CN201816147U - Semiconductor chip splitting tool - Google Patents

Abstract

Cleaving tool for semiconductor wafers. The utility model relates to a tool for cracking wafers in semiconductor wafer processing. Avoid horizontal displacement of grains. It includes an elastic wafer support plate and a hard glue stick for rolling the wafer to split the wafer into several grains. The wafer support plate is provided with a groove for accommodating the wafer, and the depth of the groove is less than the thickness of the wafer. . The utility model is provided with a shallow groove on the wafer support plate, which is equivalent to providing a positioning blocking step for the overall edge of the wafer. In this way, no matter from which direction the wafer is rolled, it will not cause serial movement and dislocation of the crystal grains. The base plate is arranged at the lower part of the wafer support plate to facilitate the operator to rotate the wafer support plate at an angle of 90° to adapt to the criss-cross grooves and more in line with the operator's habit of exerting force.

Description

Splitting tools for semiconductor wafers

technical field

The utility model relates to a tool for cracking wafers in semiconductor wafer processing.

technical background

With the rapid development of the semiconductor industry, having an operation method that can ensure a good grain appearance is an indispensable technical breakthrough to remove the impoverishment that affects the increase in yield, ensure product reliability, increase corporate image, and enhance corporate competitiveness. .

GPP wafers are cut with a blade, and the maximum cutting speed is 50mm/s under the premise of ensuring a good cutting appearance. For a wafer with a large grain size such as 140mil, the cutting speed is 20mm/s, and the cutting efficiency is low. However, if the laser is used for half-cutting, the speed of laser cutting is 160mm/s. Second, if the O/J wafer is completely cut with a blade, due to the trapezoidal slope at the blade edge, the P/N junction on the side of the grain will show waviness, which will affect the voltage and electrical stability of the grain. . Its three, adopt blade cutting to cause the waste of blue film, the waste of water, gas.

In the semiconductor manufacturing process of the microelectronics industry, after the O/J wafer (the type wafer without grooves) is used in the half-cut state of the blade, or the GPP wafer (the type wafer with glass passivation to protect the P/N junction) is laser cut on the silicon wafer Finally, the cut side of the silicon wafer in a half-cut state is facing downward, and a uniform force perpendicular to the wafer is applied on the opposite side for splitting, which has achieved the purpose of dividing the entire silicon wafer into single small grains that meet the requirements. To this end, we place the wafer on an elastic support plate, cover the wafer with a layer of film, and then use a glue stick to roll the wafer back and forth, focusing on the groove on the wafer. However, during use, we found that during the reciprocating rolling process of the wafer with the glue stick, the split crystal grains will be displaced horizontally, resulting in misalignment.

Utility model content

The purpose of the utility model is to avoid the splitting tool of the semiconductor wafer in which the crystal grains are horizontally displaced.

The technical scheme of the utility model is: comprising an elastic wafer supporting plate, and a hard glue stick for rolling the wafer to split the wafer into several grains, the wafer supporting plate is provided with a groove for accommodating the wafer, so The depth of the groove is less than the thickness of the wafer.

A bottom plate is also provided under the wafer supporting plate.

The utility model is provided with a shallow groove on the wafer support plate, which is equivalent to providing a positioning blocking step for the overall edge of the wafer. In this way, no matter from which direction the wafer is rolled, it will not cause serial movement and dislocation of the crystal grains. The bottom plate is arranged at the bottom of the wafer support plate to facilitate the operator to rotate the wafer support plate at an angle of 90° to adapt to the criss-cross grooves and more in line with the operator's habit of exerting force.

Description of drawings

Fig. 1 is a structural representation of the utility model

Among the figure, 1 is a chip supporting plate, 2 is a groove, 3 is a groove, 4 is a grain, 5 is a glue stick, 6 is a wafer, and 7 is a base plate.

Figure 2 is a top view of Figure 1

Detailed ways

The utility model, as shown in Figures 1 and 2, comprises an elastic wafer support plate 1, and a hard glue stick 5 that rolls the wafer 6 to split the wafer 6 into several crystal grains 4. A groove 2 for accommodating the wafer 6 is provided, and the depth of the groove 2 is smaller than the thickness of the wafer 6 .

A bottom plate 7 is also provided under the wafer supporting plate 1 .

The utility model using method is as follows:

1), the wafer 6 is placed in the groove 2, and then other process means are applied;

2), use the glue stick 5 to roll along the groove 3 on the wafer 6, after the horizontal groove 3 has been rolled, turn the wafer support plate 1, and then roll the longitudinal groove until the wafer 6 along the groove 3 split into several grains 4 .

Claims (2)

1. The cracking tool of semiconductor wafer, comprises an elastic wafer support plate, and the hard glue stick that rolling wafer makes wafer split into several crystal grains, it is characterized in that, described wafer support plate is provided with accommodating wafer A groove, the depth of which is less than the thickness of the wafer. 2. The splitting tool of semiconductor wafer according to claim 1, characterized in that, a bottom plate is also provided under the wafer supporting plate.

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