CN201387803Y - Inductive structure - Google Patents

Abstract

The utility model discloses an inductor structure, which is electrically arranged on a circuit board. The inductor structure includes an inductor component, and a metal layer is coated on the inductor component. The metal layer can cover the inductor component and avoid contact with at least one contact point of the inductor component, and the metal layer and the circuit board form a grounding loop. When current passes through the inductor component, the metal layer shields and absorbs the noise generated by the inductor component itself, and then the grounding part of the metal layer guides the noise to the grounding point on the circuit board for release, so as to avoid the noise generated by the inductor component causing electromagnetic interference to other electronic components on the circuit board.

Description

Inductive structure

technical field

The utility model relates to an inductance structure, in particular to an inductance structure coated with a metal layer on an inductance component.

Background technique

Electronic components of various specifications are arranged on the motherboard. Since the working voltages of each electronic component are different from each other, each electronic component has different potential requirements, so a direct current (DC)/direct current ( DC) converter module to adjust to the required voltage.

For example, taking a step-down (Buck) DC/DC converter, its schematic circuit structure utilizes a control circuit to control the conduction period of the transistor, so as to control the level of the output voltage. In the step-down DC/DC converter, when the transistor is turned on (ON), there will be current through the inductor, so that energy is stored in the inductor, and when the transistor is turned off (OFF), the energy on the inductor will be released to the load for maintain voltage output.

In addition, in order to prevent the noise generated by transistor switching from affecting other components on the motherboard, an inductor and a capacitor are added to the input end of the step-down DC/DC converter to form a filter to filter out noise.

The existing inductance structure winds the wires into coils close to each other, and then arranges them on the predetermined position of the main board. When the current flows, the inside of the inductance will be filled with magnetic energy. When the current becomes small, the magnetic energy in the coil will generate a wave. The force that prevents the current from changing. Its function is to filter the noise in the current, stabilize the current in the circuit to prevent electromagnetic wave interference, and adjust the stability of the current by storing and releasing the electric energy in the circuit.

In a general computer system, the power supply is used to input AC power at a high voltage level (such as 110 volts) and output DC power at a low voltage level (such as 12 volts) to supply the CPU or other electronic components and other loads. required electricity.

For example, the voltage level (such as 1.3 volts) of the power consumed by the CPU is lower than the voltage level provided by the power supply. A pulse-width modulation (PWM) controller is used to control a high gate (Ugate) control signal and a low gate (Lgate) control signal to control a high gate switch and a low gate switch respectively. The open/closed state enables the power supply to provide power to the CPU.

Furthermore, the power drawn by the above two switches is also provided by the power supply, and the pulse width modulation controller can adjust the switching speed of the high gate switch and the low gate switch according to the power drawn by the central processing unit , when the pulse width modulation signal passes through the inductor, the voltage level required by the central processing unit under heavy load or light load can be satisfied.

However, the above-mentioned operation method can meet the voltage level required by the central processing unit, but in practical applications, the phase signal (Phase Signal) will generate very large phase noise (Phase Noise) near the inductor, because the area of the motherboard is very large Limited, the circuit layout and electronic components on the motherboard will inevitably be close to the above-mentioned phase noise, especially some control signals of the power chip itself are interfered by the phase noise, which will inevitably lead to insufficient signal quality, and the phase noise is around the motherboard. Radiation will affect the electromagnetic compatibility (Electromagnetic Compatibility, EMC) effect of the motherboard.

Therefore, when the current passes through the inductance on the power circuit, the phase noise generated by the inductance will affect the transmission performance of the motherboard or electronic components around the circuit board. Therefore, how to effectively reduce or even eliminate the phase noise problem generated by the inductance , which is the direction of urgent research and improvement.

Contents of the invention

The utility model provides an inductance structure, which is used to solve the phase noise generated by the known inductance arranged on the main board, which is easy to cause electromagnetic interference to the electronic components around the main board, thereby causing signal transmission performance of other surrounding electronic components issues such as reduction.

According to the inductor structure disclosed in the utility model, it includes an inductor component, a first insulating layer and a metal layer. Wherein the inductance component is electrically arranged on the circuit board first, and the inductance component has at least one contact point, and the contact point is electrically connected with a power circuit on the circuit board. Then the first insulating layer covers the inductor component and the contact, so that the first insulating layer completely covers the inductor component and the contact. Afterwards, the metal layer is wrapped around the first insulating layer, and the metal layer is provided with at least one grounding portion. After the metal layer covers the first insulating layer, the ground portion of the metal layer is electrically connected to a ground point on the circuit board. A noise generated by the inductance component is shielded and absorbed by the metal layer, and the noise is guided to the ground point by the grounding part for release, so as to prevent the noise from interfering with other electronic components on the circuit board.

According to the inductor structure disclosed in the utility model, it includes an inductor component and a metal layer. The inductance component has at least one contact point, and the metal layer is coated on the outer edge of the inductance component, and the contact point is exposed outside the metal layer. In addition, the metal layer has at least one grounding portion, and when the inductance component is arranged on a circuit board, the grounding portion of the metal layer is electrically connected to a grounding point on the circuit board. A noise generated by the inductance component is shielded and absorbed by the metal layer, and the noise is guided to the ground point by the grounding part for release, so as to prevent the noise from interfering with other electronic components on the circuit board.

According to the effect of the inductance structure disclosed in the utility model, the inductance component is covered with a metal layer. After the inductance component is energized, the metal layer can absorb the noise generated by the inductance component itself, so as to reduce the impact of the inductance component on the circuit board. The phenomenon of electromagnetic interference caused by the surrounding electronic components on the device can also be avoided.

Description of drawings

Fig. 1 is a schematic diagram according to the first embodiment of the present invention before covering the inductance component;

Fig. 2 is the schematic diagram according to the first embodiment of the utility model after wrapping the inductance component;

Fig. 3 is a schematic cross-sectional view according to the first embodiment of the utility model;

4 is a schematic diagram of a power supply circuit according to a first embodiment of the present invention;

Fig. 5 is a schematic diagram before covering the inductance component according to the second embodiment of the present invention;

FIG. 6 is a schematic diagram of the second embodiment of the present invention after covering the inductance component and setting it on the circuit board;

7 is a schematic cross-sectional view according to a second embodiment of the present invention; and

Fig. 8 is a schematic cross-sectional view according to a third embodiment of the present invention.

Among them, reference signs:

10 Inductance component 11 First contact

12 second contact 20 circuit board

21 Power circuit 22 Contacts

23 Grounding point 30 First insulating layer

40 metal layer 41 ground part

50 second insulating layer

Detailed ways

Please refer to the schematic diagrams of the first embodiment shown in Fig. 1 and Fig. 2 . According to the inductor structure disclosed in the present invention, the inductor structure at least includes an inductor component 10 , a first contact 11 and a second contact 12 . The inductance structure in this embodiment is applied on a circuit board 20, and a coil and a mandrel (not shown in the figure) are placed in the inductance component 10, for example, the coil is wound on the mandrel, which belongs to the known technology, so I won't go into details here. The aforementioned two contacts 11 and 12 are in the form of Surface Mount Technology (SMT) contacts as an example, but not limited thereto.

It should be noted that when the inductance component 10 is electrically connected to a power circuit 21 of the circuit board 20, the first contact 11 and the second contact 12 can be designed to match the specifications of the corresponding contacts on the circuit board 20, for example, the first The contacts 11 and the second contacts 12 may be of Surface Mount Technology (SMT), Dual In Line Package (DIP), or Ball Grid Array (BGA) specifications.

Please continue to refer to FIGS. 1 to 3, the inductance component 10 is arranged on a circuit board 20, and the circuit board 20 has a power supply circuit 21 (as shown in FIG. 4 ), and the first contact 11 of the inductance component 10 is connected to the second The two contacts 12 are respectively electrically connected to the corresponding contacts 22 on the circuit board 20 .

After the inductor component 10 is electrically connected to the circuit board 20 through the first contact 11 and the second contact 12 , a first insulating layer 30 can be coated on the inductor component 10 . The first insulating layer 30 completely covers the inductor component 10 , the first contact 11 and the second contact 12 , and the first insulating layer 30 is an insulating tape.

Afterwards, a metal layer 40 is coated on the first insulating layer 30 , and the metal layer 40 also completely covers the first insulating layer 30 . Moreover, the metal layer 40 has a ground portion 41 , and makes the ground portion 41 electrically contact with a ground point 23 on the circuit board 20 . The type of the grounding part 41 can be a surface mount type (Surface Mount Technology, SMT), a double-row standard package (Dual In Line Package, DIP), or a ball grid array according to the specifications of the grounding point 23 of the circuit board 20. Structure (Ball Grid Array, BGA) or a wire (Wire) and other types.

The first insulating layer 30 is mainly used to isolate the two contacts 11 , 12 from the metal layer 40 to prevent the two contacts 11 , 12 from being connected to the metal layer 40 .

In this way, when the current passes through the inductance component 10, a phase noise (Phase Noise) generated by the inductance component 10 can be shielded and absorbed by the metal layer 40, and then the noise absorbed by the metal layer 40 can be guided by the ground part 41. to the ground point 23 on the circuit board 20, and then the noise is released by the ground point 23 on the circuit board 20, thereby preventing phase noise (Phase Noise) from interfering with other electronic components on the circuit board 20.

In addition, after the metal layer 40 is coated on the first insulating layer 30 , a second insulating layer 50 may be further coated on the metal layer 40 . The material of the second insulating layer 50 is the same as that of the first insulating layer 30 , which is an insulating tape for isolating the metal layer 40 from the surrounding electronic components on the circuit board 20 to avoid mutual contact between the metal layer 40 and the surrounding electronic components.

Therefore, in the above-mentioned first embodiment, after the inductance component is electrically connected to the circuit board 20 through the first contact 11 and the second contact 12, the first insulating layer 30, the metal layer 40 and the second insulating layer 50 can be wrapped in sequence. covering the inductance component 10 . In this way, the circuit board 20 is covered with various dense functional electronic components, and the inductance structure disclosed in the present invention can be used to reduce the phase noise generated by the inductance component 10 from interfering with surrounding electronic components.

Please refer to the schematic diagrams of the second embodiment shown in FIG. 5 to FIG. 7 , according to the inductor structure disclosed in the present utility model. Its specific implementation is roughly the same as the aforementioned first embodiment, and only the differences will be described below, and the rest of the similarities will not be repeated. In the second embodiment, the first contact point 11 and the second contact point 12 are respectively arranged on opposite sides of the inductance component 10, and a surrounding metal layer 40 is coated on the outer edge of the inductance component 10, and the metal layer 40 is wrapped. Covering the middle part of the inductor component 10 , the first contact 11 and the second contact 12 are exposed outside the metal layer 40 .

That is to say, the metal layer 40 covers the inductor component 10 so that the metal layer 40 does not contact with the first contact 11 and the second contact 12 . In addition, the metal layer 40 has at least one ground portion 41, and the type of the ground portion 41 can be a surface mount type (Surface Mount Technology, SMT), a double row standard package (Dual In Line) according to the specification of the ground point 23 of the circuit board 20. Package, DIP), a ball grid array structure (Ball Grid Array, BGA) or a wire (Wire) and other types.

After the inductance component 10 is arranged on the circuit board 20, the first contact 11 and the second contact 12 of the inductance component 10 are respectively electrically connected to the contact 22 on the circuit board 20, and the ground portion 41 of the metal layer 40 is also connected to the circuit board. The grounding points 23 on 20 are in electrical contact with each other.

Furthermore, for example, the first contact 11 and the second contact 12 may be of Surface Mount Technology (SMT) and electrically connected to the contact 22 of the circuit board 20 (as shown in FIG. 3 and FIG. 7 ). The first contact 11 and the second contact 12 can also be electrically connected to the contact 22 of the circuit board 20 in a dual in line package (DIP) (as shown in FIG. 8 ).

But it is worth noting that, according to the inductor structure disclosed in the present utility model, the metal layer 40 is coated on the outer edge of the inductor component 10, and after the inductor component 10 is energized, the inductor component 10 can avoid internal generation by the metal layer 40. The phenomenon that the phase noise causes electromagnetic interference to other electronic components on the circuit board 20 can also prevent the electronic components from causing electromagnetic interference to the inductance component 10 itself.

Claims (9)

1, a kind of induction structure is characterized in that, electrically be arranged on the circuit board, and this circuit board has a power circuit and at least one earth point, and this induction structure includes:

One Inductive component is arranged on this circuit board, and this Inductive component has at least one contact, electrically connects mutually with this power circuit;

One first insulating barrier envelopes this Inductive component and this contact; And

One metal level envelopes this first insulating barrier, and this metal level has at least one grounding parts, is electrically connected at this earth point of this circuit board.

2, induction structure as claimed in claim 1 is characterized in that, this first insulating barrier is one in order to isolate the insulating tape of this metal level and this contact.

3, induction structure as claimed in claim 1 is characterized in that, this contact is a SMD LED surface-mount device LED contact, a double standard packaging contact or a ball grid array structure contact.

4, induction structure as claimed in claim 1 is characterized in that, also include one in order to isolate on this metal level and this circuit board arround second insulating barrier of electronic building brick, this second insulating barrier envelopes this metal level.

5, induction structure as claimed in claim 4 is characterized in that, this second insulating barrier is an insulating tape.

6, induction structure as claimed in claim 1 is characterized in that, this grounding parts of this metal level is a lead, a SMD LED surface-mount device LED contact, a double standard packaging contact or a ball grid array structure contact.

7, a kind of induction structure is characterized in that, includes:

One Inductive component has at least one contact; And

One metal level is coated on the outer rim of this Inductive component and exposes this contact, and this metal level has at least one grounding parts.

8, induction structure as claimed in claim 7 is characterized in that, this contact is a SMD LED surface-mount device LED contact, a double standard packaging contact or a ball grid array structure contact.

9, induction structure as claimed in claim 7 is characterized in that, this grounding parts of this metal level is a lead, a SMD LED surface-mount device LED contact, a double standard packaging contact or a ball grid array structure contact.

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