CN201293967Y - Heat dissipation module capable of simultaneously dissipating heat generated by multiple heat sources and computer system - Google Patents

Abstract

The utility model relates to a can dispel the produced thermal heat radiation module and computer system of a plurality of heat sources simultaneously. A heat dissipation module comprises a base, wherein the base comprises a first bottom plate, a first side of the first bottom plate is connected with a first heat source to conduct heat of the first heat source, a second bottom plate is connected with the first bottom plate, a section difference is formed between the first bottom plate and the second bottom plate, the second bottom plate comprises a second side opposite to the first side of the first bottom plate and used for being connected with a second heat source to conduct heat of the second heat source. The heat dissipation module further comprises a heat dissipation device connected to the base and used for dissipating heat generated by the first heat source received by the first bottom plate and heat generated by the second heat source received by the second bottom plate, wherein a height difference exists between the first heat source and the second heat source, and the base is arranged between the first heat source and the second heat source. The utility model discloses make and need not to dispose exclusive heat dissipation mechanism to the individual heating element, can effectively save mechanism's space, reducible heat dissipation assembly quantity saves the cost.

Description

Heat dissipation module and computer system capable of dissipating heat generated by multiple heat sources simultaneously

technical field

The utility model relates to a heat dissipation module and a computer system, in particular to a heat dissipation module and a computer system capable of dissipating heat generated by a plurality of heat sources at the same time.

Background technique

In today's modern information society, the computer system has become one of the indispensable information tools for most people. Regardless of whether it is a desktop personal computer, a notebook personal computer or a server, etc., its operating frequency is getting higher and higher, and the application level also increasingly widespread. As the functions of computer system components become more and more powerful, the heat energy generated by each component when performing various functions also increases relatively. If the heat energy generated by the internal components of the computer system cannot be efficiently removed, it will affect the The operational stability and computing speed of the computer system.

Furthermore, the main demands of today's consumer electronics products can be divided into two directions, the first is miniaturization, and the second is diversification. The more components are packed into a small volume, the more important it is to provide diversified functions to consumers. Nowadays, it is an indispensable condition for computer systems to be able to output high-quality images and support the smoothness of 3D games. The key lies in the increasingly powerful processing capabilities of graphics cards. The heat generated during operation is also relatively increased, especially when mid-to-high-end graphics cards or image processors process complex image operations (such as 3D image processing, etc.), a large amount of heat will be generated. Due to configuration limitations, the distance between each slot of the motherboard and other internal components is often very narrow, so the heat generated by the image processor is not easy to dissipate, which will cause the temperature of the graphics card to be too high, which will affect the operation of the computer system. stability, and even reduce the service life of the graphics card, especially the problem is more serious on the barebones mainframe that has been reduced in size.

In order to solve this problem, it is often necessary to provide a dedicated heat dissipation mechanism for the image processor of the display card to dissipate the large amount of heat generated by it. However, there are still other heat sources in the computer system (such as the central processing unit, north bridge chip, etc.) The heat dissipation mechanism is used to provide a heat dissipation solution. In this way, there will be multiple heat dissipation modules specially set up for high heat-generating components in the narrow mechanism space, which will reduce the available mechanism space or increase the overall computer system. size, which goes against the trend of downsizing. Therefore, how to design a heat dissipation module suitable for a computer system with a small internal mechanism space is an important issue for current mechanism design.

Utility model content

The utility model provides a heat dissipation module and a computer system capable of dissipating heat generated by multiple heat sources at the same time, so as to solve the above problems.

The claims of the utility model disclose a heat dissipation module, which includes a base, and the base includes a first side, which is used to connect to a first heat source, so as to conduct the heat generated by the first heat source, And a second side, which corresponds to the first side, and the second side is used to connect to a second heat source, so as to conduct the heat generated by the second heat source. The heat dissipation module also includes a heat dissipation device, which is connected to the base, and the heat dissipation device is used to dissipate the heat generated by the first heat source received by the first side of the base and the second side of the base. The heat generated by the second heat source is received, wherein there is a height difference between the first heat source and the second heat source, and the base is arranged between the first heat source and the second heat source.

The claims of the utility model also disclose that the base is made of metal material.

The claims of the utility model also disclose that the base is made of copper or aluminum.

The claims of the utility model also disclose that the heat dissipation device includes a heat pipe, one end of which is connected to the base.

The claims of the utility model also disclose that the heat dissipation device also includes a plurality of heat dissipation fins (thermal fins), which are connected to the other end of the heat pipe. heat.

Claims of the present invention also disclose that the heat dissipation device further includes a fan disposed on one side of the plurality of heat dissipation fins, and the fan is used to dissipate heat from the plurality of heat dissipation fins.

The claims of the utility model also disclose that the base includes a first bottom plate, the first side is arranged on the first bottom plate, and a second bottom plate is connected to the first bottom plate, and the second side is arranged on the first bottom plate. There is a difference between the first bottom plate and the second bottom plate on the second bottom plate.

The claims of the utility model also disclose that the first base plate is integrally connected to the second base plate.

The claims of the utility model also disclose a computer system, which includes a main board, a first heat source, which is installed on the main board, a slot, which is arranged on one side of the main board, and an interface card , which is used to insert into the slot, the interface card is provided with a second heat source, there is a height difference between the first heat source and the second heat source, and a heat dissipation module. The heat dissipation module includes a base, which is arranged between the first heat source and the second heat source, and the base includes a first side, which is used to connect to the first heat source, so as to conduct the heat generated by the first heat source heat, and a second side corresponding to the first side, the second side is used to connect to the second heat source, so as to conduct the heat generated by the second heat source. The heat dissipation module also includes a heat dissipation device connected to the base, and the heat dissipation device is used to dissipate the heat generated by the first heat source received by the first side of the base and the second side of the base. The heat generated by the second heat source is received.

The claims of the utility model also disclose that the first heat source is a chip.

The claims of the utility model also disclose that the first heat source is a north bridge chip.

The claims of the utility model also disclose that the slot is a display card slot, the interface card is a display card, and the second heat source is a display card chip.

The claims of the utility model also disclose that the computer system also includes a central processing unit heat dissipation module, which is arranged on one side of the fan and on one side of the plurality of heat dissipation fins, and the fan is used to dissipate the plurality of heat dissipation fins at the same time. The heat of the cooling fins and the CPU cooling module.

The claims of the present invention also disclose that the computer system further includes a heat conduction pad installed between the first side of the substrate and the first heat source, and the heat conduction pad is used to conduct heat generated by the first heat source heat to the first side of the substrate.

The claims of the present invention also disclose that the computer system further includes a heat conduction pad installed between the second side of the substrate and the second heat source, and the heat conduction pad is used to conduct heat generated by the second heat source heat to the second side of the substrate.

The utility model uses different heat sources and the stacked mechanism of the base of the heat dissipation module to effectively use the gap between the interface card and the main board as the mechanism space for setting the heat dissipation module, and a group of heat dissipation modules can dissipate heat from more than two groups at the same time The heat generated by the components does not need to be equipped with a dedicated cooling mechanism for individual heating components. In this way, it can not only effectively save the space of the mechanism, but also reduce the number of cooling components to achieve the purpose of saving costs.

Description of drawings

FIG. 1 is a schematic functional block diagram of the computer system of the present invention.

FIG. 2 is a schematic diagram of the appearance of the components of the heat dissipation module of the present invention.

3 is a schematic cross-sectional view of the heat dissipation module of the present invention disposed between the first heat source and the second heat source.

FIG. 4 is a schematic cross-sectional view of a heat dissipation module disposed between a first heat source and a second heat source according to another embodiment of the present invention.

FIG. 5 is a schematic diagram of the appearance of the CPU cooling module of the present invention.

FIG. 6 is a schematic diagram of the relative positions of the cooling module of the present invention and the cooling module of the central processing unit.

7 is a schematic cross-sectional view of a heat dissipation module disposed between a first heat source and a second heat source according to another embodiment of the present invention.

Description of main component symbols:

50 computer system 52 motherboard

54 First Heat Source 56 Slot

58 Interface card 60 Second heat source

62 Heat dissipation module 64 Base

66 First bottom plate 661 First side

68 second bottom plate 681 second side

70 heat sink 72 heat pipe

74 Thermal fins 76 Thermal pads

77 Central processing unit 78 Central processing unit cooling module

80 heat sink 82 heat pipe

84 cooling fins 86 fans

102 Heat dissipation module 104 Base

1041 First side 1042 Second side

Detailed ways

Please refer to Fig. 1, Fig. 1 is the functional block diagram of a computer system 50 that can dissipate heat generated by a plurality of heat sources at the same time for the utility model, the computer system 50 includes a motherboard 52; a first heat source 54, which is installed On the motherboard 52, the first heat source 54 can be a chip, such as a high-wattage heating element such as a north bridge chip (north bridge), a south bridge chip (south bridge); a slot 56, which is arranged on the motherboard One side of 52; an interface card 58, it is used for inserting slot 56, and interface card 58 is provided with a second heat source 60, and wherein slot 56 is a display card slot, and interface card 58 is then correspondingly a display card , and the second heat source 60 corresponds to a display card chip, and the interface card 58 may be a TV card (TVtuner card), wireless network card, or memory, etc.; The heat generated by the first heat source 54 and the second heat source 60 on the interface card 58 . The computer system 50 also includes a central processing unit 77, which is electrically connected to the first heat source 54 and the slot 56 to control internal components, such as controlling the first heat source 54 or controlling the interface card 58 via the slot 56. The computer system 50 also includes There is a CPU cooling module 78 for dissipating the heat generated by the CPU 77 .

Please refer to FIG. 2 and FIG. 3, FIG. 2 is a schematic diagram of the appearance of the components of the heat dissipation module 62 of the present invention, and FIG. The module 62 includes a base 64, which includes a first bottom plate 66, which includes a first side 661, which is used to connect to the first heat source 54, so as to conduct the heat generated by the first heat source 54; and a second bottom plate 68 , which is connected to the first base plate 66 , and there is a difference between the first base plate 66 and the second base plate 68 , so that the material of the base plate 64 can be reduced, so as to achieve a cost-effective design. The second bottom plate 68 includes a second side 681 opposite to the first side 661 of the first bottom plate 66 , which is used to connect to the second heat source 60 to conduct heat generated by the second heat source 60 . Wherein the first bottom plate 66 and the second bottom plate 68 of the base 64 can be integrally formed, and the first bottom plate 66 and the second bottom plate 68 of the base 64 can be made of metal materials, such as copper or aluminum, so as to increase thermal conductivity. The heat dissipation module 62 also includes a heat dissipation device 70, which is connected to the base 64. The heat dissipation device 70 is used to dissipate the heat generated by the first heat source 54 received by the first bottom plate 66 and the heat generated by the second heat source 60 received by the second bottom plate 68. To generate heat, the heat dissipation device 70 includes a heat pipe 72, one end of which is connected to the base 64, and the heat dissipation device 70 also includes a plurality of heat dissipation fins 74, which are connected to the other end of the heat pipe 72, and the plurality of heat dissipation fins 74 are used for The heat transmitted by the heat pipe 72 is dissipated.

The working principle of the heat sink 70 is that when one end of the heat pipe 72 is placed at the higher-temperature base 64 and the other end is at the lower-temperature heat dissipation fin 74, the heat transfer phenomenon begins. From the high temperature, it first passes through the metal tube wall and enters the capillary object. At this time, the working fluid in the capillary object begins to evaporate due to heat. The evaporated gas will flow to the other end of the heat pipe 72, and because the other end of the heat pipe 72 is in contact with a lower temperature, so when the gas reaches the colder other end, it will start to condense. The working fluid in the vapor state passes to the outside of the lower temperature heat pipe 72 through the capillary object and the metal tube wall, and the liquid produced after condensation flows back to the higher temperature place due to the capillary phenomenon (Capillary Pumping). The general fluid phenomenon will circulate continuously, and the heat energy will be transferred from high temperature to low temperature, which is the basic principle of heat pipe heat transfer. The efficiency of the heat pipe 72 is extremely high. For example, if the two ends of the heat pipe 72 and the metal rod of the same volume are placed under the same temperature difference, the heat conduction energy of the heat pipe 72 can reach more than a thousand times that of the metal rod. In the present invention, the cooling fins 74 are vertically arranged in a direction perpendicular to the heat pipes 72, and have grooves corresponding to the size and shape of the heat pipes 72, so as to accommodate the heat pipes 72 and attach to each other. A plurality of heat dissipation fins 74 can be arranged in a grid to increase the heat dissipation area, so that the heat from the heat pipe 72 can be transferred to the ambient air. In the present invention, the interface between the heat pipe 72 and the heat dissipation fin 74 can be covered with heat dissipation paste or heat dissipation glue, so as to increase the contact area of heat conduction and make heat dissipation more efficient.

Please continue to refer to FIG. 3, since the first heat source 54 is installed on the motherboard 52, such as the north bridge chip embedded in the motherboard 52, and the interface card 58 is inserted into the slot 56 at a certain height from the motherboard 52, Wherein the height of the mechanism space formed between the slot 56 and the motherboard 52 can be less than 15 millimeters, so there is a height difference between the first heat source 54 and the second heat source 60 on the interface card 58, and the heat dissipation module 62 of the present utility model is Clamp between the motherboard 52 and the slot 56, so that the first side 661 of the first bottom plate 66 of the base 64 is in contact with the first heat source 54 and the second side 681 of the second bottom plate 68 of the base 64 is in contact with the The second heat source 60, so the first bottom plate 66 can dissipate the heat generated by the first heat source 54 by heat conduction and the second bottom plate 68 can dissipate the heat generated by the second heat source 60 by heat conduction, wherein the first bottom plate 66 and The thickness of the second bottom plate 68 may be 1.5 mm, respectively. With the first heat source 54, the first bottom plate 66 of the base 64, the second bottom plate 68 of the base 64, and the stacking mechanism of the second heat source 60, the gap between the interface card 58 and the motherboard 52 can be effectively used as a The mechanism space for the heat dissipation module 62 is set, and a group of heat dissipation modules 62 can dissipate the heat generated by more than two groups of heat generating components at the same time, so there is no need to configure a dedicated heat dissipation mechanism for individual heat generating components, so that in addition to fully utilizing the interface card The mechanism space between 58 and the main board 52 can also reduce the number of cooling components and achieve the purpose of cost saving. Furthermore, if the utility model selects the first heat source 54 as the north bridge chip and the second heat source 60 as the display card chip, then the north bridge chip and the display card chip will have a load (loading) under the same timing in the image data processing process. If the load is large, another situation occurs when the load is small, so the north bridge chip and the graphics card chip use the same set of heat dissipation modules and there will be no problem of insufficient heat dissipation wattage. In addition, the base 64 of the present invention can also include more than two bottom plates, which are used to contact with more than two heating components correspondingly, so as to dissipate the heat generated by the two or more heating components respectively. It is the same as the foregoing embodiments, and will not be described in detail here.

In addition, thermal pads (thermal pads) can be arranged respectively between the first bottom plate 66 and the second bottom plate 68 of the base 64 of the present invention and the first heat source 54 and the second heat source 60, so as to improve heat conduction efficiency, please refer to the figure 4. FIG. 4 is a schematic cross-sectional view of another embodiment of the utility model in which the heat dissipation module 62 is arranged between the first heat source 54 and the second heat source 60, between the first bottom plate 66 of the base 64 and the first heat source 54 and the second A heat conduction pad 76 is arranged between the bottom plate 68 and the second heat source 60 respectively, and the heat conduction pad 76 is used to conduct the heat generated by the first heat source 54 to the first bottom plate 66 and conduct the heat generated by the second heat source 60 to the second bottom plate 68 , so as to improve the heat conduction efficiency between the first bottom plate 66 and the first heat source 54 and between the second bottom plate 68 and the second heat source 60 . The heat conduction gasket 76 of the present utility model is selectively provided, which means that the heat conduction gasket 76 can only be provided between the first base plate 66 and the first heat source 54, or only between the second base plate 68 and the second heat source 60. Gasket 76 depends on design requirements.

Please refer to FIG. 5 and FIG. 6. FIG. 5 is a schematic diagram of the appearance of the central processing unit heat dissipation module 78 of the present invention, and FIG. The cooling module 78 includes a cooling groove (heat sink) 80, which is used to be installed on the top of the central processing unit 77, so as to dissipate the heat generated by the central processing unit 77; the central processing unit cooling module 78 also includes at least one heat pipe 82, One end thereof is connected to the heat dissipation slot 80 ; the CPU heat dissipation module 78 also includes a plurality of heat dissipation fins 84 connected to the other end of the heat pipe 82 , and the heat dissipation fins 84 are used for dissipating heat from the heat pipe 82 . The heat pipe 82 can transfer the heat from the central processing unit 77 to the heat sink 80 to the heat dissipation fins 84, and then transfer the heat from the heat pipe 82 to the external ambient air through the heat dissipation fins 84. The heat dissipation principle is as described above. , and will not be described in detail here. Furthermore, the heat dissipation device 70 also includes at least one fan 86, which is arranged on one side of the plurality of heat dissipation fins 74 of the heat dissipation device 70 and the plurality of heat dissipation fins 84 of the CPU heat dissipation module 78, and the fan 86 is used to simultaneously Dissipate the heat of the plurality of cooling fins 74 of the cooling device 70 and the plurality of cooling fins 84 of the CPU cooling module 78, that is to say, the cooling module 62 and the CPU cooling module 78 can share the same group of fans 86 as heat dissipation mechanism without adding more fans to separately dissipate heat from the first heat source 54 and the second heat source 60 or the central processing unit 77 , so that the mechanism space and component costs can be effectively saved.

Please refer to FIG. 7. FIG. 7 is a schematic cross-sectional view of a heat dissipation module 102 disposed between the first heat source 54 and the second heat source 60 according to another embodiment of the present invention. The difference from the previous embodiment is that the heat dissipation module 102 includes a base Seat 104, the base 104 can be a flat plate with uniform thickness, which means a single structure without step difference, and the base 104 includes a first side 1041, which is used to connect to the first heat source 54, so as to conduct the first heat source 54. heat generated by a heat source 54 ; and a second side 1042 corresponding to the first side 1041 , the second side 1042 is used to connect to the second heat source 60 so as to conduct the heat generated by the second heat source 60 . The base 104 can be made of metal materials, such as copper or aluminum, so as to increase thermal conductivity. The heat dissipation module 62 includes a heat dissipation device 70 connected to the base 104. The heat dissipation device 70 is used to dissipate the heat generated by the first heat source 54 received by the first side 1041 of the base 104 and the second side 1042 of the base 104. To receive the heat generated by the second heat source 60, the heat dissipation device 70 includes a heat pipe 72, one end of which is connected to the base 104, and the heat dissipation device 70 also includes a plurality of heat dissipation fins 74, which are connected to the other end of the heat pipe 72. A cooling fin 74 is used to dissipate the heat transmitted by the heat pipe 72 . The heat dissipation principle of the heat dissipation module 102 is the same as that of the foregoing embodiments, and will not be described in detail here.

Compared with the prior art, the utility model utilizes different heat sources and the stacking mechanism of the base of the heat dissipation module, and effectively uses the gap between the interface card and the main board as the mechanism space for setting the heat dissipation module, and a group of heat dissipation modules can be Simultaneously dissipate the heat generated by more than two sets of heat-generating components without having to configure a dedicated heat-dissipating mechanism for individual heat-generating components. This not only effectively saves the space of the mechanism, but also reduces the number of heat-dissipating components to achieve cost savings.

The above are only preferred embodiments of the utility model, and all equivalent changes and modifications made according to the claims of the utility model shall fall within the coverage of the utility model patent.

Claims (22)

1. A cooling module capable of dissipating heat generated by multiple heat sources at the same time, comprising: A base, characterized in that the base includes: a first side, which is used to connect to a first heat source, so as to conduct the heat generated by the first heat source; and a second side, which corresponds to the first side, and the second side is used to connect to a second heat source, so as to conduct the heat generated by the second heat source; and A heat dissipation device, which is connected to the base, and the heat dissipation device is used to dissipate the heat generated by the first heat source received by the first side of the base and the heat generated by the first heat source of the base. The two sides receive the heat generated by the second heat source; There is a height difference between the first heat source and the second heat source, and the base is disposed between the first heat source and the second heat source. 2. The heat dissipation module according to claim 1, wherein the base is a metal base. 3. The heat dissipation module according to claim 2, wherein the base is a copper base or an aluminum base. 4. The heat dissipation module according to claim 1, wherein the heat dissipation device comprises a heat pipe, one end of which is connected to the base. 5. The heat dissipation module according to claim 4, wherein the heat dissipation device further comprises a plurality of heat dissipation fins connected to the other end of the heat pipe, and the plurality of heat dissipation fins are used to dissipate the The heat transmitted by the heat pipe. 6. The heat dissipation module according to claim 5, wherein the heat dissipation device further comprises a fan, which is arranged on one side of the plurality of heat dissipation fins, and the fan is used to dissipate the plurality of heat dissipation fins. heat dissipation fins. 7. The heat dissipation module according to claim 1, wherein the base comprises: a first bottom plate, the first side is disposed on the first bottom plate; and A second bottom plate, which is connected to the first bottom plate, the second side is arranged on the second bottom plate, and there is a difference between the first bottom plate and the second bottom plate. 8 . The heat dissipation module according to claim 1 , wherein the first base plate is integrally connected to the second base plate. 9. A computer system capable of simultaneously dissipating heat generated by multiple heat sources, comprising: a motherboard; a first heat source installed on the motherboard; a slot, which is arranged on one side of the motherboard; an interface card, which is used to insert into the slot, a second heat source is provided on the interface card, and there is a height difference between the first heat source and the second heat source; and A cooling module, the cooling module includes: A base, which is arranged between the first heat source and the second heat source, is characterized in that the base includes: a first side, which is used to connect to the first heat source, so as to conduct the heat generated by the first heat source; and a second side, which corresponds to the first side, and the second side is used to connect to the second heat source, so as to conduct the heat generated by the second heat source; and A heat dissipation device, which is connected to the base, and the heat dissipation device is used to dissipate the heat generated by the first heat source received by the first side of the base and the heat generated by the first heat source of the base. The two sides receive the heat generated by the second heat source. 10. The computer system of claim 9, wherein the first heat source is a chip. 11. The computer system according to claim 10, wherein the first heat source is a north bridge chip. 12. The computer system according to claim 9, wherein the slot is a graphics card slot, the interface card is a graphics card, and the second heat source is a graphics card chip. 13. The computer system of claim 9, wherein the base is a metal base. 14. The computer system of claim 13, wherein the base is a copper base or an aluminum base. 15. The computer system according to claim 9, wherein the heat dissipation device comprises a heat pipe, one end of which is connected to the base. 16. The computer system according to claim 15, wherein the heat dissipation device further comprises a plurality of heat dissipation fins connected to the other end of the heat pipe, and the plurality of heat dissipation fins are used to dissipate the The heat transmitted by the heat pipe. 17. The computer system according to claim 16, wherein the heat dissipation device further comprises a fan, which is arranged on one side of the plurality of heat dissipation fins, and the fan is used to dissipate the plurality of heat dissipation fins. heat dissipation fins. 18. The computer system according to claim 17, wherein the computer system further comprises a central processing unit cooling module, which is arranged on one side of the fan and on one side of the plurality of cooling fins , the fan is used to dissipate the heat of the plurality of heat dissipation fins and the heat dissipation module of the central processing unit at the same time. 19. The computer system according to claim 9, wherein the computer system further comprises a thermal pad installed between the first side of the substrate and the first heat source, the The thermal pad is used for conducting the heat generated by the first heat source to the first side of the substrate. 20. The computer system according to claim 9, wherein the computer system further comprises a thermal pad installed between the second side of the substrate and the second heat source, the The thermal pad is used for conducting the heat generated by the second heat source to the second side of the substrate. 21. The computer system of claim 9, wherein the base comprises: a first bottom plate, the first side is disposed on the first bottom plate; and A second bottom plate, which is connected to the first bottom plate, the second side is arranged on the second bottom plate, and there is a difference between the first bottom plate and the second bottom plate. 22. The computer system according to claim 9, wherein the first bottom board is integrally connected to the second bottom board.

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