CN201338160Y - Double optical-head laser beam dynamic pair carving cutting machine - Google Patents
Double optical-head laser beam dynamic pair carving cutting machine Download PDFInfo
- Publication number
- CN201338160Y CN201338160Y CN 200820191807 CN200820191807U CN201338160Y CN 201338160 Y CN201338160 Y CN 201338160Y CN 200820191807 CN200820191807 CN 200820191807 CN 200820191807 U CN200820191807 U CN 200820191807U CN 201338160 Y CN201338160 Y CN 201338160Y
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200820191807 CN201338160Y (en) | 2008-10-29 | 2008-10-29 | Double optical-head laser beam dynamic pair carving cutting machine |
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| Application Number | Priority Date | Filing Date | Title |
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| CN 200820191807 CN201338160Y (en) | 2008-10-29 | 2008-10-29 | Double optical-head laser beam dynamic pair carving cutting machine |
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| Publication Number | Publication Date |
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| CN201338160Y true CN201338160Y (en) | 2009-11-04 |
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| CN 200820191807 Expired - Fee Related CN201338160Y (en) | 2008-10-29 | 2008-10-29 | Double optical-head laser beam dynamic pair carving cutting machine |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012154086A2 (en) | 2011-05-10 | 2012-11-15 | Korukov Alexey Nikolaevich | Laser cutting machine and machine-readable medium |
| CN103521930A (en) * | 2013-10-15 | 2014-01-22 | 东莞市三信精密机械有限公司 | Laser cutting machine |
| CN103769755A (en) * | 2014-02-11 | 2014-05-07 | 哈尔滨工业大学 | Dual-beam laser heat cracking cutting processing method and device for sandwich structure substrate |
| CN105364318A (en) * | 2014-08-25 | 2016-03-02 | 深圳市韵腾激光科技有限公司 | Double-SD-card laser cutting method |
| CN103769755B (en) * | 2014-02-11 | 2016-11-30 | 哈尔滨工业大学 | The double beams laser hot tearing cutting process method of sandwich structure substrate and device |
| CN108568602A (en) * | 2018-04-11 | 2018-09-25 | 安徽凯贝耐特钣金科技有限公司 | A kind of double radium-shine lock-out pulse panel beating laser cutting machines |
| CN110039202A (en) * | 2019-05-20 | 2019-07-23 | 湖南大学 | One kind is for slab composite material dislocation double light beam laser punching device and processing method |
-
2008
- 2008-10-29 CN CN 200820191807 patent/CN201338160Y/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012154086A2 (en) | 2011-05-10 | 2012-11-15 | Korukov Alexey Nikolaevich | Laser cutting machine and machine-readable medium |
| CN103521930A (en) * | 2013-10-15 | 2014-01-22 | 东莞市三信精密机械有限公司 | Laser cutting machine |
| CN103521930B (en) * | 2013-10-15 | 2016-02-03 | 东莞市三信精密机械有限公司 | Laser cutting machine |
| CN103769755A (en) * | 2014-02-11 | 2014-05-07 | 哈尔滨工业大学 | Dual-beam laser heat cracking cutting processing method and device for sandwich structure substrate |
| CN103769755B (en) * | 2014-02-11 | 2016-11-30 | 哈尔滨工业大学 | The double beams laser hot tearing cutting process method of sandwich structure substrate and device |
| CN105364318A (en) * | 2014-08-25 | 2016-03-02 | 深圳市韵腾激光科技有限公司 | Double-SD-card laser cutting method |
| CN108568602A (en) * | 2018-04-11 | 2018-09-25 | 安徽凯贝耐特钣金科技有限公司 | A kind of double radium-shine lock-out pulse panel beating laser cutting machines |
| CN110039202A (en) * | 2019-05-20 | 2019-07-23 | 湖南大学 | One kind is for slab composite material dislocation double light beam laser punching device and processing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: MA WEIHU Free format text: FORMER OWNER: WUHAN ENWEI LASER POWER EQUIPMENT CO., LTD. Effective date: 20110402 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 430051 NO. 5, KANGDA STREET, LONGYANG AVENUE, HANYANG DISTRICT, WUHAN CITY,HUBEI PROVINCE TO: 430056 NO. 5, KANGDA STREET, LONGYANG AVENUE, HANYANG DISTRICT, WUHAN CITY, HUBEI PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20110402 Address after: Longyang Road 430056 Hubei city of Wuhan province Kangda street Hanyang District No. 5 Patentee after: Ma Weihu Address before: Longyang Road 430051 Hubei city of Wuhan province Kangda street Hanyang District No. 5 Patentee before: Wuhan Anyway Laser Equipment Co., Ltd. |
|
| DD01 | Delivery of document by public notice |
Addressee: Ma Weihu Document name: Notification of Passing Examination on Formalities |
|
| ASS | Succession or assignment of patent right |
Owner name: HUBEI FUTURE ANYWAY LASER TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: MA WEIHU Effective date: 20110510 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 430056 NO. 5, KANGDA STREET, LONGYANG AVENUE, HANYANG DISTRICT, WUHAN CITY,HUBEI PROVINCE TO: 430000 BUILDING 3, NO. 398, PENGJIALING, HANYANG DISTRICT, WUHAN CITY, HUBEI PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20110510 Address after: Ling Peng 430000 Hubei city of Wuhan province Hanyang District No. 398 building third Patentee after: The future of Hubei Enwei Laser Technology Co Ltd Address before: Longyang Road 430056 Hubei city of Wuhan province Kangda street Hanyang District No. 5 Patentee before: Ma Weihu |
|
| ASS | Succession or assignment of patent right |
Owner name: MA WEIHU Free format text: FORMER OWNER: HUBEI FUTURE ANYWAY LASER TECHNOLOGY CO., LTD. Effective date: 20120716 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20120716 Address after: 430000 Industrial Park, Golden Road Industrial Park, Hanyang District, Hubei, Wuhan Patentee after: Ma Weihu Address before: Ling Peng 430000 Hubei city of Wuhan province Hanyang District No. 398 building third Patentee before: The future of Hubei Enwei Laser Technology Co Ltd |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091104 Termination date: 20131029 |