CN201335633Y - Temperature-uniforming plate with capillary tissues of different thicknesses and mold for same - Google Patents
Temperature-uniforming plate with capillary tissues of different thicknesses and mold for same Download PDFInfo
- Publication number
- CN201335633Y CN201335633Y CNU2008201826042U CN200820182604U CN201335633Y CN 201335633 Y CN201335633 Y CN 201335633Y CN U2008201826042 U CNU2008201826042 U CN U2008201826042U CN 200820182604 U CN200820182604 U CN 200820182604U CN 201335633 Y CN201335633 Y CN 201335633Y
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- China
- Prior art keywords
- capillary
- section
- temperature
- uniforming plate
- capillary structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 239000012530 fluid Substances 0.000 claims abstract description 15
- 238000000465 moulding Methods 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000000843 powder Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 7
- 238000010438 heat treatment Methods 0.000 description 5
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical group OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000011469 building brick Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A temperature equalization plate with capillary tissue of different thickness comprises a shell, a capillary tissue, a support body and a working fluid; the shell is provided with a cavity; the capillary tissue is attached to the inner wall of the cavity and is provided with a first capillary section and a second capillary section extending from the first capillary section, and the thickness of the first capillary section is greater than that of the second capillary section; the support body is accommodated in the capillary tissue; the working fluid is filled in the cavity. Therefore, the utility model discloses have the effect that promotes holistic heat conduction efficiency and save the cost simultaneously.
Description
Technical field
The utility model relates to a kind of temperature-uniforming plate and is used for the mould of this temperature-uniforming plate, and particularly a kind of temperature-uniforming plate with capillary structure of different-thickness reaches the mould in order to the capillary structure of this temperature-uniforming plate of moulding.
Background technology
Because temperature-uniforming plate (vapor chamber) has characteristics such as high hot biography ability, high thermoconductivity, in light weight, simple in structure and multipurpose, and can transmit a large amount of heats, do not consume plurality of advantages such as electric power and price be low, be widely used in the heat conduction of electronic building brick, and by electronic building brick being carried out the quick diversion of heat, with the effective hot polymerization collection phenomenon that solves the electronic building brick of present stage.
Existing temperature-uniforming plate mainly comprises-housing, a capillary structure, a supporter and a working fluid; This housing has a cavity volume; This capillary structure is attached at the inwall of this cavity volume, and this capillary structure comprises one first capillary section and from the extended one second capillary section of this first capillary section, this first capillary section forms identical thickness with this second capillary section; This supporter is located in this capillary structure inside; This working fluid is then filled in this cavity volume inside.
When using this temperature-uniforming plate, this temperature-uniforming plate is amplexiformed in an electronic heating component surface, and this first capillary Duan Ze is provided with central high thermal source district that should electronic heating component, the high heat in its central high thermal source district then major part conducts to this first capillary section, and it is hot significantly to cool off its height with the adsorbed working fluid of this first capillary intersegmental part, and the high heat that conducts to this second capillary section is then less.
But existing temperature-uniforming plate, disappearance below on reality is used, still existing, when thin as if the thickness moulding of this capillary structure (being first and second capillary section), the amount of working fluid that its inside is contained then tails off, so when carrying out the diversion of high heat, heat conduction efficiency is relatively poor; If when the thickness moulding of this capillary structure was thicker, though can promote its heat transfer efficiency, the high hot overwhelming majority conducted to this first capillary section but not this second capillary section, so this second capillary section utilization rate is very low, causes the waste of material and the increase of cost.
The utility model content
The purpose of this utility model is to provide a kind of temperature-uniforming plate of the capillary structure with different-thickness and is used for the mould of this temperature-uniforming plate, reaches simultaneously to promote its heat conduction efficiency and cost-effective effect.
To achieve these goals, the utility model provides a kind of temperature-uniforming plate with capillary structure of different-thickness, is made of a housing, a capillary structure, a supporter and a working fluid; This housing has a cavity volume; This capillary structure is attached at the inwall of this cavity volume, and this capillary structure has one first capillary section and from the extended one second capillary section of this first capillary section, the thickness of this first capillary section is greater than the thickness of this second capillary section; This supporter is located in this capillary structure inside; This working fluid is then filled in this cavity volume inside.
In addition, the utility model also provides a kind of mould that is used for this temperature-uniforming plate, is made of a plate body; This plate body surface forming has one first section that matches with the described first capillary section and one second section that extends and match with the described second capillary section from this first section.
Beneficial functional of the present utility model is: the utility model forms thicker thickness in this first capillary section of this capillary structure, and form thin thickness at its second capillary Duan Ze, reach simultaneously and promote heat conduction efficiency and cost-effective effect, can overcome relatively and promote heat conduction efficiency in the prior art and save the shortcoming that cost can't have concurrently.
Below in conjunction with the drawings and specific embodiments the utility model is described in detail, but not as to qualification of the present utility model.
Description of drawings
Fig. 1 is the generalized section of temperature-uniforming plate of the present utility model;
Fig. 2 is the a-quadrant partial enlarged drawing of Fig. 1;
Fig. 3 is the user mode figure of temperature-uniforming plate of the present utility model;
Fig. 4 is the schematic perspective view of housing of the present utility model and mould;
The cutaway view that Fig. 5 matches with mould for the utility model;
Fig. 6 removes the schematic diagram of mould for Fig. 5;
Fig. 7 is the stereogram of Fig. 6 and supporter;
Fig. 8 is another enforcement illustration of the utility model mould;
Fig. 9 is the constitutional diagram of Fig. 8;
Figure 10 is another enforcement illustration of temperature-uniforming plate of the present utility model;
Figure 11 is the B zone partial enlarged drawing of Figure 10.
Wherein, Reference numeral
1,1 ' ... temperature-uniforming plate
10..... housing
11..... cavity volume 12..... opening
20..... working fluid
30..... capillary structure
31,31 ' .., the first capillary section 32,32 ' .., the second capillary section
33..... the first raised line 34....., second raised line
35..... the first groove 36....., second groove
40..... supporter
41..... side plate 42..... wave sheet
421.... crest section 422.... trough section
5,5 ' ... mould
51..... plate body 52,52 ' ... first section
53,53 ' .., the second section 54....., first stick
55..... the second stick 56....., first conduit
57..... second conduit
6..... electronic heating component
The specific embodiment
Below in conjunction with accompanying drawing structural principle of the present invention and operation principle are done concrete description:
As Fig. 1 and Fig. 2, the utlity model has the temperature-uniforming plate 1 of the capillary structure of different-thickness, constitute by a housing 10, a working fluid 20, a capillary structure 30 and a supporter 40.
This housing 10 can be made by copper material or aluminium, and its inside is formed with a cavity volume 11.
This working fluid 20 is filled in this cavity volume 11, and described working fluid 20 can be pure water, alcohol, methyl alcohol, ethanol or acetone, but is not limited thereto.
This capillary structure 30 is attached at the inwall of this cavity volume 11, this capillary structure 30 has one first capillary section 31 and from 31 extended one second capillary sections 32 of this first capillary section, the thickness of this first capillary section 31 is greater than the thickness of this second capillary section 32, wherein, the first capillary section 31 forms a plurality of first raised lines 33, this second capillary section 32 then forms a plurality of second raised lines 34, the height of this first raised line 33 is greater than the height of this second raised line 34, and be formed with one first groove 35 between in office two adjacent these first raised lines 33, then be formed with one second groove 36 between in office two adjacent these second raised lines 34, the degree of depth of this second groove 36 of the depth ratio of this first groove 35 is dark, described capillary structure 30 can be a porous metal sintered powder, mesh grid or its both mixture, but be not limited thereto.
This supporter 40 is located in this capillary structure 30 inside, this supporter 40 comprises two side plates 41 (as shown in Figure 7) and is connected a plurality of wave sheets 42 between this two side plate 41, this wave sheet 42 is established by a plurality of crest sections 421 and a plurality of trough section 422 structures and is formed, and this trough section 422 of wantonly two adjacent these wave sheets 42 configuration that misplaces each other, described supporter 40 can be an elastomer or the flexible metal plate of tool.
When using the utility model, as Fig. 3, at first temperature-uniforming plate 1 of the present utility model is amplexiformed in an electronic heating component 6 surfaces, 31 pairs of this first capillary sections should electronic heating component 6 central high thermal source district be provided with, the high heat in its central high thermal source district then major part conducts to this first capillary section 31, and it is hot significantly to cool off its height with these first capillary section, 31 inner adsorbed a large amount of these working fluids 20, to increase whole heat conduction efficiency, simultaneously, the high heat that conducts to this second capillary section 32 is then less, and the thickness of this second capillary section 32 is little than the thickness of this first capillary section 31, has cost-effective effect.Therefore, use the utility model to have simultaneously and promote whole heat conduction efficiency and cost-effective effect.
As Fig. 4, the utility model is made of a plate body 51 in order to the mould 5 of this capillary structure 30 of this temperature-uniforming plate 1 of moulding.
This plate body 51 has one first section 52 and from 52 extended one second sections 53 of this first section, this first section 52 forms a plurality of first sticks 54 (as shown in Figure 5) that cooperatively interact with this first capillary section 31, this second section 53 then forms a plurality of second sticks 55 that cooperatively interact with this second capillary section 32, the height of this first stick 54 equals the height of this second stick 55, and in office two be formed with one first conduit 56 between adjacent this first stick 54, then be formed with one second conduit 57 between in office two adjacent these second sticks 55, the degree of depth of this second conduit 57 of the depth ratio of this first conduit 56 is dark, described this plate body 51 can be a metal plate, but is not limited thereto.
During this capillary structure 30 of moulding, extremely shown in Figure 6 as Fig. 4, at first these housing 10 1 sides offer an opening 12, this mould 5 is located in this housing 10 inside via this opening 12, and between this housing 10 and this mould 5 filled with metal powder (as shown in Figure 5), give sinter molding again and remove this mould 5 (as shown in Figure 6), to constitute this capillary structure 30 structures; At last,, again this supporter 40 is arranged on this capillary structure 30 inner and these openings 12 of involution, inserts these an amount of working fluid 20 backs again and vacuumize, to finish the making of the utility model temperature-uniforming plate 1 as Fig. 7.
As Fig. 8 and Fig. 9, another enforcement illustration for the utility model mould, the difference of present embodiment and previous embodiment be this mould 5 ' a plurality of first sticks 54 of this first section 52 ' form, a plurality of second sticks 55 of this second section 53 ' then form, wherein, the height of this first stick 54 is less than the height of this second stick 55, and is that another of aforementioned this mould 5 changes kenel.
As Figure 10 and Figure 11, another enforcement illustration for the utility model temperature-uniforming plate, present embodiment and the difference of previous embodiment be this first capillary section 31 of this temperature-uniforming plate 1 ' institute moulding ' with above-mentioned this mould 5 ' this first section 52 ' match, this of its moulding second capillary section 32 ' then and above-mentioned this second section 53 ' match, wherein, a plurality of first raised lines 33 of this first capillary section 31 ' form, this second capillary section 32 ' then forms a plurality of second raised lines 34, the height of this first raised line 33 equals height (this first and second raised line 33 of this second raised line 34,34 height is respectively the distance between its side of amplexiforming these housing 10 inwalls to the another side on these supporter 40 surfaces of its butt), and be formed with one first groove 35 between in office two adjacent these first raised lines 33, and be formed with one second groove 36 between in office two adjacent these second raised lines 34, the degree of depth of this first groove 35 is then than the depth as shallow of this second groove 36, and has the identical effect person of previous embodiment.
In sum, use heat conduction efficiency and the cost-effective effect that the utility model has the integral body of promoting simultaneously.
Certainly; the utility model also can have other various embodiments; under the situation that does not deviate from the utility model spirit and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the utility model, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the utility model.
Claims (11)
1. the temperature-uniforming plate with capillary structure of different-thickness is characterized in that, comprising:
One housing has a cavity volume;
One capillary structure layer is attached at the inwall of this cavity volume, and this capillary structure has one first capillary section and from the extended one second capillary section of this first capillary section, the thickness of this first capillary section is greater than the thickness of this second capillary section;
One supporter is located in this capillary structure inside; And
One working fluid is filled in this cavity volume inside.
2. the temperature-uniforming plate with capillary structure of different-thickness as claimed in claim 1, it is characterized in that, the described first capillary section forms a plurality of first raised lines, and this second capillary Duan Ze forms a plurality of second raised lines, and the height of this first raised line is greater than the height of this second raised line.
3. the temperature-uniforming plate with capillary structure of different-thickness as claimed in claim 2, it is characterized in that, be formed with one first groove between in office two adjacent these first raised lines, then be formed with one second groove between in office two adjacent these second raised lines, the degree of depth of this second groove of the depth ratio of this first groove is dark.
4. the temperature-uniforming plate with capillary structure of different-thickness as claimed in claim 1, it is characterized in that, the described first capillary section forms a plurality of first raised lines, and this second capillary Duan Ze forms a plurality of second raised lines, and the height of this first raised line equals the height of this second raised line.
5. the temperature-uniforming plate with capillary structure of different-thickness as claimed in claim 4, it is characterized in that, be formed with one first groove between in office two adjacent these first raised lines, then be formed with one second groove, the depth as shallow of this second groove of the depth ratio of this first groove between in office two adjacent these second raised lines.
6. the temperature-uniforming plate with capillary structure of different-thickness as claimed in claim 1 is characterized in that, described capillary structure layer is a porous metal sintered powder layer.
7. the temperature-uniforming plate with capillary structure of different-thickness as claimed in claim 1 is characterized in that, described supporter comprises two side plates and is connected a plurality of wave sheets between this two side plate.
8. the temperature-uniforming plate with capillary structure of different-thickness as claimed in claim 7 is characterized in that, described wave sheet is established by a plurality of crest sections and a plurality of trough section institute structure and formed, and this trough section of wantonly two adjacent these wave sheets configuration that misplaces each other.
9. mould in order to the capillary structure of this temperature-uniforming plate of moulding, this capillary structure have one first capillary section and from the extended one second capillary section of this first capillary section, it is characterized in that this mould comprises:
One plate body, has one first section and from extended one second section of this first section, this first section forms a plurality of first sticks that cooperatively interact with the described first capillary section, this second section then forms a plurality of second sticks that cooperatively interact with the described second capillary section, and the height of this first stick equals the height of this second stick.
10. the mould of the capillary structure in order to this temperature-uniforming plate of moulding as claimed in claim 9, it is characterized in that, be formed with one first conduit between in office two adjacent these first sticks, and being formed with one second conduit between in office two adjacent these second sticks, the degree of depth of this second conduit of the depth ratio of this first conduit is dark.
11. the mould in order to the capillary structure of this temperature-uniforming plate of moulding, this capillary structure have one first capillary section and from the extended one second capillary section of this first capillary section, it is characterized in that this mould comprises:
One plate body, has one first section and from extended one second section of this first section, this first section forms a plurality of first sticks that cooperatively interact with the described first capillary section, this second section then forms a plurality of second sticks that cooperatively interact with the described second capillary section, and the height of this first stick is less than the height of this second stick.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201826042U CN201335633Y (en) | 2008-12-26 | 2008-12-26 | Temperature-uniforming plate with capillary tissues of different thicknesses and mold for same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201826042U CN201335633Y (en) | 2008-12-26 | 2008-12-26 | Temperature-uniforming plate with capillary tissues of different thicknesses and mold for same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201335633Y true CN201335633Y (en) | 2009-10-28 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008201826042U Expired - Lifetime CN201335633Y (en) | 2008-12-26 | 2008-12-26 | Temperature-uniforming plate with capillary tissues of different thicknesses and mold for same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201335633Y (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102205485A (en) * | 2010-03-31 | 2011-10-05 | 富准精密工业(深圳)有限公司 | Flat plate heat pipe and manufacturing method thereof |
| CN104661490A (en) * | 2013-11-22 | 2015-05-27 | 奇鋐科技股份有限公司 | Vapor structure |
| CN108801015A (en) * | 2017-05-05 | 2018-11-13 | 双鸿科技股份有限公司 | Temperature equalizing plate |
| CN111447792A (en) * | 2020-04-08 | 2020-07-24 | Oppo广东移动通信有限公司 | Heat dissipation device, preparation method of heat dissipation device and electronic equipment |
| CN111836518A (en) * | 2020-07-06 | 2020-10-27 | 瑞声科技（南京）有限公司 | Vaporizing plate and method for processing the same |
| CN112888267A (en) * | 2021-02-05 | 2021-06-01 | 华南理工大学 | Ultrathin flexible vapor chamber and manufacturing method |
-
2008
- 2008-12-26 CN CNU2008201826042U patent/CN201335633Y/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102205485A (en) * | 2010-03-31 | 2011-10-05 | 富准精密工业(深圳)有限公司 | Flat plate heat pipe and manufacturing method thereof |
| CN104661490A (en) * | 2013-11-22 | 2015-05-27 | 奇鋐科技股份有限公司 | Vapor structure |
| CN104661490B (en) * | 2013-11-22 | 2017-04-12 | 奇鋐科技股份有限公司 | Vapor structure |
| CN108801015A (en) * | 2017-05-05 | 2018-11-13 | 双鸿科技股份有限公司 | Temperature equalizing plate |
| CN111447792A (en) * | 2020-04-08 | 2020-07-24 | Oppo广东移动通信有限公司 | Heat dissipation device, preparation method of heat dissipation device and electronic equipment |
| CN111447792B (en) * | 2020-04-08 | 2022-05-13 | Oppo广东移动通信有限公司 | Heat-dissipating device, preparation method of heat-dissipating device, and electronic equipment |
| CN111836518A (en) * | 2020-07-06 | 2020-10-27 | 瑞声科技（南京）有限公司 | Vaporizing plate and method for processing the same |
| CN112888267A (en) * | 2021-02-05 | 2021-06-01 | 华南理工大学 | Ultrathin flexible vapor chamber and manufacturing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20091028 |