CN201336791Y - Radiator - Google Patents
Radiator Download PDFInfo
- Publication number
- CN201336791Y CN201336791Y CNU2008203034762U CN200820303476U CN201336791Y CN 201336791 Y CN201336791 Y CN 201336791Y CN U2008203034762 U CNU2008203034762 U CN U2008203034762U CN 200820303476 U CN200820303476 U CN 200820303476U CN 201336791 Y CN201336791 Y CN 201336791Y
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- China
- Prior art keywords
- radiator
- fin
- base
- air inlet
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H10W40/43—
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Of Non-Positive Displacement Pumps (AREA)
Abstract
Description
技术领域 technical field
本实用新型是关于一种散热装置,尤指一种重量轻且散热效率高的散热装置。The utility model relates to a cooling device, in particular to a cooling device with light weight and high cooling efficiency.
背景技术 Background technique
随着中央处理器等电子元件的输出功率和工作频率的不断提高,其相应产生的热量也明显增多,若不及时排除其产生的热量,将导致热量累积引起温度升高,而严重影响电子元件的正常运行。为此,业界通常在这些发热电子元件表面安装一散热器进行辅助散热,同时在散热器上加装一风扇,以加强散热效果。传统的散热器包括若干平行于所述散热器底座设置的散热鳍片,因此具有较大的重量且散热效率不高。With the continuous improvement of the output power and operating frequency of electronic components such as central processing units, the corresponding heat generated by them has also increased significantly. If the heat generated is not removed in time, it will cause heat accumulation and cause temperature rise, which will seriously affect electronic components. of normal operation. For this reason, the industry usually installs a heat sink on the surface of these heat-generating electronic components for auxiliary heat dissipation, and at the same time installs a fan on the heat sink to enhance the heat dissipation effect. The traditional heat sink includes several heat dissipation fins arranged parallel to the heat sink base, so it has a relatively large weight and low heat dissipation efficiency.
发明内容 Contents of the invention
鉴于以上内容,有必要提供一种重量轻且散热效率高的散热装置。In view of the above, it is necessary to provide a heat sink with light weight and high heat dissipation efficiency.
一种散热器,包括一与待散热元件热接触的底座,及若干与所述底座固定在一起的散热片,所述散热片自散热器底座斜向上辐射出,并自上而下呈逐渐收拢的形态。A radiator comprising a base in thermal contact with the element to be dissipated, and a number of fins fixed to the base. The fins radiate obliquely upward from the base of the radiator and gradually converge from top to bottom. Shape.
一种散热装置,包括散热器及给所述散热器送风的散热风扇,所述散热器包括一与待散热元件热接触的底座,及若干与所述底座固定在一起的散热片,所述散热片自散热器底座斜向上辐射出,并自上而下呈逐渐收拢的形态。A heat dissipation device, comprising a heat sink and a heat dissipation fan for supplying air to the heat sink, the heat sink includes a base in thermal contact with an element to be dissipated, and a plurality of heat sinks fixed together with the base, the The radiator fins radiate obliquely upward from the radiator base, and gradually converge from top to bottom.
相对现有技术,本实用新型散热装置采用收拢式散热片设置的散热器,提高了散热效率并减轻了散热器的重量。Compared with the prior art, the heat dissipation device of the utility model adopts a heat sink provided with retractable heat dissipation fins, which improves heat dissipation efficiency and reduces the weight of the heat sink.
附图说明 Description of drawings
图1为本实用新型散热装置较佳实施例的立体分解图。FIG. 1 is an exploded perspective view of a preferred embodiment of the heat sink of the present invention.
图2为图1的立体组装图。FIG. 2 is a three-dimensional assembly view of FIG. 1 .
具体实施方式 Detailed ways
请参阅图1,本实用新型散热装置包括一散热器10、及一固定于所述散热器10上的风扇20。Please refer to FIG. 1 , the heat dissipation device of the present invention includes a
散热器10包括一底座11,在底座11的上表面设有若干散热片12。底座11的下表面可与一电脑主板上的待散热元件(如中央处理器)相接触,待散热元件产生的热量经由底座11传送到散热片12上。这些散热片12自散热器10的底座11斜向上辐射出,并自上而下呈逐渐收拢的形态。这些散热片12的中间围成一呈圆台形的空间,其顶部为散热器10的进风口。位于外层的每一散热片12后设有两导风片13,相邻的外层两散热片12间的相邻的两导风片13间形成一导风口14,来自所述进风口的风流流经散热片后经由所述导风口14流出。The
请一并参阅图2,风扇20呈圆形,位于所述散热器10的进风口处。在本实用新型较佳实施方式中,风扇20以粘合或者螺钉卡固的方式固定在散热器10上。散热片12和导风片13均为一体成形于散热器10的底座11上。Please also refer to FIG. 2 , the
所述散热片12呈自上而下逐渐收拢而形成利于风流运动的圆台形空间,当位于散热器10的进风口处的风扇20高速旋转时,风流经过散热片12的收拢作用,而使风流在流经散热片12的过程中流速逐渐增大,到达散热器10的底座11上表面时速度达到最大,因此可对散热器10上热量密集的底座11产生较大的冲击气流,可高效地降低待散热元件的温度,大大提高了散热效率。由于散热器10为收拢式设计且散热片12和导风片13一体成形于底座11上,有利于减轻散热器10的重量。The
本实用新型散热装置采用收拢式散热片设置的散热器,提高了散热效率并减轻了散热器的重量,所述散热片12和导风片13可与所述散热器10的底座11非一体形成,作为单个的元件固定于散热器10的底座11,构成了散热器10的本体。The heat dissipation device of the utility model adopts a heat sink provided with retractable heat sinks, which improves heat dissipation efficiency and reduces the weight of the heat sink. The
Claims (9)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008203034762U CN201336791Y (en) | 2008-12-17 | 2008-12-17 | Radiator |
| US12/485,326 US20100147495A1 (en) | 2008-12-17 | 2009-06-16 | Heat dissipation apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008203034762U CN201336791Y (en) | 2008-12-17 | 2008-12-17 | Radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201336791Y true CN201336791Y (en) | 2009-10-28 |
Family
ID=41288454
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008203034762U Expired - Fee Related CN201336791Y (en) | 2008-12-17 | 2008-12-17 | Radiator |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20100147495A1 (en) |
| CN (1) | CN201336791Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116801580A (en) * | 2023-05-19 | 2023-09-22 | 太原理工大学 | A three-dimensional funnel-shaped passive heat dissipation structure |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201438459U (en) * | 2009-03-13 | 2010-04-14 | 鸿富锦精密工业(深圳)有限公司 | Heat sink combination |
| CN101876427A (en) * | 2009-04-29 | 2010-11-03 | 鸿富锦精密工业(深圳)有限公司 | LED lamp cooling device |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3394387A (en) * | 1966-03-08 | 1968-07-23 | Theodore M. Williams | Spark plug heat dissipator |
| US4823869A (en) * | 1986-06-19 | 1989-04-25 | International Business Machines Corporation | Heat sink |
| US5299090A (en) * | 1993-06-29 | 1994-03-29 | At&T Bell Laboratories | Pin-fin heat sink |
| US5519575A (en) * | 1995-02-14 | 1996-05-21 | Chiou; Ming D. | CPU cooling fan mounting structure |
| US6698499B1 (en) * | 1996-02-01 | 2004-03-02 | Agilent Technologies, Inc. | Cooling device and method |
| EP0889524A3 (en) * | 1997-06-30 | 1999-03-03 | Sun Microsystems, Inc. | Scalable and modular heat sink-heat pipe cooling system |
| US5860472A (en) * | 1997-09-03 | 1999-01-19 | Batchelder; John Samual | Fluid transmissive apparatus for heat transfer |
| US6807059B1 (en) * | 1998-12-28 | 2004-10-19 | James L. Dale | Stud welded pin fin heat sink |
| US6170563B1 (en) * | 1999-07-26 | 2001-01-09 | Hsieh Hsin-Mao | Heat radiating device for notebook computer |
| US6445583B1 (en) * | 2001-01-26 | 2002-09-03 | Laird Technologies, Inc. | Snap in heat sink shielding lid |
| US20020121365A1 (en) * | 2001-03-05 | 2002-09-05 | Kozyra Kazimierz L. | Radial folded fin heat sink |
| AT413163B (en) * | 2001-12-18 | 2005-11-15 | Fotec Forschungs Und Technolog | COOLING DEVICE FOR A CHIP AND METHOD OF MANUFACTURE |
| US6640883B2 (en) * | 2002-02-14 | 2003-11-04 | Glacialtech Inc. | Computer heat sink |
| US20030188725A1 (en) * | 2002-04-04 | 2003-10-09 | John Van Winkle | Fluid cooling apparatus for a combustion system |
| KR100719702B1 (en) * | 2005-05-25 | 2007-05-17 | 삼성에스디아이 주식회사 | Plasma display device |
| CN101605443B (en) * | 2008-06-13 | 2011-06-08 | 富准精密工业(深圳)有限公司 | Heat dissipation device and heat dissipater thereof |
| CN201422226Y (en) * | 2009-05-06 | 2010-03-10 | 鸿富锦精密工业(深圳)有限公司 | Radiator combination |
| CN101907101A (en) * | 2009-06-05 | 2010-12-08 | 鸿富锦精密工业(深圳)有限公司 | heat sink |
| US7911791B2 (en) * | 2009-06-24 | 2011-03-22 | Ati Technologies Ulc | Heat sink for a circuit device |
| KR101414642B1 (en) * | 2009-11-20 | 2014-07-03 | 엘지전자 주식회사 | Heat sink |
| USD634281S1 (en) * | 2009-12-08 | 2011-03-15 | Agency For Science, Technology And Research | Heat sink |
| US20110232886A1 (en) * | 2010-03-24 | 2011-09-29 | Skynet Electronic Co., Ltd. | Heat dissipation housing for led lamp |
-
2008
- 2008-12-17 CN CNU2008203034762U patent/CN201336791Y/en not_active Expired - Fee Related
-
2009
- 2009-06-16 US US12/485,326 patent/US20100147495A1/en not_active Abandoned
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116801580A (en) * | 2023-05-19 | 2023-09-22 | 太原理工大学 | A three-dimensional funnel-shaped passive heat dissipation structure |
Also Published As
| Publication number | Publication date |
|---|---|
| US20100147495A1 (en) | 2010-06-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091028 Termination date: 20101217 |