CN201259892Y - Light emitting diode chip packaging structure with embedded electrostatic protection function - Google Patents

Abstract

A light emitting diode chip packaging structure with embedded electrostatic protection function comprises: the light-emitting device comprises a conductive unit, a first packaging unit, an electrostatic protection unit, a second packaging unit, a light-emitting unit and a third packaging unit. The conductive unit is provided with at least two conductive pins which are arranged adjacent to each other to form a concave space. The first packaging unit wraps a part of each conductive pin to generate an accommodating space communicated with the concave space, and the tail end of each conductive pin is exposed out of the packaging unit. The electrostatic protection unit is accommodated in the concave space and is electrically connected between the two conductive pins. The second packaging unit is accommodated in the concave space to cover the electrostatic protection unit. The light-emitting unit is accommodated in the accommodating space and is electrically connected between the two conductive pins. The third packaging unit is accommodated in the accommodating space to cover the light emitting unit.

Description

Light-emitting diode chip packaging structure with built-in electrostatic protection function

technical field

The utility model relates to a light-emitting diode chip packaging structure, in particular to a light-emitting diode chip packaging structure with a built-in electrostatic protection function.

Background technique

Please refer to FIG. 1 , which is a schematic cross-sectional view of an existing light-emitting diode chip package structure with an Electro-Static Discharge (ESD) function. It can be seen from the figure that the existing LED chip packaging structure includes: a base structure 1 , at least one LED 2 disposed on the upper end of the base structure 1 , an electrostatic protection device 3 , and a fluorescent colloid 4 .

Wherein, the positive electrode terminal 21 and the negative electrode terminal 22 at the upper end of the LED 2 are connected by two wires W

1 is electrically connected to the positive electrode terminal 11 and the negative electrode terminal 12 of the base structure 1 . In addition, the electrostatic protection device 3 is also arranged on the base structure 1, and the negative electrode terminal 32 of the electrostatic protection device 3 is directly electrically connected to the positive electrode area of the base structure 1, and the positive electrode terminal 32 of the electrostatic protection device 3 The terminal 31 is electrically connected to the negative terminal 12 of the base structure 1 through a wire W2. Furthermore, the fluorescent colloid 4 covers the upper ends of the light emitting diode 2 and the static electricity protection device 3 to protect the light emitting diode 2 and the static electricity protection device 3 .

However, the above-mentioned existing light-emitting diode chip packaging structure with electrostatic protection function still has the following disadvantages:

1. Because the position of the light emitting diode 2 is too low, the existing structure cannot effectively improve the luminous efficiency of the light emitting diode 2 .

2. Since the static electricity protection device 3 is arranged in the vicinity of the light emitting diode 2 , the luminous efficiency of the light emitting diode 2 will be affected by the static electricity protection device 3 .

3. Since the ESD protection device 3 and the LED 2 are adjacently disposed on the same conductive pin of the base structure 1 , the heat dissipation performance of the LED 2 will be affected by the ESD protection device 3 .

Contents of the invention

The technical problem to be solved by the utility model is to provide a light-emitting diode chip packaging structure with a built-in electrostatic protection function. In the utility model, a light-emitting unit and an electrostatic protection unit are arranged separately (layered) so as to prevent the light-emitting unit from being disturbed by the electrostatic protection unit.

In addition, the fluorescent material of the present invention does not directly contact the light-emitting unit, so the present invention can avoid reducing the luminous efficiency of the fluorescent material due to the high temperature generated by the light-emitting unit.

Furthermore, the structural design of the present invention is more suitable for various light sources, such as backlight modules, decorative light strips, lighting lamps, or scanner light sources, etc., all of which are the scope and products of the present invention.

In order to solve the above technical problems, according to one of the proposals of the present utility model, a light emitting diode chip packaging structure with built-in electrostatic protection function is provided, which includes: a conductive unit, a first packaging unit, and an electrostatic protection unit , a second packaging unit, a light emitting unit, and a third packaging unit. Wherein, the conductive unit has at least two conductive pins, and the at least two conductive pins are arranged adjacent to each other to form a recessed space. The first package unit wraps a part of each conductive pin to create an accommodating space communicated with the recessed space, and makes the end of each conductive pin exposed to the first package unit. The electrostatic protection unit is accommodated in the recessed space and electrically connected between the two conductive pins. The second packaging unit is accommodated in the recessed space to cover the electrostatic protection unit. The light emitting unit is accommodated in the accommodating space and electrically connected between the two conductive pins. The third packaging unit is accommodated in the accommodating space to cover the light emitting unit.

Furthermore, according to different needs, the third packaging unit can be implemented in the following different ways:

1. The first embodiment: the third packaging unit is a transparent material.

2. The second embodiment: the third packaging unit is a fluorescent material, and the fluorescent material is formed by mixing silica gel and fluorescent powder or epoxy resin and fluorescent powder.

3. The third embodiment: the third packaging unit has a transparent material for covering the light emitting unit and a fluorescent material formed on the transparent material.

4. Embodiment 4: the third packaging unit has a fluorescent material for covering the light emitting unit and a transparent material formed on the fluorescent material.

Therefore, the light-emitting diode chip packaging structure with built-in electrostatic protection function of the utility model has the following advantages:

1. Because the light-emitting unit is elevated by the second packaging unit, so that the light-emitting unit can be at a higher position. Therefore, the structure of the present invention can effectively improve the luminous efficiency of the luminous unit.

2. Since the static electricity protection unit and the light emitting unit are separated (layered) and arranged in different positions, the luminous efficiency of the light emitting unit will not be affected by the static electricity protection unit.

3. Since the static electricity protection unit and the light emitting unit are separated (layered) and arranged in different positions, the heat dissipation performance of the light emitting unit will not be affected by the static electricity protection unit.

4. In the above-mentioned third embodiment, because the third packaging unit is composed of the transparent material and the fluorescent material, the fluorescent material does not directly contact the light-emitting unit, so the utility model can avoid The high temperature generated by the unit reduces the luminous efficiency of the fluorescent material.

5. In the above fourth embodiment, through the use of the transparent material, on the one hand, the amount of the fluorescent material used can be reduced, and on the other hand, the transparent material can be placed on the uppermost layer to protect the fluorescent material, so as to avoid damage from external forces The advantages.

The utility model will be described in detail below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the utility model.

Description of drawings

1 is a schematic cross-sectional view of an existing light-emitting diode chip package structure with electrostatic protection function;

Fig. 2A to Fig. 2E are three-dimensional schematic diagrams of the packaging process of the first embodiment of the light-emitting diode chip packaging structure with built-in electrostatic protection function of the present invention;

Fig. 3 is a schematic cross-sectional view of the second embodiment of the light-emitting diode chip packaging structure with built-in electrostatic protection function of the present invention;

Fig. 4 is a schematic cross-sectional view of the third embodiment of the light-emitting diode chip packaging structure with built-in electrostatic protection function of the present invention;

5 is a schematic cross-sectional view of a fourth embodiment of the light-emitting diode chip packaging structure with built-in electrostatic protection function of the present invention; and

FIG. 6 is a schematic cross-sectional view of a fifth embodiment of the LED chip packaging structure with built-in electrostatic protection function of the present invention.

Among them, reference signs

1 Base structure 11 Positive electrode terminal

12 negative terminal

2 Light-emitting diode 21 Positive terminal

22 Negative terminal

3 ESD protection device 31 Positive electrode terminal

32 Negative terminal

4 fluorescent colloid

W1, W2 wire

(first embodiment)

1a Conductive unit 10a Conductive pin

100a sunken space

101a extension

102a Bending part

2a The first package unit 200a Accommodating space

3a ESD protection unit

4a Second package unit

5a Lighting unit

6a The third package unit

W1a, W2a wire

(second embodiment)

1b Conductive unit 10b Conductive pin

2b The first packaging unit

3b ESD protection unit

4b second packaging unit

5b Lighting unit

6b The third package unit

W1b, W2b wire

(third embodiment)

6c The third package unit

(fourth embodiment)

5d light emitting unit

6d third packaging unit 60d transparent material

61d fluorescent material

(fourth embodiment)

5e Lighting unit

6e third packaging unit 60e transparent material

61e fluorescent material

Detailed ways

Please refer to FIG. 2A to FIG. 2E , the manufacturing method of the light emitting diode chip packaging structure in the first embodiment of the present invention includes the following steps:

Referring to FIG. 2A , a conductive unit 1a is provided, which has at least two conductive pins 10a, and the at least two conductive pins 10a are arranged adjacent to each other to form a recessed space 100a. Each conductive pin 10a has an extension portion 101a and a bent portion 102a bent downward from the extension portion 101a, and the bent portions 102a are arranged adjacent to each other to form the recessed space 100a.

Please refer to FIG. 2A , a first packaging unit 2a is used to cover a part of each conductive pin 10a to produce an accommodating space 200a connected with the recessed space 100a, and to make each conductive pin 10a The end exposes the first packaging unit 2a. In other words, one end of each extension portion 101a is exposed outside the first packaging unit 2a, and the first packaging unit 2a is made of an opaque material.

Referring to FIG. 2B , an ESD protection unit 3 a is accommodated in the recessed space 100 a and electrically connected between the two conductive pins 10 a. According to the first embodiment of the present utility model, the ESD protection unit 3a is electrically disposed on one of the conductive pins 10a, and the ESD protection unit 3a is electrically connected to the other conductive pin 10a through a wire W1a .

2C, a second packaging unit 4a is accommodated in the recessed space 100a to cover the electrostatic protection unit 3a, wherein the second packaging unit 4a can be a packaging material with a light-reflecting substance, for example: The light reflective material can be high reflective material or total reflective material.

Please refer to FIG. 2D, a light emitting unit 5a is accommodated in the accommodating space 200a and electrically connected between the two conductive pins 10a, wherein the light emitting unit 5a can be a light emitting diode, and the light emitting The unit 5a is disposed on the second packaging unit 4a, and the light emitting unit 5a is electrically connected to the two conductive pins 10a respectively through two wires W2a. Furthermore, the light emitting unit 5a can achieve a high reflection effect through the high reflection property of the second packaging unit 4a. In addition, the light-emitting unit 5a can be placed at a higher position through the heightening of the second packaging unit 4a, so the structure of the present invention can effectively improve the light-emitting efficiency of the light-emitting unit. In addition, since the static electricity protection unit 3a and the light emitting unit 5a are separated (layered) and arranged in different positions, the light emitting performance and heat dissipation performance of the light emitting unit 5a will not be affected by the static electricity protection unit 3a.

Referring to FIG. 2E , a third packaging unit 6 a is accommodated in the accommodation space 200 a to cover the light emitting unit 5 a. According to the first embodiment of the present invention, the third packaging unit 6a can be a transparent material.

Therefore, as shown in Figure 2E, the first embodiment of the present utility model provides a light-emitting diode chip packaging structure with built-in electrostatic protection function, which includes: a conductive unit 1a, a first packaging unit 2a, an electrostatic protection Unit 3a, a second packaging unit 4a, a light emitting unit 5a, and a third packaging unit 6a.

Wherein, the conductive unit 1a has at least two conductive pins 10a, and the at least two conductive pins 10a are arranged adjacent to each other to form a recessed space 100a. The first packaging unit 2a wraps a part of each conductive pin 10a to form an accommodating space 200a communicating with the recessed space 100a, and makes the end of each conductive pin 10a expose the first packaging unit 2a . The ESD protection unit 3a is accommodated in the recessed space 100a (accommodated between the at least two conductive pins 10a) and electrically connected between the two conductive pins 10a. The second packaging unit 4a is accommodated in the recessed space 100a (arranged between the at least two conductive pins 10a) to cover the ESD protection unit 3a. The light emitting unit 5a is accommodated in the accommodating space 200a and electrically connected between the two conductive pins 10a. The third packaging unit 6a is accommodated in the accommodating space 200a to cover the light emitting unit 5a.

Please refer to FIG. 3 , which is a schematic cross-sectional view of a second embodiment of the LED chip package structure with built-in electrostatic protection function of the present invention. As can be seen from the figure, the second embodiment of the present invention provides a light-emitting diode chip packaging structure with built-in electrostatic protection function, which includes: a conductive unit 1b, a first packaging unit 2b, an electrostatic protection unit 3b, A second packaging unit 4b, a light emitting unit 5b, and a third packaging unit 6b. In addition, the biggest difference between the second embodiment of the utility model and the first embodiment is that in the second embodiment, the static electricity protection unit 3b is arranged on the first packaging unit 2b, so the static electricity protection unit 3b passes two The wire W1b is electrically connected to the two conductive pins 10b respectively. Moreover, the light emitting unit 5b is electrically disposed on one of the conductive pins 10b through a wire W2b, and the light emitting unit 5b is electrically connected to the other conductive pin 10b through another wire W2b.

Please refer to FIG. 4 , which is a schematic cross-sectional view of a third embodiment of the LED chip packaging structure with built-in electrostatic protection function of the present invention. As can be seen from the figure, the biggest difference between the third embodiment of the present invention and the first embodiment is that in the third embodiment, a third packaging unit 6c is a fluorescent material, and the fluorescent material can be mixed with silica gel and fluorescent powder Made or mixed with epoxy resin and phosphor.

Please refer to FIG. 5 , which is a schematic cross-sectional view of a fourth embodiment of the LED chip package structure with built-in electrostatic protection function of the present invention. It can be seen from the figure that the biggest difference between the fourth embodiment of the present invention and the first embodiment is that in the fourth embodiment, a third packaging unit 6d has a transparent material 60d for covering a light emitting unit 5d and a A fluorescent material 61d formed on the transparent material 60d. Therefore, because the third encapsulation unit 6d is composed of two layers of the transparent material 60d and the fluorescent material 61d, the fluorescent material 61d does not directly contact the light-emitting unit 5d, so the present invention can avoid the problem caused by the light-emitting unit 5d The resulting high temperature reduces the luminous efficiency of the fluorescent material 61d.

Please refer to FIG. 6 , which is a schematic cross-sectional view of a fifth embodiment of the LED chip packaging structure with built-in electrostatic protection function of the present invention. It can be seen from the figure that the biggest difference between the fifth embodiment of the present invention and the first embodiment is that in the fifth embodiment, a third packaging unit 6e has a fluorescent material 61e for covering a light emitting unit 5e and a A transparent material 60e formed on the fluorescent material 61e. Therefore, in the fifth embodiment, through the use of the transparent material 60e, the usage amount of the fluorescent material 61e can be reduced on the one hand, and on the other hand, the fluorescent material 61e can be protected by the transparent material 60e on the uppermost layer, so as to avoid Advantages of destruction by external force.

To sum up, in the present invention, a light-emitting unit and an electrostatic protection unit are arranged separately (layered) to prevent the light-emitting unit from being disturbed by the electrostatic protection unit. Therefore, the light-emitting diode chip packaging structure with built-in electrostatic protection function of the utility model has the following advantages:

1. Because the light-emitting unit is elevated by the second packaging unit, so that the light-emitting unit can be at a higher position. Therefore, the structure of the present invention can effectively improve the luminous efficiency of the luminous unit.

2. Since the static electricity protection unit and the light emitting unit are separated (layered) and arranged in different positions, the luminous efficiency of the light emitting unit will not be affected by the static electricity protection unit.

3. Since the static electricity protection unit and the light emitting unit are separated (layered) and arranged in different positions, the heat dissipation performance of the light emitting unit will not be affected by the static electricity protection unit.

4. In the above fourth embodiment, because the third packaging unit 6d is composed of two layers of the transparent material 60d and the fluorescent material 61d, the fluorescent material 61d does not directly contact the light emitting unit 5d, so the utility model can Avoid reducing the luminous efficiency of the fluorescent material 61d due to the high temperature generated by the luminous unit 5d.

5. In the above-mentioned fifth embodiment, through the use of the transparent material 60e, on the one hand, the usage amount of the fluorescent material 61e can be reduced, and on the other hand, the transparent material 60e can be located on the uppermost layer to protect the fluorescent material 61e, so as to avoid The advantage of being damaged by external forces.

Of course, the utility model can also have other various embodiments, and those skilled in the art can make various corresponding changes and deformations according to the utility model without departing from the spirit and essence of the utility model, but These corresponding changes and deformations should all belong to the protection scope of the appended claims of the present utility model.

Claims (9)

1. A light-emitting diode chip packaging structure with built-in electrostatic protection function, characterized in that it includes: a conductive unit having at least two conductive pins arranged adjacent to each other; A first packaging unit, which covers a part of each conductive pin to create an accommodating space, and makes the end of each conductive pin expose the first packaging unit; An electrostatic protection unit, which is accommodated between the at least two conductive pins and is electrically connected between the two conductive pins; A second packaging unit, which is accommodated between the at least two conductive pins to cover the electrostatic protection unit; a light-emitting unit, which is accommodated in the accommodation space and electrically connected between the two conductive pins; and A third packaging unit is accommodated in the accommodating space to cover the light emitting unit. 2. The light-emitting diode chip packaging structure with built-in electrostatic protection function according to claim 1, characterized in that: the at least two conductive pins are arranged adjacent to each other to form a recessed space, and the recessed space is connected to The accommodating space, the electrostatic protection unit and the second packaging unit are all accommodated in the recessed space. 3. The light-emitting diode chip packaging structure with built-in electrostatic protection function according to claim 2, wherein each conductive pin has an extension part and a bending part bent downward from the extension part , one end of the extension part is exposed outside the first packaging unit, and the bent parts are arranged adjacent to each other to form the recessed space. 4. The light-emitting diode chip packaging structure with built-in electrostatic protection function according to claim 1, characterized in that: the electrostatic protection unit is electrically disposed on one of the conductive pins or disposed on the first packaging unit superior. 5. The light-emitting diode chip packaging structure with built-in electrostatic protection function according to claim 1, characterized in that: the light-emitting unit is electrically disposed on one of the conductive pins or on the second packaging unit . 6. The light-emitting diode chip packaging structure with built-in electrostatic protection function according to claim 1, characterized in that: the first packaging unit is an opaque material, and the second packaging unit is a light-reflecting The encapsulating material of the substance. 7. The light-emitting diode chip packaging structure with built-in electrostatic protection function according to claim 1, characterized in that: the third packaging unit is a transparent material or a fluorescent material, and the fluorescent material is made of silica gel and fluorescent powder Mixed or mixed with epoxy resin and phosphor. 8. The light-emitting diode chip packaging structure with built-in electrostatic protection function according to claim 1, characterized in that: the third packaging unit has a transparent material for covering the light-emitting unit and a transparent material formed on the transparent material on the fluorescent material. 9. The light-emitting diode chip packaging structure with built-in electrostatic protection function according to claim 1, characterized in that: the third packaging unit has a fluorescent material for covering the light-emitting unit and a fluorescent material formed on the fluorescent material on transparent material.

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