CN201413835Y - LED cluster embedding structure - Google Patents
LED cluster embedding structure Download PDFInfo
- Publication number
- CN201413835Y CN201413835Y CN2009201576889U CN200920157688U CN201413835Y CN 201413835 Y CN201413835 Y CN 201413835Y CN 2009201576889 U CN2009201576889 U CN 2009201576889U CN 200920157688 U CN200920157688 U CN 200920157688U CN 201413835 Y CN201413835 Y CN 201413835Y
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- Prior art keywords
- light
- emitting diode
- conductive film
- transparent conductive
- transparent
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 239000011521 glass Substances 0.000 claims abstract description 41
- 238000009413 insulation Methods 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims description 9
- 238000000605 extraction Methods 0.000 claims description 8
- 229920002799 BoPET Polymers 0.000 claims description 3
- 239000005041 Mylar™ Substances 0.000 claims description 3
- 230000002146 bilateral effect Effects 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 238000004020 luminiscence type Methods 0.000 abstract description 3
- 239000012790 adhesive layer Substances 0.000 abstract 2
- 229920001187 thermosetting polymer Polymers 0.000 abstract 2
- 239000010410 layer Substances 0.000 abstract 1
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 2
- 239000005329 float glass Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000005336 safety glass Substances 0.000 description 1
- 239000005315 stained glass Substances 0.000 description 1
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Abstract
The utility model relates to a structure is buried underground to emitting diode cluster, its characterized in that: the LED light source comprises at least one transparent conductive film, wherein a plurality of insulation grooves are formed in the transparent conductive film, at least one LED is electrically connected with the transparent conductive film, two electrodes of the LED are respectively arranged on conductive layers on two sides of each insulation groove, transparent glass plates are symmetrically arranged on two sides of the transparent conductive film, a thermosetting transparent adhesive layer is compounded between each transparent glass plate and the transparent conductive film, and the transparent glass plates and the transparent conductive film are compounded into a whole through the thermosetting transparent adhesive layer. The utility model discloses constitute luminescence unit by LED, realize the demonstration of multicolour pattern to higher structural strength has.
Description
Technical field
The utility model relates to a kind of light-emitting diode cluster and buries structure underground, this structure comprises transparency glass plate, has the transparent conductive film of many bar insulations groove, two electrodes of light-emitting diode are separately positioned on the conductive layer on described insulated trench both sides, and described transparency glass plate and described transparent conductive film are combined into one by the hot curing substratum transparent.
Technical background
Chinese patent 92241885.3 discloses a kind of liquid-crystalline glasses window of adjustable transparent rate, it comprises double glazing and window frame of metal and potentiometer, the shape LCD panel identical with it in clamping between double glazing, transparency electrode in the LCD panel has two lead-out wires to be connected with window frame of metal with the potentiometer centre tap respectively, and the potentiometer two-end-point connects the power supply positive and negative electrode respectively.As long as rotate potentiometer, adjust the voltage that is added on the LCD panel and can change light transmission capacity, realize the purpose of shading.The transparent liquid crystal sheet is by two transparency electrodes, presss from both sides mixed liquid crystal therebetween, and two polarizing filters formations that polarization direction is perpendicular to one another are posted in the outside, and both sides respectively add a slice clear glass.This patent can be widely used in fields such as building decoration, automobile, aircraft, boats and ships, hospital, market, exhibition of cultural relics chamber, museum, but can not the display color pattern.Therefore, need provide a kind of light-emitting diode cluster to bury structure underground.
Summary of the invention
The purpose of this utility model is to provide a kind of light-emitting diode cluster to bury structure underground, this structure comprises transparency glass plate, has the transparent conductive film of many bar insulations groove, paster type light emitting type, two electrodes of light-emitting diode are separately positioned on the conductive layer on insulated trench both sides, described transparency glass plate and described transparent conductive film are combined into one by the hot curing substratum transparent, have higher structural strength; This structure constitutes luminescence unit with light-emitting diode, realizes the demonstration of multicolour pattern.
The purpose of this utility model is realized by following technical proposals: a kind of light-emitting diode cluster is buried structure underground, comprise at least one transparent conductive film, many bar insulations groove is set on this transparent conductive film, at least one piece of light-emitting diode is electrically connected with described transparent conductive film, two electrodes of described light-emitting diode are separately positioned on the conductive layer on described insulated trench both sides, described transparent conductive film bilateral symmetry is provided with transparency glass plate, be compounded with the hot curing substratum transparent between described transparency glass plate and described transparent conductive film, described transparency glass plate and described transparent conductive film are combined into one by the hot curing substratum transparent.
The purpose of this utility model also can be realized by following technical proposals: a kind of light-emitting diode cluster is buried structure underground, comprise that at least one is coated with the glass substrate of conductive layer, many bar insulations groove is set on the described conductive layer, at least one piece of light-emitting diode is electrically connected with described conductive layer, two electrodes of described light-emitting diode are separately positioned on the conductive layer on described insulated trench both sides, compound another transparency glass plate of the one side that is coated with conductive layer of described glass substrate is compounded with the hot curing substratum transparent between glass substrate and the described transparency glass plate.
Compared with the prior art the utility model has following advantage:
1, the utility model constitutes luminescence unit with paster type light emitting type, realizes the demonstration of multicolour pattern.
2, the utility model combines paster type light emitting type and transparent conductive film dexterously, has saved wiring board and supporter, simplifies the structure.
3, the utility model is encapsulated in paster type light emitting type and transparent conductive film in the similar sandwich structure cleverly, and the display unit that this structure is formed has higher structural strength.
Description of drawings
The utility model is described in further detail below in conjunction with drawings and Examples.
Fig. 1 is structural representation of the present utility model (cutaway view)
Fig. 2 is a LED scheme of installation of the present utility model
Fig. 3 is a LED cluster schematic diagram of the present utility model
Embodiment
Embodiment one:
Referring to Fig. 1 and Fig. 2, light-emitting diode cluster of the present utility model is buried structure underground, a transparent conductive film 5 is arranged, many bar insulations groove 501 is set on this transparent conductive film, at least one piece of light-emitting diode 6 is electrically connected with transparent conductive film, if a plurality of light-emitting diode series connection are arranged in the cluster, the positive pole of any light-emitting diode that is connected in series is connected with the negative electricity of another light-emitting diode, two electrodes of described light-emitting diode are separately positioned on the conductive layer 502 on described insulated trench both sides, described transparent conductive film bilateral symmetry is provided with transparency glass plate 1,2, between described transparency glass plate and described transparent conductive film, be compounded with hot curing substratum transparent 3,4, described transparency glass plate and described transparent conductive film are combined into one by the hot curing substratum transparent.In the present embodiment, described light-emitting diode is paster type light emitting type (also claiming LED).Light-emitting diode and transparent conductive film use conducting resinl 7 bonding, and conducting resinl is conductive silver paste or conductive carbon paste normally.
In the present embodiment, described transparent conductive film is that single face is coated with a kind of in the mylar of ITO (tin indium oxide) or ATO (antimony oxidation tin) conductive layer.On the described transparent conductive film extraction electrode is set, this extraction electrode is electrically connected with a controller by lead.
In the present embodiment, when transparent conductive film is switched on, the light-emitting diode cluster will demonstrate bright and colourful pattern.
In the present embodiment, transparent conductive film adopts Hunan three just to produce the ITO-PET conducting film, is the flexible mylar that single face is coated with ITO (tin indium oxide) conductive layer; Transparency glass plate is 6 millimeters thick Pilkington float glasses, 0.4 millimeter EN film that the hot curing substratum transparent selects for use Nanjing Jin Yongfa to produce.
In the present embodiment, described controller is a kind of in the switch of regular tap, point driving switch, push-button switch, light-operated switch, audio-switch, infrared switch, remote control switch, network control switch, tap changer, frequency modulation switch, accent duty ratio switch, harmonic shape switch and single-chip microcomputer or computer or cyclelog control.In the present embodiment, light-emitting diode of each group series connection should adopt constant-current source to drive, or seals in current-limiting resistance and drive with constant pressure source.
The utility model patent adopts the mode of hot curing, hot curing transparent adhesive tape synusia is clipped between glass and the transparent conductive film, hot curing transparent adhesive tape synusia is 60～150 ℃ of fusings, the cooling back is glued together glass and transparent conductive film, increase buffering effect, improved the ability that opposing is impacted, when being subjected to impacting, even the glass fragmentation is not splashed yet, reach the national standard (GB9962-1999) of safety glass.
Used hot curing substratum transparent can be PVB (polyvinyl butyral resin), EVA (ethene-polyvinyl acetate), EN (modified EVA), epoxy resin etc. in the utility model, and wherein a kind of can make the form of film.
In the utility model, described transparency glass plate can be a kind of in float glass plate, armorplate glass, coloured glass plate, transparent plastic sheet, the colored transparent plastic plate.
Embodiment two:
Present embodiment is further open on the embodiment basis, and the part identical with embodiment one is not described in detail.Present embodiment is to use the light-emitting diode cluster topology to show the technical scheme of Arabic numerals, referring to Fig. 3, Fig. 3 has only shown the Rankine-Hugoniot relations of light-emitting diode and transparent conductive film, transparency glass plate and substratum transparent have been omitted, about the technology contents of transparency glass plate and substratum transparent can not be repeated in this description referring to embodiment one.In the present embodiment, earlier a slice transparent conductive film is cut into the shape of numeral 8, cut out 5 bar insulation grooves 501 then on the horizontal stripe with top, the width of insulated trench is 0.5 millimeter, every bar insulation groove is provided with 6, five pieces of light-emitting diodes of one piece of light-emitting diode and is arranged on the 5 bar insulation grooves according to serial arrangement.Electrode 8 is set on the transparent conductive film of high order end and low order end.The middle part of numeral 8 and the identical setting of bar shaped transparent conductive film of bottom with top.The vertical bar of the upper left quarter of numeral 8, the vertical bar of upper right quarter, the vertical bar of lower left quarter, the vertical bar of right lower quadrant also cut out 5 bar insulation grooves respectively according to the horizontal stripe scheme, according to serial arrangement 5 pieces of light-emitting diodes are set.Respectively electrode is connected on the controller by lead, the switching programme according to controller is set can realize the demonstration of digital 1-0.The present embodiment controller belongs to the prior art category.Be not described at this.
Embodiment three:
Present embodiment is further open on the embodiment basis, and the part identical with embodiment one is not described in detail.The light-emitting diode cluster of present embodiment is buried structure underground and is comprised that at least one is coated with the glass substrate of conductive layer, many bar insulations groove is set on the described conductive layer, at least one piece of light-emitting diode is electrically connected with described conductive layer, two electrodes of described light-emitting diode are separately positioned on the conductive layer on described insulated trench both sides, at compound another transparency glass plate of the one side that is coated with conductive layer of described glass substrate, be compounded with the hot curing substratum transparent between described glass substrate and the described transparency glass plate.Also can be used for showing the technical scheme of embodiment two disclosed Arabic numerals according to the structure of present embodiment, in the present embodiment, described light-emitting diode is a paster type light emitting type.In the present embodiment, on the described conductive layer extraction electrode is set, this extraction electrode is electrically connected with a controller by lead.
Claims (7)
1, a kind of light-emitting diode cluster is buried structure underground, it is characterized in that: comprise at least one transparent conductive film, many bar insulations groove is set on this transparent conductive film, at least one piece of light-emitting diode is electrically connected with described transparent conductive film, two electrodes of described light-emitting diode are separately positioned on the conductive layer on described insulated trench both sides, described transparent conductive film bilateral symmetry is provided with transparency glass plate, be compounded with the hot curing substratum transparent between described transparency glass plate and described transparent conductive film, described transparency glass plate and described transparent conductive film are combined into one by the hot curing substratum transparent.
2, light-emitting diode cluster according to claim 1 is buried structure underground, it is characterized in that: described transparent conductive film is the mylar that a kind of single face is coated with conductive layer.
3, light-emitting diode cluster according to claim 1 is buried structure underground, it is characterized in that: described light-emitting diode is a paster type light emitting type.
4, light-emitting diode cluster according to claim 1 is buried structure underground, it is characterized in that: on the described transparent conductive film extraction electrode is set, this extraction electrode is electrically connected with a controller by lead.
5, a kind of light-emitting diode cluster is buried structure underground, it is characterized in that: comprise that at least one is coated with the glass substrate of conductive layer, many bar insulations groove is set on the described conductive layer, at least one piece of light-emitting diode is electrically connected with described conductive layer, two electrodes of described light-emitting diode are separately positioned on the conductive layer on described insulated trench both sides, at compound another transparency glass plate of the one side that is coated with conductive layer of described glass substrate, be compounded with the hot curing substratum transparent between described glass substrate and the described transparency glass plate.
6, light-emitting diode cluster according to claim 5 is buried structure underground, it is characterized in that: described light-emitting diode is a paster type light emitting type.
7, light-emitting diode cluster according to claim 5 is buried structure underground, it is characterized in that: on the described conductive layer extraction electrode is set, this extraction electrode is electrically connected with a controller by lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201576889U CN201413835Y (en) | 2009-06-01 | 2009-06-01 | LED cluster embedding structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201576889U CN201413835Y (en) | 2009-06-01 | 2009-06-01 | LED cluster embedding structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201413835Y true CN201413835Y (en) | 2010-02-24 |
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ID=41715716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201576889U Expired - Lifetime CN201413835Y (en) | 2009-06-01 | 2009-06-01 | LED cluster embedding structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201413835Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104157772A (en) * | 2014-08-27 | 2014-11-19 | 江苏华英光宝科技股份有限公司 | Uprightly-mounted-chip inversion 360-degree light emitting LED light source with LED lamp filaments surrounded at will |
| WO2016029809A1 (en) * | 2014-08-26 | 2016-03-03 | 蔡鸿 | Led direct-lit backlight source and light emission method therefor |
| CN108367544A (en) * | 2016-10-28 | 2018-08-03 | 法国圣戈班玻璃厂 | Method of the manufacture for the composite glass of motor vehicle |
-
2009
- 2009-06-01 CN CN2009201576889U patent/CN201413835Y/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016029809A1 (en) * | 2014-08-26 | 2016-03-03 | 蔡鸿 | Led direct-lit backlight source and light emission method therefor |
| CN104157772A (en) * | 2014-08-27 | 2014-11-19 | 江苏华英光宝科技股份有限公司 | Uprightly-mounted-chip inversion 360-degree light emitting LED light source with LED lamp filaments surrounded at will |
| CN108367544A (en) * | 2016-10-28 | 2018-08-03 | 法国圣戈班玻璃厂 | Method of the manufacture for the composite glass of motor vehicle |
| US11077650B2 (en) | 2016-10-28 | 2021-08-03 | Saint-Gobain Glass France | Method for producing a composite pane for a motor vehicle |
| CN108367544B (en) * | 2016-10-28 | 2022-03-11 | 法国圣戈班玻璃厂 | Method of making composite glass panels for motor vehicles |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP02 | Change in the address of a patent holder |
Address after: 102600 No. 6 loyalty Road, Xihongmen Town, Beijing, Daxing District Patentee after: Beijing Zhongzhi Tonghui Technology Co., Ltd. Address before: 100071 Beijing city Fengtai District No. 50 a Patentee before: Beijing Zhongzhi Tonghui Technology Co., Ltd. |
|
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 102600 No. 6 loyalty Road, Xihongmen Town, Beijing, Daxing District Patentee after: The many intelligence in Beijing shines together Science and Technology Co., Ltd. Address before: 102600 No. 6 loyalty Road, Xihongmen Town, Beijing, Daxing District Patentee before: Beijing Zhongzhi Tonghui Technology Co., Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100224 |