CN201311932Y - High temperature resistant integrated molding videography group - Google Patents
High temperature resistant integrated molding videography group Download PDFInfo
- Publication number
- CN201311932Y CN201311932Y CNU2008201547754U CN200820154775U CN201311932Y CN 201311932 Y CN201311932 Y CN 201311932Y CN U2008201547754 U CNU2008201547754 U CN U2008201547754U CN 200820154775 U CN200820154775 U CN 200820154775U CN 201311932 Y CN201311932 Y CN 201311932Y
- Authority
- CN
- China
- Prior art keywords
- image sensor
- wiring board
- sensor dice
- lens assembly
- high temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- 239000003292 glue Substances 0.000 claims description 11
- 241000218202 Coptis Species 0.000 claims description 6
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 238000005516 engineering process Methods 0.000 abstract description 2
- 229920001971 elastomer Polymers 0.000 abstract 1
- 238000012536 packaging technology Methods 0.000 abstract 1
- 239000005060 rubber Substances 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 10
- 238000000034 method Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
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- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
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Images
Landscapes
- Studio Devices (AREA)
- Lens Barrels (AREA)
Abstract
The utility model discloses a high temperature resistant integrated molding videography group, which comprises a circuit board, an image sensor chip and a lens component. The image sensor chip is fixed on the circuit board and is in electric connection with the circuit board. The lens component is arranged above a photosensitive area of the image sensor chip. The utility model is characterized in that the lens component is composed of an integrated molding lens and a supporting portion and the bottom surface of the supporting portion and the circuit board are conglutinated and fixed through heat conducting rubbers. A base body which has to be used in the past is saved because the utility model utilizes the integrated modeling sealing packaging technology of the lens component, thereby the manufacturing technology is simple, the cost is low, and the application is extensive.
Description
Technical field
The utility model relates to a kind of shooting module that is used for small-sized electronic product, is specifically related to a kind of one-body molded packaged type shooting module.
Background technology
The shooting module is widely used in making these equipment have digital photographing/camera function on the portable sets such as mobile phone, palmtop PC, notebook computer as a kind of accessory of small-sized electronic product.This portable set that has photograph/camera function has been subjected to liking of consumers in general and has pursued.
The prior camera module mainly is made up of lens assembly (lens), pedestal (holder), image sensor dice (CCD or CMOS) and wiring board, image sensor dice is set at the wiring board upper surface, pass through routing, image sensor dice is electrically connected with wiring board, again pedestal is covered on it, fix with wiring board, lens assembly is installed on the pedestal, obtain packaged shooting module thus; Usually, lens assembly can be regulated with respect to pedestal.
Yet, the manufacture craft of the shooting module of this structure is still comparatively complicated, cost is higher, concerning photograph/shooting did not have the people of high requirement, it was uneconomic using this module of making a video recording preferably, therefore for major part, how further to simplify the manufacture craft of shooting module, material saving, to reduce production costs, the problem that to be the shooting module need in extensive popularization and application solves.
Summary of the invention
The utility model purpose provides a kind of integrated packaged type shooting module with low cost, can material saving, simplify manufacture craft.
For achieving the above object, the technical solution adopted in the utility model is: a kind of high temperature resistant one-body molded shooting module, comprise wiring board, image sensor dice and lens assembly, described image sensor dice is fixing to be electrically connected in the circuit board and with it, described lens assembly is arranged at the photosensitive region top of image sensor dice, described lens assembly is made of integrated camera lens and support portion, and the bottom surface and the wiring board of described support portion are adhesively fixed through heat-conducting glue.
Above, described lens assembly and wiring board are directly bonding by heat-conducting glue, and this structure has been saved the pedestal that in the past must use, and have saved the material cost of this part greatly, have also saved this step of installation pedestal simultaneously, have simplified manufacture craft.In addition, the camera module group lens of this structure need not focusing and can directly be connected with wiring board, and the distance between lens assembly and the image sensor dice meets the requirement of lens focus, so its imaging is clear.
In the technique scheme, fixedly connected with wiring board through heat-conducting glue in described image sensor dice bottom surface, and the electric contact on the image sensor dice is electrically connected with wiring board through the gold thread routing.
In the technique scheme, described lens assembly is the one-shot forming camera lens, and the focal plane of camera lens is positioned at the photosensitive region place of image sensor dice.This camera lens can reduce cost greatly by being similar to the injection molding way mass production in enormous quantities of semiconductor wafer.
The technical scheme of same design is, a kind of high temperature resistant one-body molded shooting module, comprise wiring board, image sensor dice and lens assembly, described image sensor dice is fixing to be electrically connected in the circuit board and with it, described lens assembly is arranged at the photosensitive region top of image sensor dice, and described lens assembly is adhesively fixed on described wiring board.
In the technique scheme, described lens assembly is the one-shot forming camera lens.
The advantage of this technical scheme is, manufacture craft is simpler, and cost is also lower.
Above, image sensor dice can adopt the CMOS image sensor dice, the CMOS image sensor dice full name here is complementarity matal-oxide semiconductor image sensor chip (the English Complementary Metal-Oxide Semiconductor of being), this camera module is used for portable equipments such as mobile phone, consider from cost and price, adopt the CMOS image sensor dice preferable.Certainly, also can adopt CCD (electric charge coupling) image sensor dice.Described wiring board is FPCB flexible circuit board or PCB printed substrate.
Manufacturing process of the present utility model can be:
(1) with the high temperature heat-conducting glue image sensor dice is adhesively fixed in the circuit board;
(2) with routing between the corresponding tie point of the port of image sensor dice and wiring board, realize being electrically connected with gold thread;
(3) with the high temperature heat-conducting glue that lens assembly is fixing in the circuit board;
(4) finish encapsulation.
Because the technique scheme utilization, the utility model compared with prior art has following advantage:
1. because the utility model adopts the structure of directly encapsulation to save the pedestal that must use in the past, save the material cost of this part greatly, also saved this step of installation pedestal simultaneously, simplified manufacture craft, greatly reduced cost.
2. the lens assembly of the utility model employing is the one-shot forming camera lens, has further reduced cost.
3. because the utility model has been controlled the distance between lens assembly and the image sensor dice in advance, make its best requirement that meets lens focus, therefore, imaging of the present utility model is comparatively clear, and need not focusing.
Description of drawings
Fig. 1 is the upward view of the utility model embodiment one;
Fig. 2 is the A-A cutaway view of Fig. 1;
Fig. 3 is the utility model embodiment one perspective exploded view;
Wherein: 1, wiring board; 2, image sensor dice; 3, lens assembly; 4, gold thread.
Embodiment
Below in conjunction with drawings and Examples the utility model is further described:
Embodiment one:
Referring to accompanying drawing 1 to shown in Figure 3, a kind of high temperature resistant one-body molded packaged type shooting module, comprise wiring board 1, image sensor dice 2 and lens assembly 3, described image sensor dice 2 is fixed on the wiring board 1 and with it and is electrically connected, and described lens assembly 3 is arranged at the photosensitive region top of image sensor dice 2.
Wherein, lens assembly 3 is made of integrated camera lens and support portion, and the bottom surface and the wiring board of described support portion are adhesively fixed through heat-conducting glue; Bonding by heat-conducting glue between the bottom surface of image sensor dice 2 and the wiring board 1, the electric contact on the image sensor dice 2 is electrically connected by gold thread 4 with wiring board 1; Described image sensor dice 2 adopts the CMOS image sensor dice, and described wiring board 1 is the PCB printed substrate.
This integrated formed structure has saved the pedestal that in the past must use, and has saved the material cost of this part greatly, has also saved this step of installation pedestal simultaneously, has simplified manufacture craft.In addition,, make its best requirement that meets lens focus, make its imaging clear because the utility model has been controlled the distance between lens assembly and the image sensor dice in advance.
In the technique scheme, one-body molded camera lens can reduce cost greatly by being similar to the injection molding way mass production in enormous quantities of semiconductor Substract.
The manufacture method of this shooting module comprises the following steps:
(1) with the high temperature heat-conducting glue image sensor dice is adhesively fixed in the circuit board;
(2) with routing between the corresponding tie point of the port of image sensor dice and wiring board, realize being electrically connected with gold thread;
(3) with the high temperature heat-conducting glue that lens assembly is fixing in the circuit board;
(4) finish encapsulation.
Claims (5)
1. high temperature resistant one-body molded shooting module, comprise wiring board (1), image sensor dice (2) and lens assembly (3), described image sensor dice (2) is fixed on wiring board (1) and goes up and be electrically connected with it, described lens assembly (3) is arranged at the photosensitive region top of image sensor dice (2), it is characterized in that: described lens assembly (3) is made of integrated camera lens and support portion, and the bottom surface of described support portion and wiring board (1) are adhesively fixed through heat-conducting glue.
2. one-body molded shooting module according to claim 1 is characterized in that: fixedly connected with wiring board (1) through heat-conducting glue in described image sensor dice (2) bottom surface, and the electric contact on the image sensor dice is electrically connected with wiring board (1) through the gold thread routing.
3. one-body molded shooting module according to claim 1 is characterized in that: described lens assembly (3) is the one-shot forming camera lens, and the focal plane of camera lens is positioned at the photosensitive region place of image sensor dice (2).
4. high temperature resistant one-body molded shooting module, comprise wiring board (1), image sensor dice (2) and lens assembly (3), described image sensor dice (2) is fixed on wiring board (1) and goes up and be electrically connected with it, described lens assembly (3) is arranged at the photosensitive region top of image sensor dice (2), and it is characterized in that: described lens assembly (3) is adhesively fixed on described wiring board (1).
5. one-body molded shooting module according to claim 4 is characterized in that: described lens assembly (3) is the one-shot forming camera lens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201547754U CN201311932Y (en) | 2008-10-31 | 2008-10-31 | High temperature resistant integrated molding videography group |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201547754U CN201311932Y (en) | 2008-10-31 | 2008-10-31 | High temperature resistant integrated molding videography group |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201311932Y true CN201311932Y (en) | 2009-09-16 |
Family
ID=41109186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008201547754U Expired - Fee Related CN201311932Y (en) | 2008-10-31 | 2008-10-31 | High temperature resistant integrated molding videography group |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201311932Y (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104079803A (en) * | 2013-03-27 | 2014-10-01 | 信利光电股份有限公司 | Circuit board and camera module |
| CN104954637A (en) * | 2014-03-26 | 2015-09-30 | 南昌欧菲光电技术有限公司 | Camera module and manufacturing method thereof |
| CN104954636A (en) * | 2014-03-26 | 2015-09-30 | 南昌欧菲光电技术有限公司 | Camera module and camera module manufacturing method |
| CN108461510A (en) * | 2017-02-22 | 2018-08-28 | 深圳市中兴微电子技术有限公司 | A kind of camera module and preparation method thereof |
| CN109143734A (en) * | 2010-12-02 | 2019-01-04 | 宁波舜宇光电信息有限公司 | A kind of optical touch screen camera shooting mould group and its manufacturing method |
| CN111010498A (en) * | 2016-04-01 | 2020-04-14 | 宁波舜宇光电信息有限公司 | Camera module based on integrated packaging process |
| US10795241B2 (en) | 2017-08-16 | 2020-10-06 | Sercomm Corporation | IP camera with heat-conducting element for preventing dew condensation |
-
2008
- 2008-10-31 CN CNU2008201547754U patent/CN201311932Y/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109143734A (en) * | 2010-12-02 | 2019-01-04 | 宁波舜宇光电信息有限公司 | A kind of optical touch screen camera shooting mould group and its manufacturing method |
| CN104079803A (en) * | 2013-03-27 | 2014-10-01 | 信利光电股份有限公司 | Circuit board and camera module |
| CN104079803B (en) * | 2013-03-27 | 2019-03-01 | 信利光电股份有限公司 | Wiring board and camera module |
| CN104954637A (en) * | 2014-03-26 | 2015-09-30 | 南昌欧菲光电技术有限公司 | Camera module and manufacturing method thereof |
| CN104954636A (en) * | 2014-03-26 | 2015-09-30 | 南昌欧菲光电技术有限公司 | Camera module and camera module manufacturing method |
| CN104954636B (en) * | 2014-03-26 | 2019-02-12 | 南昌欧菲光电技术有限公司 | Camera module and camera module manufacturing method |
| CN111010498A (en) * | 2016-04-01 | 2020-04-14 | 宁波舜宇光电信息有限公司 | Camera module based on integrated packaging process |
| CN111010498B (en) * | 2016-04-01 | 2022-08-23 | 宁波舜宇光电信息有限公司 | Camera module based on integrated packaging process |
| CN108461510A (en) * | 2017-02-22 | 2018-08-28 | 深圳市中兴微电子技术有限公司 | A kind of camera module and preparation method thereof |
| US10795241B2 (en) | 2017-08-16 | 2020-10-06 | Sercomm Corporation | IP camera with heat-conducting element for preventing dew condensation |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090916 Termination date: 20101031 |