CN201417415Y - Industrial computer - Google Patents

Abstract

The utility model relates to an industrial computer, it includes a preceding frame, a backshell, a machine board and a display screen, and wherein this machine board lock attaches at this backshell, and display screen is located between preceding frame and the machine board, and the frame locks each other with the backshell before with to form five waterproof industrial computers. The method is characterized in that: the rear shell comprises a memory heat dissipation block; and the machine plate comprises a welding surface and a part surface, wherein the part surface comprises an input/output connection port, the welding surface comprises a memory, the whole thickness of the machine plate is reduced, and the position of the memory corresponds to the memory heat dissipation block so as to reduce the service temperature of the memory. Through the utility model discloses, can provide better radiating efficiency under the condition of restriction board height to can avoid the part of industrial computer to destroy or crash into machine.

Description

industrial computer

technical field

The utility model relates to an industrial computer, in particular to a five-sided waterproof industrial computer.

Background technique

Industrial computers for general industrial purposes, such as industrial computers used in counter ordering or checkout in supermarkets or restaurants, are prone to being splashed with liquid, so they have higher requirements for water resistance. The current industry standard is "five-sided waterproofing", that is, the five sides of the front, back, left, right and top must be waterproof.

However, in order to achieve the effect of waterproofing on five sides, the closed casing is likely to cause high temperature inside the computer and make it difficult to dissipate heat. Industrial computers for industrial use take a long time to start up, and may even need to run for 24 hours. The inside of the computer is prone to high temperature due to the operation of parts, so it is very necessary to have a good heat dissipation mechanism. At present, the general heat dissipation mechanism usually uses multiple heat dissipation fins on the rear shell to dissipate the high temperature inside the computer. However, the heat dissipation effect of this mechanism is limited. It is necessary to provide an industrial computer that can dissipate heat more effectively to avoid parts running Parts may be damaged or crash due to high temperature.

Contents of the invention

The main purpose of the utility model is to provide an industrial computer that can dissipate heat more effectively. Another object of the present utility model is to provide an industrial computer that can avoid parts damage or crash. Another object of the present invention is to provide an industrial computer with a height-limited board.

In order to achieve the above object, the utility model provides an industrial computer, which includes a front frame, a rear case, a machine board and a display screen, wherein the machine board is locked on the rear case, and the display screen is located on the front frame Between the board and the front frame and the rear case are locked together to form a five-sided waterproof industrial computer. The utility model is characterized in that: the rear shell includes a memory cooling block; and the board includes a welding surface and a part surface, wherein the part surface includes an input/output connection port (I/O port), the welding The surface includes a memory, thereby reducing the overall thickness of the machine board, and the position of the memory corresponds to the heat dissipation block of the memory, so as to reduce the operating temperature of the memory.

In one embodiment, the memory cooling block is integrally formed with the rear case. In another embodiment, the memory cooling block is a copper block attached and fixed on the rear case.

The rear case also includes a heat dissipation space, and the heat dissipation space is located between an edge of the board and a top surface of the rear case.

In this embodiment, the rear case further includes a groove channel, and the groove channel extends to a bottom surface of the rear case, so that the input/output connection port is covered in the groove channel.

When the display screen is a 15-inch display screen, the height of the heat dissipation space is substantially about 6.0 cm, and the height of the groove channel is substantially about 5.6 cm.

The rear case also includes a plurality of heat dissipation fins, and the plurality of heat dissipation fins are located on an outer surface of the rear case to reduce the operating temperature of the memory. Preferably, the plurality of cooling fins extend from a middle of the top surface of the rear case to the bottom of the outer surface.

In a preferred embodiment, the rear case further includes a hard disk accommodating space and a hard disk cover. The hard disk accommodating space is used for accommodating a hard disk, and the hard disk accommodating space is located on the outer surface of the rear shell, and the hard disk is fixed in the hard disk accommodating space by a plurality of elastic bodies. The hard disk cover covers the hard disk accommodating space, so that the outer surface of the rear shell forms a waterproof surface. Preferably, the cooling gasket is located between the hard disk and the hard disk cover. The essence of the plurality of elastic bodies is heat-resistant rubber or heat-proof sponge, or the essence of the plurality of elastic bodies can be springs or shrapnel fixed around the hard disk accommodating space to provide elastic force so that the hard disk is fixed in the hard disk accommodating space, and There is no need to use any screws to lock the hard disk, and the elastic force provided by the elastic body can also be used to provide better shock absorption effect. The rear shell also includes a part cooling pad, and the part cooling pad is located between the memory and the memory cooling block. The motherboard also includes a processor, and the rear shell also includes a processor cooling block, and the processor is located at a position corresponding to the processor cooling block, so as to reduce the operating temperature of the processor through the processor cooling block. The machine board also includes a crystal, and the rear shell also includes a crystal cooling block, and the crystal is located at a position corresponding to the crystal cooling block, so as to reduce the operating temperature of the crystal through the crystal cooling block.

The beneficial technical effect of the utility model is that it can provide better heat dissipation efficiency under the condition of limiting the height of the machine board, and can avoid damage or crash of parts of the industrial computer.

Description of drawings

Fig. 1 is a perspective view of the appearance of the industrial computer of the present invention.

Fig. 2 is an exploded view of the machine board and the rear case of the industrial computer of the present invention.

FIG. 3 is a partial cross-sectional view according to FIG. 1 .

FIG. 4 is a perspective view showing the assembly of the hard disk and the rear case according to the rear case of the present invention.

Wherein, the reference signs are explained as follows:

Industrial computer 100 front frame 1

Rear shell 2 Display screen 3

Motherboard 4 Processor cooling copper block 9

Crystal cooling block 21 Memory cooling block 22

The welding surface of the machine board 41 The part surface of the machine board 42

Input/Output Connection Port 421 Processor 411

Memory 412 Heat dissipation space 26

The edge of the machine board 400 The top surface of the rear shell 29

Groove channel 23 Bottom surface 27 of rear shell

Cooling fins 28 Hard disk storage space 24

Hard disk cover 25 Hard disk 5

Elastomer 61-62 Heat dissipation gasket 8, 91-93, 81

Detailed ways

In order to make the above and other objects, features and advantages of the present invention more comprehensible, specific embodiments of the present invention are enumerated below, together with the accompanying drawings, for a detailed description as follows.

The main purpose of the utility model is to provide an industrial computer that can dissipate heat more effectively. Another object of the present utility model is to provide an industrial computer that can avoid parts damage or crash. Another object of the present invention is to provide an industrial computer with a height-limited board.

Please refer to FIG. 1 and FIG. 2 at the same time. The utility model provides an industrial computer 100 , which includes a front frame 1 , a rear case 2 , a board 4 and a display screen 3 . The board 4 is locked on the rear case 2 . The display screen 3 is located between the front frame 1 and the machine board 4, and the front frame 1 and the rear case 2 are locked together to form a five-sided waterproof industrial computer.

Please refer to FIG. 2 , the rear case 2 of the present invention includes a memory cooling block 22 . In one embodiment, as shown in the figure, the memory cooling block 22 is integrally formed with the rear case 2 . In another embodiment, the memory cooling block is a copper block (not shown) attached and fixed on the rear case 2 . In addition, as shown in FIG. 2 , the rear case 2 of the present invention may further include a processor cooling copper block 9 and a crystal cooling block 21 . The processor cooling copper block 9 can be used for cooling the processor 411 of the motherboard 4 . The crystal cooling block 21 can provide cooling for crystals (not shown) such as the south bridge and the north bridge. Although the rear case 2 of FIG. 2 only shows a memory cooling block 22, a crystal cooling block 21 and a groove 210 for accommodating the cooling copper block 9, this is not intended to limit the present invention, and there can be many kinds of cooling blocks or grooves. form, or for heat dissipation of other different heat-generating parts, and the memory or crystal can also use the heat-dissipating copper block housed in the groove to achieve the effect of heat dissipation (not shown).

Traditionally, only parts are arranged on the welding surface of the general machine board, and the part surface is used to weld and fix the parts on the machine board through a tin furnace. As shown in Figure 2, the machine board 4 of the present utility model also includes a welding surface 41 and a part surface 42, but the part surface 42 of the machine board 4 of the present utility model includes at least one input/output connection port 421, and the machine The soldering surface 41 of the board 4 includes a processor 411 and a memory 412 . In addition to the memory 412 , the present invention also arranges crystals (not shown) such as a processor 411 and north and south bridges on the soldering surface 41 of the motherboard 4 . By arranging parts such as processor 411 and memory 412 to the parts surface 42 of the machine board 4, that is, the design will rearrange the parts of different heights to reduce the overall thickness of the machine board 4, for small-sized (for example 15 o'clock) industrial As far as the computer 100 is concerned, the internal space should be able to obtain a larger heat dissipation space due to the reduced size of the board 4 . The location of the memory 412 on the soldering surface 41 of the motherboard 4 corresponds to the memory cooling block 22 of the rear case 2 , so as to reduce the operating temperature of the memory 412 . Although the utility model only takes the memory 412 as an example for illustration, those skilled in the art can understand that the crystal cooling block 21 formed integrally with the back shell 2 or the heat dissipation copper block 9 not integrally formed can also be used for various heating parts ( For example, crystals or processors such as the South and North Bridges mentioned above) achieve heat dissipation.

As shown in FIG. 2 , the processor cooling copper block 9 is fixed in the groove 210 of the rear case 2 instead of integrally formed with the rear case 2 . Preferably, each component (memory, processor or crystal) is in contact with the heat dissipation blocks 22, 21 and the heat dissipation copper block 9 respectively through a component heat dissipation pad 91-93, so as to provide a better heat dissipation effect. Part heat dissipation pads 91-93 can be made of elastic rubber material, which not only provides heat dissipation effect, but also provides elastic shock absorption effect.

Please refer to FIG. 2 , the rear case 2 of the present invention further includes a cooling space 26 . Please refer to FIG. 3 , the heat dissipation space 26 is located between an edge 400 of the motherboard 4 and the top surface 29 of the rear case 2 . Preferably, when the display screen 3 is a display screen at 15, the height L1 of the cooling space 26 is substantially about 6.0 centimeters, so that the distance between the machine board 4 and the top surface of the rear shell 2 is increased to provide convection space, thereby achieving Better cooling effect.

Please return to FIG. 2 , in this embodiment, the rear case 2 further includes a groove channel 23 . As shown in FIG. 3 , the groove channel 23 extends to the bottom surface 27 of the rear case 2 , so that the input/output connection port 421 is covered in the groove channel 23 . Preferably, when the display screen 3 is a display screen at 15 o'clock, the height L2 of the groove channel 23 is substantially about 5.6 cm. Because the height of the groove channel 23 is relatively high, although the industrial computer 100 provides the function of waterproofing on five sides, the height of the wall surface of the groove channel 23 should make the non-waterproof bottom surface also have the ability to prevent liquid from being splashed from below. Function.

Please refer to FIG. 3 and FIG. 4 at the same time. The rear case 2 of the present invention also includes a plurality of heat dissipation fins 28, and the plurality of heat dissipation fins 28 are located on an outer surface of the rear case 2 to reduce the processor 411 or the memory 412 ( Figure 2) Use temperature. Preferably, the cooling fins 28 extend from a middle of the top surface 29 of the rear case 2 to the bottom of the outer surface. Since the lines of the heat dissipation fins 28 of the present invention are elongated, the path of heat flow increases when the heat flow rises, so the heat dissipation effect of the heat dissipation fins 28 can be better than the traditional one.

In a preferred embodiment, as shown in FIG. 4 , the rear case 2 further includes a hard disk accommodating space 24 and a hard disk cover 25 . The hard disk accommodating space 24 is used for accommodating a hard disk 5 . The hard disk accommodating space 24 of the present invention is located on the outer surface of the rear case 2, and the hard disk 5 is fixed in the hard disk accommodating space 24 by a plurality of elastic bodies 61-62. A plurality of elastic bodies 61 - 62 are essentially heat-proof rubber or heat-proof sponge placed around the hard disk accommodating space 24 to provide elastic force to fix the hard disk 5 in the hard disk accommodating space 24 . Alternatively, the plurality of elastic bodies can be essentially springs or springs (not shown) fixed around the hard disk accommodating space 24 to provide elastic force to fix the hard disk 5 in the hard disk accommodating space 24 . Therefore, the utility model does not need to use any screws to lock the hard disk 5, and can also use the elastic force provided by the elastic bodies 61-62 to provide a better shock-absorbing effect.

The hard disk cover 25 covers the hard disk accommodating space 24 so that the outer surface of the rear case 2 forms a waterproof surface. Preferably, the rear case 2 further includes a heat dissipation gasket 8 , and the heat dissipation gasket 8 is located between the hard disk 5 and the hard disk cover 25 . In addition, the rear case 2 may further include another heat dissipation gasket 81 located between the hard disk 5 and the hard disk accommodating space 24 . The cooling gasket 8 or 81 can also be a cooling gasket made of elastic rubber.

However, the above-mentioned embodiments are only illustrative to illustrate the principles and effects of the present utility model, and are not intended to limit the scope of the present utility model. Any person skilled in the art can make modifications and changes to the embodiments without violating the technical principle and spirit of the present utility model. The scope of protection of the rights of the utility model should be described in the scope defined by the appended claims.

Claims (15)

1. An industrial computer comprising a front frame, a rear case, a machine board and a display screen, wherein the machine board is locked on the rear case, and the display screen is located between the front frame and the machine board , the front frame and the rear shell are locked to each other to form a five-sided waterproof industrial computer, which is characterized in that: The rear case includes a memory cooling block; and The board includes a soldering surface and a component surface, wherein the component surface includes an input/output connection port, and the soldering surface includes a memory, so as to reduce the overall thickness of the board, and the position of the memory corresponds to the heat dissipation of the memory blocks to reduce the usage temperature of this memory. 2 . The industrial computer according to claim 1 , wherein the rear case further comprises a heat dissipation space, and the heat dissipation space is located between an edge of the motherboard and a top surface of the rear case. 3 . 3. The industrial computer according to claim 2, wherein the rear case further comprises a grooved passage extending to a bottom surface of the rear case so that the input/output connection port is covered within the channel of the groove. 4. The industrial computer according to claim 3, wherein the display screen is a 15 o'clock display screen, the height of the cooling space is substantially about 6.0 cm, and the height of the groove channel is substantially about 5.6 cm. 5. The industrial computer according to claim 2, wherein the rear case further comprises a plurality of heat dissipation fins, and the plurality of heat dissipation fins are located on an outer surface of the rear case to reduce the temperature of the processor or the memory. Operating temperature. 6 . The industrial computer as claimed in claim 5 , wherein the plurality of cooling fins extend from a middle of the top surface of the rear case to a bottom of the outer surface. 7. The industrial computer according to claim 5, wherein the rear case further comprises a hard disk accommodation space and a hard disk cover, the hard disk accommodation space is used to accommodate a hard disk, and the hard disk accommodation space is located at the and the hard disk is fixed in the hard disk accommodating space through a plurality of elastic bodies, and the hard disk cover covers the hard disk accommodating space, so that the outer surface of the rear shell forms a waterproof surface. 8. The industrial computer according to claim 7, wherein the plurality of elastic bodies are substantially heat-resistant rubber or heat-resistant sponge. 9. The industrial computer according to claim 7, wherein the plurality of elastic bodies are substantially springs or shrapnel. 10 . The industrial computer as claimed in claim 7 , wherein the rear case further comprises a heat dissipation gasket, and the heat dissipation gasket is located between the hard disk and the hard disk cover. 11 . 11 . The industrial computer according to claim 1 , wherein the memory cooling block is integrally formed with the rear case. 12 . The industrial computer according to claim 1 , wherein the memory cooling block is a copper block attached and fixed on the rear case. 13 . 13 . The industrial computer according to claim 11 or 12 , wherein the rear case further comprises a component heat dissipation gasket, and the component heat dissipation gasket is located between the memory and the memory heat dissipation block. 14 . 14. The industrial computer according to claim 13, wherein the board further comprises a processor, and the rear case further comprises a processor cooling block, and the processor is located at a position corresponding to the processor cooling block position to reduce the operating temperature of the processor through the processor cooling block. 15. The industrial computer according to claim 13, wherein the board further comprises a crystal, and the rear case further comprises a crystal cooling block, and the crystal is located at a position corresponding to the crystal cooling block to pass through The crystal cooling block is used to reduce the operating temperature of the crystal.

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