CN201438805U - radiator - Google Patents

Abstract

A radiator, used to improve the uniformity of air flow through the radiator, the radiator includes a fan and a plurality of cooling fins fixed on both sides of the fan, each cooling fin is arranged vertically to the fan , and each cooling fin has the same height. Compared with the prior art, in the preferred embodiment of the radiator of the present utility model, each cooling fin has the same height so that the airflow can flow through evenly, which improves the uniformity of the airflow passing through the radiator and improves the heat dissipation of the radiator. cooling efficiency.

Description

heat sink

technical field

The utility model relates to a radiator, in particular to a radiator in which a fan is sandwiched between cooling fins.

Background technique

The rapid improvement of integrated circuit technology has led to the vigorous development of the computer industry. Nowadays, computers have been widely used in various industries. With the continuous improvement of application requirements, computers are required to have more efficient performance. Now the running speed of the computer is getting faster and faster, because the running speed of the computer mainly depends on the central processing unit, so the running speed of the central processing unit is also getting faster and faster, but for integrated circuit electronic components such as the central processing unit , the faster the running speed, the more heat it generates per unit time, if it is not discharged in time, it will cause its temperature to rise and cause its operation to be unstable. The industry all installs a heat sink on the surface of the central processing unit to assist its heat dissipation. As the processor is continuously released, the heat sink used by it is also continuously improved. In the existing radiator, a fan is sandwiched between two cooling fins to improve the air cooling efficiency.

For example, as shown in FIG. 1 , a radiator 100a includes a fan 10a and a plurality of cooling fins 20a fixed on both sides of the fan 10a. Each cooling fin 20a is roughly in the shape of a "convex". Several heat pipes 21a are arranged in the middle of the heat dissipation fins 20a. As shown in FIG. 2 , the heat sink 100 a is installed in a computer case, and the heat sink 100 a dissipates heat for a CPU in the computer case. However, since the two sides of the heat dissipation fins 20a are shorter, more air flows out from the two sides of the heat dissipation fins 20a, and the heat density distributed by the heat pipes 21a in the middle of the heat dissipation fins 20a is high. In the area, the airflow has less flow through, which affects the heat dissipation efficiency.

Utility model content

In view of the above, it is necessary to provide a heat sink that can make the airflow flow evenly and improve the heat dissipation efficiency.

A radiator, used to improve the uniformity of air flow through the radiator, the radiator includes a fan and a plurality of cooling fins fixed on both sides of the fan, each cooling fin is arranged vertically to the fan , and each cooling fin has the same height.

Preferably, the area occupied by the cooling fins is not smaller than the cross-sectional area of the fan.

Preferably, each cooling fin is a rectangular sheet.

Preferably, the heat dissipation fins are provided with at least one screw guide hole for installing a screw.

Preferably, the diameter of the screw guide hole is larger than the diameter of the screw.

Preferably, several heat pipes for heat dissipation are inserted on the heat dissipation fins.

Preferably, a ventilation channel for air flow is formed between each adjacent cooling fin.

Compared with the prior art, in the preferred embodiment of the radiator of the present utility model, each cooling fin has the same height so that the airflow can flow through evenly, which improves the uniformity of the airflow passing through the radiator and improves the heat dissipation of the radiator. cooling efficiency.

Description of drawings

Fig. 1 is a perspective view of a radiator in the prior art.

FIG. 2 is a perspective view of a radiator installed in an electronic device in the prior art.

Fig. 3 is a perspective view of a radiator in a preferred embodiment of the present invention.

FIG. 4 is a perspective view of a radiator installed in an electronic device according to a preferred embodiment of the present invention.

Detailed ways

Please refer to FIG. 3 , the radiator 100 according to the preferred embodiment of the present invention includes a fan 10 and a plurality of cooling fins 20 fixed on both sides of the fan 10 . Each cooling fin 20 is vertical to the fan 10 and has the same height and length. Each cooling fin 20 is a rectangular piece. A ventilation channel for air flow is formed between each adjacent cooling fin 20 . The area occupied by the cooling fins 20 is not smaller than the cross-sectional area of the fan 10 .

Several heat pipes 21 for heat dissipation are inserted in the middle of the heat dissipation fins 20 . The heat pipe uses evaporative cooling to make the temperature difference between the two ends of the heat pipe very large, so that the heat can be conducted quickly. A general heat pipe consists of a shell, a liquid-absorbing core and an end cap. The inside of the heat pipe is pumped into a negative pressure state and filled with a suitable liquid, which has a low boiling point and is easy to volatilize. The tube wall has a liquid-absorbing core, which is made of capillary porous material. One section of the heat pipe is the evaporation end, and the other section is the condensation end. When one section of the heat pipe is heated, the liquid in the capillary evaporates rapidly, and the steam flows to the other end under a small pressure difference, and releases heat, recondenses into a liquid, and the liquid flows along the porous The material flows back to the evaporation section by the action of capillary force, and the cycle is endless, and the heat is transferred from one end of the heat pipe to the other end. This cycle is rapid, and heat can be continuously conducted away.

The bottom of the heat sink 100 is provided with a fixing seat 30 for fixing the heat sink 100 in the electronic equipment. The fixing base 30 is provided with four screws 31 at four corners of the heat sink 100 for fastening the heat sink 100 . The radiating fins 20 are respectively provided with a circular screw guide hole 22 corresponding to the screw 31 at its corner for fixing the screw 31 on the fixing seat 30, and the screw guide hole 22 penetrating through the entire heat dissipation fin 20 . The diameter of the screw guide hole 22 is slightly larger than the diameter of the screw 31 .

Please refer to FIG. 4 , the heat sink 100 is installed in a computer to dissipate heat for a central processing unit (not shown) of the computer. Use a screwdriver to pass through the screw guide hole 22 to fix the screw 31 on the computer, that is, fix the radiator 100 in the computer. The computer also includes a number of optical disk drives 40 , a number of power supplies 50 , a number of hard drives 60 , a number of memories 70 , a number of expansion cards 80 and a number of system fans 90 . The system fan 90 is located at one side of the radiator 100 , and the air flows through the radiator 100 and out through the system fan 90 . These elements in the computer work together to accomplish specific tasks and jobs.

The heat pipe 21 quickly transfers the heat of the CPU to the cooling fins 20 , and dissipates heat for the CPU through the cooling fins 20 and the fan 10 . The heat dissipation fins 20 of the heat sink 100 are evenly distributed, so that the airflow generated by the fan 10 evenly flows through the heat sink 100 , and flows out of the computer through the system fan 90 .

It has been verified by tests that the temperature of the central processing unit is lower than before, and the temperature of the radiator 100 is also lowered, and the airflow can evenly flow through the radiator 100, thereby improving the heat dissipation efficiency.

Claims (7)

1. radiator, be used to improve the uniformity of the described radiator of airflow passes, described radiator comprises that a fan and plurality of fixed in the radiating fin of described fan both sides, is characterized in that: the vertical described fan setting of each radiating fin, and each radiating fin has identical height.

2. radiator as claimed in claim 1 is characterized in that: the shared area of described radiating fin is not less than the cross-sectional area of described fan.

3. radiator as claimed in claim 1 is characterized in that: each radiating fin is a rectangle lamellar body.

4. radiator as claimed in claim 1 is characterized in that: described radiating fin offers at least one in order to install the screw guide hole of a screw.

5. radiator as claimed in claim 4 is characterized in that: the diameter of described screw guide hole is greater than the diameter of described screw.

6. radiator as claimed in claim 1 is characterized in that: be inserted with some heat pipes that are used to dispel the heat on the described radiating fin.

7. radiator as claimed in claim 1 is characterized in that: form one between every adjacent radiating fin and be used for the vent passages that air flow stream is crossed.

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