CN201388357Y - Sealed equipment phase change energy storage temperature control device - Google Patents

Abstract

The utility model discloses a phase-change energy-storage temperature control apparatus of sealing equipment, comprising a sealing tank body. A heating device is arranged in the tank body; the surface of the heating device is connected with a phase-change radiator and a phase-change cold plate; and the surface of the phase-change radiator is connected with a plate semiconductor cooler which penetrates through the sealing tank body and is communicated with the external environment. The phase-change energy-storage cooling device of the sealing electronic equipment can retain the temperature control capability for the sealing electronic equipment which works under the severe ambient temperature for quite a while after the cooling power supply is cut off, and also can ensure the working temperature stability of the key devices in the sealing electronic equipment under the severe working environment of the strong transient thermal shock or cold shock. Owing of the large phase-change latent heat of the phase-change energy-storage materials and the smaller volume of the semiconductor cooler which leads the heat out of the sealing tank, therefore the temperature control apparatus has the advantages of large cooling capacity, small volume and low energy consumption compared with the traditional cooling method, and can retain the temperature stability and controllability in the sealing electronic equipment when the working ambient temperature is extremely low.

Description

Sealed equipment phase change energy storage temperature control device

technical field

The utility model relates to a temperature control device for sealing electronic equipment with high heating power under harsh working conditions, in particular to a temperature control device for phase change energy storage of sealing equipment.

Background technique

The cooling method of traditional sealed electronic equipment usually uses the cooling medium to transfer the heat generated by the heat-generating device to the atmospheric environment outside the equipment through conduction and convection, so as to realize the temperature control inside the equipment. For some sealed electronic equipment with harsh working environment, when the ambient temperature is high, the heat generated inside is difficult to cool the internal heat-generating components through the above-mentioned traditional methods, so that the temperature of the sealed electronic equipment will gradually increase. After the cooling power supply of the sealed electronic equipment with cooling device is cut off, the temperature of the sealed electronic equipment working in a high temperature environment will rise rapidly, thereby shortening the life of the electronic equipment and greatly increasing the failure rate. When the ambient temperature is extremely low, the temperature during startup is also extremely low, sometimes causing the device to fail to start. Under the harsh working environment of instantaneous strong heat shock or cold shock and their alternating effects, it is more likely to cause the failure of key components of electronic equipment and make the equipment unable to work.

For sealed electronic equipment with large heating power, liquid such as water cooling system is generally used. Usually, the water cooling system used must have a large water storage tank, circulating water pump and water pipe, which will make the volume and weight of the entire electronic equipment relatively large. It is not suitable for use in occasions where miniaturization and light weight are required, and a more complicated water cooling system will greatly reduce the reliability of electronic equipment.

At present, semi-conductor refrigeration technology is widely used to solve the problem of miniaturization of cooling system. However, due to the low efficiency of semi-conductor refrigeration, the cooling power is small, and DC power supply is required, it can only be used as refrigeration for electronic equipment with small heat dissipation power. .

Utility model content

The purpose of this utility model is to overcome the deficiencies of the above-mentioned prior art and provide a temperature control device for phase change energy storage of sealed electronic equipment. The cooling device can not only cool sealed electronic equipment with large heat dissipation power, but also Maintain the ability to control the temperature rise of sealed electronic equipment for a considerable period of time.

The technical solution for realizing the purpose of this utility model is: a phase change energy storage temperature control device for sealed electronic equipment, which has a sealed box body and a heating device arranged in the box body; the surface of the heating device is connected with a phase change radiator and a phase change The cold plate and the surface of the phase change radiator are connected with a plate-shaped semiconductor refrigerator that passes through the sealed box and communicates with the outside world.

The plate-shaped semiconductor refrigerator of the above-mentioned phase-change energy storage temperature control device for sealed electronic equipment has a cold-end radiator, a cold-end plate, a thermopile, a hot-end plate and a hot-end radiator connected in sequence, and the cold-end radiator is located in the box body and The surface of the phase change radiator is in close contact, the phase change radiator is in close contact with the surface of the heating device, and the thermopile, hot end plate, and hot end radiator are located outside the box.

The phase-change heat sink of the phase-change energy storage temperature control device for sealed electronic equipment is a shell with a phase-change energy storage material inside; the phase-change cold plate is a shell with a phase-change energy storage material inside.

The wall of the sealed box of the phase change energy storage temperature control device for sealed electronic equipment is filled with heat insulating material or phase change energy storage material.

The casing of the phase-change cold plate of the above-mentioned phase-change energy storage temperature control device for sealed electronic equipment is provided with a coil, the coil is provided with cooling liquid, and the inlet and outlet of the coil are connected to the external circulation component through pipes.

There are one or more plate-shaped semiconductor refrigerators in the above-mentioned sealed electronic equipment phase change energy storage temperature control device.

The phase change energy storage material in the phase change cold plate of the phase change energy storage temperature control device for sealed electronic equipment is in direct contact with the coil. The inner surface of the phase change cold plate shell is in close contact.

The external circulation assembly of the phase change cold plate of the phase change energy storage temperature control device for sealed electronic equipment has a circulation pump and a heat exchanger.

The utility model has the following characteristics:

(1) The phase-change energy storage cooling device for sealed electronic equipment can maintain the temperature control capability of sealed electronic equipment working at harsh ambient temperatures for a considerable period of time after the cooling power supply is cut off.

(2) It can ensure the stability of the working temperature of the key components in the sealed electronic equipment under the harsh working environment of strong transient thermal shock or cold shock.

(3) Since the phase change latent heat of the phase change energy storage material is very large, a small amount of phase change energy storage material can absorb a large amount of heat, and the volume of the semiconductor refrigerator that leads the heat out of the sealed box is also small, so Compared with the traditional cooling method, the utility model has the advantages of large cooling capacity, small volume and low energy consumption.

(4) When the temperature of the working environment is extremely low, the temperature inside the sealed electronic device can be kept stable and controllable.

Description of drawings

In order to make the content of the utility model easier to understand clearly, the utility model will be further described in detail according to the specific embodiments below in conjunction with the accompanying drawings, wherein

Fig. 1 is the structural representation of the first embodiment of the utility model;

Fig. 2 is the A-A sectional view of Fig. 1;

Fig. 3 is a schematic structural view of the second embodiment of the present invention.

Detailed ways

(Example 1)

Semiconductor refrigeration, also known as thermoelectric refrigeration, is based on the Peltier effect discovered by the French scientist Peltier, that is, when a direct current is applied to a loop composed of two different conductors, a temperature difference appears at the connection. This phenomenon is particularly pronounced in semiconductor materials, where it can produce effective cooling capabilities.

When a phase change material changes from one state to another, it needs to absorb or release heat from the environment to achieve heat storage and release, which can achieve the purpose of temperature control. When a solid state changes to a liquid state, a large amount of heat is absorbed, and when the liquid changes to a solid state, heat is released. At the same time, the phase change process is generally an isothermal or nearly isothermal process. Using the characteristics of phase change materials, it can be used to adjust Controls the temperature of the surrounding environment and can be reused many times.

See Fig. 1, the sealing box body 14 of the present utility model can be cuboid, and box wall refers to six faces of box body, has installation hole on box wall, and plate-shaped semiconductor cooler 1 is housed in the hole, cold end plate 5 The box wall of the sealed box body 14 is sealed by a sealing ring or welded, and the plate-shaped semiconductor refrigerator 1 can be purchased in the market as required. The plate-shaped semiconductor refrigerator 1 is composed of a hot end radiator 2 , a hot end plate 3 , a thermopile 4 , a cold end plate 5 and a cold end heat absorber 6 . The cold end plate 5 is located inside the sealed box 14 , and the hot end radiator 2 , hot end plate 3 , and thermopile 4 are located outside the sealed box 14 . The wall of the sealed box 14 is filled with heat-insulating material 15, which may be foamed asbestos, foamed plastic, glass wool and the like. The heating device 8 in the sealed box 14 is installed on the phase-change cold plate 9, the phase-change cold plate 9 is a shell, and a coil 18 is arranged in the shell, and a coolant 17 is arranged in the coil 18, and the intake of the coil 18 is The outlets m and n communicate with the external circulation assembly through a pipeline 11 , and the external circulation assembly has a circulation pump 12 and a heat exchanger 10 . A phase-change energy storage material 16 is provided between the phase-change cold plate 9 and the coil 18. The coil 18 is curved in an S shape in the shell of the phase-change cold plate 9. The cross-section of the coil 18 is rectangular, and the two ends are round. shape, the upper and lower outer surfaces of the coil pipe 18 are in close contact with the inner surface of the shell of the phase change cold plate 9 . The cooling liquid 17 in the coil 18 can be heat conduction oil, inorganic liquid or water. The coil 18 is placed in the phase change material 16 and is in close contact with the cold plate to facilitate heat conduction.

Phase change energy storage materials 13, 16 (PCM) are usually composed of multiple components, including main energy storage agent, phase transition temperature (freezing point) regulator, anti-supercooling agent (nucleating agent), accelerator, anti-phase separation agent (Used when solid and liquid coexist and phase separation is likely to occur due to density difference), etc. Inorganic phase change energy storage materials can use crystalline hydrated salts, molten salts, metal alloys and other inorganic substances. Organic phase change energy storage materials can use paraffin, fatty acid and other organic substances. When using hydrated salt, that is Glauber's salt and calcium chloride hexahydrate, it is necessary to add nucleating agent borax to prevent supercooling, and add thickener to prevent precipitation. At present, such commercialized products have been sold in China. When using paraffin, due to its poor thermal conductivity, it is necessary to add heat-conducting pads or aluminum powder to the paraffin to increase its thermal conductivity.

After turning on the power supply, the heating device 8, the semiconductor refrigerator 1, and the cooling pump 12 start to work. Through the phase-change radiator 7 and the phase-change cold plate 9 that are in close contact with the heating device 8, part of the heat is transferred from the sealed box 14 to the Outside the sealed box 14, due to the refrigeration effect of the semiconductor refrigerator 1, the phase change energy storage material 13 in the phase change radiator 7 is basically solid. At the same time, during the working process of the cooling pump 12, another part of the heat generated by the heating device 8 is conducted through the phase change cold plate 9, and the heat is taken out of the sealed box 14 by the movement of the cooling liquid 17 in the coil 18, and passed through the heat exchanger 10. Transfer heat to atmosphere. Due to the circulating cooling of the liquid cooling system, the phase change material 16 in the cold plate 9 is basically solid. Since the heat transfer of the heat dissipation system of the sealed equipment is one-way, only a small part of the heat of the external environment can enter the inside of the sealed box 14 after the power is cut off, relying on the phase change heat absorption of the solid phase change material, which can ensure The ability to control the temperature inside the sealed box 14 under harsh environments. This ensures that the internal temperature of the sealed electronic equipment is stable within a considerable period of time after the power is cut off, and the operating temperature of key components in the sealed equipment does not exceed the allowable value. In addition, under the working condition of extremely low ambient temperature, by changing the current direction of the plate-shaped semiconductor cooler 1, the semiconductor cooler can be changed into a semiconductor heater, which can ensure the reliable operation of sealed electronic equipment under extremely low ambient temperature sex.

(Example 2)

See Fig. 3, when the dissipation power of the heating element 8 is not very large, and the volume and weight of the cooling device are strictly required, the temperature control structure shown in Fig. 3 can be adopted, and three plate-shaped semiconductor refrigerators 1, 7a and 7b use the principle of semiconductor refrigeration to transfer the heat in the sealed box 14 to the outside of the sealed equipment through the phase change radiator 7. Due to the cooling effect of the semiconductor refrigerator, the phase change material in the phase change radiator is basically solid. Similarly, the heat transfer direction of the heat dissipation system of the sealed equipment is controllable. After the power is cut off, only a small part of the heat in the external environment can enter the inside of the sealed equipment, relying on the phase change heat absorption of the solid phase change material, which can ensure Temperature control capability inside sealed equipment for harsh environments. It ensures that the phase-change energy storage cooling device for sealed electronic equipment can keep the internal temperature of the sealed electronic equipment working in a harsh temperature environment stable for a considerable period of time after the power is cut off. Next, due to the heat insulation effect of the heat insulating material 15 on the box wall of the sealed box body 14, the operating temperature of the key components in the sealed equipment can be kept within the allowable value. Under the working condition of extremely low ambient temperature, by changing the current direction of the semiconductor cooler, the semiconductor cooler can be changed into a semiconductor heater, so as to ensure the reliability of the sealed electronic equipment in extremely low ambient temperature.

Apparently, the above-mentioned embodiments of the utility model are only examples for clearly illustrating the utility model, rather than limiting the implementation of the utility model. For those of ordinary skill in the art, other changes or changes in different forms can be made on the basis of the above description. It is not necessary and impossible to exhaustively list all the implementation manners here. And these obvious changes or variations derived from the spirit of the present utility model are still within the protection scope of the present utility model.

Claims (8)

1. A phase-change energy storage temperature control device for sealed electronic equipment, which has a sealed box (14), and a heating device (8) is arranged in the box (14); it is characterized in that: the surface of the heating device (8) A phase-change radiator (7) and a phase-change cold plate (9) are connected, and the surface of the phase-change radiator (7) is connected with a plate-shaped semiconductor refrigerator (1) that passes through a sealed box (14) and communicates with the outside. 2. The temperature control device for phase-change energy storage of sealed electronic equipment according to claim 1, characterized in that: the plate-shaped semiconductor refrigerator (1) has a cold-end radiator (6) and a cold-end plate (5) connected in sequence , a thermopile (4), a hot end plate (3) and a hot end radiator (2), the cold end radiator (6) is located in the box and is in close contact with the surface of the phase change radiator (7), and the phase change radiator (7) ) is in close contact with the surface of the heating device (8), and the thermopile (4), the hot end plate (3), and the hot end radiator (2) are located outside the box. 3. The phase-change energy storage temperature control device for sealed electronic equipment according to claim 2, characterized in that: the phase-change radiator (7) is a shell, and a phase-change energy storage material (13) is arranged inside it; The cold plate (9) is a shell, and a phase change energy storage material (16) is arranged inside it. 4. The temperature control device for phase change energy storage of sealed electronic equipment according to claim 1, characterized in that: the wall of the sealed box (14) is filled with heat insulating material or phase change energy storage material (15). 5. The temperature control device for phase-change energy storage of sealed electronic equipment according to claim 3, characterized in that: a coil (18) is provided in the shell of the phase-change cold plate (9), and the inside of the coil (18) A coolant (17) is provided, and the inlet and outlet (m, n) of the coil (18) communicate with the external circulation component through the pipeline (11). 6. The temperature control device for phase-change energy storage of sealed electronic equipment according to claim 2, characterized in that there are one or more plate-shaped semiconductor refrigerators (1). 7. The phase change energy storage temperature control device for sealed electronic equipment according to claim 1, characterized in that: the phase change energy storage material (16) in the phase change cold plate (9) is in direct contact with the coil (18), The cross section of the coil (18) is rectangular, with circular ends. The upper and lower outer surfaces of the coil (18) are in close contact with the inner surface of the shell of the phase change cold plate (9). 8. The temperature control device for phase change energy storage of sealed electronic equipment according to claim 5, characterized in that: the external circulation component of the phase change cold plate (9) has a circulation pump (12) and a heat exchanger (10) .

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