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CN201336791Y - Radiator - Google Patents

Radiator Download PDF

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Publication number
CN201336791Y
CN201336791Y CNU2008203034762U CN200820303476U CN201336791Y CN 201336791 Y CN201336791 Y CN 201336791Y CN U2008203034762 U CNU2008203034762 U CN U2008203034762U CN 200820303476 U CN200820303476 U CN 200820303476U CN 201336791 Y CN201336791 Y CN 201336791Y
Authority
CN
China
Prior art keywords
radiator
fin
base
air inlet
air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU2008203034762U
Other languages
Chinese (zh)
Inventor
曹亮亮
杜中勇
李阳
郭磊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CNU2008203034762U priority Critical patent/CN201336791Y/en
Priority to US12/485,326 priority patent/US20100147495A1/en
Application granted granted Critical
Publication of CN201336791Y publication Critical patent/CN201336791Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H10W40/43

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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)

Abstract

The utility model relates to a radiator, which comprises a base contacted with an element to be radiated, and a plurality of radiating plates fixed with the base together. The radiating plates radiate slantingly and unwards from the base of the radiator, and are gradually retracted from top to bottom. The radiator is provided with retract type radiating plates, thereby improving the radiating efficiency and reducing the weight of the radiator.

Description

散热装置 heat sink

技术领域 technical field

本实用新型是关于一种散热装置,尤指一种重量轻且散热效率高的散热装置。The utility model relates to a cooling device, in particular to a cooling device with light weight and high cooling efficiency.

背景技术 Background technique

随着中央处理器等电子元件的输出功率和工作频率的不断提高,其相应产生的热量也明显增多,若不及时排除其产生的热量,将导致热量累积引起温度升高,而严重影响电子元件的正常运行。为此,业界通常在这些发热电子元件表面安装一散热器进行辅助散热,同时在散热器上加装一风扇,以加强散热效果。传统的散热器包括若干平行于所述散热器底座设置的散热鳍片,因此具有较大的重量且散热效率不高。With the continuous improvement of the output power and operating frequency of electronic components such as central processing units, the corresponding heat generated by them has also increased significantly. If the heat generated is not removed in time, it will cause heat accumulation and cause temperature rise, which will seriously affect electronic components. of normal operation. For this reason, the industry usually installs a heat sink on the surface of these heat-generating electronic components for auxiliary heat dissipation, and at the same time installs a fan on the heat sink to enhance the heat dissipation effect. The traditional heat sink includes several heat dissipation fins arranged parallel to the heat sink base, so it has a relatively large weight and low heat dissipation efficiency.

发明内容 Contents of the invention

鉴于以上内容,有必要提供一种重量轻且散热效率高的散热装置。In view of the above, it is necessary to provide a heat sink with light weight and high heat dissipation efficiency.

一种散热器,包括一与待散热元件热接触的底座,及若干与所述底座固定在一起的散热片,所述散热片自散热器底座斜向上辐射出,并自上而下呈逐渐收拢的形态。A radiator comprising a base in thermal contact with the element to be dissipated, and a number of fins fixed to the base. The fins radiate obliquely upward from the base of the radiator and gradually converge from top to bottom. Shape.

一种散热装置,包括散热器及给所述散热器送风的散热风扇,所述散热器包括一与待散热元件热接触的底座,及若干与所述底座固定在一起的散热片,所述散热片自散热器底座斜向上辐射出,并自上而下呈逐渐收拢的形态。A heat dissipation device, comprising a heat sink and a heat dissipation fan for supplying air to the heat sink, the heat sink includes a base in thermal contact with an element to be dissipated, and a plurality of heat sinks fixed together with the base, the The radiator fins radiate obliquely upward from the radiator base, and gradually converge from top to bottom.

相对现有技术,本实用新型散热装置采用收拢式散热片设置的散热器,提高了散热效率并减轻了散热器的重量。Compared with the prior art, the heat dissipation device of the utility model adopts a heat sink provided with retractable heat dissipation fins, which improves heat dissipation efficiency and reduces the weight of the heat sink.

附图说明 Description of drawings

图1为本实用新型散热装置较佳实施例的立体分解图。FIG. 1 is an exploded perspective view of a preferred embodiment of the heat sink of the present invention.

图2为图1的立体组装图。FIG. 2 is a three-dimensional assembly view of FIG. 1 .

具体实施方式 Detailed ways

请参阅图1,本实用新型散热装置包括一散热器10、及一固定于所述散热器10上的风扇20。Please refer to FIG. 1 , the heat dissipation device of the present invention includes a radiator 10 and a fan 20 fixed on the radiator 10 .

散热器10包括一底座11,在底座11的上表面设有若干散热片12。底座11的下表面可与一电脑主板上的待散热元件(如中央处理器)相接触,待散热元件产生的热量经由底座11传送到散热片12上。这些散热片12自散热器10的底座11斜向上辐射出,并自上而下呈逐渐收拢的形态。这些散热片12的中间围成一呈圆台形的空间,其顶部为散热器10的进风口。位于外层的每一散热片12后设有两导风片13,相邻的外层两散热片12间的相邻的两导风片13间形成一导风口14,来自所述进风口的风流流经散热片后经由所述导风口14流出。The heat sink 10 includes a base 11 , and a plurality of cooling fins 12 are disposed on the upper surface of the base 11 . The lower surface of the base 11 can be in contact with an element to be dissipated (such as a central processing unit) on a computer motherboard, and the heat generated by the element to be dissipated is transmitted to the heat sink 12 through the base 11 . These cooling fins 12 radiate obliquely upward from the base 11 of the radiator 10 , and gradually converge from top to bottom. The middle of these cooling fins 12 encloses a conical space, the top of which is the air inlet of the radiator 10 . Two air guide fins 13 are arranged behind each heat sink 12 of the outer layer, and an air guide port 14 is formed between the adjacent two air guide fins 13 between the two heat sink fins 12 of the adjacent outer layer, and the air from the air inlet The wind flows out through the air guide opening 14 after passing through the cooling fins.

请一并参阅图2,风扇20呈圆形,位于所述散热器10的进风口处。在本实用新型较佳实施方式中,风扇20以粘合或者螺钉卡固的方式固定在散热器10上。散热片12和导风片13均为一体成形于散热器10的底座11上。Please also refer to FIG. 2 , the fan 20 is circular and located at the air inlet of the radiator 10 . In a preferred embodiment of the present utility model, the fan 20 is fixed on the radiator 10 by bonding or screwing. Both the cooling fins 12 and the air guiding fins 13 are integrally formed on the base 11 of the radiator 10 .

所述散热片12呈自上而下逐渐收拢而形成利于风流运动的圆台形空间,当位于散热器10的进风口处的风扇20高速旋转时,风流经过散热片12的收拢作用,而使风流在流经散热片12的过程中流速逐渐增大,到达散热器10的底座11上表面时速度达到最大,因此可对散热器10上热量密集的底座11产生较大的冲击气流,可高效地降低待散热元件的温度,大大提高了散热效率。由于散热器10为收拢式设计且散热片12和导风片13一体成形于底座11上,有利于减轻散热器10的重量。The cooling fins 12 are gradually gathered from top to bottom to form a frustum-shaped space that is conducive to air flow movement. When the fan 20 at the air inlet of the radiator 10 rotates at a high speed, the air flow passes through the drawing effect of the cooling fins 12 to make the air flow In the process of flowing through the heat sink 12, the flow velocity gradually increases, and reaches the maximum speed when reaching the upper surface of the base 11 of the radiator 10, so that a relatively large impact airflow can be generated on the heat-intensive base 11 of the radiator 10, which can efficiently The temperature of the components to be dissipated is reduced, and the heat dissipation efficiency is greatly improved. Since the heat sink 10 is designed to be folded and the heat sink 12 and the air guide fin 13 are integrally formed on the base 11 , it is beneficial to reduce the weight of the heat sink 10 .

本实用新型散热装置采用收拢式散热片设置的散热器,提高了散热效率并减轻了散热器的重量,所述散热片12和导风片13可与所述散热器10的底座11非一体形成,作为单个的元件固定于散热器10的底座11,构成了散热器10的本体。The heat dissipation device of the utility model adopts a heat sink provided with retractable heat sinks, which improves heat dissipation efficiency and reduces the weight of the heat sink. The heat sink 12 and the air guide fin 13 can be formed non-integrally with the base 11 of the heat sink 10 , which is fixed to the base 11 of the radiator 10 as a single component, constituting the body of the radiator 10 .

Claims (9)

1. radiator, comprise one with the base for the treatment of the heat dissipation element thermo-contact, and the fin that is fixed together of some and described base, it is characterized in that: described fin gives off obliquely from foot of radiator, and is the form of gathering gradually from top to bottom.
2. radiator as claimed in claim 1 is characterized in that: the centre of described fin surrounds a space that is truncated cone-shaped, and its top is the air inlet of radiator.
3. radiator as claimed in claim 2, it is characterized in that: be provided with two guide vanes after being positioned at outer field each fin, form an air guide hole between adjacent two guide vanes between adjacent skin two fin, from the distinguished and admirable fin of flowing through of described air inlet after flow out by described air guide hole.
4. radiator as claimed in claim 3 is characterized in that: described fin and guide vane are on the base that is integrally formed in radiator.
5. heat abstractor, comprise radiator and give the radiator fan of described radiator air-supply, described radiator comprise one with treat the base of heat dissipation element thermo-contact, reach the fin that some and described base is fixed together, it is characterized in that: described fin gives off obliquely from foot of radiator, and be gradually the form of drawing in from top to bottom, and the centre of described fin surrounds a space that is truncated cone-shaped, and its top is the air inlet of radiator.
6. heat abstractor as claimed in claim 5, it is characterized in that: be provided with two guide vanes after being positioned at outer field each fin, form an air guide hole between adjacent two guide vanes between adjacent skin two fin, from the distinguished and admirable fin of flowing through of described air inlet after flow out by described air guide hole.
7. heat abstractor as claimed in claim 6 is characterized in that: described radiator fan is rounded and be positioned at the air inlet position.
8. heat abstractor as claimed in claim 6 is characterized in that: described fan is fixed on the described radiator in mode bonding or that screw fixes.
9. heat abstractor as claimed in claim 6 is characterized in that: described fin and guide vane are on the base that is integrally formed in radiator.
CNU2008203034762U 2008-12-17 2008-12-17 Radiator Expired - Fee Related CN201336791Y (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CNU2008203034762U CN201336791Y (en) 2008-12-17 2008-12-17 Radiator
US12/485,326 US20100147495A1 (en) 2008-12-17 2009-06-16 Heat dissipation apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2008203034762U CN201336791Y (en) 2008-12-17 2008-12-17 Radiator

Publications (1)

Publication Number Publication Date
CN201336791Y true CN201336791Y (en) 2009-10-28

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CNU2008203034762U Expired - Fee Related CN201336791Y (en) 2008-12-17 2008-12-17 Radiator

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US (1) US20100147495A1 (en)
CN (1) CN201336791Y (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116801580A (en) * 2023-05-19 2023-09-22 太原理工大学 A three-dimensional funnel-shaped passive heat dissipation structure

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CN101876427A (en) * 2009-04-29 2010-11-03 鸿富锦精密工业(深圳)有限公司 LED lamp cooling device

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20091028

Termination date: 20101217