CN201403146Y - Small CMOS image acquisition module - Google Patents

Abstract

Disclosed is a miniature CMOS image sampling module group, comprising a lens, a lens seat, a flexible circuit board and a CMOS photographic chip. Wherein the lens is connected with the lens seat through threads, the CMOS photographic chip is installed on the flexible circuit board in a way of sealing, a capacitance with the positioning function or a resistance positioning electronic component arearranged on the flexible circuit board. The positioning electronic component not only is the requirement of the circuit design, but also can play the effect of positioning. The utility model spurns the traditional positioning method which uses a positioning column and a positioning hole to position, but uses a CMOS photographic chip corner and the positioning electronic component to position, theminimum size can be 4. 5millimeter x4. 5millimeter x2. 8millimeter. Meanwhile the structure is compact, the production materials are saved, the reliability of an image module group is increased. In addition, the service life and the anti-interference and anti-seismic performance of the module group are improved.

Description

Small CMOS image acquisition module

technical field

The utility model relates to a CMOS image acquisition module, in particular to a miniaturized small CMOS image acquisition module.

Background technique

CMOS is the abbreviation of Complementary Metal Oxide Semiconductor (Complementary Metal Oxide Semiconductor), which refers to a technology used to manufacture large-scale integrated circuit chips or chips manufactured by this technology. The CMOS image acquisition module converts light, shadow, and image into electronic digital signals. Each pixel of the CMOS lens includes an amplifier and an A/D conversion circuit. Multiple positioning electronic components are compressed within the surface area of the photosensitive area of a single pixel. The working principle of CMOS image acquisition module is to use photodiode to convert light and electricity. The light collected by the object through the lens (Lens) passes through the CMOS photosensitive integrated circuit to convert the optical signal into an electrical signal, and after conversion by the internal ISP (image signal processor), it becomes a digital image signal output. It is then sent to the digital signal processor for processing and converted into standard YUV and RGB format image signals.

CMOS image acquisition modules can be divided into two categories: fixed-focus modules and auto-focus modules. The fixed-focus module is a CMOS image acquisition module that fixes the position of the lens and keeps the focusing distance after the lens group and chip are assembled. During the production of this type of module, it is necessary to calculate the focusing distance of the lens according to the photosensitive characteristics of the Sensor, and fix the Sensor to the relative distance of the lens. With the development of technology, Sensor's photosensitive wafers are getting smaller and smaller, which also makes CMOS image acquisition module manufacturers need to design small CMOS image acquisition modules that are compatible with Sensor's characteristics. With the advent of the 3G era, there are two development trends in camera modules; one is high-end pixels with auto focus or optical zoom, and the other is small CMOS image capture modules.

Due to the limitations of 3G mobile phone output bandwidth and mobile phone space, the traditional positioning method of positioning pillars and positioning holes can only use low-pixel small CMOS image acquisition modules for the front camera to realize the function of video calls.

Utility model content

The purpose of this utility model is to design an ultra-small, ultra-thin, and cost-saving small-scale CMOS image acquisition module according to the characteristics of CMOS photosensitive chips getting smaller and smaller; to meet the current development direction of CMOS image acquisition modules, in the future Gained a leading edge in 3G mobile phone camera modules.

The utility model is realized in this way: the small-sized CMOS image acquisition module includes a lens, a mirror holder, a circuit board and a CMOS photosensitive chip, the lens and the mirror holder are connected by threads, the CMOS photosensitive chip is packaged on the circuit board, and the circuit board is provided with Positioning electronics as a positioning function. Positioning electronic components is not only a need for circuit design, but also plays a role in positioning.

The positioning electronic components can be capacitors or resistors.

The lens module composed of the lens and the lens holder is provided with a metal protective cover outside; the function of the shield cover is to increase the shock resistance of the module and prolong the service life; and it can effectively shield electromagnetic interference, which has a good effect on the electromagnetic compatibility of the product. protection.

The circuit board is a flexible circuit board (FPC), the back side of the flexible circuit board connected with the CMOS photosensitive chip is provided with a reinforcing steel sheet, and the back side of the connection pad of the flexible circuit board is provided with a reinforced hard plastic board. The reinforcing steel sheet plays a role in strengthening the protection of the CMOS photosensitive chip and the flexible circuit board PFC, and the hard plastic board also plays the role of protecting the FPC board.

The mirror base and the flexible circuit board are bonded and connected by thermosetting glue.

The lens and mirror base are bonded and fixed by glue after the focus is fixed.

A metal protective cover is arranged outside the lens module composed of the lens and the lens holder.

The utility model is based on the wafer technology of the most advanced CMOS photosensitive chip, adopts the CSP module packaging technology, and miniaturizes the CMOS image acquisition module, and the minimum size can be 4.5mm×4.5mm×2.8mm. In the meantime, from design to production and assembly, advanced production and packaging technology is adopted to ensure the quality of ultra-small and ultra-thin CMOS image acquisition modules. In the positioning of the lens group composed of the lens and the lens holder and the CMOS photosensitive chip, a bold breakthrough has been made, abandoning the traditional positioning method of positioning posts and positioning holes, and adopting the corners of the CMOS photosensitive chip and positioning electronic components for positioning, with high positioning accuracy and accuracy.

Description of drawings

Fig. 1 is the assembling schematic diagram of the utility model small-sized CMOS image acquisition module;

Fig. 2 is the top view of camera lens in the utility model small-sized CMOS image acquisition module;

Fig. 3 is the partial sectional view of lens in the small-sized CMOS image acquisition module of the present invention;

Fig. 4 is the top view of the mirror seat of the small-sized CMOS image acquisition module of the present invention;

Fig. 5 is a sectional view of part A-A of the small-sized CMOS image acquisition module of the present invention;

Fig. 6 is the front view of the utility model small-sized CMOS image acquisition module;

Fig. 7 is a cross-sectional view of part C-C of the small CMOS image acquisition module of the present invention.

Fig. 8 is a structural diagram of a small CMOS image acquisition module of the present invention equipped with a metal protective cover.

Detailed ways

The small CMOS image acquisition module of the present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

A small CMOS image acquisition module, as shown in FIGS. 1 to 8 , includes a lens 1 , a mirror holder 2 , a circuit board 7 and a CMOS photosensitive chip 4 . The lens 1 is connected to the mirror base 2 through threads. The CMOS photosensitive chip 4 is packaged on the circuit board 7, and the circuit board 7 is provided with a positioning electronic component 6 as a positioning function. Positioning the electronic component 6 is not only a need for circuit design, but also can play a role in positioning. The positioning electronic component 6 cooperates with the corners of the CMOS photosensitive chip 4 for positioning, and the positioning accuracy is high and accurate. The positioning electronics 6 can be capacitors or resistors. What the circuit board 7 adopts is a flexible circuit board (FPC) with light and small characteristics. The back side of the connection between the flexible circuit board and the CMOS photosensitive chip 4 is provided with a reinforcing steel sheet 3, and the reinforcing steel sheet 3 strengthens the rigidity of the flexible circuit board. Protect the CMOS photosensitive chip 4 packaged on the flexible circuit board. The back side of the connection pad of the flexible circuit board is provided with a reinforced hard plastic board 5, and the hard plastic board 5 also plays a role in protecting the FPC board. The mirror base 2 and the flexible circuit board are bonded and connected by thermosetting glue. Lens 1 and lens mount 2 are fixed by glue after testing the fixed focus. A metal protective cover 8 is arranged outside the lens module composed of the lens 1 and the lens holder 2 . The function of the metal protective cover 8 is to increase the anti-seismic performance of the module and prolong the service life; and it can effectively shield electromagnetic interference, which has a good guarantee for the electromagnetic compatibility of the product.

To protect the lens module.

In order to achieve ultra-small and ultra-thin miniaturization, the utility model requires each component to be matched with high precision, which can be completed through the following process:

1. Mounting: First, the CMOS photosensitive chip 4 can be directly mounted on a flexible circuit board (FPC) by reflow soldering.

2. Assembly: the lens 1 and the mirror base 2 are assembled together after cleaning, the mirror base 2 is positioned on the flexible circuit board by positioning the electronic component 6, and the mirror base 2 and the flexible circuit board are bonded together through the black glue process. Fixtures can be used to fix the mirror base 2 and the flexible circuit board together through a heat curing furnace to ensure that there will be no gaps and warping angles and other undesirable phenomena. The furnace temperature can be set according to the properties of the black glue. Use a thermosetting glue with better curing performance, and set the furnace temperature at 75°C to 80°C for 15 minutes.

3. Focusing: Use the CMOS image acquisition module focusing test system to adjust the focus of the module, and adjust the focal length of the module to the best position. Take out the cured CMOS image acquisition module from the heat curing furnace and test the effect of the CMOS image acquisition module in the special production test focusing system.

4. Fixed focus: The lens 1 can be sealed with UV light curing glue, and it can be cured by UV light curing machine, and the module will not appear out of focus. The advantage of using UV light-curing adhesive is that it does not require high temperature, fast curing speed, convenient and easy to operate, which is very conducive to mass production and high efficiency.

After the fixed focus is completed, the production of ultra-small and ultra-thin CMOS image acquisition modules has basically been completed. This is followed by inspection and packaging of the finished product. The entire production process avoids the production bottleneck of multiple mobile phone camera modules, so that the production efficiency is improved and the quality is well guaranteed. It not only conforms to the future development direction of CMOS photosensitive chips, but also caters to the trend of the mobile phone camera market.

The utility model is based on the wafer technology of the most advanced CMOS photosensitive chip, adopts the CSP module packaging technology, and miniaturizes the CMOS image acquisition module, and the minimum size can be 4.5mm×4.5mm×2.8mm. In the meantime, from design to production and assembly, advanced production and packaging technology is adopted to ensure the quality of ultra-small and ultra-thin CMOS image acquisition modules. In the positioning of the lens group composed of the lens 1 and the mirror base 2 and the CMOS photosensitive chip 5, a bold breakthrough has been made, abandoning the traditional positioning method of positioning posts and positioning holes, and adopting the positioning of the corners of the CMOS photosensitive chip 5 and positioning electronic components, and the positioning accuracy High and accurate.

Claims (7)

1. A small CMOS image acquisition module, including a lens, a mirror base, a circuit board and a CMOS photosensitive chip. Functional positioning of electronic components. 2. The small CMOS image acquisition module according to claim 1, characterized in that: the positioning electronic components are capacitors or resistors, 3. The small CMOS image acquisition module according to claim 1, wherein the circuit board is a flexible circuit board, and a reinforcing steel sheet is provided on the back of the flexible circuit board connected to the CMOS photosensitive chip. 4. The small CMOS image acquisition module according to claim 3, characterized in that: a reinforced hard plastic board is arranged on the back of the connection pad of the flexible circuit board. 5. The small CMOS image acquisition module as claimed in claim 1, characterized in that: the mirror base and the flexible circuit board are bonded and connected by thermosetting glue. 6. The small CMOS image acquisition module as claimed in claim 1, characterized in that: said lens and lens base are glued and fixed after the focus is fixed. 7. The small CMOS image acquisition module according to claim 1, characterized in that: the lens module composed of the lens and the lens holder is provided with a metal protective cover outside.

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