CN201285648Y - Improved structure of display - Google Patents

Abstract

An improved structure of display is prepared as forming display by combining chip on glass technique with chip on film technique, forming said display by a display panel, at least a chip on film circuit board, a flexible printed circuit board and at least a printed circuit board, connecting signal output end of chip on film circuit board to display panel and signal input end of chip on film circuit board to printed circuit board through flexible printed circuit board.

Description

Improved structure of the display

technical field

The utility model relates to an optical display, and more specifically refers to an improved structure of a display made by combining glass-on-chip technology and film-on-chip technology.

Background technique

Fig. 1 is the existing display 1 that uses chip on glass technology (Chip on Glass, COG) to make, and it comprises a display panel 2, and the lower substrate 2a of this display panel 2 has a bonding area 2b, and a driving integrated circuit (IC) 3 is electrically connected to the bonding area 2b of the lower substrate 2a, and one end of a flexible printed circuit board (Flexible Printed Circuit, FPC) 4 is also electrically connected to the bonding area 2b of the lower substrate 2a and is electrically connected to the driving integrated circuit 3 conduction, and the other end is electrically connected with a printed circuit board (Printed Circuit Board, PCB) 5. In the structure of the aforementioned display 1, the bonding area 2b must have a relatively large area so that the driving integrated circuit 3 and the flexible printed circuit board 4 can be smoothly combined with it. However, an excessively large area of the bonding area 2b will cause the display panel 2 The size cannot be reduced, and it seems that it does not meet expectations for the display 1 products that are increasingly required to be thinner and smaller. Secondly, the excessively large area of the bonding area 2b will make it difficult to reduce the cost of the display panel 2. Furthermore, the driver integrated circuit 3 is directly disposed on the lower substrate. The method of 2a has the disadvantage of low process yield.

Fig. 2 is the existing display 6 that uses chip on film technology (Chip on Film, COF) to make, and it comprises a display panel 7, a chip on film circuit board 8 and a printed circuit board (PCB) 9, and this display panel 7 The lower substrate 7a also has a bonding area 7b. The film-on-chip circuit board 8 includes a flexible circuit board 8a and a driving integrated circuit (IC) 8b. One end of the flexible circuit board 8a is electrically connected to the bonding area 7b of the lower substrate 7a. The other end is electrically connected with the printed circuit board 9. Since the driving integrated circuit 8b is combined on the flexible circuit board 8a, the area of the bonding area 7b of the lower substrate 7a does not need to be too large. Compared with the above-mentioned display 1 made by the chip-on-glass technology, the display 6 seems to be more suitable for The product is light, thin and short, and the cost can be reduced. However, due to the fact that the flexible circuit board 8a is manufactured in a tape-and-reel manner, the printed circuit board 9 that provides the start-up signal required to drive the integrated circuit 8b can only be connected to one end of the flexible circuit board 8a opposite to the lower substrate 7a, resulting in occupation of Excessive mechanism space and the presence of multiple film-on-chip circuit boards 8 will also cause the area of the printed circuit board 9 connected thereto to be too large. In view of this, the author of this case has thought carefully and accumulated many years of experience in the research and development of optical displays, and finally has the generation of this utility model.

Utility model content

In order to solve the problems in the prior art, the main purpose of the present invention is to provide an improved structure of the display, which can improve the process yield and reduce the excessive structural space occupied by components.

In order to achieve the above object, the improved structure of a display provided by the present invention includes: a display panel having at least one conductive bonding area; at least one film-on-chip circuit board including a flexible circuit board and a A driving integrated circuit (IC), wherein the flexible circuit board has at least one signal input terminal and a signal output terminal, the driving integrated circuit is electrically connected between the signal input terminal and the signal output terminal, and the signal output terminal is connected to the signal output terminal The bonding area of the display panel is electrically connected; a flexible printed circuit board has at least one first conductive terminal and at least one second conductive terminal, and the second conductive terminal is electrically connected to the signal input terminal of the film-on-chip circuit board; and at least one printed circuit board (PCB), electrically connected to the first conductive end of the flexible printed circuit board, and the printed circuit board provides an activation signal to the driving integrated circuit.

Beneficial effects of the utility model: adopting the technical scheme of driving integrated circuits and film-on-chip circuit boards improves the yield rate of the process, and reduces the combined area of film-on-chip circuit boards and display panels, which is beneficial to the lightness, thinness and shortness of products direction, and can reduce the cost of the panel; the flexible printed circuit board is also used to connect several thin-film chip-on-chip circuit boards in series, so the number of printed circuit boards can be reduced, and the space occupied by the display is relatively reduced. The circuit board is connected to the free end of the flexible printed circuit board, so that the overall mechanism has more utilization during assembly.

Description of drawings

FIG. 1 is a schematic diagram of a conventional display manufactured using chip-on-glass technology.

FIG. 2 is a schematic diagram of a conventional display manufactured using the thin-film-on-chip technology.

Fig. 3 is an exploded perspective view of a preferred embodiment of the present invention.

Fig. 4 is a partially exploded perspective view of the preferred embodiment of the present invention.

Fig. 5 is a combined perspective view of the above-mentioned preferred embodiment of the utility model.

Fig. 6 is a partial enlarged view of the preferred embodiment of the present invention.

Fig. 7 is an exploded perspective view of another preferred embodiment of the present invention.

Fig. 8 is a partially enlarged view of another preferred embodiment of the present utility model.

[Description of main component symbols]

100 monitors

10 display panel

10a lower substrate 10b upper substrate

12 The first binding area 121 The first electrode 121a Front electrode

121b Rear electrode 122 Second electrode 122a Front electrode

122b Rear electrode 14 Second bonding area 141 Parallel electrodes

16 The third binding area 161 The third electrode 161a Front-end electrode

161b Rear electrode 162 Fourth electrode 162a Front electrode

162b rear electrode

20 Thin film chip-on-chip circuit board

22 Flexible circuit board 221 Signal output terminal 221a Lead wire

222 Signal input terminal 222a lead wire 222b lead wire

24 Driver Integrated Circuit (IC)

30 flexible printed circuit board

32 Upper layer copper wire 321 First conductive end 34 Lower layer copper wire

341 Second conductive end 36 Conductive hole

40 Printed Circuit Board (PCB)

200 monitors

50 display panels

52 Binding area 521 Parallel electrodes

60 Thin film chip-on-chip circuit board

62 Flexible circuit board 621 Signal output terminal 621a Lead wire

622 Signal input terminal 64 Driver integrated circuit (IC)

70 flexible printed circuit board

72 Upper layer copper wire 721 First conductive end 74 Lower layer copper wire

741 Second conductive end 76 Conductive hole

80 Printed Circuit Board (PCB)

Detailed ways

Please refer to FIG. 3 , which is a schematic diagram of an improved structure of a display in a preferred embodiment of the present invention. In this embodiment, the display 100 includes a display panel 10, two film-on-chip circuit boards 20, a flexible printed circuit board 30 and A printed circuit board 40 (PCB), wherein:

The display panel 10 is a liquid crystal panel in this embodiment. The display panel 10 has a lower substrate 10a and an upper substrate 10b. Please refer to FIG. A first bonding region 12, a second bonding region 14, and a third bonding region 16, each electrode represents the transmission of a signal, for the convenience of explanation, a group of them will be described as an example, wherein:

The first bonding area 12 covers two electrodes, as shown in FIG. 3 , they are the first electrode 121 and the second electrode 122 respectively, and each electrode can be divided into a front segment electrode 121a, 122a and a rear segment electrode 121b, 122b , wherein the outline of the rear-stage electrode 121b of the first electrode 121 is generally "T"-shaped to form an alignment pattern;

The second bonding region 14 covers a plurality of parallel electrodes 141;

The third bonding region 16 covers two electrodes, namely a third electrode 161 and a fourth electrode 162, and each electrode is also divided into a front segment electrode 161a, 162a and a rear segment electrode 161b, 162b, wherein the third electrode The profile of the front electrode 161a of the third electrode 161 is generally in a "T" shape, and the profile of the rear electrode 161b of the third electrode 161 is generally in a "+" shape, each of which constitutes a pair of alignment patterns.

The two film-on-chip circuit boards 20 have the same structure, and one of the film-on-chip circuit boards 20 will be described later. Please refer to FIG. 3. The film-on-chip circuit board 20 includes a flexible circuit board 22 and a driver integrated circuit (IC )24, where:

The flexible circuit board 22 has a signal output terminal 221 on the same side and a signal input terminal 222 on both sides of the signal output terminal 221. The signal output terminal 221 has the same number of conductive leads as the parallel electrodes 141. 221a, each of the signal input terminals 222 is composed of two conductive leads 222a, 222b, wherein the outline of the lead 222a is "T" to form a bit pattern, and the lead 222b is a straight line, As shown in Figure 6, the flexible circuit board 22 after assembling, with its lead wire 221a and parallel electrode 141 corresponding contact conduction, each lead wire 222a is respectively connected with the rear segment electrode 121b of the first electrode 121, the rear segment electrode of the 3rd electrode 161. 161b corresponds to contact conduction, because the outline of the lead wire 222a and each rear segment electrode 121b, 161b is special, and has the effect of convenient assembly alignment reference. In addition, each lead wire 222b is then connected to the rear segment electrode 122b, fourth The rear segment electrode 162b of the electrode 162 is correspondingly contacted and conducted;

The driving integrated circuit 24 is located on the flexible circuit board 22 and is electrically connected between each of the signal input terminals 222 and the signal output terminal 221 .

The flexible printed circuit board 30 is strip-shaped, and its surface width is smaller than that of the lower substrate 10a of the display panel 10 protruding beyond the upper substrate 10b. The flexible printed circuit board 30 has a plurality of upper layer copper wires (indicated by the solid line in the figure). Shown) 32, a plurality of lower layer copper wires 34 and a plurality of conductive holes 36, each layer of copper wires is covered with a protective layer (not shown); wherein, one end of each upper layer copper wire 32 forms a first conductive end 321 Each of the lower-layer copper wires 34 has a second conductive end 341 formed of a bare copper portion (shown by a dotted line in the figure), and the conductive hole 36 is electrically connected to the corresponding upper-layer copper wire 32 and the lower-layer copper wire 34, so that The first conductive end 321 and the second conductive end 341 form electrical conduction, as shown in Figures 5 and 6, the flexible printed circuit board 30 after assembly, the second conductive end 341 of its lower layer copper wire 34 is connected to the first electrode 121 , the front-end electrodes 121a, 122a of the second electrode 122, and the front-end electrodes 161a, 162a of the third electrode 161 and the fourth electrode 162 are in contact with each other, and in particular, at least the second conductive end 341 of the lower layer copper wire 34 The outline of the third electrode 161 forms an alignment pattern matched with the front electrode 161a of the third electrode 161, which is beneficial for alignment reference during assembly.

The printed circuit board 40 is combined with one side of the flexible printed circuit board 30, and is electrically connected to the first conductive end 321, and the activation signal provided by the printed circuit board 40 is introduced into the front-end electrode 121a through the second conductive end 341 ( 122a, 161a, 162a), and then lead into the signal input terminal 222 by the rear electrode 121b (122b, 161b, 162b) and enter the drive integrated circuit 24, after that, the signal continues to enter the display panel 10 along the signal output terminal 221, To achieve the purpose of display control.

The above is the description of the components and their relative positions of the display 100 of this embodiment. The structure of the display 100 is not provided on the display panel 10 because the driving integrated circuit 24 is not arranged on the display panel 10, so the process yield can be improved, and the film-on-chip circuit board can be reduced. The combined area of 20 and display panel 10 is beneficial to the manufacture of products in the direction of lightness, thinness and shortness, and can reduce the cost of the panel; secondly, thanks to the flexible printed circuit board 30 connecting several film-on-chip circuit boards 20 in series, so The number of printed circuit boards 40 can be reduced, relatively reducing the space occupied by the mechanism of the display 100, and because the printed circuit board 40 is connected to the free end of the flexible printed circuit board 30, the overall mechanism has more usability during assembly .

Please refer to Fig. 7 and shown in 8 again, it is the display diagram of another preferred embodiment of the present utility model, and in this embodiment, display 200 also has a display panel 50, two film-on-chip circuit boards 60, a flexible printing The circuit board 70 and a printed circuit board 80 (PCB), and the difference from the display 100 of the previous embodiment are:

The display panel 50 of the display 200 cooperates with each film-on-chip circuit board 60 and has only one corresponding bonding area 52, and the bonding area 52 is formed by a plurality of parallel electrodes 521; the flexible circuit board of each film-on-chip circuit board 60 The signal output terminal 621 of 62 is composed of a plurality of lead wires 621a and is in contact with the parallel electrodes 521. The signal input terminal 622 of the film-on-chip circuit board 60 is arranged on the side opposite to the signal output terminal 621, and it has an outline roughly in the shape of " T"-shaped alignment pattern; and the structure of the flexible printed circuit board 70 is generally the same as that of the flexible printed circuit board 30 of the foregoing embodiment and has an upper layer copper wire 72, a lower layer copper wire 74 and a conductive hole 76, wherein one end of the upper layer copper wire 72 The first conductive end 721 is formed and is electrically connected to the printed circuit board 80. The lower layer copper wire 74 also has a second conductive end 741 made of bare copper and is in contact with the signal input end 622 of the film-on-chip circuit board 60, especially Yes, the second conductive end 741 of part of the lower layer copper wire 74 forms a "T"-shaped alignment pattern matched with the alignment pattern of the signal input end 622, which is helpful for alignment reference during assembly.

The activation signal provided by the printed circuit board 80 is directly introduced into the corresponding signal input terminal 622 through the second conductive terminal 741 and then enters the driver integrated circuit (IC) 64, and then the follow-up signal output terminal 621 enters the display panel 50 to achieve display control. Purpose. The display 200 has the same functions as the above-mentioned display 100 , which will not be repeated here.

The above descriptions are only two preferred feasible embodiments of the present utility model, and all equivalent structural changes made by applying the description of the present utility model and the scope of the claims should be included in the scope of the claims of the present utility model.

Claims (8)

1. the structure-improved of a display is characterized in that, comprises:

One display panel, the land with at least one tool electric conductivity;

At least one membrane of flip chip circuit board, comprise a flexible PCB and a drive integrated circult, wherein this flexible PCB has an at least one signal input part and a signal output part, this drive integrated circult is electrically connected between this signal input part and this signal output part, and the land of this signal output part and this display panel electrically connects;

One flexible printed circuit board has at least one first conducting end and at least one second conducting end, and the signal input part of this second conducting end and this membrane of flip chip circuit board electrically connects; And

At least one printed circuit board (PCB) is electrically connected at first conducting end of this flexible printed circuit board, and this printed circuit board (PCB) provides enabling signal to this drive integrated circult.

2. the structure-improved of display according to claim 1 is characterized in that at least one land of this display panel comprises one first land and one second land; The flexible PCB of this membrane of flip chip circuit board has this signal input part and this signal output part in the same side, this signal output part and this second land electrically connect; Second conducting end of this flexible printed circuit board electrically connects by this first land and this signal input part.

3. as the structure-improved of display as described in the claim 2, it is characterized in that first land of this display panel has at least one electrode, this electrode have be connected one before a segment electrode and a back segment electrode; The signal input part of this membrane of flip chip circuit board contacts conducting with this back segment electrode; This flexible printed circuit board has many upper copper leads, many lower floor's copper conductors and a plurality of conductive hole in order to electrically connect corresponding upper copper conductor and lower floor's copper conductor, wherein respectively this upper copper lead one end forms this first conducting end, respectively this lower floor's copper conductor has this second conducting end that partly is made of naked copper, and wherein at least one this second conducting end contacts conducting with the preceding segment electrode of this first land.

4. as the structure-improved of display as described in the claim 3, it is characterized in that, the profile of the back segment electrode of this display panel first land constitutes one and aims at pattern, the signal input part of this membrane of flip chip circuit board be the lead-in wire of tool electric conductivity constitute and its profile constitute one cooperate with this aligned pattern to bit patterns.

5. as the structure-improved of display as described in the claim 3, it is characterized in that at least one land of this display panel also includes one the 3rd land, the 3rd land has at least one electrode, this electrode have be connected one before a segment electrode and a back segment electrode; At least one signal input part of the flexible PCB of this membrane of flip chip circuit board also comprises second signal input part being located at this signal output part same side, and this second signal input part contacts conducting with the back segment electrode of the 3rd land; Wherein this second conducting end of the described lower floor copper conductor of this flexible printed circuit board contacts conducting with the preceding segment electrode of the 3rd land.

6. as the structure-improved of display as described in the claim 5, it is characterized in that, the leading portion electrode profile of this display panel the 3rd land constitutes one and aims at pattern, wherein this second conducting end of the described lower floor copper conductor of this flexible printed circuit board form one cooperate with this aligned pattern to bit patterns.

7. the structure-improved of display according to claim 1 is characterized in that the land of this display panel is made of many strip electrodes; The signal output part of the flexible PCB of this membrane of flip chip circuit board is that a plurality of leads constitutes and contacts with described electrode; This flexible printed circuit board has many upper copper leads, many lower floor's copper conductors and a plurality of conductive hole in order to electrically connect corresponding upper copper conductor and lower floor's copper conductor, wherein respectively this upper copper lead one end forms this first conducting end, respectively this lower floor's copper conductor has this second conducting end that partly is made of naked copper, and wherein at least one this second conducting end contacts conducting with the signal input part of the flexible PCB of this membrane of flip chip circuit board.

8. as the structure-improved of display as described in the claim 7, it is characterized in that, the signal input part of the flexible PCB of this membrane of flip chip circuit board is that the lead-in wire of tool electric conductivity and its profile constitute one and aim at pattern, wherein this second conducting end of the described lower floor copper conductor of this flexible printed circuit board form one cooperate with this aligned pattern to bit patterns.

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