CN201260287Y - Heat radiation module and electronic device with same - Google Patents
Heat radiation module and electronic device with same Download PDFInfo
- Publication number
- CN201260287Y CN201260287Y CNU200820135849XU CN200820135849U CN201260287Y CN 201260287 Y CN201260287 Y CN 201260287Y CN U200820135849X U CNU200820135849X U CN U200820135849XU CN 200820135849 U CN200820135849 U CN 200820135849U CN 201260287 Y CN201260287 Y CN 201260287Y
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- Prior art keywords
- radiating module
- evaporation part
- cooling assembly
- thermoelectric cooling
- reservoir
- Prior art date
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- Expired - Lifetime
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- 230000005855 radiation Effects 0.000 title description 12
- 238000001816 cooling Methods 0.000 claims abstract description 74
- 238000010438 heat treatment Methods 0.000 claims abstract description 30
- 238000001704 evaporation Methods 0.000 claims description 70
- 230000008020 evaporation Effects 0.000 claims description 70
- 238000009833 condensation Methods 0.000 claims description 56
- 230000005494 condensation Effects 0.000 claims description 56
- 239000011469 building brick Substances 0.000 claims description 30
- 238000009434 installation Methods 0.000 claims description 23
- 239000012071 phase Substances 0.000 claims description 20
- 239000007791 liquid phase Substances 0.000 claims description 14
- 239000012530 fluid Substances 0.000 claims description 13
- 230000005514 two-phase flow Effects 0.000 abstract description 35
- 230000017525 heat dissipation Effects 0.000 abstract description 11
- 238000005057 refrigeration Methods 0.000 abstract 2
- 238000010586 diagram Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 3
- 235000019628 coolness Nutrition 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
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Abstract
The utility model relates to a heat dissipation module and have this heat dissipation module's electron device. The heat dissipation module is used for dissipating heat of the electronic component, the heat dissipation module comprises a two-phase flow heat dissipation loop and a thermoelectric refrigeration component, the two-phase flow heat dissipation loop can be a CPL loop or an LHP loop, the thermoelectric refrigeration component is provided with a cooling end and a heating end which can be respectively used for cooling and heating different parts of the two-phase flow heat dissipation loop or directly cools the electronic component by the cooling end, so that the heat dissipation efficiency of the two-phase flow heat dissipation loop is improved, and the purpose of dissipating heat of the electronic component is achieved.
Description
Technical field
The utility model relates to a kind of radiating module and has the electronic installation of this radiating module, particularly relates to a kind of radiating module that the two phase flow heat-radiation loop dispels the heat and electronic installation with this radiating module of utilizing.
Background technology
Consult Fig. 1, be the two phase flow heat-radiation loop 8 of a kind of loop heat pipe formula (Loop Heat Pipe is abbreviated as LHP), it comprise one can for working fluid in flowing in circulation circuit 81 and be arranged on an evaporation part 82 and a condensation part 83 on the circulation circuit 81.
The operation principle of this two phase flow heat-radiation loop 8 is that evaporation part 82 is arranged on the pyrotoxin (figure does not show), when liquid working fluid flows into evaporation part 82, the heat energy that absorbs pyrotoxin by evaporation part 82 is vaporized into steam, the working fluid of gaseous state flows out evaporation part 82 again and flows into condensation part 83, by condensation part 83 latent heat of vaporization of gaseous working fluid is taken away also condensation and return liquid state, and finish the circulation of once pyrotoxin being dispelled the heat.
Consult Fig. 2, be a kind of capillary pump formula (Capillary Pumped Loop, be abbreviated as CPL) two phase flow heat-radiation loop 9, it comprises that one can flow in interior circulation circuit 91, be arranged on an evaporation part 92 and a condensation part 93 on the circulation circuit 91 for working fluid, and a reservoir 94 that is connected with circulation circuit 91.The two phase flow heat-radiation loop 8 of the radiating mode of this capillary pump formula two phase flow heat-radiation loop 9 and the loop heat pipe formula of Fig. 1 is roughly the same, and just, this two phase flow heat-radiation loop 9 is to start the entire heat dissipation circulation by the working fluid in the heating reservoir 94.
Utilize above-mentioned two kinds of heat-radiation loops 8, when 9 pairs one pyrotoxins dispel the heat, remove evaporation part 82 for loosing, 92 and condensation part 83, the 93 unnecessary heat energy that absorbed, evaporation part 82,92 and condensation part 83, the complicated radiator structure 84 of structure all can be set on 93,95 (for example heat radiating fin bars), but because radiator structure 84, the 95th, belong to radiating mode than passive type, it is to evaporation part 82,92 and condensation part 83,93 radiating effect can't be grasped, and owing to be passive heat radiation, for asking the radiating effect that reaches expection, radiator structure 84,95 is also bigger than complexity and volume, therefore, also may have the problem that the heat radiation cost increases.
The utility model content
Therefore, the purpose of this utility model, be to provide a kind of in conjunction with thermoelectric cooling module and two phase flow heat-radiation loop radiating module and have the electronic installation of this radiating module.
Another purpose of the present utility model is to provide a kind of the two phase flow heat-radiation loop is carried out initiatively cooling and the electronic installation that can grasp the radiating module of cooling effect and have this radiating module.
So radiating module of the present utility model comprises a wandering hot loop of a two-phase and a thermoelectric cooling assembly.The two phase flow heat-radiation loop comprises a condensation part, an evaporation part and connects this condensation part and this evaporation part and can be for a liquid-phase tube group, the vapour phase pipe group of working fluid in flowing in.This thermoelectric cooling assembly has a colling end and a heating end, the colling end of this thermoelectric cooling assembly be arranged at this condensation part and this evaporation part one of them and in order to cool off this condensation part and this evaporation part one of them.
The electronic installation that the utlity model has radiating module comprises a casing, and is arranged on interior circuit unit of this casing and above-mentioned radiating module, circuit unit comprises that a circuit board and is arranged on the electronic building brick on the circuit board, central processing unit (CPU) for example, this evaporation part is arranged at this electronic installation, and this radiating module is that its evaporation part of mat is arranged at this electronic building brick and to the heat radiation of this electronic building brick.
Preferably, this two phase heat-radiation loop can be loop heat pipe formula (LHP) loop, and this colling end of mat is arranged at the evaporation part of this two phase flow heat-radiation loop or condensation part and in order to the active cooling is carried out in this evaporation part or condensation part.
Preferably, this two phase heat-radiation loop can be capillary pump formula (CPL) loop, and this liquid-phase tube group comprises a reservoir, and this thermoelectric cooling assembly can be arranged between this reservoir and this evaporation part, its heating end of mat is to this reservoir heating, and its colling end of mat carries out the active cooling to this evaporation part.
This thermoelectric cooling assembly also can be arranged between this reservoir and this condensation part, and its heating end of mat is to this reservoir heating, and its colling end of mat carries out the active cooling to this condensation part.
The electronic installation that the utlity model has radiating module comprises a casing, and is arranged on interior circuit unit of this casing and above-mentioned radiating module, this circuit unit comprises that a circuit board and is arranged on the electronic building brick on the circuit board, central processing unit (CPU) for example, the colling end of this thermoelectric cooling assembly is arranged at this electronic building brick and in order to cooling off this electronic building brick, and this heating end is arranged at this evaporation part and in order to heat this evaporation part.
The utility model with the two phase flow heat-radiation loop in conjunction with the thermoelectric cooling assembly, and be applied in the heat radiation of the central processing unit of main frame for example or other chip modules, the desired area of two phase flow heat-radiation loop is cooled off and heat by the colling end of thermoelectric cooling assembly and heating end, compared to way in the past, more can reach its cooling effect really.
Description of drawings
Fig. 1 is a kind of two phase flow heat-radiation loop schematic diagram of loop heat pipe pattern;
Fig. 2 is a kind of two phase flow heat-radiation loop schematic diagram of capillary pump pattern;
Fig. 3 is the schematic diagram of first preferred embodiment of the present utility model;
Fig. 4 is a radiating module schematic diagram of this first preferred embodiment;
Fig. 5 is a kind of version of this first preferred embodiment;
Fig. 6 is the radiating module schematic diagram of second preferred embodiment of the present utility model;
Fig. 7 is a kind of version of this second preferred embodiment; And
Fig. 8 is the radiating module schematic diagram of the 3rd preferred embodiment of the present utility model.
The primary clustering symbol description:
1 ... electronic installation 213 with radiating module ... the liquid-phase tube group
2 ... radiating module 213 ' ... the liquid-phase tube group
11 ... casing 213a ... first flow
12 ... circuit unit 213b ... second runner
121 ... circuit board 213c ... reservoir
122 ... electronic building brick 214 ... vapour phase pipe group
21 ... two phase flow heat-radiation loop 214 ' ... vapour phase pipe group
21 ' ... two phase flow heat-radiation loop 22 ... the thermoelectric cooling assembly
211 ... evaporation part 221 ... colling end
211 ' ... evaporation part 222 ... the heating end
212 ... condensation part 23,24 ... the heat radiating fin bar
212 ' ... the condensation part
Embodiment
About aforementioned and other technology contents, characteristics and effect of the present utility model, in the detailed description of following cooperation three preferred embodiments with reference to the accompanying drawings, can clearly present.
Before the utility model is described in detail, be noted that in the following description content similarly assembly is to represent with identical numbering.
Consult Fig. 3, Fig. 4, first preferred embodiment that the utlity model has the electronic installation 1 of radiating module comprises a casing 11, and is arranged on a circuit unit 12 and a radiating module 2 in the casing 11.
The casing 11 of present embodiment can be the casing of a main frame or other electronic installations, circuit unit 12 comprises that a circuit board 121 and that is arranged in the casing 11 is arranged on the electronic building brick 122 on the circuit board 121, the electronic building brick 122 of indication is central processing unit (CPU) herein, but its also can be other can produce heat energy in working order the time and need the electronic building brick of for example chip module etc. of heat radiation.
Radiating module 2 comprises a wandering hot loop 21 of a two-phase and a thermoelectric cooling assembly 22.
Two phase flow heat-radiation loop 21 comprises an evaporation part 211, a condensation part 212 and the liquid-phase tube group 213 and the vapour phase pipe group 214 that connect evaporation part 211 and condensation part 212.In the present embodiment, this two phase flow heat-radiation loop 21 is a capillary pump formula loop, vapour phase pipe group 214 is that a pipeline is connected between evaporation part 211 and the condensation part 212, liquid-phase tube group 213 comprises a first flow 213a, one second a runner 213b and a reservoir 213c, first flow 213a also is connected between evaporation part 211 and the condensation part 212 and connects into a loop with the pipeline of vapour phase pipe group 214 and in can flowing in for working fluid, the second runner 213b, one end is connected first flow 213a, reservoir 213c is arranged on the other end of the second runner 213b, evaporation part 211 lays respectively at first flow 213a and junction, vapour phase pipe group 214 two ends with condensation part 212, and evaporation part 211 is arranged on the electronic building brick 122, its set-up mode can be a screw lock, fixing or other physical bond modes are installed in around the electronic building brick 122, and preferable situation is that the outer surface of evaporation part 211 is contacted with electronic building brick 122 outer surfaces.
When the evaporation part 211 of two phase flow heat-radiation loop 21 is arranged on electronic building brick 122, the heat energy that just can absorb electronic building brick 122 by the working fluid of the evaporation part 211 of flowing through is shed by condensation part 212 again, brings into play the heat radiation function of 21 pairs of electronic building bricks 122 of two phase flow heat-radiation loop by this.
The thermoelectric cooling assembly 22 of present embodiment is a thermoelectric cooling module (ThermoElectric cooling is called for short TEC), and it has a colling end 221 (being commonly called as cold junction) and a heating end 222 (being commonly called as the hot junction).In the present embodiment, thermoelectric cooling assembly 22 is between reservoir 213c and evaporation part 211, wherein, colling end 221 contacts with evaporation part 211, can remove the too much heat energy that evaporation part 211 absorbs by this in order to cooling evaporation part 211, avoid evaporation part 211 overheated.222 at heating end is to contact with reservoir 213c, and in order to the liquid working fluid in the reservoir 213c is carried out preheating, to keep the circulation power in entire heat dissipation loop.
As shown in the above, with two phase flow heat-radiation loop 21 in conjunction with thermoelectric cooling assembly 22, on the one hand, utilize the colling end 221 of thermoelectric cooling assembly 22 to cool off to evaporation part 211, because colling end 221 is that active heat removal is carried out in evaporation part 211, radiator structure compared to known setting carries out the passive type cooling, can reach needed radiating effect really, and thus, evaporation part 211 does not need additionally to be provided with other radiator structure (for example heat radiating fin bar) yet again, so just can reduce the heat radiation cost of this some, in addition, utilize 222 couples of reservoir 213c of heating end of thermoelectric cooling assembly 22 to carry out preheating simultaneously, can keep the power of circulation circuit, and also can control the temperature of preheating reservoir 213c.
Consult Fig. 5, it is a kind of version of first preferred embodiment, wherein, 22 evaporation parts 211 that are arranged on two phase flow heat-radiation loop 21 with its colling end 221 of thermoelectric cooling assembly, by this active cooling is carried out in evaporation part 211, compared to the passive heat radiation mode of passing through radiator structure in the past, can reach its cooling effect equally, in addition, in this version, this electronic installation 1 also can also comprise one, and to be arranged on the heating end 222 of thermoelectric cooling assembly 22 and structure simple and in order to the heat radiating fin bar 23 to 22 heat radiations of thermoelectric cooling assembly.
Consult Fig. 6, be second preferred embodiment of the present utility model, its member is roughly identical with first preferred embodiment, only in second preferred embodiment, the colling end 221 of thermoelectric cooling assembly 22 is arranged on the condensation part 212 of two phase flow heat-radiation loop 21 and contacts with condensation part 212, by this active cooling is carried out in condensation part 212, make condensation part 212 can reach better condensation effect, and the heating end 222 of thermoelectric cooling assembly 22 be arranged on equally two phase flow heat-radiation loop 21 reservoir 213c and in order to reservoir 213c is carried out preheating, to keep circulation power.
Consulting Fig. 7, is a kind of version of second preferred embodiment, and wherein, thermoelectric cooling assembly 22 only is arranged on the condensation part 212 of two phase flow heat-radiation loop 21 with its colling end 221, by this too much heat energy of absorption condensation portion 212.And in this version, this electronic installation 1 also can also comprise one, and to be arranged on the heating end 222 of thermoelectric cooling assembly 22 and structure simple and in order to the heat radiating fin bar 24 to 22 heat radiations of thermoelectric cooling assembly.
Consulting Fig. 8, be the 3rd preferred embodiment of the present utility model, is to be the colling end 221 of thermoelectric cooling assembly 22 and the position that heating end 222 is arranged on two phase flow heat-radiation loop 21 ' with the first two embodiment difference.
In the 3rd preferred embodiment, two phase flow heat-radiation loop 21 ' is a loop heat pipe, it comprises an evaporation part 211 ', a condensation part 212 ' and the liquid-phase tube group 213 ' and the vapour phase pipe group 214 ' that connect evaporation part 211 ' and condensation part 212 ', wherein, liquid-phase tube group 213 ' is a pipeline with vapour phase pipe group 214 ', and liquid-phase tube group 213 ' is connected with vapour phase pipe group 214 ' and forms a loop.
The colling end 221 of thermoelectric condensation 22 is arranged on electronic building brick 122, and can directly electronic building brick 122 be lowered the temperature, 222 at the heating end of thermoelectric condensation 22 is to contact with evaporation part 211, because the LHP loop heat pipe does not have reservoir, therefore, in this embodiment, it is 222 pairs of evaporation parts of heating end, the 211 ' heating that directly utilizes thermoelectric cooling assembly 22, keep the power of whole circulation by this, and the colling end 221 of thermoelectric condensation 22 is arranged on electronic building brick 122, also can directly carry out the active cooling to electronic building brick 122.
Subsidiary some explanation be, also can be applied in the evaporation part 211 ' or the condensation part 212 ' of LHP loop heat pipe as the set-up mode (way that cool off promptly independent application 221 pairs of condensation parts of its cooling end or evaporation part) of the thermoelectric cooling assembly 22 of Fig. 5 and Fig. 7.
In sum, the utility model is with two phase flow heat-radiation loop 21,21 ' is applied in the heat radiation of the central processing unit of main frame for example or other chip modules in conjunction with thermoelectric cooling assembly 22,222 pairs of two phase flow heat-radiation loops 21 of colling end 221 and heating end by thermoelectric cooling assembly 22,21 ' desired area cools off and heats, or direct 221 pairs of electronic building bricks of colling end, 122 coolings by thermoelectric cooling assembly 22, compared to way in the past, for two phase flow heat-radiation loop 21,21 ' more can reach cooling effect really, can reach the purpose of this utility model, and this thermoelectric cooling assembly 22 can be used to also directly to electronic building brick 122 coolings.
The above-described content of thought, it only is preferred embodiment of the present utility model, can not limit the scope that the utility model is implemented with this, be every simple equivalent variations and modification of being done according to the utility model claims scope and utility model description, all still belong in the scope that the utility model patent contains.
Claims (14)
1. radiating module comprises:
The hot loop of scattering of one two-phase, comprise a condensation part, an evaporation part and connect described condensation part and described evaporation part and can flow in for working fluid in a liquid-phase tube group, a vapour phase pipe group;
It is characterized in that, described radiating module comprises a thermoelectric cooling assembly, described thermoelectric cooling assembly has a colling end and a heating end, the colling end of described thermoelectric cooling assembly be arranged at described condensation part and described evaporation part one of them and in order to cool off described condensation part and described evaporation part one of them.
2. radiating module according to claim 1 is characterized in that, described radiating module comprises that also one is arranged at the heat radiating fin bar of the heating end of described thermoelectric cooling assembly.
3. radiating module according to claim 1, it is characterized in that, described liquid-phase tube group comprises that one connects the reservoir that described condensation part is communicated with described first flow with first flow, an end of described evaporation part one second runner and is arranged at the described second runner other end, and described heating end is arranged at described reservoir and in order to described reservoir is heated.
4. radiating module according to claim 3 is characterized in that, described thermoelectric cooling assembly makes described colling end be arranged at described condensation part and in order to the cooling of described condensation part between described reservoir and described condensation part.
5. radiating module according to claim 3 is characterized in that, described thermoelectric cooling assembly makes described colling end be arranged at described evaporation part and in order to the cooling of described evaporation part between described reservoir and described evaporation part.
6. electronic installation with radiating module comprises:
One casing;
One circuit unit is arranged in the described casing and comprises that a circuit board and is arranged at the electronic building brick of described circuit board; And
One radiating module comprises
The hot loop of scattering of one two-phase, comprise a condensation part, an evaporation part and connect described condensation part and described evaporation part and can flow in for working fluid in a liquid-phase tube group, a vapour phase pipe group, described evaporation part is arranged at described electronic building brick;
It is characterized in that, described radiating module comprises a thermoelectric cooling assembly, described thermoelectric cooling assembly has a colling end and a heating end, the colling end of described thermoelectric cooling assembly be arranged at described condensation part and described evaporation part one of them and in order to cool off described condensation part and described evaporation part one of them.
7. the electronic installation with radiating module according to claim 6 is characterized in that, described electronic installation comprises that also one is arranged at the heat radiating fin bar of the heating end of described thermoelectric cooling assembly.
8. the electronic installation with radiating module according to claim 6, it is characterized in that, described liquid-phase tube group comprises that one connects the reservoir that described condensation part is communicated with described first flow with first flow, an end of described evaporation part one second runner and is arranged at the described second runner other end, and described heating end is arranged at described reservoir and in order to described reservoir is heated.
9. the electronic installation with radiating module according to claim 8 is characterized in that, described thermoelectric cooling assembly makes described colling end be arranged at described condensation part and in order to the cooling of described condensation part between described reservoir and described condensation part.
10. the electronic installation with radiating module according to claim 8 is characterized in that, described thermoelectric cooling assembly makes described colling end be arranged at described evaporation part and in order to the cooling of described evaporation part between described reservoir and described evaporation part.
11., it is characterized in that described electronic building brick is a central processing unit according to each described electronic installation in the claim 6 to 10 with radiating module.
12. the electronic installation with radiating module comprises:
One casing;
One circuit unit is arranged in the described casing and comprises that a circuit board and is arranged at the electronic building brick of described circuit board; And
One radiating module comprises
The hot loop of scattering of one two-phase, comprise a condensation part, an evaporation part and connect described condensation part and described evaporation part and can flow in for working fluid in a liquid-phase tube group, a vapour phase pipe group;
It is characterized in that, described radiating module comprises a thermoelectric cooling assembly, described thermoelectric cooling assembly has a colling end and a heating end, the colling end of described thermoelectric cooling assembly is arranged at described electronic building brick and in order to cooling off described electronic building brick, and described heating end is arranged at described evaporation part and in order to heat described evaporation part.
13. the electronic installation with radiating module according to claim 12 is characterized in that, described thermoelectric cooling assembly is arranged between described evaporation part and the described electronic building brick.
14., it is characterized in that described electronic building brick is a central processing unit according to claim 12 or 13 described electronic installations with radiating module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU200820135849XU CN201260287Y (en) | 2008-10-09 | 2008-10-09 | Heat radiation module and electronic device with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU200820135849XU CN201260287Y (en) | 2008-10-09 | 2008-10-09 | Heat radiation module and electronic device with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201260287Y true CN201260287Y (en) | 2009-06-17 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU200820135849XU Expired - Lifetime CN201260287Y (en) | 2008-10-09 | 2008-10-09 | Heat radiation module and electronic device with same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201260287Y (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102006763A (en) * | 2009-08-27 | 2011-04-06 | 阿尔斯通运输股份有限公司 | Electric power converter cooled by a static technology |
| CN102092482A (en) * | 2009-12-11 | 2011-06-15 | 上海卫星工程研究所 | Cooling device for loop heat pipe of satellite borne equipment |
| CN102092481A (en) * | 2009-12-11 | 2011-06-15 | 上海卫星工程研究所 | Blocking device for loop heat pipe of satellite borne equipment |
| CN103186213A (en) * | 2011-12-27 | 2013-07-03 | 宏达国际电子股份有限公司 | Handheld electronic device and thermal energy control method using the device |
| CN104040280A (en) * | 2011-12-20 | 2014-09-10 | 阿斯特里姆有限公司 | Cooling device |
| CN106507639A (en) * | 2016-09-30 | 2017-03-15 | 成都益睿信科技有限公司 | A kind of power inverter |
-
2008
- 2008-10-09 CN CNU200820135849XU patent/CN201260287Y/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102006763A (en) * | 2009-08-27 | 2011-04-06 | 阿尔斯通运输股份有限公司 | Electric power converter cooled by a static technology |
| CN102006763B (en) * | 2009-08-27 | 2015-05-20 | 阿尔斯通运输股份有限公司 | Electric power converter cooled by a static technology |
| CN102092482A (en) * | 2009-12-11 | 2011-06-15 | 上海卫星工程研究所 | Cooling device for loop heat pipe of satellite borne equipment |
| CN102092481A (en) * | 2009-12-11 | 2011-06-15 | 上海卫星工程研究所 | Blocking device for loop heat pipe of satellite borne equipment |
| CN104040280A (en) * | 2011-12-20 | 2014-09-10 | 阿斯特里姆有限公司 | Cooling device |
| CN104040280B (en) * | 2011-12-20 | 2017-09-12 | 空中客车防务和空间公司 | Cooling device |
| CN103186213A (en) * | 2011-12-27 | 2013-07-03 | 宏达国际电子股份有限公司 | Handheld electronic device and thermal energy control method using the device |
| CN106507639A (en) * | 2016-09-30 | 2017-03-15 | 成都益睿信科技有限公司 | A kind of power inverter |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20090617 |
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| CX01 | Expiry of patent term |