CN201233444Y - Solid-state detector for radiation detection - Google Patents

Abstract

An array solid detector for radiation detection comprises a plurality of sensors for detecting rays which radiate in the scheduled direction, each sensor is provided with an end surface for incident rays and a plurality of first boards which are almost arranged in parallel to form at least a row of space, a plurality of sensors are arranged in the space, wherein a plurality for first boards are formed by metals. The use of the structural form can constitute any multi-row array solid detector, thereby increasing the radiation detection speed of a large object under the situation of not sacrificing the spatial resolution and the contrast sensitivity of a scanned image.

Description

Arrayed Solid State Detectors for Radiation Detection

technical field

The utility model relates to a detector used for radiation detection (for example, a radiation imaging system), in particular to an array solid detector used for radiation detection of large objects.

Background technique

In a radiation imaging system, the function of the array detector is to convert the X-ray or γ-ray signal transmitted through the detected object into an electrical signal. In the radiation imaging system of a large object, a single-column detector array is generally used, including ionization chamber-type gas detectors and scintillator-type solid-state detectors. In Chinese patents 02148670.0 and 200420009319.2, the applicant disclosed two radiation imaging solid-state detector technologies. The solid-state detector arrays using these patented technologies have been widely used in X-ray container scanning systems. The multi-column detector array is proposed to meet the requirements of increasing the scanning speed of radiation detection of large objects, such as the radiation scanning detection of trains. Increasing the width of the detector sensitive area in the scanning direction can increase the scanning speed, but increasing the width of the detector sensitive area will sacrifice the spatial resolution of the radiation imaging system, resulting in a decrease in the quality of the scanned image. To meet the requirements of improving scanning speed and scanning image quality at the same time, multi-column detectors are generally used. Chinese patent 200520136585.6 discloses a multi-array detector module structure for radiation imaging, but this patent does not point out how to construct multi-row solid detectors. In patent 02148670.0 and 200420009319.2, the coupling of the scintillator and the photodiode in the solid-state detector or array solid-state detector is on the side of the scintillator parallel to the ray direction, and these two kinds of detectors are used to construct multi-column solid-state detection with more than 2 columns When the detector is used, since the photodiode and its output circuit board will occupy space, the dead zone between the sensitive areas of at least two columns of detectors will be relatively large, and a large dead zone will make the contrast sensitivity of the scanned image worse.

There have been many examples of radiation imaging multi-column solid detectors in the field of medical detection and small object detection, such as multi-slice CT detectors, flat panel detectors, etc. However, these detector structures designed for the detection of small objects are not suitable for the construction of radiation imaging detection of large objects, mainly because the detection efficiency of these detectors for high-energy ionizing radiation (such as pulsed X-rays generated by accelerators) is too low and too large. The fine pixel size makes it too expensive to build and maintain large object detection pipelines.

Fig. 1 is a schematic diagram of a detector of a radiation detection system commonly used for large objects at present. In this detector structure, the coupling surface of the photodiode 102 and the scintillator 101 is parallel to the radiation direction (shown by the arrow 105 in the figure). The ionizing radiation 105 deposits energy inside the scintillator 101 to generate visible light, which is collected by a reflective material (coated on the surface of the scintillator), enters the photodiode 102 through the coupling surface, and is converted into a charge signal in the photodiode 102, and the charge signal passes through the PCB board After 103, the socket 104 on the PCB board 103 outputs to the subsequent signal amplification and data acquisition circuit. The characteristic of this structure is that the energy deposition light-emitting point in the scintillator is relatively close to the light-collecting surface of the photodiode, and more visible light can be collected when the light transmission conditions in the scintillator are not good.

Utility model content

An object of the present invention is to provide an array solid-state detector for radiation imaging. This array solid-state detector can be constructed into an array solid-state detector with any number of columns, and can be used without sacrificing the spatial resolution of the scanned image. Increased radiation detection speed for large objects.

Another object of the present utility model is to provide an array solid-state detector for radiation imaging. This array solid-state detector can be constructed into any number of rows of array solid-state detectors, and can be used without sacrificing the spatial resolution and contrast of the scanned image. Improve the radiation detection speed of large objects in the case of sensitivity.

Another object of the present invention is to provide an array solid-state detector for radiation imaging. The multi-row solid-state detector constructed by using the array solid-state detector can not only maintain long-term stability, but also be easy to manufacture and maintain.

According to one aspect of the present invention, the present invention provides an array solid-state detector for radiation detection, the array solid-state detector includes: a plurality of sensors for detecting radiation radiated along a predetermined direction, the sensors have a radiation incident and a plurality of first plates arranged substantially in parallel to form at least one row of spaces in which the plurality of sensors are arranged, wherein the plurality of first plates are formed of metal.

According to an aspect of the present invention, the array solid-state detector for radiation detection may further include: a plurality of second plates intersecting with a plurality of first plates, whereby the Each of the at least one row of spaces is divided into a plurality of space arrays, each of the sensors is located in one of the plurality of space arrays, wherein the plurality of second plates are formed of metal.

Preferably, the plurality of second plates are substantially perpendicular to the plurality of first plates.

The sensor may include a plurality of scintillators that receive rays radiated in a predetermined direction and convert the rays into visible light, and a plurality of photodiodes, the plurality of photodiodes are respectively coupled to the plurality of scintillators through coupling surfaces, so that Visible light enters the photodiode so that the visible light is converted into a charge signal.

Preferably, the coupling surface is substantially perpendicular to the predetermined direction.

Preferably, the plurality of first plates and the plurality of second plates protrude beyond the predetermined length of the end surface in a direction opposite to the predetermined direction to form a collimator.

Preferably, each of the plurality of scintillators has a surface other than the surface coupled to the photodiode surrounded by a reflective material for reflecting the visible light.

Preferably, the reflective material has a refractive index smaller than that of the scintillator.

Preferably, an outermost plate among the plurality of first plates and the plurality of second plates forms a first case so as to surround respective sides extending in a predetermined direction.

The array solid-state detector for radiation detection according to the present invention may further include: a printed circuit board for outputting charge signals of the plurality of photodiodes, and a metal second housing, the second housing at least around a portion of the printed circuit board.

Preferably, the plurality of photodiodes are photodiodes of a chip-scale package structure.

Preferably, the plurality of photodiodes and the corresponding plurality of scintillators are coupled along the coupling surface with an optically transparent double-sided adhesive tape or an optically transparent adhesive film.

The array solid-state detector for radiation detection according to the present utility model may also include: a printed circuit board for outputting charge signals of the plurality of photodiodes, and a circuit board for connecting the plurality of photodiodes to the printed circuit board. An elastic connector is connected, the elastic connector is an insulating rubber sheet, and conductive medium stripes are provided in the predetermined direction, and the conductive medium stripes connect a plurality of photodiodes to the printed circuit board.

Preferably, the projection of the photodiode in the predetermined direction substantially falls into the projection of the scintillator in the predetermined direction.

The plurality of first plates and the plurality of second plates may be formed of heavy metal.

The heavy metal may be one of tungsten, lead or tantalum, or one of alloys composed of tungsten, lead or tantalum.

According to the structure of the utility model, solid detectors of any number of columns can be constructed to meet the requirement of improving the rapid scanning of radiation imaging of large objects without sacrificing the spatial resolution and contrast sensitivity of the scanning system. In addition to the functions of moisture-proof, light-proof, and electromagnetic interference-proof, this detector also has the advantages of good reliability, convenient assembly and maintenance.

Description of drawings

In order to more fully understand the characteristics and purpose of the utility model, the utility model will be described in detail below with reference to the accompanying drawings.

Figure 1 is a schematic diagram of the detector principle of a commonly used radiation detection system for large objects.

Fig. 2 is a structural schematic diagram of the scintillator and photodiode of the detector of the present invention.

Fig. 3 is a structural schematic diagram of the detector housing of the present invention.

Fig. 4 is a schematic diagram of the coupling surface of the scintillator and the photodiode.

Fig. 5 is a schematic diagram of connecting a photodiode and a PCB board through an elastic connector.

Figure 6 is a schematic diagram of a weighted metal spacer between scintillator channels.

Fig. 7 is a schematic diagram of the forward extension of the heavy metal partition between the scintillator channels.

Detailed ways

Fig. 2 is a schematic diagram of the detector of the radiation detection system of the present invention, wherein the detector is a multi-row solid detector including a plurality of scintillators and a plurality of photodiodes. As shown in FIG. 2, the array solid-state detector for radiation detection according to the present invention includes: a plurality of scintillators 201 that receive radiation radiated in a predetermined direction (for example, a radiation irradiation direction 205) and convert the radiation into visible light, and a plurality of photodiodes 202 , the plurality of photodiodes are respectively coupled with the plurality of scintillators through coupling surfaces, so that visible light enters the photodiodes 202 and converts the visible light into charge signals. The coupling surface is substantially perpendicular to the predetermined direction. That is, the coupling surface of the photodiode 202 and the scintillator 201 is perpendicular to the ray irradiation direction 205 . The surface of the scintillator is surrounded by reflective material except for the coupling surface of the photodiode. The photodiode signal is output through the PCB board 203 . Radiation detection systems for large items generally use higher-energy radiation sources (such as electron linear accelerators, high-energy radiation sources), and the corresponding detectors also require higher detection efficiency for the radiation. Therefore, in the utility model The length of the scintillator 201 in the detector can be relatively long (such as greater than 30mm), and in order to achieve a specific spatial resolution, the sensitive area of the scintillator perpendicular to the ray irradiation direction 205 of each detector channel can be relatively small (such as less than 5mm ² ). In this way, the scintillator 201 presents an elongated strip shape. The preferred method is to select a reflector material whose refractive index is lower than that of the scintillator 201, and an optical waveguide structure can be formed inside the scintillator, and this optical waveguide structure is more conducive to transmitting the visible light generated by the radiation energy deposition to the The two end faces of the strip-shaped scintillator 201, so when the photodiode 202 is coupled to the end face of the scintillation crystal, although the transmission distance of visible light inside the scintillation crystal will be farther than that of the photodiode coupled to the side of the scintillation crystal, it can still Get enough visible light signal.

Preferably, the scintillator has a substantially columnar shape.

As a sensor for detecting radiation, in addition to the above-mentioned multiple scintillators 201 and multiple photodiodes 202 , other suitable elements in the field may also be used: such as compound semiconductor radiation detectors and the like.

Fig. 3 is a schematic diagram of the detector of the present invention plus a metal casing. Wherein the first housing 301 and the second housing 302 contain the scintillator 201 shown in FIG. 2 , the photodiode 202 and a part of the PCB board 203 in between. Several sides of the first casing 301 except the incident surface 3011 perpendicular to the ray irradiation direction 205 are made of heavy metal materials or lined with heavy metal materials. The heavy metal material can be W, Pb or Ta, etc. The metal shell protects the scintillator and the photodiode from light and moisture, and also supports various elements or parts in the shell. The role of the heavy metal material is to weaken the impact of scattered ionizing radiation around the detector on the edge channels of the multi-column detector module.

FIG. 4 is a schematic diagram of the coupling surface of the scintillator 201 and the photodiode 202 . According to an embodiment of the present invention, the photodiode is preferably a photodiode with a CSP (Chip Size Package) structure. The characteristic of the photodiode with CSP structure is that its sensitive area and external dimensions are almost the same, and there is no jumper on the surface of the photodiode, which is beneficial to improve the coupling efficiency of the photodiode and the scintillator, and increase the signal sensitivity of the detector channel. In addition, as shown in FIG. 4, a scintillator 201 and a photodiode 202 coupled to each other form a unit, and in each unit, the projection of the photodiode in the predetermined direction generally falls into the scintillator In projection in said predetermined direction.

For the coupling of the scintillator 201 and the photodiode 202, another embodiment of the present invention preferably adopts an optically transparent double-sided adhesive tape or an optically transparent adhesive film. Compared with general optical coupling adhesives, such as optically transparent epoxy resin or optically transparent silicone rubber, its advantages are simple process, easy assembly and maintenance.

According to another embodiment of the present invention, the connection between the photodiode 202 and the PCB board 203 is connected by an elastic connector, see 501 in FIG. 5 . The elastic connector referred to here refers to a special insulating rubber sheet embedded with conductive medium stripes 5011 in only one direction. To achieve the purpose of conducting current signals. The application of this elastic connection technology can make the packaging of the array detector easier, does not require high-temperature operations such as soldering, and is convenient for maintenance.

As shown in FIGS. 6-7 , in another embodiment of the present invention, the array solid-state detector for radiation detection according to the present invention includes: a plurality of sensors (such as , a plurality of scintillators 201, and a plurality of photodiodes 202), the sensor has a ray-incident end face (upper end face in FIG. At least one row of spaces in which the plurality of sensors are arranged.

The array solid-state detector for radiation detection according to the present invention may also include a plurality of second plates (not shown in the figure), and the plurality of second plates intersect with the plurality of first plates 601, thus, the Each row of the at least one row of spaces is divided into a plurality of spatial arrays, and each of the sensors is located in one of the plurality of spatial arrays. The plurality of second plates and the plurality of first plates 601 may be substantially perpendicular, or form an angle of, for example, 80-100 degrees.

That is, a scintillator and a photodiode coupled to each other form a unit, and heavy metal partitions (ie, first and second plates) are provided between adjacent units. That is, a heavy metal spacer as the first plate is added between each scintillator and the photodiode channel, as shown by 601 in FIG. 6 . The first plate 601 can basically eliminate the crosstalk of scintillation light between the two adjacent channels, and at the same time reduce the crosstalk of ionizing radiation between the two channels, so that the spatial resolution of the scanned image is improved. The heavy metal separator material may be tungsten (W), lead (Pb) or tantalum (Ta) metal or an alloy material mainly composed of these metals.

According to another embodiment of the present invention, the above-mentioned heavy metal partition can also protrude from the front end of the scintillator toward the direction opposite to the radiation irradiation direction 205 , as shown by 701 in FIG. 7 . These protruding heavy metal partitions actually form a set of grid collimators (heavy metal partitions protruding in only one direction) or grid collimators (heavy metal partitions protruding forward in both directions), These collimators can reduce the scattered rays entering the multi-column detector, thereby improving the contrast sensitivity of the scanned image.

In the above-mentioned embodiment, the metal shell 301 is formed alone, alternatively, the metal shell 301 may also be formed by the outermost first plate 601 and the second plate, so as to surround each side extending along a predetermined direction.

In addition, although the above is an example in which heavy metal partitions (ie, first and second plates) are provided between adjacent units, the partitions (ie, first and second plates) may also be impermeable. The material of light, the effect of partition like this (ie first and second plate) is to isolate light. In addition, the spacers (ie, the first and second plates) can also be made of ordinary metal materials, so that the role of the spacers (ie, the first and second plates) is to isolate light, electricity and magnetism. In the case of heavy metal materials, the function of the partitions (ie the first and second plates) is to isolate light, electricity, magnetism and ionizing radiation.

Although the above embodiments describe the use of the array solid detector of the present invention for radiation imaging, the detector can also be used in other radiation detection systems or devices.

Claims (17)

1. An array solid detector for radiation detection, characterized in that the array solid detector comprises: A plurality of sensors detecting rays radiated in a predetermined direction, the sensors having an end surface on which the rays are incident, and a plurality of first plates arranged substantially in parallel to form at least one row of spaces, the plurality of sensors are arranged In the space, wherein the plurality of first plates are formed of metal. 2. The array solid-state detector for radiation detection according to claim 1, characterized in that the array solid-state detector further comprises: a plurality of second plates intersecting with a plurality of first plates , whereby each row of the at least one row of spaces is divided into a plurality of space arrays, each of the sensors is located in one of the plurality of space arrays, wherein the plurality of second plates are formed of metal. 3. The array solid-state detector for radiation detection according to claim 2, characterized in that the plurality of second plates are substantially perpendicular to the plurality of first plates. 4. The array solid-state detector for radiation detection according to claim 3, characterized in that the sensor comprises: a plurality of scintillators that receive radiation radiated in a predetermined direction and convert the radiation into visible light, and a plurality of photoelectric diodes, the plurality of photodiodes are respectively coupled to the plurality of scintillators through coupling surfaces, so that visible light enters the photodiodes, so as to convert the visible light into charge signals. 5. The array solid-state detector for radiation detection according to claim 4, characterized in that the coupling surface is substantially perpendicular to the predetermined direction. 6. The array solid-state detector for radiation detection according to claim 2, wherein the plurality of first plates and the plurality of second plates protrude in a direction opposite to the predetermined direction for more than The end face has a predetermined length to form a collimator. 7. The array solid-state detector for radiation detection according to claim 5, characterized in that: the surface of each of the plurality of scintillators, except the surface coupled with the photodiode, is made of a reflective material Surrounding, the reflective material is used to reflect the visible light. 8. The array solid-state detector for radiation detection according to claim 7, characterized in that: the refractive index of the reflective material is smaller than the refractive index of the scintillator. 9. The array solid-state detector for radiation detection according to claim 6, characterized in that the outermost plate among the plurality of first plates and the plurality of second plates forms a first housing, so as to Surrounds sides extending in a predetermined direction. 10. The array solid-state detector for radiation detection according to claim 7, characterized in that the array solid-state detector further comprises: a printed circuit board for outputting charge signals of the plurality of photodiodes, and a metal A second housing surrounding at least a portion of the printed circuit board. 11. The array solid-state detector for radiation detection according to claim 10, characterized in that the plurality of photodiodes are photodiodes of a chip-scale package structure. 12. The array solid-state detector for radiation detection according to claim 11, characterized in that the plurality of photodiodes and the corresponding plurality of scintillators are optically transparent double-sided adhesive tape or optically transparent glue along the coupling surface Membrane coupling. 13. The array solid-state detector for radiation detection according to claim 12, characterized in that the array solid-state detector further comprises: a printed circuit board for outputting charge signals of the plurality of photodiodes, and for An elastic connector for connecting a plurality of photodiodes to a printed circuit board, the elastic connector is an insulating rubber sheet, and a conductive medium stripe is provided in the predetermined direction, and the conductive medium stripe connects a plurality of photodiodes to the printed circuit board board connection. 14. The array solid-state detector for radiation detection according to claim 13, characterized in that: the projection of the photodiode in the predetermined direction substantially falls into the projection of the scintillator in the predetermined direction middle. 15. The array solid-state detector for radiation detection according to claim 1, characterized in that: the plurality of first plates are formed of heavy metal. 16. The array solid-state detector for radiation detection according to claim 2, wherein the plurality of first plates and the plurality of second plates are formed of heavy metal. 17. The array solid-state detector for radiation detection according to claim 15 or 16, characterized in that: the heavy metal is one of tungsten, lead or tantalum, or an alloy of tungsten, lead or tantalum A sort of.

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