CN201424517Y - Improved electroplating device - Google Patents
Improved electroplating device Download PDFInfo
- Publication number
- CN201424517Y CN201424517Y CN2009201354686U CN200920135468U CN201424517Y CN 201424517 Y CN201424517 Y CN 201424517Y CN 2009201354686 U CN2009201354686 U CN 2009201354686U CN 200920135468 U CN200920135468 U CN 200920135468U CN 201424517 Y CN201424517 Y CN 201424517Y
- Authority
- CN
- China
- Prior art keywords
- plate
- hole
- baffle
- negative
- washer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000009713 electroplating Methods 0.000 title abstract 7
- 239000007788 liquid Substances 0.000 claims abstract description 10
- 238000007747 plating Methods 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 3
- 239000011796 hollow space material Substances 0.000 claims description 2
- 238000004049 embossing Methods 0.000 abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 230000003467 diminishing effect Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000011536 re-plating Methods 0.000 description 1
Images
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- Electroplating Methods And Accessories (AREA)
Abstract
The utility model relates to an electroplating device, in particular to an improved electroplating device used for manufacturing embossing plate. The electroplating device comprises an electroplatingbath filled with electroplating liquid; and a cathode plate and an anode plate are arranged in the electroplating liquid. The utility model is characterized in that the cathode plate and the anode plate are arranged in parallel; a baffle is arranged between the cathode plate and the anode plate, and is parallel with the cathode plate and the anode plate; through holes are formed in the baffle; theaxle centers of the through holes are perpendicular to the surface of the baffle; and the diameters of the through holes near the edges of the baffle are less than that in the middle of the baffle. The utility model provides an improved electroplating device which can enable the plated layer of the embossing plate to be uniform.
Description
Technical field
The utility model relates to a kind of electroplanting device, relates in particular to a kind of improved type electric plating appts that coining plate is used of making.
Background technology
Fake and inferior commodities are seriously disturbed market, infringement human consumer's interests.Be protection manufacturer and human consumer's interests, increase the ability that the human consumer discerns certified products, on product, use anti-counterfeiting mark usually.
The most frequently used anti-counterfeiting mark is exactly a holographic anti-counterfeiting film, and holographic anti-counterfeiting film is generally made by the impression mode, promptly makes the coining plate that has specific identifier in advance, finishes the stamp work of sign then on stamping press.Coining plate itself also is kind of a thin nickel plate, and certain thickness in the back re-plating of front reproducing holographic sign during work, prints to the hologram marking on the metallic nickel version on the holographic anti-counterfeiting film by impression.
The existing plating device comprises negative plate and positive plate, all is arranged in the electroplate liquid in the plating tank, and the coining plate that is plated places between negative plate and the positive plate.The coining plate that this kind device plates out, the coating of its edge always is thicker than the middle part, adjusts the position of current parameters and negative plate, positive plate repeatedly, also can't improve.This kind coining plate is when the impression holographic anti-counterfeiting film, can cause the edge to print to, middle but print less than or the uneven phenomenon of seal, has only the mode that adopts pressure boost, the whole breadth of holographic anti-counterfeiting film all can be printed to, can make deformation of thin membrane again, influence impression quality but pressure is excessive, and because the pressure of edge and middle part is inhomogeneous, the impression effect is difficult to ideal.
The utility model content
The purpose of this utility model is to overcome above-mentioned the deficiencies in the prior art part and provides a kind of and can make the uniform improved type electric plating appts of coining plate coating.
The purpose of this utility model can be achieved through the following technical solutions:
The improved type electric plating appts, comprise plating tank, electroplate liquid is housed in the plating tank, negative plate, positive plate are set in the electroplate liquid, it is characterized in that: negative plate and positive plate be arranged in parallel, and between negative plate and positive plate, plate washer is set, plate washer and negative plate, positive plate be arranged in parallel, and baffle plate is provided with through hole, and the axle center of through hole is perpendicular to the surface of baffle plate, near the through hole of baffle edge, its diameter is less than the through hole at plate washer middle part.
The improved type electric plating appts, it is characterized in that, described plate washer is hollow and " returns " font, described hole is logical to be arranged in several and described plate washer hollow space concentric " mouth " font, the one group of through hole that constitutes each " mouth " font has identical diameter, and from inside to outside, each aperture of organizing through hole reduces gradually.
The improved type electric plating appts is characterized in that, described negative plate has two, is arranged on two sides of positive plate, and described accordingly baffle plate also has two, is arranged between two negative plates and the positive plate.
The improved type electric plating appts is characterized in that, described plate washer is the PC material.
The improved type electric plating appts is characterized in that, described plate washer links together by fastening piece and negative plate, is provided with contour pad between described plate washer and the described negative plate.
The improved type electric plating appts that the utility model relates to, between negative plate and positive plate, be provided with plate washer, part has intercepted the distribution of power line in the electroplate liquid, because through hole near baffle edge, its diameter is less than the through hole at plate washer middle part, so the barriering effect at edge is obvious, and the barriering effect of middle part is less, thereby has reduced the thickness of coining plate edge coating.As a kind of optimal way, when baffle plate was arranged to " returning " font, because the centre is empty, the middle part did not intercept fully, its better effects if.The improved type electric plating appts that the utility model relates to compared with prior art, has and makes the coating effect of uniform that is pressure-plated with forme.
Description of drawings
Fig. 1 is the synoptic diagram of first embodiment of the utility model.
Fig. 2 is the synoptic diagram of the baffle plate of first embodiment of the utility model.
Fig. 3 be among Fig. 2 A to view.
Embodiment
The utility model is described in further detail below in conjunction with accompanying drawing.First embodiment of the present utility model is a kind of improved type electric plating appts, with reference to figure 1, Fig. 2, Fig. 3, the improved type electric plating appts comprises plating tank 101, electroplate liquid 105 is housed in the plating tank 101, negative plate 103 is set in the electroplate liquid 105, positive plate 102, negative plate 103 and positive plate 102 be arranged in parallel, and between negative plate 103 and positive plate 102, plate washer 104 is set, plate washer 104 and negative plate 103, positive plate 102 be arranged in parallel, baffle plate 104 is provided with through hole 1041, the axle center of through hole 1041 is perpendicular to the surface of baffle plate 104, near the through hole 1041 at baffle plate 104 edges, its diameter refers again to Fig. 2 less than the through hole 1041 at plate washer 104 middle parts, by baffle plate 104 middle parts to baffle plate 104 edges, directly progressively the diminishing of through hole 1041.In the present embodiment, described plate washer 104 is " returning " font of hollow, described hole logical 1041 is arranged in several and described plate washer 104 hollow spaces concentric " mouth " font, the one group of through hole 1041 that constitutes each " mouth " font has identical diameter, and from inside to outside, each aperture of organizing through hole 1041 reduces gradually.In the present embodiment, described negative plate 103 has two, is arranged on two sides of positive plate 102, and described accordingly baffle plate 104 also has two, is arranged between two negative plates 103 and the positive plate 102.In the present embodiment, described plate washer 104 is the PC material.In the present embodiment, described plate washer 104 links together by screw and negative plate 103, is provided with contour pad between described plate washer 104 and the described negative plate 103.
Claims (5)
1, improved type electric plating appts, comprise plating tank, electroplate liquid is housed in the plating tank, negative plate, positive plate are set in the electroplate liquid, it is characterized in that: negative plate and positive plate be arranged in parallel, and between negative plate and positive plate, plate washer is set, plate washer and negative plate, positive plate be arranged in parallel, and baffle plate is provided with through hole, and the axle center of through hole is perpendicular to the surface of baffle plate, near the through hole of baffle edge, its diameter is less than the through hole at plate washer middle part.
2, improved type electric plating appts according to claim 1, it is characterized in that: described plate washer is " returning " font of hollow, described hole is logical to be arranged in several and described plate washer hollow space concentric " mouth " font, the one group of through hole that constitutes each " mouth " font has identical diameter, and from inside to outside, each aperture of organizing through hole reduces gradually.
3, improved type electric plating appts according to claim 1, it is characterized in that: described negative plate has two, is arranged on two sides of positive plate, and described accordingly baffle plate also has two, is arranged between two negative plates and the positive plate.
4, improved type electric plating appts according to claim 1 is characterized in that: described plate washer is the PC material.
5, improved type electric plating appts according to claim 1, it is characterized in that: described plate washer links together by fastening piece and negative plate, is provided with contour pad between described plate washer and the described negative plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201354686U CN201424517Y (en) | 2009-03-10 | 2009-03-10 | Improved electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201354686U CN201424517Y (en) | 2009-03-10 | 2009-03-10 | Improved electroplating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201424517Y true CN201424517Y (en) | 2010-03-17 |
Family
ID=42023958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201354686U Expired - Fee Related CN201424517Y (en) | 2009-03-10 | 2009-03-10 | Improved electroplating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201424517Y (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102605397A (en) * | 2011-01-20 | 2012-07-25 | 富葵精密组件(深圳)有限公司 | Electroplating system and electroplating method |
| CN102703961A (en) * | 2012-06-08 | 2012-10-03 | 镇江华印电路板有限公司 | Method for improving electroplating uniformity |
| CN102747400A (en) * | 2012-07-06 | 2012-10-24 | 新疆西部宏远电子有限公司 | Uniform-current-density electrode foil formation method and uneven mesh type insulation board |
| CN102828211A (en) * | 2012-08-30 | 2012-12-19 | 东莞市五株电子科技有限公司 | Electroplating method |
| CN103205786A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | A cathode baffle plate and a production method thereof, and a mask plate electroforming device |
| CN106550546A (en) * | 2016-11-04 | 2017-03-29 | 奥士康精密电路（惠州）有限公司 | A kind of printed wiring panel forming method of low consumption copper |
| CN106555221A (en) * | 2015-09-25 | 2017-04-05 | 盛美半导体设备（上海）有限公司 | Ejecting device |
| CN107761158A (en) * | 2017-10-31 | 2018-03-06 | 广东骏亚电子科技股份有限公司 | A kind of electroplating device and electro-plating method |
| CN108315702A (en) * | 2018-02-05 | 2018-07-24 | 中国科学院长春光学精密机械与物理研究所 | A kind of planar rectangular magnetic control sputtering cathode plating film uniformity adjusting apparatus and method |
| CN109402713A (en) * | 2018-12-19 | 2019-03-01 | 汕头凯星印制板有限公司 | Gantry upright plating line plates cylinder |
| CN110306224A (en) * | 2015-05-14 | 2019-10-08 | 朗姆研究公司 | Using the resistive ion of ion can piercing elements plating metal device and method |
| CN110565128A (en) * | 2019-10-21 | 2019-12-13 | 深圳市正基电子有限公司 | Treatment method for uniformity of electroplated copper on surface of IC packaging substrate |
| CN116411329A (en) * | 2022-06-13 | 2023-07-11 | 先进半导体材料(安徽)有限公司 | Electroplating device |
-
2009
- 2009-03-10 CN CN2009201354686U patent/CN201424517Y/en not_active Expired - Fee Related
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102605397A (en) * | 2011-01-20 | 2012-07-25 | 富葵精密组件(深圳)有限公司 | Electroplating system and electroplating method |
| CN103205786A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | A cathode baffle plate and a production method thereof, and a mask plate electroforming device |
| CN103205786B (en) * | 2012-01-16 | 2016-01-27 | 昆山允升吉光电科技有限公司 | Cathode baffle and preparation method thereof, mask plate electroforming apparatus |
| CN102703961A (en) * | 2012-06-08 | 2012-10-03 | 镇江华印电路板有限公司 | Method for improving electroplating uniformity |
| CN102747400A (en) * | 2012-07-06 | 2012-10-24 | 新疆西部宏远电子有限公司 | Uniform-current-density electrode foil formation method and uneven mesh type insulation board |
| CN102828211A (en) * | 2012-08-30 | 2012-12-19 | 东莞市五株电子科技有限公司 | Electroplating method |
| CN102828211B (en) * | 2012-08-30 | 2016-05-04 | 东莞市五株电子科技有限公司 | Electro-plating method |
| CN110306224A (en) * | 2015-05-14 | 2019-10-08 | 朗姆研究公司 | Using the resistive ion of ion can piercing elements plating metal device and method |
| CN110306224B (en) * | 2015-05-14 | 2022-04-05 | 朗姆研究公司 | Apparatus and method for electroplating metal using ion-resistive ion-permeable components |
| CN106555221A (en) * | 2015-09-25 | 2017-04-05 | 盛美半导体设备（上海）有限公司 | Ejecting device |
| CN106555221B (en) * | 2015-09-25 | 2023-03-07 | 盛美半导体设备(上海)股份有限公司 | Spray head device |
| CN106550546A (en) * | 2016-11-04 | 2017-03-29 | 奥士康精密电路（惠州）有限公司 | A kind of printed wiring panel forming method of low consumption copper |
| CN107761158A (en) * | 2017-10-31 | 2018-03-06 | 广东骏亚电子科技股份有限公司 | A kind of electroplating device and electro-plating method |
| CN108315702A (en) * | 2018-02-05 | 2018-07-24 | 中国科学院长春光学精密机械与物理研究所 | A kind of planar rectangular magnetic control sputtering cathode plating film uniformity adjusting apparatus and method |
| CN109402713A (en) * | 2018-12-19 | 2019-03-01 | 汕头凯星印制板有限公司 | Gantry upright plating line plates cylinder |
| CN110565128A (en) * | 2019-10-21 | 2019-12-13 | 深圳市正基电子有限公司 | Treatment method for uniformity of electroplated copper on surface of IC packaging substrate |
| CN116411329A (en) * | 2022-06-13 | 2023-07-11 | 先进半导体材料(安徽)有限公司 | Electroplating device |
| CN116411329B (en) * | 2022-06-13 | 2024-02-13 | 先进半导体材料(安徽)有限公司 | Electroplating device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100317 Termination date: 20150310 |
|
| EXPY | Termination of patent right or utility model |