually collects the heat from the heat source in the system into the working fluid, and then through heat exchange. The heat exchange between the heat exchanger and the air is performed uniformly. Because the length of the pipeline can be changed by itself, the position of the heat exchanger is also relatively flexible, and the design of the heat exchanger (radiating fins) will not be limited by space; however, water cooling The system needs a pump to push the working fluid to flow, and also needs a water storage tank, so the whole system still has pump reliability problems, pipeline leakage problems, etc., but because the heat of the heating components in the personal computer continues to increase , so although the water-cooled heat dissipation technology is not perfect, it is still the best choice for thermal management and control in the market. Computers are different. Notebook computers are getting thinner and smaller, and they cannot use water at all. So far, heat pipes are still used for heat transfer, and then heat dissipation fins are used for heat exchange. In addition, the power consumption of the CPU can only be reduced as much as possible. In view of this, the industry is actively looking for heat dissipation technologies with higher heat flux to meet the ensuing huge demand for heat dissipation.
另外习知技术亦透过热管、均温板等散热组件做为热传组件使用,而制造热管及均温板时系透管于其内壁成型一烧结体,作为毛细结构使用,其主要制程系先将金属(铜质)颗或粒粉末填充于该内壁内,再将其铜质颗粒或粉末压密压实,最后送入烧结炉内施以烧结加工,令该铜质颗粒或粉末形成多孔性质之毛细结构,使之可藉由该烧结体得毛细力,但却也因该烧结体令该热管及均温板之体积存在着一定厚度,而无法有效薄型化;另者所述VC(Vapor chamber)系使用烧结之芯或网格或沟槽等结构,进而产生毛细力现象驱动热管或VC(Vapor chamber)中之汽水循环,但该项结构上之应用制造方式相当复杂,增加制造成本,故甚不适当。 In addition, the known technology also uses heat pipes, vapor chambers and other heat dissipation components as heat transfer components. When manufacturing heat pipes and vapor chambers, a sintered body is formed on the inner wall of the heat pipe and vapor chamber, which is used as a capillary structure. The main process is First fill the inner wall with metal (copper) particles or powder, then compact the copper particles or powder, and finally send it into the sintering furnace for sintering, so that the copper particles or powder become porous The capillary structure of the nature makes it possible to obtain capillary force through the sintered body, but because the sintered body has a certain thickness in the volume of the heat pipe and the chamber, it cannot be effectively thinned; in addition, the VC (Vapor chamber) is to use sintered core or grid or groove structure, and then generate capillary force phenomenon to drive the steam-water circulation in heat pipe or VC (Vapor chamber), but the application and manufacturing method of this structure is quite complicated, which increases the manufacturing cost. So very inappropriate. the
再者,蒸汽芯之选择系为一门学问,选择适当的蒸汽芯系相当重要,该蒸汽芯须要能够保持冷凝液的流速及保持足够的毛细压力以克服重力的影响。 Furthermore, the selection of the steam core is a science, and it is very important to choose the appropriate steam core. The steam core must be able to maintain the flow rate of the condensate and maintain sufficient capillary pressure to overcome the influence of gravity. the
故习知技术之热管或VC(Vapor chamber)具有下列缺点: Therefore, the heat pipe or VC (Vapor chamber) of the prior art has the following disadvantages:
1.加工不便; 1. Inconvenient processing;
2.无法实现薄型化; 2. Unable to achieve thinning;
3.成本较高; 3. High cost;
4.耗费工时。 4. Time-consuming. the
实用新型内容Utility model content
为有效解决上述之问题,本创作之主要目的,系提供不需任何毛细结构即可驱动工作流体传递热量,并且大幅降低制造成本的压力梯度驱动之薄板式低压热虹吸板。 In order to effectively solve the above problems, the main purpose of this invention is to provide a pressure gradient driven thin-plate low-pressure thermosiphon plate that can drive the working fluid to transfer heat without any capillary structure and greatly reduce the manufacturing cost. the
本创作另一目的,系提供一种具有高效率热传效率的压力梯度驱动之薄板式低压热虹吸板。 Another purpose of the present invention is to provide a pressure gradient-driven thin-plate low-pressure thermosiphon plate with high heat transfer efficiency. the
为达上述之目的,本创作系提供一种压力梯度驱动之薄板式低压热虹吸板,系包含:一本体、一板体,该板体对应盖合前述本体,该本体靠近中央处设有一受热区,该受热区两侧具有一蓄压区及一第一流道组,并该蓄压区连接一自由区,该自由区更连接一第一冷凝区及一第二冷凝区,该第一流道 组更连接一第三冷凝区及一第四冷凝区,所述第一、三冷凝区间具有一第二流道组并连通该第一、三冷凝区,所述第二、四冷凝区具有一第三流道组并连通该第二、四冷凝区;藉由适当之减压设计,产生低压端,形成驱动压力差驱动热虹吸板中汽水循环所需之压力梯度不需任何毛细结构即可驱动工作流体传递热量,并且大幅降低制造成本者。 In order to achieve the above-mentioned purpose, this invention provides a pressure gradient-driven thin-plate low-pressure thermosiphon plate, which includes: a body and a plate body, the plate body corresponds to cover the aforementioned body, and a heated There is a pressure accumulating area and a first flow channel group on both sides of the heating area, and the pressure accumulating area is connected to a free area, and the free area is further connected to a first condensation area and a second condensation area. The first flow channel The group is further connected to a third condensation area and a fourth condensation area, the first and third condensation areas have a second flow channel group and communicate with the first and third condensation areas, and the second and fourth condensation areas have a The third channel group is connected to the second and fourth condensation areas; through appropriate decompression design, a low-pressure end is generated to form a driving pressure difference to drive the pressure gradient required for the steam-water circulation in the thermosiphon plate without any capillary structure. Those who drive the working fluid to transfer heat and greatly reduce the manufacturing cost. the
附图说明Description of drawings
图1系为本创作压力梯度驱动之薄板式低压热虹吸板较佳实施例立体分解图; Fig. 1 is the three-dimensional exploded view of the preferred embodiment of the thin-plate low-pressure thermosiphon plate driven by the pressure gradient of this creation;
图2系为本创作压力梯度驱动之薄板式低压热虹吸板较佳实施例立体组合图; Fig. 2 is the three-dimensional assembly diagram of the preferred embodiment of the thin-plate low-pressure thermosiphon plate driven by the pressure gradient of this creation;
图3系为本创作压力梯度驱动之薄板式低压热虹吸板较佳实施例本体俯视图; Fig. 3 is the top view of the body of the preferred embodiment of the thin-plate low-pressure thermosiphon plate driven by the pressure gradient of the present invention;
图4系为本创作压力梯度驱动之薄板式低压热虹吸板第二实施例本体俯视图; Fig. 4 is the top view of the body of the second embodiment of the thin-plate low-pressure thermosiphon plate driven by the pressure gradient of this creation;
图5系为本创作压力梯度驱动之薄板式低压热虹吸板第三实施例本体俯视图; Figure 5 is a top view of the body of the third embodiment of the thin-plate low-pressure thermosiphon plate driven by the pressure gradient of this creation;
图6系为本创作压力梯度驱动之薄板式低压热虹吸板第四实施例本体俯视图; Fig. 6 is the top view of the body of the fourth embodiment of the thin-plate low-pressure thermosiphon plate driven by the pressure gradient of the present invention;
图7系为本创作压力梯度驱动之薄板式低压热虹吸板第五实施例本体俯视图。 Fig. 7 is a top view of the body of the fifth embodiment of the thin-plate low-pressure thermosiphon plate driven by the pressure gradient of the present invention. the
主要组件符号说明 Description of main component symbols
本体1 第一间距112
板体1a 自由区12 Board 1a
受热区11 蓄压区13
凸柱111 蓄压流道131 Protruding
蓄压导流体132 第二刃边2123
第一冷凝区14 第二流道组22 The
第二冷凝区15 第二流道221
第三冷凝区16 第二导流体222 The
第四冷凝区17 第三流道组23 The
第一出口18 第三流道231 The first exit 18 The
第二出口19 第三导流体232 The second exit 19 The
第一流道组21 凹坑3 The
第一流道211 蒸发气泡4 The
第一导流体212 凸肋5
第一顶角2121 第一区间6 First Vertex 2121 First Interval 6
第一刃边2122 第二区间7 The first cutting edge 2122 The second section 7
具体实施方式Detailed ways
本创作之上述目的及其结构与功能上的特性,将依据所附图式之较佳实施例予以说明。 The above-mentioned purpose of this creation and its structural and functional characteristics will be described according to the preferred embodiments of the accompanying drawings. the
请参阅第1、2、3图,如图所示本创作压力梯度驱动之薄板式低压热虹吸板较佳实施例,所述压力梯度驱动之薄板式低压热虹吸板系包含:一本体1、一板体1a; Please refer to Figures 1, 2, and 3. As shown in the figure, a preferred embodiment of the pressure gradient-driven thin-plate low-pressure thermosiphon plate is created. The pressure gradient-driven thin-plate low-pressure thermosiphon plate system includes: a
该板体1a对应盖合该本体1。 The plate body 1a covers the
该本体1具有一受热区11、一第一流道组21、一第二流道组22、一第三流道组23、一自由区12、一蓄压区13、一第一冷凝区14、一第二冷凝区15、一第三冷凝区16、一第四冷凝区17。 The
该受热区11设于该本体1之靠近本体1之中央处,而该受热区11两侧分别连接该第一流道组21及一蓄压区13,并该蓄压区13具有复数蓄压流道131及复数蓄压导流体132,该等蓄压导流体呈间隔排列,该等蓄压流道131形成于两两蓄压导流体132间,并由该蓄压流道131连接前述自由区12。 The
该受热区11具有复数凸柱111并呈间隔排列,该等凸柱111间具有一第 一间距112。 The
该自由区12分别连接前述第一冷凝区14及第二冷凝区15,第一流道组21连接前述第三冷凝区16及第四冷凝区17。 The
所述第二流道组22位于该第一、三冷凝区14、16之间,并由该第三流道组22连通该第一、三冷凝区14、16。 The
所述第三流道组23位于该第二、四冷凝区15、17之间,并由该第三流道组23连通该第二、四冷凝区15、17。 The
所述第一流道组21具有复数第一流道211及复数第一导流体212,该等第一导流体212呈间隔排列,并该第一流道211形成于两两第一导流体212间,所述第二流道组22具有复数第二流道221及复数第二导流体222,该等第二导流体222呈间隔排列,并该第二流道221形成于两两第二导流体222间。 The first
所述第三流道组23具有复数第三流道231及复数第三导流体232,该等第三导流体232呈间隔排列,并该第三流道231形成于两两第三导流体232间。 The third
本较佳实施例中之所述第一、二、三导流体212、222、232系为一长条状肋条。 The first, second, and
请参阅第4图,系为本创作之压力梯度驱动之薄板式低压热虹吸板第二实施例,如图所示,本实施例部分结构及组件间之关连性系与前述较佳实施例相同,故在此不再赘述,唯本实施例与前述较佳实施例不同之处系为所述第一导流体212系为一肋条,该肋条具有一第一顶角2121及一第一刃边2122及一第二刃边2123,所述第一、二刃边2122、2123相交于该第一顶角2121,该等第一流道形成于该等肋条间,并该等第一导流部间具有一第一间距。。 Please refer to Figure 4, which is the second embodiment of the thin-plate low-pressure thermosyphon plate driven by the pressure gradient of this creation. As shown in the figure, the structure of this embodiment and the relationship between components are the same as those of the previous preferred embodiment. , so it will not be repeated here, but the difference between this embodiment and the previous preferred embodiment is that the
请参阅第5图,系为本创作之压力梯度驱动之薄板式低压热虹吸板第三实施例,如图所示,本实施例部分结构及组件间之关连性系与前述较佳实施例相同,故在此不再赘述,唯本实施例与前述较佳实施例不同之处系为所述本体更具有一凸肋5,该凸肋5纵向贯穿该受热区11及该蓄压区13及该第一流道组21。 Please refer to Figure 5, which is the third embodiment of the thin-plate low-pressure thermosyphon plate driven by the pressure gradient of this creation. As shown in the figure, the structure of this embodiment and the relationship between components are the same as those of the previous preferred embodiment. , so it will not be repeated here, but the difference between this embodiment and the above-mentioned preferred embodiment is that the body further has a rib 5, and the rib 5 runs through the
请参阅第6图,系为本创作之压力梯度驱动之薄板式低压热虹吸板第四实施例,如图所示,本实施例部分结构及组件间之关连性系与前述较佳实施例相同,故在此不再赘述,唯本实施例与前述较佳实施例不同之处系为该本体更具有一凸肋5及一第一出口18及一第二出口19,该凸肋5纵向贯穿该受热区11及该蓄压区13及该第一流道组21并将该本体1界定一第一区间6及一第二区间7。 Please refer to Figure 6, which is the fourth embodiment of the thin-plate low-pressure thermosyphon plate driven by the pressure gradient of this creation. As shown in the figure, the structure of this embodiment and the relationship between components are the same as those of the previous preferred embodiment. , so I won’t go into details here, but the difference between this embodiment and the above-mentioned preferred embodiment is that the body has a rib 5, a first outlet 18 and a second outlet 19, and the rib 5 runs through it longitudinally. The
请参阅第7图,系为本创作之压力梯度驱动之薄板式低压热虹吸板第五实施例,如图所示,本实施例部分结构及组件间之关连性系与前述较佳实施例相同,故在此不再赘述,唯本实施例与前述较佳实施例不同之处系为所述该等第一、二、三流道211、221、231间具有复数凹坑3,并所述凹坑3系可呈圆形及方形及三角形及鱼鳞状及几何形状其中任一,于本说明实施例中系以鱼鳞状作为说明,但并不引以为限,前述第一、二、三、四实施例中亦可加入本实施例之于鱼鳞状凹坑3技术特征。 Please refer to Figure 7, which is the fifth embodiment of the thin-plate low-pressure thermosyphon plate driven by the pressure gradient of this creation. As shown in the figure, the structure of this embodiment and the relationship between components are the same as those of the previous preferred embodiment. , so it will not be described in detail here, but the difference between this embodiment and the aforementioned preferred embodiment is that there are
请复参阅第3图,如图所示,本创作较佳实施例及第二、三、四实施例系提出两相压力梯度驱动之薄板式低压热虹吸板循环冷却技术,此方法为自我驱动循环方式,使用的工作流体可为纯水、甲醇、丙酮、R134A等冷媒其中任一,压力梯度驱动之薄板式低压热虹吸板之内部系为抽真空之状态,故于内部所填充之工作流体,于摄氏20~30度即为工作流体之饱和温度;该受热区设置有凸柱111数组产生过热蒸汽气泡4于,流经自由区12而瞬间降压,产生驱动汽水循环所需之压力梯度;另外受到第一、二、三、四冷凝区14、15、16、17经由该第一、二、三流道组之导引,流回受热区11(即具有凸柱111之区域),完成汽水循环。 Please refer to Figure 3 again, as shown in the figure, the preferred embodiment of the invention and the second, third, and fourth embodiments propose a thin-plate low-pressure thermosiphon plate circulation cooling technology driven by two-phase pressure gradients. This method is self-driven Circulation mode, the working fluid used can be any of pure water, methanol, acetone, R134A and other refrigerants, the interior of the thin-plate low-pressure thermosiphon plate driven by pressure gradient is in a vacuum state, so the working fluid filled inside , at 20-30 degrees Celsius is the saturation temperature of the working fluid; the heated area is provided with an array of
即系统利用与发热组件(图中未表示)接触之受热区11产生过热汽,建立驱动汽水循环,即热量导入于本体1受热区11表面再传至该受热区11产生沸腾现象而使部份工作流体汽化,再藉由蒸汽气泡4因过热度产生压力(即蓄压区13压力较大)推动该流体由受热区11至该自由区12再到该第一、二、三、四冷凝区14、15、16、17散热,冷凝后之工作流体藉由蓄压区13加压回到受热区11,即受热区11与发热组件(图中未表示)接触的受热区11吸热而再循环。 That is to say, the system utilizes the
应用蒸发(加压)、冷凝(降压),建立汽液循环所需之压力梯度与循环流道,可避免使用毛细结构,大幅降低VC厚度,大幅改善压力梯度驱动之薄板式低压热虹吸板之均温性,并降低热阻。 Apply evaporation (pressurization) and condensation (depressurization) to establish the pressure gradient and circulation channel required for vapor-liquid circulation, which can avoid the use of capillary structure, greatly reduce the thickness of VC, and greatly improve the thin-plate low-pressure thermosiphon plate driven by pressure gradient temperature uniformity and reduce thermal resistance. the
另外,本创作为确保使流体回流亦可加设有mesh等毛细结构,以帮助工作流体回流至蓄压区或受热区者。 In addition, in order to ensure the backflow of the fluid, capillary structures such as mesh can also be added to help the working fluid return to the pressure storage area or the heating area. the
近年来各大散热厂虽投入许多水冷技术,尤其是主动式之水冷技术,即为帮浦产生循环动力,然而,此种方法容易产生帮浦阀件之可靠度与寿命问题,但本创作所提出之两相压力梯度驱动之薄板式低压热虹吸板循环冷却技术之优点为系统中无动件,因此较无零件耗损及寿命等问题,且不需要外加额外之泵浦及毛细结构,可以节省能源,更可以解决噪音的问题。 In recent years, major cooling factories have invested a lot of water-cooling technology, especially the active water-cooling technology, which is to generate circulating power for the pump. However, this method is prone to problems with the reliability and life of the pump valve parts. The advantage of the thin-plate low-pressure thermosiphon plate circulation cooling technology driven by the two-phase pressure gradient is that there are no moving parts in the system, so there are no problems such as parts wear and tear, and there is no need for additional pumps and capillary structures, which can save Energy, but also can solve the problem of noise. the
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| CN102338582A (en) * | 2010-07-23 | 2012-02-01 | 奇鋐科技股份有限公司 | Thin-plate low-pressure thermosiphon plate driven by pressure gradient |
| CN102338582B (en) * | 2010-07-23 | 2014-03-26 | 奇鋐科技股份有限公司 | Thin-plate low-pressure thermosiphon plate driven by pressure gradient |
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