CN201289009Y - Oval-shaped LED module with lamp cup - Google Patents
Oval-shaped LED module with lamp cup Download PDFInfo
- Publication number
- CN201289009Y CN201289009Y CNU200820203540XU CN200820203540U CN201289009Y CN 201289009 Y CN201289009 Y CN 201289009Y CN U200820203540X U CNU200820203540X U CN U200820203540XU CN 200820203540 U CN200820203540 U CN 200820203540U CN 201289009 Y CN201289009 Y CN 201289009Y
- Authority
- CN
- China
- Prior art keywords
- led
- lamp cup
- shell
- light
- oval
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000009413 insulation Methods 0.000 claims abstract description 7
- 239000003292 glue Substances 0.000 claims description 4
- 239000000284 extract Substances 0.000 claims description 3
- 230000005855 radiation Effects 0.000 abstract description 3
- 238000005286 illumination Methods 0.000 abstract description 2
- 230000005494 condensation Effects 0.000 abstract 1
- 238000009833 condensation Methods 0.000 abstract 1
- 239000006185 dispersion Substances 0.000 abstract 1
- 230000000191 radiation effect Effects 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000005395 radioluminescence Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Images
Landscapes
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model disclose an elliptic LED module with a lamp cup, comprising an insulated shell (1) of elliptic frame shape, a heat radiation slice (2) on the middle bottom of the inner ring of the shell, at least two lamp cups (5) on the heat radiation slice capable of forming a light condensation reflection surface, a LED (3) in the lamp cup wherein the conduction insulation rubber is filled in the space between the LED and the lamp cup and the pin (4) of the LED extends from the side wall of the shell. Two or more than two LEDs are set in the same circular shell with equal illumination intensity, light efficiency or the like with the large-power LED and the PCB space is saved to facilitate the arrangement of the electronic element with good heat radiation effect. The LEDs are in dispersion type arrangement in the same module to realize the mutual light distribution and the lens cost required by the large-power LED is saved and LEDs of different color are arranged in the shell and emit different mixed color at different time interval by an external circuit design. In addition, the lamp cup can condense light for the LED and increase the directivity and centrality of the LED light source, with simple structure and low cost.
Description
Technical field
The utility model belongs to the technical field of semiconductor devices, is specifically related to a kind of LED module that uses light emitting diode as light source.
Background technology
The same with conventional light source, semiconductor light-emitting-diode (LED) also can produce heat during operation, and how much it depends on whole luminous efficiency.Power up outside under the energy, the radiation recombination generation electroluminescent in electronics and hole, semiconductor medium and encapsulation medium that near the light that radiates the P-N knot also need pass through wafer (chip) itself just can arrive at external world's (air).Comprehensive electric current injection efficiency, radioluminescence quantum efficiency, wafer exterior light are taken out efficient etc., finally probably have only the input electric energy of 30-40% to be converted into luminous energy, the energy of all the other 60-70% mainly transforms heat energy with the form of the lattice vibration of non-radiative compound generation.And the rising of chip temperature then can strengthen non-radiative compoundly, further slackens luminous efficiency.
LED lighting on the market is that many LED are carried out the connection in series-parallel combination now.If carry out the connection in series-parallel combination with great power LED, the light fixture heat dissipation problem is an insoluble problem of present stage; If carry out the connection in series-parallel combination with the 20mA low-power LED, the usage quantity of LED can roll up, and in limited space, also is a necessary considerable problem to the components and parts layout on the circuit board.In addition, the concentration structure of existing LED lamp also exists cost to compare problem of higher.
The utility model content
The purpose of this utility model is to provide that a kind of good heat dissipation, layout are convenient, concentration structure is simply with the oval LED module of Lamp cup.
For solving the problems of the technologies described above, the technical solution adopted in the utility model is: the oval LED module of band Lamp cup, the housing that comprises insulation, housing is the oval frame shape, the inner ring central bottom of housing is provided with fin, is provided with at least two Lamp cups that can constitute the optically focused reflecting surface on fin, is provided with LED in the described Lamp cup, be filled with thermal conductive insulation glue between LED and the Lamp cup, the pin of LED extracts from the sidewall of housing.
Owing to adopted above-mentioned structure, the utlity model has following beneficial effect:
1), two even more a plurality of 3V/20mALED chip dispersed combination in same circular shell, can be suitable in indexs such as illumination, light efficiencies with great power LED, also save the PCB space simultaneously, make things convenient for the layout of electronic component;
2), the heat that produces of LED is delivered to the dew copper zone of the PCB that is installed by fin, reveals the copper zone by PCB then and distributes, and has better heat radiating effect;
3), distributing is arranged in the same module LED can realize mutual luminous intensity distribution, can save the lens cost that great power LED need be used, the LED of discharging different colours in housing, by the external circuit design, the different periods can be sent the mixed light of different colours again;
4), according to external circuit design, can take the connection in series-parallel connected mode flexibly to LED in the module;
5), Lamp cup can carry out optically focused to LED, strengthens the directionality and the centrality of led light source, it is simple in structure, cost is low.
Description of drawings
Below in conjunction with accompanying drawing the specific embodiment of the present utility model is described in further detail, but does not constitute any restriction of the present utility model.
Fig. 1 is the stereogram of the oval LED module of band Lamp cup;
Fig. 2 is the phantom of Fig. 1.
The specific embodiment
As depicted in figs. 1 and 2, the oval LED module of band Lamp cup described in the utility model comprises housing 1, and housing 1 is made by insulating materials, is shaped as the oval frame shape.The inner ring central bottom of housing 1 is provided with fin 2, fin 2 can be made by the good material of heat conduction such as metal, is provided with at least two Lamp cups 5 that can constitute the optically focused reflecting surface on fin 2, and described Lamp cup 5 can be formed by the shrinkage pool that is located on the fin 2, it is more easily made, and cost is low.Select 10 Lamp cups 5 among the figure for use, also can be other numbers certainly.Be provided with LED3 in each Lamp cup 5, be filled with thermal conductive insulation glue between LED3 and the Lamp cup 5, the shape of thermal conductive insulation glue and LED3 is not clearly drawn in the drawings.10 LED3 have 20 pins, and pin 4 extracts from the sidewall of housing 1, and the power supply that is used for LED3 connects.
Claims (3)
1. oval LED module with Lamp cup, it is characterized in that: the housing (1) that comprises insulation, housing (1) is the oval frame shape, the inner ring central bottom of housing (1) is provided with fin (2), on fin (2), be provided with at least two Lamp cups (5) that can constitute the optically focused reflecting surface, be provided with LED (3) in the described Lamp cup (5), be filled with thermal conductive insulation glue between LED (3) and the Lamp cup (5), the pin (4) of LED (3) extracts from the sidewall of housing (1).
2. according to the oval LED module of the described band Lamp cup of claim 1, it is characterized in that: described Lamp cup (5) is provided in a side of the shrinkage pool on the fin (2).
3. according to the oval LED module of claim 1 or 2 described band Lamp cups, it is characterized in that: described LED (3) is 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU200820203540XU CN201289009Y (en) | 2008-11-17 | 2008-11-17 | Oval-shaped LED module with lamp cup |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU200820203540XU CN201289009Y (en) | 2008-11-17 | 2008-11-17 | Oval-shaped LED module with lamp cup |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201289009Y true CN201289009Y (en) | 2009-08-12 |
Family
ID=40980692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU200820203540XU Expired - Fee Related CN201289009Y (en) | 2008-11-17 | 2008-11-17 | Oval-shaped LED module with lamp cup |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201289009Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103026123A (en) * | 2010-07-15 | 2013-04-03 | 骆万宝 | LED light device with improved thermal and optical characteristics |
-
2008
- 2008-11-17 CN CNU200820203540XU patent/CN201289009Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103026123A (en) * | 2010-07-15 | 2013-04-03 | 骆万宝 | LED light device with improved thermal and optical characteristics |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090812 Termination date: 20121117 |