CN201812003U - Test equipment for electronic components - Google Patents

Abstract

An apparatus for testing electronic components, comprising: the probe comprises a substrate, a connecting plate, a bearing plate, an insulating member and a plurality of probes; the base plate is provided with electric contacts, the connecting plate is fixed on the base plate and is provided with an opening, the bearing plate is fixedly connected to the connecting plate, a first slot and a second slot are arranged at the positions corresponding to the opening, the insulating member is provided with a flat plate and a positioning lug extending from the flat plate, the flat plate is bridged over the first slot, the positioning lug is connected with the second slot in a penetrating manner, the positioning lug is provided with a pin hole, one end of each probe is electrically connected with the electric contacts, and the other end of each probe penetrates through the pin hole to be electrically connected with; by supporting the insulating member on the bearing plate, the screws below the bearing plate can be effectively prevented from loosening and touching the electronic element to be tested, so that the quality of the probe test process and the structural strength of the whole test device are maintained.

Description

Test equipment for electronic components

technical field

The utility model relates to a test device, in particular to a test device for electronic components such as semiconductor wafers.

Background technique

After the semiconductor wafer is manufactured, it must be tested one by one to ensure whether its electrical characteristics, flatness and other important properties meet the requirements; therefore, many kinds of test devices containing probes have been developed. This type of test device is mainly The structure includes: a circuit substrate, an upper positioning plate (upper die), a lower positioning plate (lower die), a spacer between the upper positioning plate and the lower positioning plate, and a spacer for the aforementioned upper die. The positioning plate, the lower positioning plate and the spacer are locked together on a connecting plate (jig) on the circuit substrate; there are multiple electrical contacts on the circuit substrate to make electrical contact with one end of the probe, and the upper positioning plate and the lower positioning plate The boards are respectively provided with pinholes for the probes to pass through, so that the two ends of the probes can respectively protrude from the upper positioning plate and the lower positioning plate to electrically contact the electrical contacts and a wafer to be tested, so that the probe can be tested. Measure the disc for testing.

However, since the probes are conductive and used to transmit electrical signals, the upper positioning plate and the lower positioning plate for the positioning and passage of the probes must be made of insulating materials to avoid short circuits between the probes and the two. Therefore, the industry mostly uses ceramic or plastic materials to make the upper positioning plate and the lower positioning plate, and uses a metal partition to lock the upper positioning plate and the lower positioning plate to the upper and lower surfaces of the metal partition respectively. And increase the overall fixed strength.

However, since the lower positioning plate is made of ceramic or plastic material, and the partition plate is made of metal material, the difference in the two materials will result in different fastening forces when the screws are locked; in addition, the lower positioning plate is located at The bottom of the partition and the closest to the disc to be tested, and the screws are locked into the partition from the lower positioning plate, so during the long-term test, the screws in the lower positioning plate may gradually loosen due to vibration or shaking, plus The attraction of gravity causes the screw to loosen downwards and protrude to touch the wafer to be tested. In severe cases, the screw may even fall off.

Due to the thinning of electronic components, the size of wafers and probes is also increasingly reduced, and the size of the upper and lower positioning plates used to position the probes must also be reduced accordingly; It is more difficult to achieve the same or sufficient screw fastening effect between the upper positioning plate and the lower positioning plate, because sometimes the force of the screws locked into the partition has exceeded the maximum bearing capacity of the upper positioning plate and the lower positioning plate itself. Stress, thus resulting in the rupture of the upper positioning plate and the lower positioning plate.

Therefore, how to solve the above problems becomes the improved goal of the present invention.

Utility model content

An object of the present invention is to provide a testing device for electronic components, which can effectively prevent the screws from loosening and touching the electronic components to be tested, so as to maintain the quality of the probe testing process and the structural strength of the entire testing device.

In order to achieve the above purpose, the utility model provides a test device for electronic components, comprising: a base plate with a plurality of electrical contacts; An opening is provided; a bearing plate is fixedly connected to the connecting plate, and the bearing plate is provided with a stepped first slot and a second slot at the position corresponding to the opening; an insulating member has a flat plate and a self- A positioning protrusion extending from the flat plate, the flat plate straddles the first slot, the positioning protrusion passes through the second slot, and the positioning protrusion is provided with a plurality of pinholes; and a plurality of probes One end of each probe is electrically connected to the electrical contact, and the other end passes through the pinhole to be electrically connected to the electronic component.

In the above-mentioned testing device for electronic components, the supporting plate is provided with a plurality of screw holes in the first slot, and the periphery of the plate of the insulating member is provided with a plurality of through holes aligned with the plurality of screw holes.

In the above-mentioned testing device for electronic components, the insulating member further includes a positioning plate, the positioning plate is stacked on the flat plate and locked to the carrier plate together with the flat plate, and the positioning plate is provided with a A plurality of probe holes are pierced upward by the top of the needle, and a plurality of countersink through holes aligned with the plurality of penetration holes are arranged on the periphery of the positioning plate.

The above-mentioned testing device for electronic components, wherein each of the probes is composed of an upper probe section, a lower probe section, and a lateral connecting section extending between the upper probe section and the lower probe section. Composition, the upper probe section extends upwards to pass through the plurality of probe holes, the lower probe section extends downwards to pass through the plurality of pinholes, the connection between the plurality of probe holes and the plurality of pinholes There is a lateral offset between them.

The above-mentioned testing device for electronic components, wherein, the positioning plate forms a groove on the surface contacting the flat plate, and the flat plate forms a recess on the surface contacting the positioning plate, and the groove and the recess jointly provide the Space required for positioning and bending of multiple probes.

The above-mentioned testing device for electronic components, wherein, the substrate is a piece of metal material, on which there is a printed circuit board, the plurality of electrical contacts are formed on the printed circuit board, and the substrate has a plurality of electrical contacts surrounding the plurality of electrical contacts. assembly holes.

The above-mentioned testing device for electronic components, wherein, the connecting plate is a piece of metal material, and the connecting plate has a plurality of through holes corresponding to the plurality of assembly holes, each of which is a countersunk through hole, and the connecting plate A positioning groove is formed on the periphery of the opening for fixing the bearing plate, and a plurality of fixing holes and two positioning columns are arranged on the upper ring of the positioning groove.

The above-mentioned testing device for electronic components, wherein the carrying plate is a piece of metal material, the carrying plate has a plurality of perforations corresponding to the plurality of fixing holes, and the carrying plate additionally has two positioning holes for the two positioning posts to be embedded in, Each of the through holes of the bearing plate is a countersinked through hole.

Compared with the prior art, the utility model has the following effects:

Since the insulating member of the present utility model is used for positioning and passing out of the probe, and the flat plate of the insulating member is connected to the first slot of the carrier plate in a stepped shape, and the positioning protrusion passes through the first slot of the carrier plate. Two slots, so even if the screws on the insulating member are loose, they will not touch the electronic components to be tested under the carrier board, thereby maintaining the quality of the probe testing process and the structural strength of the entire testing device.

The utility model will be described in detail below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the utility model.

Description of drawings

Fig. 1 is the exploded perspective view of the utility model;

Fig. 2 is a combined perspective view of the utility model;

Fig. 3 is a composite sectional view made along the line 3-3 of Fig. 2;

Fig. 4 is a combined sectional view of the utility model in a working state.

Among them, reference signs

1 test device

10 substrates

11 printed circuit board

111 electrical contacts

12 assembly holes

20 connection plate

21 through holes

22 openings

23 positioning slot

231 fixing hole

232 positioning column

30 load plate

31 perforations

32 limit holes

33 first slot

34 second slot

35 screw holes

40 insulating member

41 flat

411 positioning bump

412 pinholes

413 piercing hole

414 pocket

42 positioning plate

421 probe hole

422 countersunk through hole

423 Groove

50 probes

51 upper probe section

52 lateral connection section

53 Lower Probe Sections

100 screws

110 screw

120 screw

200 electronic components

Detailed ways

The detailed description and technical content of the present utility model will be described as follows with accompanying drawings, but the attached drawings are only for illustration purposes and are not intended to limit the present utility model.

Please refer to Fig. 1 to Fig. 4, which are three-dimensional exploded views of the present utility model. The present utility model provides a testing device for electronic components (hereinafter referred to as "testing device 1"), which includes: a base plate 10, a connecting plate 20 , a carrier plate 30 , an insulating member 40 , and a plurality of probes 50 .

The base plate 10 is made of metal material and is in the shape of a disc, on which there is a printed circuit board 11, on which a plurality of electrical contacts 111 electrically contacted with one end of the probe 50 are arranged. A plurality of assembly holes 12 are arranged around the circuit board 11 .

The connecting plate 20 is made of a metal material and is in the shape of a ring for fixing on the substrate 10. The connecting plate 20 has a plurality of through holes 21 corresponding to the assembly holes 12, and the screws 100 are used to pass through the through holes 21 and the assembly holes 12. The connecting plate 20 can be locked on the bottom surface of the base plate 10; in order to prevent the head of the screw 100 from protruding below the through hole 21, the through hole 21 is made as a countersunk through hole so that the head of the screw 100 can be embedded in the connection The bottom surface of the plate 20; the center of the connecting plate 20 is provided with an opening 22 at the position corresponding to the electrical contact 111, a positioning groove 23 is formed on the periphery of the opening 22, and a plurality of fixing holes 231 and two positioning columns 232 are arranged on the upper ring of the positioning groove 23.

The carrying plate 30 is made of metal material and is disc-shaped, and is used to be fixedly connected to the connecting plate 20. The carrying plate 30 has a plurality of perforations 31 corresponding to the fixing holes 231 and a limiting hole 32 for the positioning column 232 to be embedded; The screw 110 passes through the perforation 31 of the carrier plate 30 and the fixing hole 231 of the connecting plate 20 from below, so that the carrier plate 30 can be locked on the bottom surface of the connecting plate 20; bottom surface, so the perforation 31 is also made into a countersunk perforation; the center of the carrier plate 30 is provided with a stepped first slot 33 and a second slot 34 at the position corresponding to the opening 22 of the connecting plate 20, the first slot A plurality of screw holes 35 are provided around the hole 33 .

The insulating member 40 is made of ceramic or plastic material, and it is installed on the carrying plate 30. The insulating member 40 has a flat plate 41 and a positioning protrusion 411 extending from the flat plate 41. The flat plate 41 is connected to the carrying plate 30. The first slot 33, and the positioning protrusion 411 passes through the second slot 34; the insulating member 40 additionally includes a positioning plate 42 stacked on the flat plate 41, in the embodiment shown in FIG. 1, the positioning plate 42 The peripheral contour is equal to the flat plate 41 and is disc-shaped; the center of the positioning plate 42 is provided with a plurality of probe holes 421 for the probe 50 to pass through, and the periphery of the positioning plate 42 is provided with a plurality of countersunk through holes 422 to prevent screws 120 from The head of the upper surface of the positioning plate 42 is exposed, and the contact surface of the positioning plate 42 and the flat plate 41 is formed with a groove 423; the center of the positioning protrusion 411 is provided with a plurality of pinholes 412 for the probe 50 to pass through. A plurality of piercing holes 413 are provided on the periphery; it should be noted that the countersunk penetration holes 422 and the penetration holes 413 are respectively aligned with the screw holes 35 of the carrier plate 30, so the screws 120 can be used to pass through the countersunk penetration holes in sequence from top to bottom. The hole 422 passes through the hole 413 and is locked in the screw hole 35 so as to lock the positioning plate 42 and the flat plate 41 on the supporting plate 30 sequentially.

It should be noted that, as shown in FIG. 3 , the probes 50 are not in a straight line, but have a lateral bending offset, that is to say, each probe 50 is composed of an upper probe segment 51 , and a lateral connection section 52, and a lower probe section 53, wherein the upper probe section 51 extends upwards and passes through the probe hole 421 of the positioning plate 42, so as to generate electrical contact with the electrical contact 111 of the substrate 10 Contact; the lower probe section 53 extends downwards and passes through the pinhole 412 of the flat plate 41, so as to make electrical contact with the electronic component 200 (Fig. 4). Laterally offset, so the probe hole 421 and the pinhole 412 also have the same lateral offset and are not aligned with each other.

In order to allow all the probes 50 to be bent and positioned in the component 40, the surface of the flat plate 41 that contacts the positioning plate 42 is formed with a recess 414 ( FIG. 3 ). Therefore, the groove 423 on the bottom surface of the positioning plate 42 and the flat plate The recesses 414 on the upper surface of the probe 41 collectively provide enough space for the positioning and bending of the probe 50 .

Although in this embodiment, the positioning of the probe 50 is achieved by the flat plate 41 in the insulating member 40 collaborating with the upper positioning plate 42, other equivalent replacement means can be easily conceived by those skilled in the art. Reach the same effect of the present utility model; For example, only utilize flat plate 41 and probe 50 is welded and fixed in recess 414, then can not need to additionally arrange positioning plate 42; Or, reduce the size of positioning plate 42, make it become A cover plate on the recess 414 of the plate 41 is covered, and the positioning plate 42 is still provided with a probe hole for the upper probe segment 51 to pass through. In this way, the same effect of the component of the present invention can also be achieved.

Of course, the utility model can also have other various embodiments, and those skilled in the art can make various corresponding changes and deformations according to the utility model without departing from the spirit and essence of the utility model, but These corresponding changes and deformations should all belong to the protection scope of the appended claims of the present utility model.

Claims (8)

1. the proving installation of an electronic component is characterized in that, comprising:

One substrate is laid with a plurality of electric terminals;

A plate is fixed on this substrate, and this web joint is to being provided with an opening in a plurality of electric terminals position;

One loading plate is fixed in this web joint, and this loading plate is to offering one first stepped slotted eye and one second slotted eye by aperture position;

One insulating component has dull and stereotyped reaching from the extended location projection of this flat board, and this flat board is connected across this first slotted eye, and this locating convex block is this second slotted eye of cross-under then, and this locating convex block is provided with a plurality of pin holes; And

A plurality of probes, an end of each this probe electrically connects this electric terminal, and the other end then passes this pin hole to electrically connect with described electronic component.

2. the proving installation of electronic component according to claim 1 is characterized in that, this loading plate is provided with a plurality of screws in this first slotted eye, and the dull and stereotyped periphery of this insulating component is provided with a plurality of jack holes that align mutually with these a plurality of screws.

3. the proving installation of electronic component according to claim 2, it is characterized in that, this insulating component also comprises a location-plate, this location-plate is stacked and placed on this flat board and with this flat board and is locked in this loading plate, this location-plate is provided with a plurality of probe aperture that the top for these a plurality of probes passes up, and the periphery of this location-plate is provided with a plurality of counterbore through hole of aliging mutually with these a plurality of jack holes.

4. the proving installation of electronic component according to claim 3, it is characterized in that, each this probe is by probe segment on, probe segment and extend on this side direction linkage section between the probe segment and this time probe segment and formed once, should go up probe segment extends up and passes this a plurality of probe aperture, this time probe segment is extended down and is passed this a plurality of pin holes, has a laterally offset amount between these a plurality of probe aperture and this a plurality of pin holes.

5. the proving installation of electronic component according to claim 4, it is characterized in that, this location-plate has a groove at the surface forming that contacts with this flat board, this flat board has a depression at the surface forming that contacts with this location-plate, and this groove and this depression provide this a plurality of probes location jointly and bend required space.

6. the proving installation of electronic component according to claim 5, it is characterized in that this substrate is a metal material spare, have a printed circuit board (PCB) on it, these a plurality of electric terminals are formed on this printed circuit board (PCB), and this substrate has a plurality of assembly holes around these a plurality of electric terminals.

7. the proving installation of electronic component according to claim 6, it is characterized in that, this web joint is a metal material spare, this web joint has a plurality of through holes that should a plurality of assembly holes, each this through hole is one and immerses oneself in through hole, this opening periphery of this web joint forms for the affixed locating slot of this loading plate, is equipped with a plurality of fixed orifices and two reference columns on this locating slot.

8. the proving installation of electronic component according to claim 7, it is characterized in that, this loading plate is a metal material spare, this loading plate has a plurality of perforation that should a plurality of fixed orifices, this loading plate has two spacing holes that embed for this two reference column in addition, and this perforation of each of this loading plate is one and immerses oneself in to bore a hole.

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