CN201364544Y - High-end cabinet type server heat radiation structure device - Google Patents
High-end cabinet type server heat radiation structure device Download PDFInfo
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- CN201364544Y CN201364544Y CNU2009200196399U CN200920019639U CN201364544Y CN 201364544 Y CN201364544 Y CN 201364544Y CN U2009200196399 U CNU2009200196399 U CN U2009200196399U CN 200920019639 U CN200920019639 U CN 200920019639U CN 201364544 Y CN201364544 Y CN 201364544Y
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Abstract
Description
技术领域 technical field
本实用新型涉及一种多路服务器的散热系统,具体地说是一种高端机柜式服务器散热结构装置。The utility model relates to a heat dissipation system of a multi-channel server, in particular to a high-end cabinet type server heat dissipation structure device.
背景技术 Background technique
在多路服务器领域里面,可靠性是至关重要的,其中散热尤为重要,现在的CPU功率越来越高,空间也是有限的,意味着热流密度在不断增加,在有限的空间里面解决大功率的热量非常棘手,噪声控制也是一个重要指标。这就使得我们需求高效的散热装置来满足要求,采用大风量,减少系统阻抗,采用高性能的散热器,降低噪音是我们寻求的主要途径。多路高端服务器是一种高可靠的设备,散热结构必须做到易维护,可以热插拔,防尘,防潮,冗余设计。很多服务器厂商采用的都是ATCA架构,采用机柜上下通风结构,风扇盘放置在机柜的上层和下层,下层风扇盘吹风(入风口)上层风扇盘抽风(出风口)。In the field of multi-channel servers, reliability is very important, and heat dissipation is particularly important. Now the power of CPU is getting higher and higher, and the space is limited, which means that the heat flux density is increasing continuously, and high power consumption can be solved in a limited space The heat is very tricky, and noise control is also an important indicator. This makes us need high-efficiency cooling devices to meet the requirements, using large air volume, reducing system impedance, using high-performance radiators, and reducing noise are the main ways we seek. The multi-channel high-end server is a kind of highly reliable equipment. The heat dissipation structure must be easy to maintain, hot-swappable, dust-proof, moisture-proof, and redundant. Many server manufacturers adopt the ATCA architecture, which adopts the upper and lower ventilation structure of the cabinet. The fan trays are placed on the upper and lower layers of the cabinet. The lower fan trays blow air (air inlet) and the upper fan trays exhaust air (air outlet).
实用新型内容Utility model content
本实用新型的技术任务是针对以上不足之处,提供一种结构简单、易维护、散热效果好、可靠性高的一种高端机柜式服务器散热结构装置。The technical task of the utility model is to provide a high-end cabinet-type server heat dissipation structure device with simple structure, easy maintenance, good heat dissipation effect and high reliability in view of the above deficiencies.
本实用新型解决其技术问题所采用的技术方案是:包括风扇盘和风道,风扇盘通过导轨后插在背板上,风道包括计算板、交换板、监控板和I/O板,风扇盘位于机柜前门靠近计算板处,计算板和I/O板采用连接器连接,监控板和I/O板相连接形成一个整体模块通过导轨,然后插在背板上固定。The technical solution adopted by the utility model to solve the technical problem is: comprising fan disc and air duct, the fan disc is inserted on the backboard after passing through the guide rail, the air duct includes a computing board, an exchange board, a monitoring board and an I/O board, and the fan disc It is located near the computing board at the front door of the cabinet. The computing board and the I/O board are connected by connectors. The monitoring board and the I/O board are connected to form a whole module through the guide rail, and then plugged into the backplane for fixing.
每个计算板上并排安装4个处理器及散热片,后面有8块内存模块形成良好的散热风道。Four processors and heat sinks are installed side by side on each computing board, and there are eight memory modules behind to form a good cooling air duct.
每个风扇盘采用两层风扇串联,风扇盘采用热插拔结构,风扇盘内的每个风扇也是采用热插拔结构。Each fan tray uses two layers of fans in series, the fan tray adopts a hot-swappable structure, and each fan in the fan tray also adopts a hot-swappable structure.
监控板上的监控管理总线通过背板连接到每个被监控的单元。The monitoring management bus on the monitoring board is connected to each monitored unit through the backplane.
入风口在机柜的后门,入风口外设置有防尘网。The air inlet is on the back door of the cabinet, and a dust-proof net is arranged outside the air inlet.
风道是从机柜的后门到前门,形成前后通风,风从后门进入,先冷却内存模块,然后通过处理器及散热片,再通过I/O板冷却I/O模块,最后热量通过风扇盘从前门吹出。风扇盘采用热插拔结构,每个风扇也是采用热插拔结构,方便维护风扇。风扇采用冗余设计,每个风扇盘采用两层风扇串联(也有利于增加风压),具有两种速度,半速和全速,当温度探测器探测到其中零件温度过高所有的风扇将全速运转,当单一风扇发生故障时其余风扇也将全速运转。根据不同的配置还可配置一些其它的设备,如:memory riser card、I/O扩展箱、I/O riser card。The air duct is from the back door to the front door of the cabinet, forming front-to-back ventilation. The wind enters from the back door, cools the memory module first, then passes through the processor and heat sink, and then cools the I/O module through the I/O board. The front door blows out. The fan tray adopts a hot-swappable structure, and each fan also adopts a hot-swappable structure, which facilitates fan maintenance. The fans adopt a redundant design. Each fan tray uses two layers of fans in series (also conducive to increasing the wind pressure). It has two speeds, half speed and full speed. When the temperature detector detects that the temperature of the parts is too high, all the fans will be at full speed. When a single fan fails, the rest of the fans will also run at full speed. According to different configurations, some other devices can also be configured, such as: memory riser card, I/O expansion box, I/O riser card.
本实用新型的一种高端机柜式服务器散热结构装置和现有技术相比,采用前后通风,具有风压大、系统阻抗低、风量大、易维护、等特点,因而,具有很好的推广使用价值。Compared with the prior art, a high-end cabinet-type server heat dissipation structure device of the utility model adopts front and rear ventilation, and has the characteristics of large wind pressure, low system impedance, large air volume, and easy maintenance. Therefore, it has good popularization and use value.
附图说明 Description of drawings
下面结合附图对本实用新型进一步说明。Below in conjunction with accompanying drawing, the utility model is further described.
附图1为一种高端机柜式服务器散热结构装置的原理图;Accompanying drawing 1 is a schematic diagram of a high-end rack-type server cooling structure device;
附图2为一种高端机柜式服务器散热结构装置的结构示意图;Accompanying drawing 2 is a structural schematic diagram of a high-end rack-type server cooling structure device;
附图3为附图2中计算板和I/O板的结构示意图。Accompanying drawing 3 is the structural representation of computing board and I/O board in accompanying
图中:1、交换板,2、计算板,3、I/O板,4、监控板,5、风扇盘,6、内存模块,7、处理器及散热片,8、机柜,9、背板。In the figure: 1. Switching board, 2. Computing board, 3. I/O board, 4. Monitoring board, 5. Fan tray, 6. Memory module, 7. Processor and heat sink, 8. Cabinet, 9. Back plate.
具体实施方式 Detailed ways
下面结合附图和具体实施例对本实用新型作进一步说明。Below in conjunction with accompanying drawing and specific embodiment the utility model is further described.
本实用新型的一种高端机柜式服务器散热结构装置,其结构包括风扇盘5和风道,风扇盘5通过导轨后插在背板9上,风道包括计算板2、交换板1、监控板4和I/O板3,风扇盘5位于机柜8前门靠近计算板2处,计算板2和I/O板3采用连接器连接,监控板4和I/O板3相连接形成一个整体模块通过导轨,然后插在背板9上固定。The utility model is a high-end cabinet-type server heat dissipation structure device, and its structure includes a fan tray 5 and an air duct, the fan tray 5 is inserted on the backplane 9 through the guide rail, and the air duct includes a
每个计算板2上并排安装4个处理器及散热片7,后面有8块内存模块6形成良好的散热风道。Four processors and
每个风扇盘5采用两层风扇串联,风扇盘5采用热插拔结构,风扇盘5内的每个风扇也是采用热插拔结构。Each fan tray 5 adopts two layers of fans connected in series, the fan tray 5 adopts a hot-swappable structure, and each fan in the fan tray 5 also adopts a hot-swappable structure.
监控板4上的监控管理总线通过背板9连接到每个被监控的单元。The monitoring management bus on the
入风口在机柜8的后门,入风口外设置有防尘网。The air inlet is at the back door of the
根据不同的配置还可配置一些其它的设备,如:memory riser card、I/O扩展箱、I/O riser card等。According to different configurations, some other devices can also be configured, such as: memory riser card, I/O expansion box, I/O riser card, etc.
本实用新型的一种高端机柜式服务器散热结构装置其加工制作非常简单方便,按说明书附图所示加工制作即可。The processing and manufacturing of a high-end cabinet-type server heat dissipation structure device of the present utility model is very simple and convenient, and can be processed and manufactured as shown in the accompanying drawings of the specification.
除说明书所述的技术特征外,均为本专业技术人员的已知技术。Except for the technical features described in the instructions, all are known technologies by those skilled in the art.
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2009200196399U CN201364544Y (en) | 2009-03-26 | 2009-03-26 | High-end cabinet type server heat radiation structure device |
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| Application Number | Priority Date | Filing Date | Title |
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| CNU2009200196399U CN201364544Y (en) | 2009-03-26 | 2009-03-26 | High-end cabinet type server heat radiation structure device |
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| CN201364544Y true CN201364544Y (en) | 2009-12-16 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101807100A (en) * | 2010-03-18 | 2010-08-18 | 北京航空航天大学 | High-density rack server radiating system |
| CN102129274A (en) * | 2010-12-28 | 2011-07-20 | 华为技术有限公司 | Server, server subassembly and fan speed control method |
| CN102340977A (en) * | 2011-09-08 | 2012-02-01 | 曙光信息产业股份有限公司 | A cooling device for a cabinet and a method for cooling the cabinet |
| CN103605412A (en) * | 2009-04-21 | 2014-02-26 | 雅虎公司 | Cold row encapsulation for server farm cooling system |
| CN106970691A (en) * | 2016-11-14 | 2017-07-21 | 奇鋐科技股份有限公司 | Series fan with frame |
| CN107765795A (en) * | 2017-11-08 | 2018-03-06 | 北京图森未来科技有限公司 | A kind of computer server |
| CN108594975A (en) * | 2018-07-12 | 2018-09-28 | 常州天能博智能系统科技有限公司 | A kind of operation board radiator structure |
-
2009
- 2009-03-26 CN CNU2009200196399U patent/CN201364544Y/en not_active Expired - Fee Related
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103605412A (en) * | 2009-04-21 | 2014-02-26 | 雅虎公司 | Cold row encapsulation for server farm cooling system |
| CN103605412B (en) * | 2009-04-21 | 2018-10-19 | 埃克斯凯利博Ip有限责任公司 | A kind of server cooling chamber |
| CN101807100A (en) * | 2010-03-18 | 2010-08-18 | 北京航空航天大学 | High-density rack server radiating system |
| CN102129274A (en) * | 2010-12-28 | 2011-07-20 | 华为技术有限公司 | Server, server subassembly and fan speed control method |
| CN102129274B (en) * | 2010-12-28 | 2014-09-17 | 华为技术有限公司 | Server, server subassembly and fan speed control method |
| CN102340977A (en) * | 2011-09-08 | 2012-02-01 | 曙光信息产业股份有限公司 | A cooling device for a cabinet and a method for cooling the cabinet |
| CN102340977B (en) * | 2011-09-08 | 2015-10-07 | 曙光信息产业股份有限公司 | Heat dissipation device for cabinet and method for dissipating heat of cabinet |
| CN106970691A (en) * | 2016-11-14 | 2017-07-21 | 奇鋐科技股份有限公司 | Series fan with frame |
| CN106970691B (en) * | 2016-11-14 | 2020-03-10 | 奇鋐科技股份有限公司 | Series fan with frame |
| CN107765795A (en) * | 2017-11-08 | 2018-03-06 | 北京图森未来科技有限公司 | A kind of computer server |
| CN108594975A (en) * | 2018-07-12 | 2018-09-28 | 常州天能博智能系统科技有限公司 | A kind of operation board radiator structure |
| CN108594975B (en) * | 2018-07-12 | 2023-11-21 | 常州天能博智能系统科技有限公司 | Operation board card heat radiation structure |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091216 Termination date: 20120326 |