CN201402004Y - A semiconductor refrigeration heat exchange device - Google Patents

Abstract

The utility model discloses a semiconductor refrigerating heat exchange device, which comprises a semiconductor refrigerating sheet, one end of which is connected to the central point of a heat collector, the other end is provided with a radiator, and a fan is arranged under the radiator, and is characterized in that it is also included in the A booster pump is arranged above the heat collector, the inlet of the booster pump is connected with the outlet of the heat collector, and a hose is also included, the inlet of the hose is connected with the outlet of the booster pump, and the outlet of the hose is connected with the outlet of the heat collector. The inlet of the heat collector is connected; and a temperature control circuit is also included, and the temperature control circuit is connected with the semiconductor refrigerating sheet. The utility model has the following beneficial effects: 1. The heat exchange can be carried out evenly and fully. 2. Able to fit in many smaller spaces. 3. The temperature control range is large and the control precision is high. 4. Cooling and heating speed is fast. 5. Less power consumption.

Description

A semiconductor refrigeration heat exchange device

technical field

The invention relates to a semiconductor refrigeration heat exchange device, in particular to a semiconductor refrigeration heat exchange device utilizing liquid circulation to dissipate heat.

Background technique

In today's life, people are more and more pursuing the quality of life. Facing hot summer and cold winter, people hope to have a cool working and living environment. Although people can stay in an air-conditioned environment, the air conditioner is bulky, relatively expensive, and powerful, and is generally used in larger spaces. For example, when the car is parked outdoors in winter and summer, the temperature inside the car is quite high. When people first enter the car, the temperature of the car seat cushion is quite high. Even if there is an air conditioner, it will take a while to adjust the temperature.

At present, some of the similar products adopt the direct conduction of the cold or heat of the semiconductor refrigeration sheet to the seat cushion, so that the cold and heat are not evenly transmitted, and the temperature cannot be fully balanced; In terms of output, if the human body sits on the hole where the seat cushion is pressed, there will be no wind blowing out, and the human body will not feel good heat exchange, and the comfort is not good.

Semiconductor refrigeration, also known as electronic refrigeration, or thermoelectric refrigeration, is a discipline developed from the 1950s between refrigeration technology and semiconductor technology. It uses P-N junctions composed of special semiconductor materials to form thermocouple pairs and produce Pearl Post effect, that is, a new type of refrigeration method through direct current refrigeration, is known as the world's three major refrigeration methods together with compression refrigeration and absorption refrigeration. The working operation of the semi-conductor refrigerating sheet uses direct current, which can be cooled and heated, and the cooling or heating can be realized on the same refrigerating sheet by changing the polarity of the direct current. The size of heat absorption and heat release is determined by the size of the current and the number of pairs of semiconductor materials N and P. Semiconductor cooler (TE), also called thermoelectric cooler, is a kind of heat pump. Its advantage is that it has no sliding parts, and it is used in some occasions where the space is limited, the reliability is high, and there is no refrigerant pollution. The thermal inertia of the semiconductor cooling chip is very small, and the cooling and heating time is very fast. When the hot end has good heat dissipation and the cold end is empty, the cooling chip can reach the maximum temperature difference in less than one minute after being powered on. The semiconductor refrigeration chip is a current-transforming chip. Through the control of the input current, high-precision temperature control can be realized. Coupled with temperature detection and control means, it is easy to realize remote control, program control, and computer control, and it is convenient to form an automatic control system.

For this reason, someone has applied for a patent (application number: 200720117328.7). The patent mainly includes a semiconductor refrigeration device, a circulating water pump, a cold/heat storage device and a single-chip microcomputer measurement control unit. The device uses semiconductor refrigeration, small in size and fast in heating. However, how the liquid in the circulating water pump flows is not considered, and the seat cushion is connected to the cold/heat storage device to cool down in this plan, and the device is used as a heat exchange part in the plan, and it should generally be a metal material, which is obviously related to the seat cushion. The installation is not very convenient, so the actual work of the program does not work well.

Utility model content

The utility model mainly solves the following problems: in a small space, the temperature needs to be adjusted, and it can ensure better temperature control, rapid cooling and heating, and proper power consumption.

The above-mentioned technical problems of the present invention are mainly solved by the following technical solutions: a semiconductor refrigeration heat exchange device, comprising a semiconductor refrigeration sheet and a heat collector, one end of the semiconductor refrigeration sheet is connected to the central point of the heat collector, The other end is provided with a radiator, and a fan is arranged under the radiator, and it is characterized in that a booster pump is arranged above the heat collector, the inlet of the booster pump is connected with the outlet of the heat collector, and a soft The inlet of the hose is connected with the outlet of the booster pump, and the outlet of the hose is connected with the inlet of the heat collector; a temperature control circuit is also included, and the temperature control circuit is connected with the semiconductor refrigeration sheet. Thermal silica gel is coated between the radiator and the semiconductor cooling sheet. When the device is in a cooling state, the radiator works with the fan to dissipate the heat. After the booster pump pressurizes the refrigerant liquid, the refrigerant liquid can accelerate circulation and improve heat dissipation efficiency. The hose is connected to the equipment that needs to adjust the temperature and can be well adapted to the shape of the equipment. The heat exchange and semiconductor refrigeration part can be separated from the hose part for easy installation.

Preferably, the heat collector is a vortex heat dissipation pipe.

Preferably, the shape of the hose is a swirl shape.

Preferably, heat insulating materials are arranged outside the heat collector.

The heat collector pipe spirally surrounds, expands from the central area to the surroundings, and connects with the semiconductor cooling sheet at the central point, so that the heat exchange with the semiconductor cooling sheet can be more efficient. At the same time, a layer of heat insulating material is wrapped on the outside of the collector to avoid heat loss. The material of the hose can be flexibly selected according to the temperature-controlled equipment. Generally, you can choose metal or plastic and other finished products. The shape is set as a vortex, which can be evenly and fully conducted to the controlled equipment. The hose can be easily folded into other shapes as needed.

Preferably, the heat collector, the booster pump and the hose contain refrigerant liquid. At present, there are many refrigerant liquid products on the market, and the refrigerant liquid can be selected according to factors such as product grade and cost.

Preferably, the temperature range of the heat collector is 15°C-40°C. The temperature control circuit controls the temperature at the end of the collector by controlling the current flowing through the semiconductor cooling sheet. Due to the characteristics of semiconductor refrigeration, the accuracy of temperature control can be well guaranteed.

Preferably, the heating or cooling of the peltier cooler can be controlled by a temperature control circuit. A voltage switching circuit is included in the temperature control circuit. The voltage switching circuit can be composed of a double-pole double-throw switch, which mainly realizes the change of the voltage direction of the semiconductor refrigeration chip, thereby changing the current direction of the semiconductor refrigeration chip. Due to the characteristics of the semiconductor refrigerating sheet, the temperature control circuit can change whether the refrigerating sheet is cooling or heating by changing the direction of the current flowing through the semiconductor refrigerating sheet.

Due to the characteristics of the above-mentioned semiconductor refrigerating sheet, the utility model also has small volume and fast heating/cooling. Moreover, the cost is relatively low and the power consumption is small. It is especially suitable for sleeping blankets, seats and car seats and cushions for household use.

Therefore, the utility model has the following beneficial effects: 1. Even and sufficient heat exchange can be performed. 2. It can fit many smaller spaces. 3. The temperature control range is large and the control precision is high. 4. Fast cooling and heating speed. 5. Less power consumption.

Description of drawings

Accompanying drawing 1 is the structural representation of the utility model

Accompanying drawing 2 is the structural representation of heat collector of the present utility model

Accompanying drawing 3 is the structural representation of flexible pipe of the present utility model

Accompanying drawing 3 is the block diagram of temperature control circuit of the present utility model

Detailed ways

The technical solutions of the present invention will be further specifically described below through the embodiments and in conjunction with the accompanying drawings.

As shown in Figures 1 and 3, a semiconductor refrigeration heat exchange device includes a semiconductor refrigeration sheet 20, one end of which is connected to the central point of the heat collector 10, a radiator 30 is provided at the other end, and a fan 31 is arranged below the radiator. It is characterized in that a booster pump 40 is arranged above the heat collector, the inlet 41 of the booster pump is connected with the outlet 12 of the heat collector, and a hose 50 is included, and the inlet 51 of the hose is connected with the booster pump. The outlet 42 of the pressure pump is connected, and the outlet 52 of the hose is connected with the inlet 11 of the heat collector; a temperature control circuit is also included, and the temperature control circuit is connected with the semiconductor refrigeration sheet. Thermal silica gel is coated between the radiator and the semiconductor cooling sheet. When the device is in a cooling state, the radiator works with the fan to dissipate the heat. After the booster pump pressurizes the refrigerant liquid, the refrigerant liquid can accelerate circulation and improve heat dissipation efficiency. The hose is connected to the equipment that needs to adjust the temperature and can be well adapted to the shape of the equipment. The heat exchange and semiconductor refrigeration part can be separated from the hose part for easy installation.

As shown in Figure 2, the heat collector is a vortex heat dissipation pipe. The heat collector pipe spirally surrounds, expands from the central area to the surroundings, and connects with the semiconductor cooling sheet at the central point, so that the heat exchange with the semiconductor cooling sheet can be more efficient.

As shown in Figure 3, the shape of the hose is swirl. The material of the hose can be flexibly selected according to the temperature-controlled equipment. Generally, you can choose metal or plastic and other finished products. The shape is set as a vortex, which can be evenly and fully conducted to the controlled equipment. The hose can be easily folded into other shapes as needed.

As shown in FIG. 4 , heat insulating material 60 is arranged on the outside of the heat collector. At the same time, a layer of heat insulating material is wrapped on the outside of the collector to avoid heat loss.

Refrigerant liquid is contained in the heat collector, the booster pump and the hose. At present, there are many refrigerant liquid products on the market, and the refrigerant liquid can be selected according to factors such as product grade and cost.

The temperature range of the collector is 15°C-40°C. The temperature control circuit controls the temperature at the end of the collector by controlling the current flowing through the semiconductor cooling sheet. Due to the characteristics of semiconductor refrigeration, the accuracy of temperature control can be well guaranteed.

The heating or cooling of the peltier cooler can be controlled by a temperature control circuit. A voltage switching circuit is included in the temperature control circuit. The voltage switching circuit can be composed of a double-pole double-throw switch, which mainly realizes the change of the voltage direction of the semiconductor refrigeration chip, thereby changing the current direction of the semiconductor refrigeration chip. Due to the characteristics of the semiconductor refrigerating sheet, the temperature control circuit can change whether the refrigerating sheet is cooling or heating by changing the direction of the current flowing through the semiconductor refrigerating sheet.

The fans and booster pumps are connected to and controlled by the CPU. When the cooling plate is cooling or heating, the CPU controls the operation of the booster pump and the fan, and when the temperature of the collector reaches the preset value, the CPU controls the booster pump and the fan to stop running to reduce noise.

The man-machine interface and display module connected with the CPU are mainly used to set the temperature of the heat collector.

The temperature sensor is arranged on the surface of the heat collector to detect its surface temperature. It is also possible to set multiple temperature sensors as required to detect the temperature more accurately and in multiple directions.

If the utility model is applied to the car seat cushion, the DC power supply can be directly connected with the 12V power supply of the car. The hose fits under the seat cushion, which can be placed on top of the car seat. The semi-conductor refrigerating sheet and the radiator part can be installed separately behind the car seat or in other convenient spaces.

The specific embodiments described herein are merely illustrative of the spirit of the invention. Those skilled in the art to which the present invention belongs can make various modifications or supplements to the described specific embodiments or adopt similar methods to replace them, but they will not deviate from the spirit of the present invention or go beyond the definition of the appended claims range.

Claims (8)

1. semiconductor refrigerating heat-exchange device, comprise semiconductor chilling plate, heat collector, one end of described semiconductor chilling plate links to each other with the center of heat collector, the other end is provided with radiator, it is characterized in that also being included in described heat collector top and be provided with booster pump, the inlet of booster pump links to each other with the outlet of described heat collector, also comprises flexible pipe, the inlet of flexible pipe links to each other with described supercharging delivery side of pump, and the outlet of flexible pipe links to each other with the inlet of described heat collector; Also comprise temperature-control circuit, temperature-control circuit links to each other with described semiconductor chilling plate.

2. a kind of semiconductor refrigerating heat-exchange device according to claim 1 is characterized in that described heat collector is an eddy current shape radiating tube.

3. a kind of semiconductor refrigerating heat-exchange device according to claim 1, what it is characterized in that described flexible pipe is shaped as the eddy current shape.

4. according to claim 1 or 2 or 3 described a kind of semiconductor refrigerating heat-exchange devices, it is characterized in that described heat collector, booster pump and flexible pipe communicate and constitute the liquid cyclic space of a sealing, and accommodate refrigerating fluid.

5. a kind of semiconductor refrigerating heat-exchange device according to claim 1 is characterized in that described heat collector outer setting has heat-barrier material.

6. a kind of semiconductor refrigerating heat-exchange device according to claim 1 is characterized in that the temperature on described heat collector surface is controlled at 15 ℃-40 ℃ by temperature-control circuit.

7. a kind of semiconductor refrigerating heat-exchange device according to claim 1 is characterized in that heating or freeze and being controlled by temperature-control circuit of described semiconductor chilling plate.

8. a kind of semiconductor refrigerating heat-exchange device according to claim 1 is characterized in that the below of described radiator is provided with fan.

Images