CN201252710Y - Heat sink device - Google Patents

Abstract

The utility model relates to a heat dissipation device, which comprises a temperature equalizing plate, a heat dissipation fin group, a cover body and a fan; the temperature equalizing plate is bent; the heat radiating fin group is attached to one part of the surface of the temperature-uniforming plate; the cover body is connected with the temperature equalizing plate, a flow channel is formed between the cover body and the temperature equalizing plate in an enclosing manner, the radiating fin group is positioned in the flow channel, and the cover body is provided with an opening communicated with the flow channel; the fan is arranged corresponding to the opening and the other part of the surface of the temperature equalizing plate; therefore, the utility model discloses a heat abstractor can improve holistic radiating effect by a wide margin.

Description

heat sink

technical field

The utility model relates to a heat dissipation device, in particular to a heat dissipation device with a uniform temperature plate.

Background technique

With the continuous improvement of the computing speed of the central processing unit (CPU) of the computer, the heat generated by it is also getting higher and higher. In the past, the heat dissipation device composed of the cooling fin group and the fan cannot meet the requirements of the current central processing unit. Therefore, people in the industry have successively developed Vapor Chambers with higher thermal conductivity and combined them with heat dissipation fins to effectively solve the current heat dissipation problem; among them, the Vapor Chamber The temperature plate has the characteristics of direct attachment and contact with the heating electronic components in a large area, which attracts more related industries to invest in the research of this temperature chamber.

As the known heat dissipation device, it mainly includes a vapor chamber, a heat radiation fin group and a fan; the temperature chamber is planar and attached to the surface of the heating element; The surface of the temperature plate; the fan is fastened to the heat dissipation fin set, and dissipates heat from the heat dissipation fin set and the temperature chamber; thereby, the heat energy generated by the heating element is taken away.

However, the known heat sink still has the following disadvantages in actual use. Because the fan cannot effectively concentrate the wind force in the process of dissipating heat from the heat dissipation fin group and the vapor chamber, resulting in incomplete heat dissipation, thereby affecting the heat dissipation effect. In addition, since the vapor chamber is planar and its surface area is completely attached to the heating element, its heat conduction area is only limited to the surface area of the heat generating element, so its heat conduction effect cannot be further effectively improved. In addition, if the width of the vapor chamber is increased to increase its surface area, it may collide with other electronic components mounted on the circuit board, making the cooling device unable to be installed and used.

Utility model content

In view of this, the main purpose of the present utility model is to provide a heat dissipation device that can improve the heat dissipation effect, improve the heat conduction effect, and have better installation flexibility.

In order to achieve the above purpose, the utility model provides a heat dissipation device, which is composed of a temperature chamber, a heat radiation fin group, a cover body and a fan; the temperature chamber is bent; the heat radiation fin group is attached to Part of the surface of the uniform temperature plate; the cover is connected to the uniform temperature plate, and a flow channel is formed between the cover body and the uniform temperature plate, the cooling fin group is located in the flow channel, and the cover body is opened There is an opening communicating with the flow channel; the fan is arranged corresponding to the opening and another part of the surface of the uniform temperature plate.

From the above technical solutions, it can be seen that the heat dissipation device of the present invention uses the cover to cover the heat dissipation fin group and the fan, so that the wind generated by the fan operation is concentrated, and the heat dissipation fin group and the uniform temperature plate are directly dissipated. , which effectively improves the overall heat dissipation effect; the design of the curved vapor chamber increases the heat conduction area of the vapor chamber, thereby improving its heat conduction effect; Collision with other electronic components on the motherboard can be avoided, and better installation flexibility is achieved.

Description of drawings

Fig. 1 is the three-dimensional exploded schematic diagram of the heat dissipation device of the present invention;

Fig. 2 is a three-dimensional combination schematic diagram of the utility model heat sink;

Fig. 3 is a sectional view along line 3-3 in Fig. 2;

Fig. 4 is a sectional view along line 4-4 in Fig. 3;

Fig. 5 is a diagram of the use state of the heat sink of the present invention.

Explanation of reference signs

10 Vapor chamber

11 Heat absorption section 12 Heat release section

20 heat sink fins

21 Heat sink fins

30 Cover body

31 Accommodating space 32 Runner

33 Opening Hole 34 Perforation

35 buckle

40 fan

41 Bracket 42 Screw hole

50 screws

60 electronic products

61 Motherboard 62 Heating element

63 Electronic components

Detailed ways

The following examples further describe the viewpoints of the utility model in detail, but do not limit the protection scope of the utility model in any way.

Please refer to FIG. 1 and FIG. 4 , the heat dissipation device of the present invention is composed of a vapor chamber 10 , a heat dissipation fin set 20 , a cover body 30 and a fan 40 .

The vapor chamber 10 is a narrow and bent vapor chamber, the vapor chamber 10 has a heat absorption section 11 and a heat release section 12 bent and extended from both sides of the heat absorption section 11, and The heat absorbing section 11 protrudes from the surfaces of the two heat releasing sections 12, the heat absorbing section 11 abuts against the surface of the heating element 62 (as shown in FIG. 5 ), and the heat releasing section 12 is in contact with the heat absorbing section 12. The segment 11 is formed with a larger heat conduction area, and the heating element 62 can be a CPU, a semiconductor package, a chip or other electronic components that generate high heat and need to be dissipated.

The heat dissipation fin group 20 is attached to a part of the surface of the temperature chamber 10. Preferably, the heat dissipation fin group 20 is attached to the surface of the heat radiation section 12, and the heat dissipation fin group 20 is arranged at equal intervals. Two or more heat dissipation fins 21 are formed, and these heat dissipation fins 21 can be respectively extruded aluminum heat dissipation fins.

The cover body 30 is connected to the uniform temperature plate 10, and a flow channel 32 is formed between each other. The cooling fin group 20 is located in the flow channel 32. The cover body 30 is provided with an opening communicating with the flow channel 32. The hole 33 and an accommodating space 31 communicating with the opening 33 are formed inside. Or two or more perforations 34, these perforations 34 are respectively arranged adjacent to the opening 33, and in addition, clasps 35 are respectively formed on both sides of the cover body 30, and these clasps 35 are respectively fastened to the placement of the temperature chamber 10. Both sides of hot section 12.

The fan 40 is accommodated inside the accommodating space 31 and is arranged corresponding to the opening 33 and another part of the surface of the temperature chamber 10. The fan 40 includes a bracket 41, and on the bracket 41 there are corresponding There are two or more screw holes 42 in the through hole 34 , these through holes 34 and these screw holes 42 can be fixed with screws 50 respectively, and the fan 40 can be an axial fan or a centrifugal fan.

When assembling the utility model, refer to Fig. 1 and Fig. 2 again, first attach the cooling fin group 20 to the surface of the heat release section 12 of the chamber 10, and the cooling fin group 20 can be welded for example. The group 20 is welded on the heat dissipation section 12, and then the fan 40 is connected to the through holes 34 of the cover 30 with the screw holes 42 of the bracket 41, and the screw holes 42 are respectively threaded and locked with the screws 50. and these perforations 34, and fix the fan 40 inside the accommodating space 31 of the cover body 30, and finally, the cover body 30 is fastened to the heat release section of the temperature chamber 10 with the clasps 35 12, and the cover body 30 and the chamber 10 can be welded and fixed, for example, by welding to complete the assembly work of the utility model.

When using the utility model, please refer to Fig. 5, the utility model is applied to an electronic product 60, and the electronic product 60 includes a motherboard 61 and the heating element 62 electrically connected to the motherboard 61 and two or more For the electronic component 63, firstly, after the heat absorbing section 11 of the heat dissipation device of the present invention is abutted against the surface of the heating element 62, the heat energy generated by the heating element 62 is conducted to the cooling fin group via the temperature chamber 10 20, to escape the heat energy generated by the heating element 62, and by starting the operation of the fan 40, the wind is concentrated, and the cooling fin group 20 and the chamber 10 are directly radiated to quickly dissipate the heat energy. It is brought out through the flow channel 32 to effectively improve the overall heat dissipation effect.

In addition, the utility model utilizes the design of the heat release section 12 respectively extending from both sides of the heat absorption section 11 to increase the heat conduction area of the temperature chamber 10 , thereby improving its heat conduction effect.

In addition, because the heat release section 12 of the heat dissipation device of the present invention is higher than the heat absorption section 11, it can not only increase the heat conduction area of the vapor chamber 10, but also avoid contact with the electronic components 63 on the motherboard 61. Collision occurs, so the utility model can be pasted on any one of the heating elements 62 on the main board 61, and the utility model cannot be caused by the different positions of the electronic components 63 around the heating element 62 Therefore, the heat sink of the utility model has better installation flexibility.

However, it is worth noting that the present invention can be applied to the thin electronic product 60 , such as a notebook computer or a personal digital assistant (PDA), etc., but not limited thereto.

To sum up, the application of the utility model can improve the overall heat conduction and heat dissipation effect and increase the flexibility of installation, so as to solve various shortcomings of the known technology, and has a high industrial application value.

The above descriptions are only preferred embodiments of the present utility model, and are not intended to limit the protection scope of the present utility model.

Claims (10)

1. A cooling device, characterized in that it comprises: The vapor chamber is bent; a heat dissipation fin group attached to a part of the surface of the vapor chamber; The cover is connected to the uniform temperature plate, and a flow channel is formed between the cover body and the uniform temperature plate, the heat dissipation fin group is located in the flow channel, and the cover is provided with an opening communicating with the flow channel ;as well as The fan is arranged corresponding to the opening and another part of the surface of the temperature chamber. 2. The heat dissipation device according to claim 1, wherein the vapor chamber is a long and narrow vapor chamber. 3. The heat dissipation device according to claim 1, wherein the vapor chamber has a heat absorbing section and a heat releasing section bent and extended from both sides of the heat absorbing section. 4. The heat dissipation device according to claim 3, wherein the heat absorbing section protrudes from the surface of the two heat releasing sections. 5. The heat dissipation device according to claim 3, wherein the set of heat dissipation fins is attached to the heat dissipation section. 6. The heat dissipation device according to claim 1, wherein the set of heat dissipation fins is composed of two or more heat dissipation fins extruded from aluminum. 7. The heat dissipation device according to claim 1, wherein an accommodating space communicating with the flow channel is formed inside the cover, and the fan is accommodated in the accommodating space. 8. The heat dissipation device according to claim 1, wherein hooks are respectively formed on both sides of the cover body, and the hooks are respectively hooked to both sides of the temperature chamber. 9. The heat dissipation device according to claim 1, wherein the fan includes a bracket, and two or more screw holes are opened on the bracket, and the cover body is opened with corresponding screw holes Two or more perforations, the screw holes and the perforations are locked by screws. 10. The heat dissipation device according to claim 1, wherein the fan is an axial fan.

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