CN201336411Y - Bonding pad group for SFP connector and communication device - Google Patents
Bonding pad group for SFP connector and communication device Download PDFInfo
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- CN201336411Y CN201336411Y CNU2008201827609U CN200820182760U CN201336411Y CN 201336411 Y CN201336411 Y CN 201336411Y CN U2008201827609 U CNU2008201827609 U CN U2008201827609U CN 200820182760 U CN200820182760 U CN 200820182760U CN 201336411 Y CN201336411 Y CN 201336411Y
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- 238000004891 communication Methods 0.000 title claims description 8
- 230000003287 optical effect Effects 0.000 claims description 9
- 238000006073 displacement reaction Methods 0.000 claims description 4
- 238000013461 design Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 238000005457 optimization Methods 0.000 description 6
- 238000002788 crimping Methods 0.000 description 5
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 230000008859 change Effects 0.000 description 3
- 230000006872 improvement Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 238000003466 welding Methods 0.000 description 1
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Abstract
The utility model discloses a bonding pad group for a SFP connector which comprises a high speed differential signal bonding pad for connecting a high speed differential signal pin. The high speed differential signal bonding pad is matched with the high speed differential signal pin in dimension. In the utility model, an impedance discontinuity point at the pressing joint interface part of the SFP connector is reduced through reducing or displacing the high speed differential signal bonding pad in the SFP connector, so as to improve the eye pattern quality of high speed differential signals and reduce the attenuation of the high speed differential signals.
Description
Technical Field
The utility model relates to the field of communication technology, especially, relate to a SFP connector pad group and communications facilities.
Background
In the prior art, a common interface of a high-speed signal (such as 10GHz, 40GHz, 160GHz, or the like) is an XFP (10-Gigabit Small Form-factor Pluggable transceiver), but since an XFP module is large in size, not beneficial to integration, and high in cost, the common interface of a high-speed signal may be diverted to use an SFP (Small Form-factor Pluggable transceiver) in the future, and therefore it is necessary to improve a PCB (Printed Circuit Board) design of an SFP (signal rate of 10GHz) link as soon as possible, where the signal rate of the SFP is 1GHz, and the signal rate of the SFP + is 10 GHz.
As shown in fig. 1a, the SFP signal includes: two pairs of high-speed differential signals TD-and TD +, RD-and RD +; ground signal VEET and VEER, power supply signal VCCT and VCCR; a control signal. The SFP connector signal arrangement is: two side pads of high-speed differential signal pads TD-and TD +, RD-and RD + are ground signals, and the middle two pads are power signals; the other bonding pads are control signal pins.
In the prior art, in the original design of the PCB package library of the SFP connector, the high-speed differential signal pads are arranged with the same length and width as the ground/power pads and other pads, for example, the size of the SFP + connector pad at 10GHz is 2.0 × 0.5 mm. And the size of the high-speed differential signal pin in the SFP + of 10GHz is 1.1 x 0.3 mm. Since the link impedance is proportional to the link inductance and inversely proportional to the link capacitance, and the capacitance is proportional to the area, the link impedance is inversely proportional to the capacitance; in addition, since the high-speed differential signal pad is generally larger in area than the high-speed differential signal pin, when the high-speed differential signal pin is pressed onto the high-speed differential signal pad, a link impedance discontinuity may be caused, as shown in fig. 1b, in which the signal pin 103 is pressed onto the signal pad 102, and the signal pad 102 includes a Stub101, in which the other end of the signal pad 102 opposite to the Stub101 is connected to a PCB trace, and the Stub101 may cause a link impedance discontinuity.
Due to the discontinuous impedance of the link, it may affect the performance indexes of IL (insertion Loss) and RL (Return Loss) of the SFP link, which may cause the SFP signal to lose packets, fail to work normally, and affect the product performance.
SUMMERY OF THE UTILITY MODEL
The utility model provides a SFP connector pad group and communication equipment has reduced the impedance mutation point of connection interface part, has improved high-speed differential signal quality.
The utility model provides a SFP connector pad group, include:
and the high-speed differential signal bonding pad is connected with the high-speed differential signal pin, and the size of the high-speed differential signal bonding pad is matched with that of the high-speed differential signal pin.
The high-speed differential signal pad includes:
the high-speed differential sending signal pad is connected with a high-speed differential sending signal pin of the high-speed differential signal;
and the high-speed differential receiving signal bonding pad is connected with the high-speed differential receiving signal pin of the high-speed differential signal.
The length of the high-speed differential signal bonding pad is matched with that of the high-speed differential signal pin; the high speed differential signal pad width matches the high speed differential signal pin width.
The centers of the high-speed differential signal pads and the centers of the other pads are located on the same horizontal line.
And one end of the high-speed differential signal pad, which is connected with the PCB wiring, is aligned with other pads in the length direction.
For a 10GHz SFP + connector, the length of the high-speed differential signal pad is 1.1mm to 2.0 mm; the width of the high-speed differential signal bonding pad is 0.3mm to 0.5 mm; the center displacement of the high-speed differential signal pad is 0mm to 0.45 mm. Preferably, the high-speed differential signal pad is 1.6mm long; the width of the high-speed differential signal bonding pad is 0.4 mm; or the length of the high-speed differential signal bonding pad is 1.75 mm; the width of the high-speed differential signal bonding pad is 0.4 mm; or the length of the high-speed differential signal bonding pad is 1.1 mm; the high-speed differential signal pad width is 0.4 mm.
The utility model provides a support communication equipment of SFP high-speed optical port, include:
the physical layer chip is connected with the SFP connector pad group through the PCB routing;
the SFP connector bonding pad group comprises high-speed differential signal bonding pads connected with high-speed differential signal pins, and the sizes of the high-speed differential signal bonding pads are matched with those of the high-speed differential signal pins.
Compared with the prior art, the utility model has the advantages of it is following:
the utility model discloses in, reduce or the displacement through high-speed differential signal pad in to the SFP connector, reduced the impedance discontinuity of SFP connector crimping interface part, improved high-speed differential signal's eye diagram quality, reduce high-speed differential signal decay.
Drawings
FIG. 1a is a schematic diagram of the signal distribution of an SFP connector in the prior art;
FIG. 1b is a schematic diagram of a high-speed differential signal interface crimping in the prior art;
fig. 2a to fig. 2c are schematic diagrams of the pad design after 3 kinds of optimization in the present invention;
FIG. 3 is a schematic diagram showing the comparison of frequency domain parameters of 3 sizes of bonding pads in the present invention;
fig. 4 is a schematic diagram comparing differential impedance of different pads in the present invention;
fig. 5 is a schematic diagram of the crimping of the 1.1 × 0.4mm pad of the present invention.
Detailed Description
In the present invention, the whole SFP signal (e.g. 10GHz, also can be applied to 40GHz, 80GHz or 160GHz, etc.) link path is composed of the signal routing from PHY (physical layer) chip to SFP connector and the SFP connector interface. For a signal routing part on a PCB board in a link path, the prior art has realized an optimal design of parameter indexes through reasonable wiring. The utility model discloses in optimize the design to SFP connector crimping interface, realize reaching the optimization to high-speed signal quality to the whole optimal design of whole link.
Next, the SFP + at 10GHz will be described as an example. SFP + connector raw PCB package library, pad size was 2.0 x 0.5 mm. When an SFP + optical module is inserted, there is a Stub in the dashed box shown in fig. 1 b. Stub is a main factor causing impedance abrupt change of the SFP + interface crimping part, and the influence on the impedance abrupt change is remarkably reduced by optimizing the Stub design of the part.
The operational content is optimized for the pads of the SFP + connector raw PCB package library, as shown in figure 2,
in fig. 2a, the size of the high speed differential signal pads of the SFP + connector is optimized and then the location of the pads is shifted. For example, the width of the high-speed differential signal pad of the SFP + connector is reduced to 0.4mm, which is as wide as possible as the width of the high-speed differential signal pin of the SFP + optical module, the length of the high-speed differential signal pad of the SFP + connector is reduced to 1.6mm, which is as long as possible as the length of the high-speed differential signal pin of the SFP + optical module, and the center of the high-speed differential signal pad is on the same horizontal line with the centers of the other pads, that is, the center of the high-speed differential signal pad of the SFP + optical module is displaced by 0.2 mm.
In fig. 2b, the size of the high speed differential signal pads of the SFP + connector is optimized. The width and the length of the high-speed differential signal pad of the SFP + connector are reduced to 0.4mm and 1.75mm respectively, the high-speed differential signal pad of the SFP + connector is close to one end (connected with a PCB (printed circuit board) wire) connected with the optical module in the longitudinal direction and is aligned with other pads, and the other end of the high-speed differential signal pad is 0.25mm shorter than the other pads.
In fig. 2c, the size of the high speed differential signal pads of the SFP + connector is optimized. The width of a high-speed differential signal pad of the SFP + connector is reduced to 0.4mm, the length of the high-speed differential signal pad is reduced to 1.1mm, one end of the high-speed differential signal pad, which is connected with a PCB (printed circuit board) wire, is aligned with other pads, and the other end of the high-speed differential signal pad is 0.9mm shorter than other pads.
It can be seen that the optimization for the high speed differential signal pads of an SFP + connector is a dynamic range of values. In the modification range of the size of the original bonding pad: the length may be 1.1mm to 2.0mm and the width 0.3mm to 0.5 mm; the moving range of the up-down position is within 0 to 0.9mm, that is, the moving range of the center position is within 0 to 0.45 mm. Ideally, the high-speed differential signal pads of the SFP + connector and the high-speed differential signal pins of the SFP + optical module have the same area, i.e., 1.1mm by 0.3 mm. The above specific data is only a case illustration and does not represent the optimization effect of only these dimensions.
The following is combined with the utility model discloses an improvement compares the performance index change of several kinds of condition.
1. Index comparison in frequency domain, as shown in fig. 3, where the abscissa is frequency and the ordinate is attenuation, it can be seen that the SFP + connector high-speed differential signal pad is optimized to 1.6 × 0.5mm and 1.1 × 0.4mm, and then compared with the original 2.0 × 0.5mm pad parameter, where dB (s (2, 1)), and the thin black line represents the pad insertion loss curve of 1.1 × 0.4 mm; dB (s (4, 3)), the thicker black line represents the insertion loss curve for a pad of 1.6 x 0.5 mm; dB (s (6, 5)), the thickest black line, represents the insertion loss curve for a pad of 2.0 x 0.5 mm.
Through parameter comparison of the three bonding pads, the higher the area matching between the high-speed differential signal bonding pad and the high-speed differential signal pin of the SFP + connector, the lower the attenuation.
2. Differential impedance comparison in time domain, as shown in fig. 4, the abscissa is time and the ordinate is impedance, wherein X1, thin black line represents 1.1 × 0.4mm differential impedance; x2, the thicker black line represents a differential impedance of 1.6X 0.5 mm; x3, the most bold black line represents a differential impedance of 2.0X 0.5 mm;
the original pad impedance has dropped below 70 ohms, while other optimized pad impedance designs are a significant improvement. Substantially around 90 ohms, a continuous match with 100 ohms can be achieved (errors within 10% are acceptable).
3. The process realizability needs to be considered while optimizing the bonding pad. So that it is impossible to optimize excessively the size or move up and down, which affects the reliability of the product.
In a similar way, the scheme of the utility model is applicable to the optimization of 1 GHz's SFP pad equally.
The utility model discloses in, the communication equipment side of supporting the high-speed optical port of SFP, the pad (the high-speed differential signal pad) that is used for welding interface connector on the PCB carries out the optimization operation on current standard's basis, as shown in FIG. 5. The impedance discontinuity of the connection interface part is reduced; IL (insertion loss) and RL (return loss) performance index parameters of the high-speed link are improved; the eye diagram quality of the high-speed differential signal is obviously improved, and the signal attenuation is effectively reduced.
The above disclosure is only for the specific embodiments of the present invention, however, the present invention is not limited thereto, and any changes that can be considered by those skilled in the art should fall within the protection scope of the present invention.
Claims (10)
1. A small form factor pluggable transceiver SFP connector padset, comprising:
and the high-speed differential signal bonding pad is connected with the high-speed differential signal pin, and the size of the high-speed differential signal bonding pad is matched with that of the high-speed differential signal pin.
2. The SFP connector padset of claim 1, wherein the high-speed differential signal pads comprise:
the high-speed differential sending signal pad is connected with a high-speed differential sending signal pin of the high-speed differential signal;
and the high-speed differential receiving signal bonding pad is connected with the high-speed differential receiving signal pin of the high-speed differential signal.
3. The SFP connector padset of claim 1, wherein the high-speed differential signal pad length matches the high-speed differential signal pin length; the high speed differential signal pad width matches the high speed differential signal pin width.
4. The SFP connector padset of any of claims 1 to 3, wherein centers of the high-speed differential signal pads are located on a same horizontal line as centers of the other pads.
5. The SFP connector padset of any one of claims 1 to 3, wherein the high-speed differential signal pads are aligned with other pads at one end connected to a PCB trace in the lengthwise direction.
6. The SFP connector padset of claim 4, wherein the high-speed differential signal pad length is 1.1mm to 2.0mm for a 10GHz SFP + connector; the width of the high-speed differential signal bonding pad is 0.3mm to 0.5 mm; the center displacement of the high-speed differential signal pad is 0mm to 0.45 mm.
7. The SFP connector padset of claim 6, wherein the high-speed differential signal pads are 1.6mm in length; the high-speed differential signal pad width is 0.4 mm.
8. The SFP connector padset of claim 5, wherein the high-speed differential signal pad length is 1.1mm to 2.0mm for a 10GHz SFP connector; the width of the high-speed differential signal bonding pad is 0.3mm to 0.5 mm; the center displacement of the high-speed differential signal pad is 0mm to 0.45 mm.
9. The SFP connector padset of claim 8, wherein the high-speed differential signal pads are 1.75mm in length; the width of the high-speed differential signal bonding pad is 0.4 mm;
or,
the length of the high-speed differential signal bonding pad is 1.1 mm; the high-speed differential signal pad width is 0.4 mm.
10. A communication device supporting an SFP high-speed optical port, comprising:
the physical layer chip is connected with the SFP connector pad group through the PCB routing;
the SFP connector bonding pad group comprises high-speed differential signal bonding pads connected with high-speed differential signal pins, and the sizes of the high-speed differential signal bonding pads are matched with those of the high-speed differential signal pins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201827609U CN201336411Y (en) | 2008-12-24 | 2008-12-24 | Bonding pad group for SFP connector and communication device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201827609U CN201336411Y (en) | 2008-12-24 | 2008-12-24 | Bonding pad group for SFP connector and communication device |
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| Publication Number | Publication Date |
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| CN201336411Y true CN201336411Y (en) | 2009-10-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNU2008201827609U Expired - Lifetime CN201336411Y (en) | 2008-12-24 | 2008-12-24 | Bonding pad group for SFP connector and communication device |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103155452A (en) * | 2010-10-12 | 2013-06-12 | 思科技术公司 | Compact small form-factor pluggable transceiver |
| CN103974555A (en) * | 2014-05-20 | 2014-08-06 | 杭州华三通信技术有限公司 | Manufacturing method of printed circuit board and printed circuit board |
| CN107918581A (en) * | 2017-11-09 | 2018-04-17 | 郑州云海信息技术有限公司 | One kind is directed to high-speed signal connector method for optimization analysis and system |
| CN110501533A (en) * | 2019-08-13 | 2019-11-26 | 深圳市迅特通信技术有限公司 | A QSFP28 optical module test adapter device and test method |
| CN110557888A (en) * | 2018-06-01 | 2019-12-10 | 凡甲电子(苏州)有限公司 | circuit board and electric connection assembly |
| CN113766730A (en) * | 2021-07-29 | 2021-12-07 | 苏州浪潮智能科技有限公司 | Connector PCB and differential signal non-stub fan-out wiring structure thereof |
| CN113939091A (en) * | 2021-10-21 | 2022-01-14 | 苏州浪潮智能科技有限公司 | Impedance matching design method and device of link electrostatic impedor and printed circuit board |
| CN114363205A (en) * | 2021-12-17 | 2022-04-15 | 苏州浪潮智能科技有限公司 | High-speed link impedance mutation analysis method, system, terminal and storage medium |
-
2008
- 2008-12-24 CN CNU2008201827609U patent/CN201336411Y/en not_active Expired - Lifetime
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103155452A (en) * | 2010-10-12 | 2013-06-12 | 思科技术公司 | Compact small form-factor pluggable transceiver |
| CN103155452B (en) * | 2010-10-12 | 2016-08-03 | 思科技术公司 | Compact small form-factor pluggable transceiver |
| CN103974555A (en) * | 2014-05-20 | 2014-08-06 | 杭州华三通信技术有限公司 | Manufacturing method of printed circuit board and printed circuit board |
| CN107918581A (en) * | 2017-11-09 | 2018-04-17 | 郑州云海信息技术有限公司 | One kind is directed to high-speed signal connector method for optimization analysis and system |
| CN110557888A (en) * | 2018-06-01 | 2019-12-10 | 凡甲电子(苏州)有限公司 | circuit board and electric connection assembly |
| CN110557888B (en) * | 2018-06-01 | 2024-09-03 | 凡甲电子(苏州)有限公司 | Circuit board and electric connection assembly |
| CN110501533A (en) * | 2019-08-13 | 2019-11-26 | 深圳市迅特通信技术有限公司 | A QSFP28 optical module test adapter device and test method |
| CN113766730A (en) * | 2021-07-29 | 2021-12-07 | 苏州浪潮智能科技有限公司 | Connector PCB and differential signal non-stub fan-out wiring structure thereof |
| CN113939091A (en) * | 2021-10-21 | 2022-01-14 | 苏州浪潮智能科技有限公司 | Impedance matching design method and device of link electrostatic impedor and printed circuit board |
| CN113939091B (en) * | 2021-10-21 | 2023-08-18 | 苏州浪潮智能科技有限公司 | Impedance matching design method, device and printed circuit board of link electrostatic impedance device |
| CN114363205A (en) * | 2021-12-17 | 2022-04-15 | 苏州浪潮智能科技有限公司 | High-speed link impedance mutation analysis method, system, terminal and storage medium |
| CN114363205B (en) * | 2021-12-17 | 2023-08-25 | 苏州浪潮智能科技有限公司 | High-speed link impedance mutation analysis method, system, terminal and storage medium |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 310052 Binjiang District Changhe Road, Zhejiang, China, No. 466, No. Patentee after: Xinhua three Technology Co., Ltd. Address before: 310053 Hangzhou hi tech Industrial Development Zone, Zhejiang province science and Technology Industrial Park, No. 310 and No. six road, HUAWEI, Hangzhou production base Patentee before: Huasan Communication Technology Co., Ltd. |
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| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20091028 |